DATA SHEET BIPOLAR ANALOG INTEGRATED CIRCUIT µPC3207GR FREQUENCY DOWN CONVERTER FOR VHF TO UHF BAND RECEIVER DESCRIPTION The µPC3207GR is a Silicon monolithic IC designed for receiver applications. This IC consists of a double balanced mixer (DBM), local oscillator, preamplifier for precscaler operation, IF amplifier, regulator, UHF/VHF switching circuit, and so on. This one-chip IC covers a wide frequency band from VHF to UHF bands. This IC is packaged in 20-pin SSOP (Shrink Small Outline Package) suitable for surface mounting. FEATURES • VHF to UHF bands operation. • Low distortion CM: VHF (@fRF = 470 MHz) 96 dBµ UHF (@fRF = 890 MHz) 92 dBµ • Supply voltage : 9V • Packaged in 20-pin SSOP suitable for surface mounting APPLICATIONS • Tuners for TV and VCR • Receivers for VHF to UHF bands ORDERING INFORMATION Part Number µPC3207GR-E1 Package Supplying Form 20-pin plastic SSOP (225 mil) Embossed tape 12 mm wide. Pin 1 indicates pull-out direction of tape. Qty 2.5 kp/reel. To order evaluation samples, please contact your local NEC office. (Part number for sample order: µPC3207GR) Caution electro-static sensitive device The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. Not all devices/types available in every country. Please check with local NEC representative for availability and additional information. Document No. P13717EJ3V0DS00 (3rd edition) Date Published October 1999 N CP(K) Printed in Japan The mark shows major revised points. © 1998,1999 µPC3207GR INTERNAL BLOCK DIAGRAM AND PIN CONFIGURATION (TOP VIEW) U OSC C1 1 20 URF IN U OSC B2 2 19 URF IN U OSC B1 3 18 GND U OSC C2 4 17 VRF IN UB 5 16 VRF IN OSC OUT 6 15 MIX OUT GND 7 14 MIX OUT V OSC B1 8 13 VCC V OSC B2 9 12 IF OUT 11 REG V OSC C1 10 2 REG Data Sheet P13717EJ3V0DS00 µPC3207GR PIN EXPLANATION Pin No. Symbol Function and Explanation 1 UOSC collector (Tr. 1) Collector pin of UHF oscillator with balance amplifier. Assemble LC resonator with 2 pin through capacitor ~ 1 pF to oscillate with active feedback loop. 2 UOSC base (Tr.2) Base pin of UHF oscillator with balance amplifier. Connected to LC resonator 3 UOSC base (Tr. 1) through feedback capacitor ~ 360 pF. 4 UOSC collector (Tr. 2) Collector pin of UHF oscillator with balance amplifier. Assemble LC resonator with 2 pin through capacitor ~ 1 pF to oscillate with active feedback loop. Double balanced oscillator with transistor 1 and transistor 2. 5 UB Switching pin for VHF or UHF operation. VHF operation = open UHF operation = 9.0 V 6 OSC output UHF and VHF oscillator output pin. In case of F/S tuner application, connected PLL symthesizer IC’s input pin. Grounded through 1.5 kΩ resistor. Equivalent Circuit 3 1 4 2 6 1.5 k * External element 7 GND GND pin of VHF and UHF oscillator. 8 VOSC base (Tr. 1) Base pin of VHF oscillator. Grounded through capacitor ~ 10 pF. 9 VOSC base (Tr. 2) Base pin of VHF oscillator. Assemble LC resonator with 10 pin to oscillate with active feedback loop. 10 VOSC collector (Tr. 1) Collector pin of VHF oscillator. Connected to LC resonator through feedback capacitor ~ 3 pF. Data Sheet P13717EJ3V0DS00 8 10 9 3 µPC3207GR Pin No. Symbol Function and Explanation 11 REG Monitor pin of regulator output voltage. 12 IF output IF signal output pin of VHF-UHF band functions. Equivalent Circuit 12 13 14 4 VCC Power supply pin for VHF-UHF band functions. MIX VHF and UHF MIX output pins. output1 These pins should be equipped with tank 15 MIX output2 circuit to adjust intermediate frequency. 16 VRF input (bypass) Bypass pin for VHF MIX input. Grounded through capacitor. 17 VRF input VRF signal input pin. 18 GND GND pin of MIX, IF amplifier and regulator. 19 URF input (bypass) Bypass pin for UHF Mü\œinput. Grounded through capacitor. 20 URF input URF signal input pin. Data Sheet P13717EJ3V0DS00 14 17 16 14 19 15 15 20 µPC3207GR ABSOLUTE MAXIMUM RATINGS (TA = +25 °C UNLESS OTHERWISE SPECIFIED) Parameter Symbol Condition Rating Unit Supply Voltage 1 VCC 11.0 V Supply Voltage 2 UB 11.0 V Power Dissipation PD 500 mW Operating Ambient Temperature TA –40 to +75 °C Storage Temperature Tstg –60 to +150 °C TA = 75 °CNote Note Mounted on 50 × 50 × 1.6 mm double epoxy glass board. RECOMMENDED OPERATING RANGE Parameter Symbol MIN. TYP. MAX. Unit Supply Voltage 1 VCC 8.0 9.0 10.0 V Supply Voltage 2 UB 8.0 9.0 10.0 V Operating Ambient Temperature TA –20 +25 +75 °C Data Sheet P13717EJ3V0DS00 5 µPC3207GR ELECTRICAL CHARACTERISTICS (TA = +25 °C, VCC = 9 V, fIF = 45 MHz, fOSC = fRF + 45 MHz, POSC = –10 dBm) Parameter Circuit Current 1 Circuit Current 2 Conversion Gain 1 Conversion Gain 2 Conversion Gain 3 Symbol ICC1 ICC2 CG1 CG2 CG3 Test Conditions MIN. TYP. MAX. Unit @VHF, no input signal Notes 1, 2 31.0 38.0 45.0 mA @UHF, no input signal Notes 1, 2 31.0 38.0 45.0 mA VHF, fRF = 55 MHz, PRF = –30 dBm Note 3 18.5 22.0 25.5 dB VHF, fRF = 200 MHz, PRF = –30 dBm Note 3 18.5 22.0 25.5 dB VHF, fRF = 470 MHz, PRF = –30 dBm Note 3 18.5 22.0 25.5 dB 24.5 28.0 31.5 dB Conversion Gain 4 CG4 UHF, fRF = 470 MHz, PRF = –30 dBm Note 3 Conversion Gain 5 CG5 UHF, fRF = 890 MHz, PRF = –30 dBm Note 3 24.5 28.0 31.5 dB Noise Figure 1 NF1 VHF, fRF = 55 MHz Note 4 — 11.0 14.0 dB Noise Figure 2 NF2 VHF, fRF = 200 MHz Note 4 — 11.0 14.0 dB Noise Figure 3 NF3 VHF, fRF = 470 MHz Note 4 — 11.0 14.0 dB Noise Figure 4 NF4 UHF, fRF = 470 MHz Note 4 — 9.5 12.5 dB Noise Figure 5 NF5 UHF, fRF = 890 MHz Note 4 — 10.0 13.0 dB Maximum Output Power 1 Po (sat)1 VHF, fRF = 55 MHz, PRF = 0 dBm Note 3 7.0 10.0 — dBm Maximum Output Power 2 Po (sat)2 VHF, fRF = 200 MHz, PRF = 0 dBm Note 3 7.0 10.0 — dBm VHF, fRF = 470 MHz, PRF = 0 dBm Note 3 7.0 10.0 — dBm UHF, fRF = 470 MHz, PRF = 0 dBm Note 3 7.0 10.0 — dBm UHF, fRF = 890 MHz, PRF = 0 dBm Note 3 7.0 10.0 — dBm Maximum Output Power 3 Maximum Output Power 4 Maximum Output Power 5 Po (sat)3 Po (sat)4 Po (sat)5 Notes 1. no resistance of OSC output 2. By measurement circuit 1 3. By measurement circuit 2 4. By measurement circuit 3 6 Data Sheet P13717EJ3V0DS00 µPC3207GR STANDARD CHARACTERISTICS (TA = +25 °C, VCC = 9 V, fIF = 45 MHz, fOSC = fRF + 45 MHz, POSC = –10 dBm) Parameter 1 % cross-modulation distortion 1 1 % cross-modulation distortion 2 1 % cross-modulation distortion 3 1 % cross-modulation distortion 4 1 % cross-modulation distortion 5 Note Symbol CM1 CM2 CM3 CM4 CM5 Test Conditions Reference Value Unit fRF = 55 MHz Note 100 dBµ fRF = 200 MHz Note 100 dBµ fRF = 470 MHz Note 96 dBµ fRF = 470 MHz Note 94 dBµ fRF = 890 MHz Note 92 dBµ By measurement circuit 4, fundes = fdes + 6 MHz, PRF = –30 dBm, AM 100 kHz, 30 % modulation, DES/CM = 46 dBc Data Sheet P13717EJ3V0DS00 7 µPC3207GR TYPICAL CHARACTERISTICS CIRCUIT CURRENT vs. SUPPLY VOLTAGE 60 40 UHF no input signal TA=−20°C TA=+25°C TA=+75°C measurement circuit 1 50 Circuit Current ICC (mA) 50 Circuit Current ICC (mA) CIRCUIT CURRENT vs. SUPPLY VOLTAGE 60 VHF no input signal TA=−20°C TA=+25°C TA=+75°C measurement circuit 1 30 20 10 40 30 20 10 0 0 0 2 4 6 8 10 12 0 2 Supply Voltage VCC (V) 10 10 0 −20 −40 VHF fRF=470MHz fOSC=515MHz POSC=−10dBm TA=−20°C TA=+25°C TA=+75°C measurement circuit 2 −30 −20 −10 Input Power Pin (dBm) 0 10 12 UHF fRF=890MHz fOSC=935MHz POSC=−10dBm TA=−20°C TA=+25°C TA=+75°C measurement circuit 2 −10 −30 −20 −10 0 10 Input Power Pin (dBm) CONVERSION GAIN vs. INPUT FREQUENCY NOISE FIGURE vs. INPUT FREQUENCY 20 15 30 fOSC=fRF+45MHz PRF=−30dBm POSC=−10dBm TA=−20°C TA=+25°C TA=+75°C measurement circuit 2 20 10 0 200 400 600 800 Input Frequency fRF (MHz) 1000 Noise Figure NF (dB) Conversion Gain CG (dB) 8 0 −20 −40 10 40 8 6 OUTPUT POWER vs. INPUT POWER 20 Output Power Pout (dBm) Output Power Pout (dBm) OUTPUT POWER vs. INPUT POWER 20 −10 4 Supply Voltage VCC (V) 10 fOSC=fRF+45MHz POSC=−10dBm TA=−20°C TA=+25°C TA=+75°C measurement circuit 3 5 0 0 Data Sheet P13717EJ3V0DS00 200 400 600 800 Input Frequency fRF (MHz) 1000 µPC3207GR STANDARD CHARACTERISTICS (VCC = 9 V) 1% CROSS-MODULATION DISTORTION vs. INPUT FREQUENCY OUTPUT POWER vs. OSC INPUT POWER 10 5 105 Output Power Pout (dBm) 1% Cross-Modulation Distortion CM (dB µ ) 110 100 95 fundes=fRF+6MHz 90 fOSC=fRF+45MHz PRF=−30dBm POSC=−10dBm TA=−20°C 85 TA=+25°C TA=+75°C measurement 80 circuit 4 0 200 400 600 800 Input Frequency fRF (MHz) fRF=890MHz 0 −5 fRF=470MHz −10 −15 −20 fOSC=fRF+45MHz PRF=−30dBm measurement circuit 2 −25 −30 −50 1000 −40 −30 −20 −10 0 Oscillator Input Power Posc (dBm) 10 3rd ORDER INTERMODULATION DISTORTION 3rd ORDER INTERMODULATION DISTORTION 20 20 10 0 Output Power Pout (dBm) −20 VHF fRF1=470MHz fRF2=476MHz fOSC=515MHz POSC=−10dBm −40 −80 −40 −30 −20 −10 Input Power Pin (dBm) 0 −10 −20 −30 UHF fRF1=890MHz fRF2=896MHz fOSC=935MHz POSC=−10dBm −40 −50 TA=−20°C TA=+25°C TA=+75°C measurement circuit 4 −60 TA=−20°C TA=+25°C TA=+75°C measurement circuit 4 −60 −70 −80 −40 10 −30 −20 −10 0 10 Input Power Pin (dBm) OSC FREQUENCY vs. TUNING VOLTAGE 1000 application circuit example 800 OSC Frequency fosc (MHz) Output Power Pout (dBm) 0 U 600 VH 400 VL 200 0 0 5 10 15 20 Tuning Voltage Vtu (V) Data Sheet P13717EJ3V0DS00 25 30 9 µPC3207GR INPUT IMPEDANCE (BY MEASUREMENT CIRCUIT 5) <VRF INPUT: 17 PIN> 1: 45 MHz 851.97 Ω –275.69 Ω 2: 200 MHz 346.66 Ω –441.2 Ω 1 3: 450 MHz 112.42 Ω –265.13 Ω 3 START STOP 0.045000000 GHz 0.450000000 GHz <URF INPUT: 20 PIN> 1: 400 MHz 105.59 Ω –265.56 Ω 2: 650 MHz 55.539 Ω –169.88 Ω 3: 900 MHz 39.918 Ω –119.70 Ω 1 3 2 10 START 0.400000000 GHz STOP 0.900000000 GHz Data Sheet P13717EJ3V0DS00 2 µPC3207GR OUTPUT IMPEDANCE (BY MEASUREMENT CIRCUIT 5) <IF OUTPUT: 12 PIN> 2 1: 45 MHz 25.903 Ω +17.223 Ω 1 2: 60 MHz 26.446 Ω +22.927 Ω START STOP Data Sheet P13717EJ3V0DS00 0.045000000 GHz 0.095000000 GHz 11 µPC3207GR MEASUREMENT CIRCUIT 1 OPEN VCC(9V) OPEN OPEN 1 000 1 000 pF pF 1 000 20T pF 1 000 pF 1 000 pF 20 1 000 pF 19 18 17 1 000 pF 27 pF 16 15 14 13 12 11 REG 1 2 3 4 5 6 7 9 1 000 pF 1 000 pF 1 000 pF 8 1 000 pF 10 1 000 pF 1 000 pF OPEN Voltage of 5 pin OPEN OPEN UB(9V) VHF OPEN UHF 9V MEASUREMENT CIRCUIT 2 SG1 VHF Spectrum Analyzer UHF 1 000 20T pF 1 000 pF 1 000 pF 20 1 000 pF 19 18 17 16 1 000 pF 27 pF 15 14 13 1 000 pF 1 000 pF 12 11 REG 1 1 000 pF 2 3 4 5 6 1 000 pF 1 000 pF 7 1 000 pF 1.5k 1 000 pF OPEN 8 9 10 Voltage of 5 pin 1 000 pF VHF SG2 UHF 12 Data Sheet P13717EJ3V0DS00 VHF OPEN UHF 9V µPC3207GR MEASUREMENT CIRCUIT 3 Noise Meter VCC(9V) VHF Noise Source 1 000 20T pF UHF 1 000 pF 1 000 pF 20 1 000 pF 19 18 17 1 000 pF 27 pF 16 15 14 13 1 000 pF 1 000 pF 12 11 REG 1 2 3 4 5 6 7 1 000 pF 1 000 pF 8 9 1 000 pF 1 000 pF 1.5k 1 000 pF 1 000 pF 10 OPEN Voltage of 5 pin VHF OPEN UHF 9V VHF UB(9V) SG1 UHF MEASUREMENT CIRCUIT 4 MIX PAD VHF Spectrum Analyzer UHF 1 000 20T pF SG1 desire SG2 1 000 pF 1 000 pF 20 1 000 pF 19 18 17 16 1 000 1 000 pF pF 1 000 pF 27 pF 15 14 13 12 11 undesire REG 1 1 000 pF 2 3 4 5 6 1 000 pF 1 000 pF 7 8 1 000 pF 1 000 1.5k pF 9 10 Voltage of 5 pin 1 000 pF OPEN VHF OPEN UHF 9V VHF SG3 UHF Data Sheet P13717EJ3V0DS00 13 µPC3207GR MEASUREMENT CIRCUIT 5 Network Analyzer VCC(9V) 1 000 pF 1 000 pF 1 000 pF 20 19 1 000 pF 1 000 pF 18 17 16 1 000 pF 1 000 pF 15 14 13 12 11 REG 1 2 1 000 pF 3 4 5 6 7 1 000 pF 1 000 pF 8 1 000 pF 9 10 1 000 pF 1 000 pF OPEN OPEN Voltage of 5 pin OPEN UB(9V) 14 Data Sheet P13717EJ3V0DS00 VHF OPEN UHF 9V µPC3207GR APPLICATION CIRCUIT EXAMPLE URF IN VRF IN 1 000 pF VCC IF OUT 1 000 pF 1 000 pF 1 000 pF 20 19 18 17 1 000 pF 20T 1 000 pF 1 000 pF 27 pF 16 15 14 13 12 11 REG 1 4 pF 2 4 5 47 k 6 pF 7 8 9 10 pF 1 000 pF 360 pF 8 pF 6 1.5 k 1 pF 3 pF 1 pF 360 pF Vtu 3 47 k 10 200 pF 3 pF 75 HVU307 × 2 1 000 pF 47 k 47 k 0.5 pF 4T OSC OUT 2T 82 pF Vtu HVU 307 47 k 1 000 pF HB 47 k UB 7T 1 000 pF LB 2.7 k 1 000 pF The application circuits and their parameters are for reference only and are not intended for use in actual design-ins. Data Sheet P13717EJ3V0DS00 15 µPC3207GR µPC3207GR IF OUT VLO IN OSC OUT ILLUSTRATION OF THE EVALUATION BOARD FOR APPLICATION CIRCUIT EXAMPLE (SURFACE) A 16 ULO IN URF IN VRF IN 1 1000p B Data Sheet P13717EJ3V0DS00 µPC3207GR ILLUSTRATION OF THE EVALUATION BOARD FOR APPLICATION CIRCUIT EXAMPLE (BACK SIDE) A B 1 000p 1 000p 1 000p Vtu 4p 47k 1p VCC 1T363 360p 3p 0.5pF 1p 27p 360p 20T 1 000p 1 000p 2T 6p 8p 47k UB 200p 3p 10p 75 1T363×2 47k 1 000p 82p 47k 7T 1.5k 1 000p 4T 47k 1 000p 2.7k 1 000p 47k 1 000p 1 000p LB HB represents cutout Data Sheet P13717EJ3V0DS00 17 µPC3207GR PACKAGE DIMENSIONS 20 PIN PLASTIC SSOP (225 mil) (UNIT: mm) 20 11 detail of lead end +7˚ 3˚–3˚ 1 10 6.7 ± 0.3 6.4 ± 0.2 1.8 MAX. 4.4 ± 0.1 1.5 ± 0.1 1.0 ± 0.2 0.5 ± 0.2 0.15 0.65 +0.10 0.22 –0.05 0.10 M 0.15 +0.10 –0.05 0.575 MAX. 0.1 ± 0.1 NOTE Each lead centerline is located within 0.10 mm of its true position (T.P.) at maximum material condition. 18 Data Sheet P13717EJ3V0DS00 µPC3207GR NOTE ON CORRECT USE (1) Observe precautions for handling because of electro-static sensitive devices. (2) Form a ground pattern as widely as possible to minimize ground impedance (to prevent undesires oscillation). (3) Keep the track length of the ground pins as short as possible. (4) A low pass filter must be attached to VCC line. RECOMMENDED SOLDERING CONDITIONS This product should be soldered under the following recommended conditions. For soldering methods and conditions other than those recommended below, contact your NEC sales representative. Soldering Method Soldering Conditions Recommended Condition Symbol Infrared Reflow Package peak temperature: 235 °C or below Time: 30 seconds or less (at 210 °C) Count: 3, Exposure limit: NoneNote IR35-00-3 VPS Package peak temperature: 215 °C or below Time: 40 seconds or less (at 200 °C) Count: 3, Exposure limit: NoneNote VP15-00-3 Partial Heating Pin temperature: 300 °C Time: 3 seconds or less (per side of device) Exposure limit: NoneNote – Note After opening the dry pack, keep it in a place below 25 °C and 65 % RH for the allowable storage period. Caution Do not use different soldering methods together (except for partial heating). For details of recommended soldering conditions for surface mounting, refer to information document SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E). Data Sheet P13717EJ3V0DS00 19 µPC3207GR • The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. • No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this document. • NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from use of a device described herein or any other liability arising from use of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Corporation or others. • Descriptions of circuits, software, and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software, and information in the design of the customer's equipment shall be done under the full responsibility of the customer. NEC Corporation assumes no responsibility for any losses incurred by the customer or third parties arising from the use of these circuits, software, and information. • While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices, the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety measures in its design, such as redundancy, fire-containment, and anti-failure features. • NEC devices are classified into the following three quality grades: "Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a customer designated “quality assurance program“ for a specific application. The recommended applications of a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device before using it in a particular application. Standard: Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) Specific: Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems or medical equipment for life support, etc. The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books. If customers intend to use NEC devices for applications other than those specified for Standard quality grade, they should contact an NEC sales representative in advance. M7 98.8