ETC UPC3200GS-E1

DATA SHEET
BIPOLAR ANALOG INTEGRATED CIRCUIT
µPC3200GS
FREQUENCY DOWN CONVERTER FOR
VHF TO UHF BAND TV/VCR TUNER
DESCRIPTION
The µPC3200GS is a Silicon monolithic IC designed for TV/VCR tuner applications. This IC consists of a double
balanced mixer (DBM), local oscillator, preamplifier for prescaler operation, IF amplifier, regulator, UHF/VHF
switching circuit, and so on. This one-chip IC covers a wide frequency band from VHF to UHF bands. This IC is
packaged in 20-pin SOP (Small Outline Package) suitable for surface mounting.
FEATURES
•
VHF to UHF band operation.
•
Low distortion
•
Supply voltage: 9 V
•
Packaged in 20-pin SOP suitable for surface mounting
CM: VHF (@fRF = 470 MHz) 96 dBµ
UHF (@fRF = 890 MHz) 92 dBµ
ORDERING INFORMATION
Part Number
Package
µPC3200GS-E1
20-pin plastic SOP
(300 mil)
Package Style
Embossed tape 24 mm wide. 2.5 k/REEL.
Pin 1 indicates pull-out direction of tape.
For evaluation sample order, please contact your local NEC office. (Part number for sample order: µPC3200GS)
Caution
electro-static sensitive device
The information in this document is subject to change without notice. Before using this document, please
confirm that this is the latest version.
Not all devices/types available in every country. Please check with local NEC representative for
availability and additional information.
Document No. P12037EJ3V0DS00 (3rd edition)
Date Published October 1999 N CP(K)
Printed in Japan
The mark
shows major revised points.
©
1996, 1999
µPC3200GS
INTERNAL BLOCK DIAGRAM AND PIN CONFIGURATION (Top View)
2
20
REG
2
19
IF OUT
V OSC B1
3
18
VCC
GND
4
17
MIX OUT
OSC OUT
5
16
MIX OUT
UB
6
15
VRF IN
U OSC C2
7
14
VRF IN
U OSC B1
8
13
GND
U OSC B2
9
12
URF IN
U OSC C1 10
11
URF IN
V OSC C1
1
V OSC B2
REG
Data Sheet P12037EJ3V0DS00
µPC3200GS
PIN EXPLANATION
Pin
No.
1
Symbol
VOSC
collector
(Tr. 1)
Pin Voltage TYP.
above: VHF mode
below: UHF mode
6.20
6.90
Function and Explanation
Equivalent Circuit
Collector pin of VHF oscillator.
Connected to LC resonator through
feedback capacitor ~ 3 pF.
3
1
2
REG
2
3
4
VOSC
base
(Tr. 2)
VOSC
base
(Tr. 1)
GND
3.50
5.90
3.50
Base pin of VHF oscillator.
Assemble LC resonator with 1 pin
to oscillate with active feedback
loop.
Base pin of VHF oscillator.
Grounded through capacitor ~ 10 pF.
5.90
0.0
VHF and UHF oscillator’s GND pin.
0.0
5
OSC
output
5.85
UHF and VHF oscillator output pin.
In case of F/S tuner application,
connected PLL synthesizer IC’s
input pin.
Grounded through 1.5 kΩ resistor.
REG
from
OSC
5
5.85
external
element
6
UB
−
9.0
7
UOSC
collector
(Tr. 2)
6.90
6.25
Switching pin for VHF or UHF
operation.
VHF operation = open
UHF operation = 9.0 V
Collector pin of UHF oscillator
with balance amplifier. Assemble LC
resonator with 8 pin through
capacitor ~ 1 pF to oscillate with
active feedback loop.
Double balanced oscillator with
transistor 1 and transistor 2.
8 10
7
9
6
8
9
10
UOSC
base (Tr. 1)
6.00
UOSC
base (Tr. 2)
6.00
UOSC
collector
(Tr. 1)
6.90
3.90
3.90
6.25
Base pin of UHF oscillator with
balance amplifier. Connected to LC
resonator through feedback
capacitor ~ 360 pF.
Base pin of UHF oscillator with
balance amplifier. Connected to LC
resonator through feedback
capacitor ~ 360 pF.
Collector pin of UHF oscillator.
Assemble LC resonator with 9 pin
through capacitor ~ 1 pF to
oscillate with active feedback
loop.
Data Sheet P12037EJ3V0DS00
3
µPC3200GS
Pin
No.
11
Symbol
URF
input
Pin Voltage TYP.
above: VHF mode
below: UHF mode
3.10
Function and Explanation
Equivalent Circuit
URF signal input pin from antenna.
3.10
18
17 16
12
13
URF
input
(bypass)
3.10
GND
0.0
Bypass pin for UHF MIX input.
Grounded through capacitor.
12
3.10
from
UHF
OSC
11
GND pin of MIX, IF amplifier and
regulator.
0.0
14
VRF
input
3.10
VRF signal input pin from antenna.
3.10
18
15
16
17
18
VRF
input
(bypass)
3.10
7.10
MIX
output 1
7.10
VCC
9.0
7.05
IF
output
14
VHF and UHF MIX output pin.
These pins should be equipped with
tank circuit to adjust intermediate
frequency.
2.80
Power supply pin for VHF-UHF
band functions.
IF output pin of VHF-UHF band
functions.
REG
6.90
6.90
4
18
19
2.80
20
15
7.05
9.0
19
Bypass pin for VHF MIX input.
Grounded through capacitor.
3.10
MIX
output 2
17 16
Monitor pin of regulator output
voltage.
Data Sheet P12037EJ3V0DS00
from
VHF
OSC
µPC3200GS
ABSOLUTE MAXIMUM RATINGS (TA = 25 °C unless otherwise specified)
Parameter
Symbol
Supply Voltage 1
VCC
Supply Voltage 2
UB
Condition
TA = 80 °C
Note
Rating
Unit
11.0
V
11.0
V
700
mW
Power Dissipation
PD
Operating Ambient Temperature
TA
−40 to +80
°C
Storage Temperature
Tstg
−60 to +150
°C
Note Mounted on 50 × 50 × 1.6 mm double cupper epoxy glass board.
RECOMMENDED OPERATION RANGE
Parameter
Symbol
MIN.
TYP.
MAX.
Unit
Supply Voltage 1
VCC
8.0
9.0
10.0
V
Supply Voltage 2
UB
8.0
9.0
10.0
V
Operating Ambient Temperature
TA
−20
+25
+80
°C
Data Sheet P12037EJ3V0DS00
5
µPC3200GS
ELECTRICAL CHARACTERISTICS (TA = +25 °C, VCC = 9V, fIF = 45 MHz, POSC = –10 dBm)
Parameter
Symbol
Test Conditions
TYP.
MAX.
Unit
Circuit Current 1
ICC1
@VHF, no input signal
Note 1
31.0
38.0
45.0
mA
Circuit Current 2
ICC2
@UHF, no input signal
Note 1
31.0
38.0
45.0
mA
Conversion Gain 1
CG1
fRF = 55 MHz, PRF = −30 dBm
Note 2
18.5
22.0
25.5
dB
Conversion Gain 2
CG2
fRF = 200 MHz, PRF = −30 dBm
Note 2
18.5
22.0
25.5
dB
Conversion Gain 3
CG3
fRF = 470 MHz, PRF = −30 dBm
Note 2
18.5
22.0
25.5
dB
Conversion Gain 4
CG4
fRF = 470 MHz, PRF = −30 dBm
Note 2
24.5
28.0
31.5
dB
Conversion Gain 5
CG5
fRF = 890 MHz, PRF = −30 dBm
Note 2
24.5
28.0
31.5
dB
Noise Figure 1
NF1
fRF = 55 MHz
Note 3
−
11.0
14.0
dB
Noise Figure 2
NF2
fRF = 200 MHz
Note 3
−
11.0
14.0
dB
Noise Figure 3
NF3
fRF = 470 MHz
Note 3
−
11.0
14.0
dB
Noise Figure 4
NF4
fRF = 470 MHz
Note 3
−
9.5
12.5
dB
Noise Figure 5
NF5
fRF = 890 MHz
Note 3
−
10.0
13.0
dB
Maximum Output Power 1
PO(SAT)1
fRF = 55 MHz, PRF = 0 dBm
Note 2
7.0
10.0
−
dBm
Maximum Output Power 2
PO(SAT)2
fRF = 200 MHz, PRF = 0 dBm
Note 2
7.0
10.0
−
dBm
Maximum Output Power 3
PO(SAT)3
fRF = 470 MHz, PRF = 0 dBm
Note 2
7.0
10.0
−
dBm
Maximum Output Power 4
PO(SAT)4
fRF = 470 MHz, PRF = 0 dBm
Note 2
7.0
10.0
−
dBm
Maximum Output Power 5
PO(SAT)5
fRF = 890 MHz, PRF = 0 dBm
Note 2
7.0
10.0
−
dBm
Notes 1. By measurement circuit 1
2. By measurement circuit 2
3. By measurement circuit 3
6
MIN.
Data Sheet P12037EJ3V0DS00
µPC3200GS
STANDARD CHARACTERISTICS (Reference Values) (TA = 25 °C, VCC = 9 V
Parameter
Note
)
Value for
Reference
Symbol
Test Conditions
Unit
1 % cross-modulation
distortion 1
CM1
fdes = 55 MHz, fundes = fdes + 6 MHz,
Pdes = −30 dBm, fIF = 45 MHz, POSC = −10 dBm
AM 100 kHz, 30 % modulation, DES/CM = 46 dBc
100
dBµ
1 % cross-modulation
distortion 2
CM2
fdes = 200 MHz, fundes = fdes + 6 MHz,
Pdes = −30 dBm, fIF = 45 MHz, POSC = −10 dBm
AM 100 kHz, 30 % modulation, DES/CM = 46 dBc
100
dBµ
1 % cross-modulation
distortion 3
CM3
fdes = 470 MHz, fundes = fdes + 6 MHz,
Pdes = −30 dBm, fIF = 45 MHz, POSC = −10 dBm
AM 100 kHz, 30 % modulation, DES/CM = 46 dBc
96
dBµ
1 % cross-modulation
distortion 4
CM4
fdes = 470 MHz, fundes = fdes + 6 MHz,
Pdes = −30 dBm, fIF = 45 MHz, POSC = −10 dBm
AM 100 kHz, 30 % modulation, DES/CM = 46 dBc
94
dBµ
1 % cross-modulation
distortion 5
CM5
fdes = 890 MHz, fundes = fdes + 6 MHz,
Pdes = −30 dBm, fIF = 45 MHz, POSC = −10 dBm
AM 100 kHz, 30 % modulation, DES/CM = 46 dBc
92
dBµ
Note By measurement circuit 4
Data Sheet P12037EJ3V0DS00
7
µPC3200GS
TYPICAL CHARACTERISTICS (VCC = 9 V)
ICC vs. VCC
60
ICC - Circuit Current - mA
ICC - Circuit Current - mA
30
20
2
20
0
VHF mode
fRF = 470 MHz
fOSC = 515 MHz
POSC = –10 dBm
TA = –20 °C
TA = 25 °C
TA = 80 °C
by measurement
circuit 2
–30
–20
–10
0
Pin - Input Power - dBm
2
10
4
6
8
10
VCC - Supply Voltage - V
12
Pout vs. Pin
20
Pout - Output Power - dBm
Pout - Output Power - dBm
30
0
0
12
10
–10
8
4
6
8
10
VCC - Supply Voltage - V
Pout vs. Pin
20
–20
–40
UHF mode
no input signal
no external resister
50
TA = –20 °C
TA = 25 °C
TA = 80 °C
by measurement
40
circuit 1
10
10
0
0
ICC vs. VCC
60
VHF mode
no input signal
no external resister
50
TA = –20 °C
TA = 25 °C
TA = 80 °C
by measurement
40
circuit 1
10
0
UHF mode
fRF = 890 MHz
fOSC = 935 MHz
POSC = –10 dBm
TA = –20 °C
TA = 25 °C
TA = 80 °C
by measurement
circuit 2
–10
–20
–40
Data Sheet P12037EJ3V0DS00
–30
–20
–10
0
Pin - Input Power - dBm
10
µPC3200GS
CG, NF vs. fRF
fIF = 45 MHz
PRF = –30 dBm
POSC = –10 dBm
by measurement
30 circuit 2 or 3
CG - Conversion Gain - dB
NF - Noise Figure - dB
40
CG
20
NF
10
0
0
TA = –20 °C
TA = 25 °C
TA = 80 °C
200
400
600
800
CM - 1 % Cross-modulation Distortion - dBµ
TYPICAL CHARACTERISTICS (VCC = 9 V)
fundes = fRF + 6 MHz
fOSC = fRF + 45 MHz
PRF = –30 dBm
POSC = –10 dBm
110 by mesurement
circuit 4
100
90
80 0
1000
fRF - Input Frequency - MHz
IM3
20
0
–20
–40
–60
–80
–40
200
400
600
TA = –20 °C
TA = 25 °C
TA = 80 °C
800
1000
fRF - Input Frequency - MHz
VHF mode
fRF1 = 470 MHz
fRF2 = 476 MHz
fOSC = 515 MHz
POSC = –10 dBm
TA = –20 °C
TA = 25 °C
TA = 80 °C
by measurement
circuit 4
–30
–20
–10
0
10
Pin-Input Power - dBm
Pout - Output Power - dBm
Pout - Output Power - dBm
20
CM vs. fRF
120
IM3
0
–20
–40
–60
–80
–40
Data Sheet P12037EJ3V0DS00
UHF mode
fRF1 = 890 MHz
fRF2 = 896 MHz
fOSC = 935 MHz
POSC = –10 dBm
TA = –20 °C
TA = 25 °C
TA = 80 °C
by measurement
circuit 4
–30
–20
–10
0
10
Pin - Input Power - dBm
9
µPC3200GS
STANDARD CHARACTERISTICS (by application circuit example)
CG, NF vs. fRF
VCC = 9 V
fIF = 45 MHz
PRF = –30 dBm
fRF = 802 MHz
10
Pout - Output Power - dBm
CG - Conversion Gain - dB
NF - Noise Figure - dB
Pout vs. Pin
20
40
30
20
10
fRF = 362 MHz
0
–10
–20
VCC = 9 V
fIF = 45 MHz
0
–30
–40
1000
800
600
400
200
fRF - Input Frequency - MHz
CM vs. fRF
110
–30
–20
–10
0
Pin - Input Power - dBm
0
100
90
VCC = 9 V
fundes = fRF + 6 MHz
fIF = 45 MHz
PRF = –30 dBm
80
0
–10
–20
–30
–40
–50
VCC = 9 V
fP = 83.25 MHz
fS = 87.75 MHz
fOSC = 129 MHz
–60
200
400
600
800
fRF - Input Frequency - MHz
–70
–40
1000
–30
–20
–10
Pin - Input Power - dBm
Vtu vs. fOSC
30
Vtu - Tuning Voltage - V
25
20
VL
VH
U
15
10
5
0
0
200
400
600
800
fOSC - OSC Frequency - MHz
10
10
6 Channel Beat
10
Pout - OUtput Power - dBm
CM - 1 % Cross Modulation Distortion - dBµ
0
Data Sheet P12037EJ3V0DS00
1000
0
µPC3200GS
INPUT IMPEDANCE (by measurement circuit 5)
<VRF INPUT: 14 PIN>
1
2
3
START
STOP
1
45 MHz
754.59 Ω –328.09 Ω
2
200 MHz
204.59 Ω –325.09 Ω
3
470 MHz
55.156 Ω –138.75 Ω
1
400 MHz
78.891 Ω –169.88 Ω
2
600 MHz
34.215 Ω –93.555 Ω
3
890 MHz
12.045 Ω –42.268 Ω
0.045000000 GHz
0.500000000 GHz
<URF INPUT: 11 PIN>
1
3
START
STOP
2
0.400000000 GHz
1.000000000 GHz
Data Sheet P12037EJ3V0DS00
11
µPC3200GS
OUTPUT IMPEDANCE (by measurement circuit 5)
<IF OUTPUT: 19 PIN>
1
1
START
STOP
12
0.045000000 GHz
0.065000000 GHz
Data Sheet P12037EJ3V0DS00
45 MHz
31.489 Ω –17.409 Ω
µPC3200GS
MEASUREMENT CIRCUIT 1
OPEN
VCC (9 V)
1000
1000 pF
pF
20 T
OPEN
1000
pF
1000
pF
27 pF
1000
pF
20
OPEN
1000
pF
1000
pF
19
18
17
16
15
14
13
12
11
2
3
4
5
6
7
8
9
10
REG
1
1000
pF
1000
OPEN pF
1000
pF
1000
pF
1000
pF
1000
pF
OPEN
Voltage of 6 pin
VHF
OPEN
UHF
9V
OPEN
UB (9 V)
MEASUREMENT CIRCUIT 2
Spectrum
Analyzer
VCC (9 V)
1000
1000 pF
pF
1000
pF
20
1000
pF
20 T
VHF
1000
pF
UHF
1000
pF
27 pF
SG1
1000
pF
19
18
17
16
15
14
13
12
11
2
3
4
5
6
7
8
9
10
REG
1
1000
pF
1000
pF
1000
pF
1.5 k
OPEN
1000
pF
1000
pF
Voltage of 6 pin
1000
pF
UHF
UB (9 V)
Data Sheet P12037EJ3V0DS00
VHF
VHF
OPEN
UHF
9V
SG1
13
µPC3200GS
MEASUREMENT CIRCUIT 3
Noise
Meter
VCC (9 V)
1000
1000 pF
pF
1000
pF
20
1000
pF
20 T
VHF
1000
pF
UHF
1000
pF
27 pF
Noise
Source
1000
pF
19
18
17
16
15
14
13
12
11
2
3
4
5
6
7
8
9
10
REG
1
1000
pF
1000
pF
1000
pF
1000
pF
1000
pF
1.5 k
OPEN
Voltage of 6 pin
1000
pF
UHF
UB (9 V)
VHF
VHF
OPEN
UHF
9V
SG1
MEASUREMENT CIRCUIT 4
Spectrum
Analyzer
VCC (9 V)
1000
1000 pF
pF
1000
pF
20
19
18
1000
pF
20 T
UHF
1000
pF
27 pF
17
VHF
1000
pF
16
15
14
MIX PAD
1000
pF
13
12
SG1
desire
11
SG2
undesire
REG
1
2
3
1000
pF
4
5
1000
pF
1000
pF
1.5 k
OPEN
6
7
1000
pF
1000
pF
8
1000
pF
UHF
UB (9 V)
14
Voltage of 6 pin
10
9
Data Sheet P12037EJ3V0DS00
VHF
VHF
OPEN
UHF
9V
SG3
µPC3200GS
MEASUREMENT CIRCUIT 5
Network
Analyzer
VCC (9 V)
1000
1000
pF
1000 pF
pF
20
1000
pF
1000
pF
1000
pF
19
18
17
16
15
14
13
12
11
2
3
4
5
6
7
8
9
10
1000
pF
REG
1
1000
pF
1000
pF
1000
pF
OPEN
1000
pF
1000
pF
1000
pF
OPEN
UB (9 V)
Voltage of 6 pin
OPEN
Data Sheet P12037EJ3V0DS00
VHF
UHF
OPEN
9V
15
µPC3200GS
APPLICATION CIRCUIT EXAPLE
IF OUT VCC
VRF IN
1000
1000 pF
pF
1000
pF
20
URF IN
1000
pF
20 T
1000
pF
1000
pF
27 pF
1000
pF
19
18
17
16
15
14
13
12
11
2
3
4
5
6
7
8
9
10
REG
1
3 pF
1T363
×2
82 pF
HB
LB
47 k
1000
pF
1000
pF
47 k
1000
pF
2.7 k
1.5 k
10 pF
200
pF
1 pF 3 pF 1 pF
75
4 T 47 k
47 k
Vtu
360 pF
1000
pF
6 pF
1000
pF
360 pF
47 k
47 k
4 pF
Vtu
8 pF
2T
0.5 pF
1T363
7T
OSC UB
OUT
The application circuits and their parameters are for reference only and are not intended for use in actual design-ins.
16
Data Sheet P12037EJ3V0DS00
µPC3200GS
ILLUSTRATION OF THE EVALUATION BOARD FOR APPLICATION CIRCUIT EXAMPLE (Surface)
1000P
A
B
Data Sheet P12037EJ3V0DS00
17
µPC3200GS
ILLUSTRATION OF THE EVALUATION BOARD FOR APPLICATION CIRCUIT EXAMPLE (Back side)
LB
HB
A
B
1000p
1000p
47k
1000p
2.7k 1000p
7T
1000p
47k
4T
1.5k
IT3
63
1000p
47k
75
63
47k 82p
IT3
3p
200p
10p
VCC
1000p
20T
27p
1p
360p
2T
3p
47k
8p 0.5p
360p
1p
IT363
47k
4p
1000p
1000p
1000p
represents cutout.
represents short-circuit strip.
18
Data Sheet P12037EJ3V0DS00
1000p
UB
6p
Vtu
µPC3200GS
PACKAGE DIMENSIONS
20 PIN PLASTIC SOP (300 mil) (UNIT: mm)
20
11
detail of lead end
3˚ +7˚
–3˚
1
10
12.7±0.3
7.7±0.3
5.6±0.2
1.55±0.1
0.78 MAX.
1.27
1.1
0.6±0.2
+0.10
0.4±0.1
0.12
M
0.10
0.20 –0.05
0.1±0.1
1.8 MAX.
NOTE Each lead centerline is located within 0.12 mm of its true position (T.P.) at maximum material condition.
Data Sheet P12037EJ3V0DS00
19
µPC3200GS
NOTE ON CORRECT USE
(1) Observe precautions for handling because of electro-static sensitive devices.
(2) Form a ground pattern as widely as possible to minimize ground impedance (to prevent undesires oscillation).
(3) Keep the track length of the ground pins as short as possible.
(4) A low pass filter must be attached to VCC line.
(5) A matching circuit must be externally attached to output port.
RECOMMENDED SOLDERING CONDITIONS
The following conditions (see table below) must be met when soldering this product.
Please consult with our sales officers in case other soldering process is used or in case soldering is done under
different conditions.
For details of recommended soldering conditions for surface mounting, refer to information document
SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E).
µPC3200GS
Soldering Process
Soldering Conditions
Symbol
Infrared Ray Reflow
Peak package’s surface temperature: 235 °C or below,
Reflow time: 30 seconds or below (at 210 °C),
Note
Number of reflow process: 3, Exposure limit : None
IR35-00-3
VPS
Peak package’s surface temperature: 215 °C or below,
Reflow time: 40 seconds or below (at 200 °C),
Note
Number of reflow process: 3, Exposure limit : None
VP15-00-3
Partial Heating Method
Terminal temperature: 300 °C or below,
Note
Flow time: 3 seconds or below (per one pin), Exposure limit : None
Note
Exposure limit before soldering after dry-pack package is opened.
Storage conditions: 25 °C and relative humidity at 65% or less.
Caution Do not apply more than single process at once, except for “Partial heating method”.
20
Data Sheet P12037EJ3V0DS00
µPC3200GS
[MEMO]
Data Sheet P12037EJ3V0DS00
21
µPC3200GS
[MEMO]
22
Data Sheet P12037EJ3V0DS00
µPC3200GS
[MEMO]
Data Sheet P12037EJ3V0DS00
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µPC3200GS
NESAT (NEC Silicon Advanced Technology) is a trademark of NEC Corporation.
• The information in this document is subject to change without notice. Before using this document, please
confirm that this is the latest version.
• No part of this document may be copied or reproduced in any form or by any means without the prior written
consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in
this document.
• NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property
rights of third parties by or arising from use of a device described herein or any other liability arising from use
of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other
intellectual property rights of NEC Corporation or others.
• Descriptions of circuits, software, and other related information in this document are provided for illustrative
purposes in semiconductor product operation and application examples. The incorporation of these circuits,
software, and information in the design of the customer's equipment shall be done under the full responsibility
of the customer. NEC Corporation assumes no responsibility for any losses incurred by the customer or third
parties arising from the use of these circuits, software, and information.
• While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices,
the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or
property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety
measures in its design, such as redundancy, fire-containment, and anti-failure features.
• NEC devices are classified into the following three quality grades:
"Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a
customer designated "quality assurance program" for a specific application. The recommended applications of
a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device
before using it in a particular application.
Standard: Computers, office equipment, communications equipment, test and measurement equipment,
audio and visual equipment, home electronic appliances, machine tools, personal electronic
equipment and industrial robots
Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster
systems, anti-crime systems, safety equipment and medical equipment (not specifically designed
for life support)
Specific: Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life
support systems or medical equipment for life support, etc.
The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books.
If customers intend to use NEC devices for applications other than those specified for Standard quality grade,
they should contact an NEC sales representative in advance.
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