DATA SHEET BIPOLAR ANALOG INTEGRATED CIRCUIT µPC3200GS FREQUENCY DOWN CONVERTER FOR VHF TO UHF BAND TV/VCR TUNER DESCRIPTION The µPC3200GS is a Silicon monolithic IC designed for TV/VCR tuner applications. This IC consists of a double balanced mixer (DBM), local oscillator, preamplifier for prescaler operation, IF amplifier, regulator, UHF/VHF switching circuit, and so on. This one-chip IC covers a wide frequency band from VHF to UHF bands. This IC is packaged in 20-pin SOP (Small Outline Package) suitable for surface mounting. FEATURES • VHF to UHF band operation. • Low distortion • Supply voltage: 9 V • Packaged in 20-pin SOP suitable for surface mounting CM: VHF (@fRF = 470 MHz) 96 dBµ UHF (@fRF = 890 MHz) 92 dBµ ORDERING INFORMATION Part Number Package µPC3200GS-E1 20-pin plastic SOP (300 mil) Package Style Embossed tape 24 mm wide. 2.5 k/REEL. Pin 1 indicates pull-out direction of tape. For evaluation sample order, please contact your local NEC office. (Part number for sample order: µPC3200GS) Caution electro-static sensitive device The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. Not all devices/types available in every country. Please check with local NEC representative for availability and additional information. Document No. P12037EJ3V0DS00 (3rd edition) Date Published October 1999 N CP(K) Printed in Japan The mark shows major revised points. © 1996, 1999 µPC3200GS INTERNAL BLOCK DIAGRAM AND PIN CONFIGURATION (Top View) 2 20 REG 2 19 IF OUT V OSC B1 3 18 VCC GND 4 17 MIX OUT OSC OUT 5 16 MIX OUT UB 6 15 VRF IN U OSC C2 7 14 VRF IN U OSC B1 8 13 GND U OSC B2 9 12 URF IN U OSC C1 10 11 URF IN V OSC C1 1 V OSC B2 REG Data Sheet P12037EJ3V0DS00 µPC3200GS PIN EXPLANATION Pin No. 1 Symbol VOSC collector (Tr. 1) Pin Voltage TYP. above: VHF mode below: UHF mode 6.20 6.90 Function and Explanation Equivalent Circuit Collector pin of VHF oscillator. Connected to LC resonator through feedback capacitor ~ 3 pF. 3 1 2 REG 2 3 4 VOSC base (Tr. 2) VOSC base (Tr. 1) GND 3.50 5.90 3.50 Base pin of VHF oscillator. Assemble LC resonator with 1 pin to oscillate with active feedback loop. Base pin of VHF oscillator. Grounded through capacitor ~ 10 pF. 5.90 0.0 VHF and UHF oscillator’s GND pin. 0.0 5 OSC output 5.85 UHF and VHF oscillator output pin. In case of F/S tuner application, connected PLL synthesizer IC’s input pin. Grounded through 1.5 kΩ resistor. REG from OSC 5 5.85 external element 6 UB − 9.0 7 UOSC collector (Tr. 2) 6.90 6.25 Switching pin for VHF or UHF operation. VHF operation = open UHF operation = 9.0 V Collector pin of UHF oscillator with balance amplifier. Assemble LC resonator with 8 pin through capacitor ~ 1 pF to oscillate with active feedback loop. Double balanced oscillator with transistor 1 and transistor 2. 8 10 7 9 6 8 9 10 UOSC base (Tr. 1) 6.00 UOSC base (Tr. 2) 6.00 UOSC collector (Tr. 1) 6.90 3.90 3.90 6.25 Base pin of UHF oscillator with balance amplifier. Connected to LC resonator through feedback capacitor ~ 360 pF. Base pin of UHF oscillator with balance amplifier. Connected to LC resonator through feedback capacitor ~ 360 pF. Collector pin of UHF oscillator. Assemble LC resonator with 9 pin through capacitor ~ 1 pF to oscillate with active feedback loop. Data Sheet P12037EJ3V0DS00 3 µPC3200GS Pin No. 11 Symbol URF input Pin Voltage TYP. above: VHF mode below: UHF mode 3.10 Function and Explanation Equivalent Circuit URF signal input pin from antenna. 3.10 18 17 16 12 13 URF input (bypass) 3.10 GND 0.0 Bypass pin for UHF MIX input. Grounded through capacitor. 12 3.10 from UHF OSC 11 GND pin of MIX, IF amplifier and regulator. 0.0 14 VRF input 3.10 VRF signal input pin from antenna. 3.10 18 15 16 17 18 VRF input (bypass) 3.10 7.10 MIX output 1 7.10 VCC 9.0 7.05 IF output 14 VHF and UHF MIX output pin. These pins should be equipped with tank circuit to adjust intermediate frequency. 2.80 Power supply pin for VHF-UHF band functions. IF output pin of VHF-UHF band functions. REG 6.90 6.90 4 18 19 2.80 20 15 7.05 9.0 19 Bypass pin for VHF MIX input. Grounded through capacitor. 3.10 MIX output 2 17 16 Monitor pin of regulator output voltage. Data Sheet P12037EJ3V0DS00 from VHF OSC µPC3200GS ABSOLUTE MAXIMUM RATINGS (TA = 25 °C unless otherwise specified) Parameter Symbol Supply Voltage 1 VCC Supply Voltage 2 UB Condition TA = 80 °C Note Rating Unit 11.0 V 11.0 V 700 mW Power Dissipation PD Operating Ambient Temperature TA −40 to +80 °C Storage Temperature Tstg −60 to +150 °C Note Mounted on 50 × 50 × 1.6 mm double cupper epoxy glass board. RECOMMENDED OPERATION RANGE Parameter Symbol MIN. TYP. MAX. Unit Supply Voltage 1 VCC 8.0 9.0 10.0 V Supply Voltage 2 UB 8.0 9.0 10.0 V Operating Ambient Temperature TA −20 +25 +80 °C Data Sheet P12037EJ3V0DS00 5 µPC3200GS ELECTRICAL CHARACTERISTICS (TA = +25 °C, VCC = 9V, fIF = 45 MHz, POSC = –10 dBm) Parameter Symbol Test Conditions TYP. MAX. Unit Circuit Current 1 ICC1 @VHF, no input signal Note 1 31.0 38.0 45.0 mA Circuit Current 2 ICC2 @UHF, no input signal Note 1 31.0 38.0 45.0 mA Conversion Gain 1 CG1 fRF = 55 MHz, PRF = −30 dBm Note 2 18.5 22.0 25.5 dB Conversion Gain 2 CG2 fRF = 200 MHz, PRF = −30 dBm Note 2 18.5 22.0 25.5 dB Conversion Gain 3 CG3 fRF = 470 MHz, PRF = −30 dBm Note 2 18.5 22.0 25.5 dB Conversion Gain 4 CG4 fRF = 470 MHz, PRF = −30 dBm Note 2 24.5 28.0 31.5 dB Conversion Gain 5 CG5 fRF = 890 MHz, PRF = −30 dBm Note 2 24.5 28.0 31.5 dB Noise Figure 1 NF1 fRF = 55 MHz Note 3 − 11.0 14.0 dB Noise Figure 2 NF2 fRF = 200 MHz Note 3 − 11.0 14.0 dB Noise Figure 3 NF3 fRF = 470 MHz Note 3 − 11.0 14.0 dB Noise Figure 4 NF4 fRF = 470 MHz Note 3 − 9.5 12.5 dB Noise Figure 5 NF5 fRF = 890 MHz Note 3 − 10.0 13.0 dB Maximum Output Power 1 PO(SAT)1 fRF = 55 MHz, PRF = 0 dBm Note 2 7.0 10.0 − dBm Maximum Output Power 2 PO(SAT)2 fRF = 200 MHz, PRF = 0 dBm Note 2 7.0 10.0 − dBm Maximum Output Power 3 PO(SAT)3 fRF = 470 MHz, PRF = 0 dBm Note 2 7.0 10.0 − dBm Maximum Output Power 4 PO(SAT)4 fRF = 470 MHz, PRF = 0 dBm Note 2 7.0 10.0 − dBm Maximum Output Power 5 PO(SAT)5 fRF = 890 MHz, PRF = 0 dBm Note 2 7.0 10.0 − dBm Notes 1. By measurement circuit 1 2. By measurement circuit 2 3. By measurement circuit 3 6 MIN. Data Sheet P12037EJ3V0DS00 µPC3200GS STANDARD CHARACTERISTICS (Reference Values) (TA = 25 °C, VCC = 9 V Parameter Note ) Value for Reference Symbol Test Conditions Unit 1 % cross-modulation distortion 1 CM1 fdes = 55 MHz, fundes = fdes + 6 MHz, Pdes = −30 dBm, fIF = 45 MHz, POSC = −10 dBm AM 100 kHz, 30 % modulation, DES/CM = 46 dBc 100 dBµ 1 % cross-modulation distortion 2 CM2 fdes = 200 MHz, fundes = fdes + 6 MHz, Pdes = −30 dBm, fIF = 45 MHz, POSC = −10 dBm AM 100 kHz, 30 % modulation, DES/CM = 46 dBc 100 dBµ 1 % cross-modulation distortion 3 CM3 fdes = 470 MHz, fundes = fdes + 6 MHz, Pdes = −30 dBm, fIF = 45 MHz, POSC = −10 dBm AM 100 kHz, 30 % modulation, DES/CM = 46 dBc 96 dBµ 1 % cross-modulation distortion 4 CM4 fdes = 470 MHz, fundes = fdes + 6 MHz, Pdes = −30 dBm, fIF = 45 MHz, POSC = −10 dBm AM 100 kHz, 30 % modulation, DES/CM = 46 dBc 94 dBµ 1 % cross-modulation distortion 5 CM5 fdes = 890 MHz, fundes = fdes + 6 MHz, Pdes = −30 dBm, fIF = 45 MHz, POSC = −10 dBm AM 100 kHz, 30 % modulation, DES/CM = 46 dBc 92 dBµ Note By measurement circuit 4 Data Sheet P12037EJ3V0DS00 7 µPC3200GS TYPICAL CHARACTERISTICS (VCC = 9 V) ICC vs. VCC 60 ICC - Circuit Current - mA ICC - Circuit Current - mA 30 20 2 20 0 VHF mode fRF = 470 MHz fOSC = 515 MHz POSC = –10 dBm TA = –20 °C TA = 25 °C TA = 80 °C by measurement circuit 2 –30 –20 –10 0 Pin - Input Power - dBm 2 10 4 6 8 10 VCC - Supply Voltage - V 12 Pout vs. Pin 20 Pout - Output Power - dBm Pout - Output Power - dBm 30 0 0 12 10 –10 8 4 6 8 10 VCC - Supply Voltage - V Pout vs. Pin 20 –20 –40 UHF mode no input signal no external resister 50 TA = –20 °C TA = 25 °C TA = 80 °C by measurement 40 circuit 1 10 10 0 0 ICC vs. VCC 60 VHF mode no input signal no external resister 50 TA = –20 °C TA = 25 °C TA = 80 °C by measurement 40 circuit 1 10 0 UHF mode fRF = 890 MHz fOSC = 935 MHz POSC = –10 dBm TA = –20 °C TA = 25 °C TA = 80 °C by measurement circuit 2 –10 –20 –40 Data Sheet P12037EJ3V0DS00 –30 –20 –10 0 Pin - Input Power - dBm 10 µPC3200GS CG, NF vs. fRF fIF = 45 MHz PRF = –30 dBm POSC = –10 dBm by measurement 30 circuit 2 or 3 CG - Conversion Gain - dB NF - Noise Figure - dB 40 CG 20 NF 10 0 0 TA = –20 °C TA = 25 °C TA = 80 °C 200 400 600 800 CM - 1 % Cross-modulation Distortion - dBµ TYPICAL CHARACTERISTICS (VCC = 9 V) fundes = fRF + 6 MHz fOSC = fRF + 45 MHz PRF = –30 dBm POSC = –10 dBm 110 by mesurement circuit 4 100 90 80 0 1000 fRF - Input Frequency - MHz IM3 20 0 –20 –40 –60 –80 –40 200 400 600 TA = –20 °C TA = 25 °C TA = 80 °C 800 1000 fRF - Input Frequency - MHz VHF mode fRF1 = 470 MHz fRF2 = 476 MHz fOSC = 515 MHz POSC = –10 dBm TA = –20 °C TA = 25 °C TA = 80 °C by measurement circuit 4 –30 –20 –10 0 10 Pin-Input Power - dBm Pout - Output Power - dBm Pout - Output Power - dBm 20 CM vs. fRF 120 IM3 0 –20 –40 –60 –80 –40 Data Sheet P12037EJ3V0DS00 UHF mode fRF1 = 890 MHz fRF2 = 896 MHz fOSC = 935 MHz POSC = –10 dBm TA = –20 °C TA = 25 °C TA = 80 °C by measurement circuit 4 –30 –20 –10 0 10 Pin - Input Power - dBm 9 µPC3200GS STANDARD CHARACTERISTICS (by application circuit example) CG, NF vs. fRF VCC = 9 V fIF = 45 MHz PRF = –30 dBm fRF = 802 MHz 10 Pout - Output Power - dBm CG - Conversion Gain - dB NF - Noise Figure - dB Pout vs. Pin 20 40 30 20 10 fRF = 362 MHz 0 –10 –20 VCC = 9 V fIF = 45 MHz 0 –30 –40 1000 800 600 400 200 fRF - Input Frequency - MHz CM vs. fRF 110 –30 –20 –10 0 Pin - Input Power - dBm 0 100 90 VCC = 9 V fundes = fRF + 6 MHz fIF = 45 MHz PRF = –30 dBm 80 0 –10 –20 –30 –40 –50 VCC = 9 V fP = 83.25 MHz fS = 87.75 MHz fOSC = 129 MHz –60 200 400 600 800 fRF - Input Frequency - MHz –70 –40 1000 –30 –20 –10 Pin - Input Power - dBm Vtu vs. fOSC 30 Vtu - Tuning Voltage - V 25 20 VL VH U 15 10 5 0 0 200 400 600 800 fOSC - OSC Frequency - MHz 10 10 6 Channel Beat 10 Pout - OUtput Power - dBm CM - 1 % Cross Modulation Distortion - dBµ 0 Data Sheet P12037EJ3V0DS00 1000 0 µPC3200GS INPUT IMPEDANCE (by measurement circuit 5) <VRF INPUT: 14 PIN> 1 2 3 START STOP 1 45 MHz 754.59 Ω –328.09 Ω 2 200 MHz 204.59 Ω –325.09 Ω 3 470 MHz 55.156 Ω –138.75 Ω 1 400 MHz 78.891 Ω –169.88 Ω 2 600 MHz 34.215 Ω –93.555 Ω 3 890 MHz 12.045 Ω –42.268 Ω 0.045000000 GHz 0.500000000 GHz <URF INPUT: 11 PIN> 1 3 START STOP 2 0.400000000 GHz 1.000000000 GHz Data Sheet P12037EJ3V0DS00 11 µPC3200GS OUTPUT IMPEDANCE (by measurement circuit 5) <IF OUTPUT: 19 PIN> 1 1 START STOP 12 0.045000000 GHz 0.065000000 GHz Data Sheet P12037EJ3V0DS00 45 MHz 31.489 Ω –17.409 Ω µPC3200GS MEASUREMENT CIRCUIT 1 OPEN VCC (9 V) 1000 1000 pF pF 20 T OPEN 1000 pF 1000 pF 27 pF 1000 pF 20 OPEN 1000 pF 1000 pF 19 18 17 16 15 14 13 12 11 2 3 4 5 6 7 8 9 10 REG 1 1000 pF 1000 OPEN pF 1000 pF 1000 pF 1000 pF 1000 pF OPEN Voltage of 6 pin VHF OPEN UHF 9V OPEN UB (9 V) MEASUREMENT CIRCUIT 2 Spectrum Analyzer VCC (9 V) 1000 1000 pF pF 1000 pF 20 1000 pF 20 T VHF 1000 pF UHF 1000 pF 27 pF SG1 1000 pF 19 18 17 16 15 14 13 12 11 2 3 4 5 6 7 8 9 10 REG 1 1000 pF 1000 pF 1000 pF 1.5 k OPEN 1000 pF 1000 pF Voltage of 6 pin 1000 pF UHF UB (9 V) Data Sheet P12037EJ3V0DS00 VHF VHF OPEN UHF 9V SG1 13 µPC3200GS MEASUREMENT CIRCUIT 3 Noise Meter VCC (9 V) 1000 1000 pF pF 1000 pF 20 1000 pF 20 T VHF 1000 pF UHF 1000 pF 27 pF Noise Source 1000 pF 19 18 17 16 15 14 13 12 11 2 3 4 5 6 7 8 9 10 REG 1 1000 pF 1000 pF 1000 pF 1000 pF 1000 pF 1.5 k OPEN Voltage of 6 pin 1000 pF UHF UB (9 V) VHF VHF OPEN UHF 9V SG1 MEASUREMENT CIRCUIT 4 Spectrum Analyzer VCC (9 V) 1000 1000 pF pF 1000 pF 20 19 18 1000 pF 20 T UHF 1000 pF 27 pF 17 VHF 1000 pF 16 15 14 MIX PAD 1000 pF 13 12 SG1 desire 11 SG2 undesire REG 1 2 3 1000 pF 4 5 1000 pF 1000 pF 1.5 k OPEN 6 7 1000 pF 1000 pF 8 1000 pF UHF UB (9 V) 14 Voltage of 6 pin 10 9 Data Sheet P12037EJ3V0DS00 VHF VHF OPEN UHF 9V SG3 µPC3200GS MEASUREMENT CIRCUIT 5 Network Analyzer VCC (9 V) 1000 1000 pF 1000 pF pF 20 1000 pF 1000 pF 1000 pF 19 18 17 16 15 14 13 12 11 2 3 4 5 6 7 8 9 10 1000 pF REG 1 1000 pF 1000 pF 1000 pF OPEN 1000 pF 1000 pF 1000 pF OPEN UB (9 V) Voltage of 6 pin OPEN Data Sheet P12037EJ3V0DS00 VHF UHF OPEN 9V 15 µPC3200GS APPLICATION CIRCUIT EXAPLE IF OUT VCC VRF IN 1000 1000 pF pF 1000 pF 20 URF IN 1000 pF 20 T 1000 pF 1000 pF 27 pF 1000 pF 19 18 17 16 15 14 13 12 11 2 3 4 5 6 7 8 9 10 REG 1 3 pF 1T363 ×2 82 pF HB LB 47 k 1000 pF 1000 pF 47 k 1000 pF 2.7 k 1.5 k 10 pF 200 pF 1 pF 3 pF 1 pF 75 4 T 47 k 47 k Vtu 360 pF 1000 pF 6 pF 1000 pF 360 pF 47 k 47 k 4 pF Vtu 8 pF 2T 0.5 pF 1T363 7T OSC UB OUT The application circuits and their parameters are for reference only and are not intended for use in actual design-ins. 16 Data Sheet P12037EJ3V0DS00 µPC3200GS ILLUSTRATION OF THE EVALUATION BOARD FOR APPLICATION CIRCUIT EXAMPLE (Surface) 1000P A B Data Sheet P12037EJ3V0DS00 17 µPC3200GS ILLUSTRATION OF THE EVALUATION BOARD FOR APPLICATION CIRCUIT EXAMPLE (Back side) LB HB A B 1000p 1000p 47k 1000p 2.7k 1000p 7T 1000p 47k 4T 1.5k IT3 63 1000p 47k 75 63 47k 82p IT3 3p 200p 10p VCC 1000p 20T 27p 1p 360p 2T 3p 47k 8p 0.5p 360p 1p IT363 47k 4p 1000p 1000p 1000p represents cutout. represents short-circuit strip. 18 Data Sheet P12037EJ3V0DS00 1000p UB 6p Vtu µPC3200GS PACKAGE DIMENSIONS 20 PIN PLASTIC SOP (300 mil) (UNIT: mm) 20 11 detail of lead end 3˚ +7˚ –3˚ 1 10 12.7±0.3 7.7±0.3 5.6±0.2 1.55±0.1 0.78 MAX. 1.27 1.1 0.6±0.2 +0.10 0.4±0.1 0.12 M 0.10 0.20 –0.05 0.1±0.1 1.8 MAX. NOTE Each lead centerline is located within 0.12 mm of its true position (T.P.) at maximum material condition. Data Sheet P12037EJ3V0DS00 19 µPC3200GS NOTE ON CORRECT USE (1) Observe precautions for handling because of electro-static sensitive devices. (2) Form a ground pattern as widely as possible to minimize ground impedance (to prevent undesires oscillation). (3) Keep the track length of the ground pins as short as possible. (4) A low pass filter must be attached to VCC line. (5) A matching circuit must be externally attached to output port. RECOMMENDED SOLDERING CONDITIONS The following conditions (see table below) must be met when soldering this product. Please consult with our sales officers in case other soldering process is used or in case soldering is done under different conditions. For details of recommended soldering conditions for surface mounting, refer to information document SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E). µPC3200GS Soldering Process Soldering Conditions Symbol Infrared Ray Reflow Peak package’s surface temperature: 235 °C or below, Reflow time: 30 seconds or below (at 210 °C), Note Number of reflow process: 3, Exposure limit : None IR35-00-3 VPS Peak package’s surface temperature: 215 °C or below, Reflow time: 40 seconds or below (at 200 °C), Note Number of reflow process: 3, Exposure limit : None VP15-00-3 Partial Heating Method Terminal temperature: 300 °C or below, Note Flow time: 3 seconds or below (per one pin), Exposure limit : None Note Exposure limit before soldering after dry-pack package is opened. Storage conditions: 25 °C and relative humidity at 65% or less. Caution Do not apply more than single process at once, except for “Partial heating method”. 20 Data Sheet P12037EJ3V0DS00 µPC3200GS [MEMO] Data Sheet P12037EJ3V0DS00 21 µPC3200GS [MEMO] 22 Data Sheet P12037EJ3V0DS00 µPC3200GS [MEMO] Data Sheet P12037EJ3V0DS00 23 µPC3200GS NESAT (NEC Silicon Advanced Technology) is a trademark of NEC Corporation. • The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. • No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this document. • NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from use of a device described herein or any other liability arising from use of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Corporation or others. • Descriptions of circuits, software, and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software, and information in the design of the customer's equipment shall be done under the full responsibility of the customer. NEC Corporation assumes no responsibility for any losses incurred by the customer or third parties arising from the use of these circuits, software, and information. • While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices, the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety measures in its design, such as redundancy, fire-containment, and anti-failure features. • NEC devices are classified into the following three quality grades: "Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a customer designated "quality assurance program" for a specific application. The recommended applications of a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device before using it in a particular application. Standard: Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) Specific: Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems or medical equipment for life support, etc. The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books. If customers intend to use NEC devices for applications other than those specified for Standard quality grade, they should contact an NEC sales representative in advance. M7 98. 8