DATA SHEET GaAs INTEGRATED CIRCUIT PPG152TA L-BAND SPDT SWITCH DESCRIPTION The PPG152TA is an L-band SPDT (Single Pole Double Throw) GaAs FET switch which was developed for digital cellular or cordless telephone application. The device can operate from 100 MHz to 2.5 GHz, having the low insertion loss. It housed in as original 6 pin mini-mold that is smaller than usual 8 pin SSOP and easy to install and contributes to miniaturizing the system. It can be used in wide-band switching applications. FEATURES • Low insertion loss : LINS = 0.6 dB typ. @ f = 2 GHz • High power switching : Pin (1 dB) = +30 dBm typ. @ VCONT = +3.0 V/0 V, f = 2 GHz • Small 6 pin mini-mold APPLICATION • Digital cordless telephone : PHS, DECT, PCS etc. • Digital hand-held cellular phone: PDC Antenna diversity etc. ORDERING INFORMATION PART NUMBER PPG152TA-E3 Remark PACKAGE PACKING FORM 6 pins Mini-mold Carrier tape width 8 mm, 1 pin faces toward the open end of the tape, 3000 pcs/Reel For evaluation sample order, please contact your local NEC sales office. (Part number for sample order: PPG152TA) ABSOLUTE MAXIMUM RATINGS (TA = 25 °C) PARAMETERS Control Voltage 1, 2 SYMBOL VCONT1, 2 RATING UNIT Note ð6.0 to +6.0 V Input Power Pin +31 dBm Total Power Dissipation Ptot 0.4 W Operating Temperature TA ð50 to +80 °C Storage Temperature Tstg ð65 to +150 °C Note Condition 2.7 d | VCONT1 - VCONT 2 | d 6.0 V Caution The IC must be handled with care to prevent static discharge because its circuit is composed of GaAs MES FET. Document No. P12398EJ2V1DS00 (2nd edition) Date Published January 1998 N CP(K) Printed in Japan © 1996 PPG152TA PIN CONNECTION DIAGRAM (Top View) PIN No. CONNECTION PIN No. CONNECTION 1 OUT1 4 VCONT 2 2 GND 5 IN 3 OUT2 6 VCONT 1 (Bottom View) 3 4 4 3 2 5 5 2 1 6 6 1 RECOMMENDED OPERATING CONDITIONS (TA = 25 °C) PARAMETERS SYMBOL MIN. TYP. MAX. UNIT Control Voltage (OFF) VCONT +2.7 +3.0 +5.3 V Control Voltage (ON) VCONT ð0.2 0 +0.2 V +27 +29 dBm Input Power (VCONT = 3 V/0 V) Pin ELECTRICAL CHARACTERISTICS (Unless otherwise specified, TA = 25 °C, VCONT1 = 3 V, VCONT2 = 0 V or VCONT1 = 0 V, VCONT2 = 3 V, Off chip DC blocking capacitors value; 51 pF) CHARACTERISTICS Insertion Loss SYMBOL LINS TEST CONDITIONS MIN. f = 100 M to 2 GHz ISL f = 100 M to 2 GHz f = 2.5 GHz MAX. UNIT 0.6 1.0 dB Note 1 0.8 f = 2.5 GHz Isolation TYP. 20 20 22 dB Note 1 Input Return Loss RIin f = 100 M to 2 GHz 11 dB Output Return Loss RIout f = 100 M to 2 GHz 11 dB Pin(1 dB) f = 1 GHz to 2 GHz 27 Input Power at 1 dB Note 2 Compression Point Switching Speed Control Current tsw ICONT VCONT = 3 V/0 V RF None 30 dBm 30 ns 5 PA Notes 1 Characteristic for reference at 2.0 to 2.5 GHz 2 Pin(1 dB) is measured the input power level when the insertion loss increase more 1 dB than that of linear range. All other characteristics are measured in linear range. 3 When the PPG152TA is used it is necessary to use DC blocking capacitors for No.1 (OUT1), No.3 (OUT2) and No.5 (IN). The value of DC blocking capacitors should be chosen to accommodate the frequency of operation, band width, switching speed and the condition with actual board of your system. The range of recommended DC blocking capacitor value is less than 100 pF. 4 The distance between IC’s GND pin and ground pattern of substrate should be as shorter as possible to avoid parasitic parameters. 2 PPG152TA TYPICAL CHARACTERISTICS (TA = 25 °C) Note This data is including loss of the test fixture IN-OUT1 INSERTION LOSS vs. FREQUENCY 0 VCONT1 = 0 V VCONT2 = +3 V Pin = 0 dBm +1.0 0 –1.0 –2.0 –3.0 100 M 200 M VCONT1 = +3 V VCONT2 = 0 V Pin = 0 dBm –10 ISL - Isolation - dB LINS - Insertion Loss - dB +2.0 IN-OUT1 ISOLATION vs. FREQUENCY –20 –30 –40 500 M 1G –50 100 M 200 M 2G 3G 500 M f - Frequency - Hz f - Frequency - Hz 1G ISL LINS OUT1 IN 50 Ω OUT1 IN OUT2 IN-OUT1 INPUT RETURN LOSS vs. FREQUENCY VCONT1 = 0 V VCONT2 = +3 V Pin = 0 dBm 0 –10 –20 –30 –40 100 M 200 M f - Frequency - Hz 500 M 1G 2G 3G 50 Ω +10 VCONT1 = 0 V VCONT2 = +3 V Pin = 0 dBm 0 –10 –20 –30 –40 100 M 200 M 500 M 1G f - Frequency - Hz RLin 50 Ω OUT2 2G 3G RLout OUT1 IN OUT2 IN-OUT1 OUTPUT RETURN LOSS vs. FREQUENCY RLout - Output Return Loss - dB RLin - Input Return Loss - dB +10 2G 3G OUT1 IN 50 Ω OUT2 3 PPG152TA IN-OUT2 INSERTION LOSS vs. FREQUENCY 0 VCONT1 = +3 V VCONT2 = 0 V Pin = 0 dBm +1.0 0 –1.0 –2.0 –3.0 100 M 200 M VCONT1 = 0 V VCONT2 = +3 V Pin = 0 dBm –10 ISL - Isolation - dB LINS - Insertion Loss - dB +2.0 IN-OUT2 ISOLATION vs. FREQUENCY –20 –30 –40 500 M 1G –50 100 M 200 M 2G 3G 500 M 1G f - Frequency - Hz f - Frequency - Hz OUT1 50 Ω OUT1 50 Ω IN IN OUT2 IN-OUT2 INPUT RETURN LOSS vs. FREQUENCY VCONT1 = +3 V VCONT2 = 0 V Pin = 0 dBm 0 –10 –20 –30 f - Frequency - Hz 500 M 1G 2G 3G +10 VCONT1 = +3 V VCONT2 = 0 V Pin = 0 dBm 0 –10 –20 –30 –40 100 M 200 M 500 M 1G 2G 3G f - Frequency - Hz RLin OUT1 50 Ω OUT1 50 Ω IN OUT2 IN OUT2 4 IN-OUT2 OUTPUT RETURN LOSS vs. FREQUENCY RLout - Output Return Loss - dB RLin - Input Return Loss - dB +10 OUT2 ISL LINS –40 100 M 200 M 2G 3G RLout PPG152TA Temperature characteristics Temperature Characteristics of Input/Output 34 VCONT1 = +3.0 V VCONT2 = 0 V 32 f = 2 GHz Non-modulated Signal input (cw) 30 Pout (dBm) 28 26 TA = –50 °C TA = –10 °C TA = 30 °C TA = 50 °C TA = 90 °C 24 22 20 18 18 20 22 24 26 28 Pin (dBm) 30 32 34 36 5 PPG152TA TEST CIRCUIT TA = 25 °C, VCONT1 = +3 V, VCONT2 = 0 V or VCONT1 = 0 V, VCONT2 = +3 V, f = 2 GHz Off chip DC blocking capacitors value; 51 pF, Using NEC standard evaluation board IN ZO = 50 Ω 51 pF VCONT1 VCONT2 1000 pF 4 6 3 1 51 pF 1000 pF 51 pF OUT2 OUT1 ZO = 50 Ω ZO = 50 Ω 6 PIN MINI-MOLD PACKAGE DIMENSIONS (UNIT: mm) +0.1 0.3 –0.0 3 +0.2 2 1.5 –0.1 2.8 –0.3 +0.2 1 0 to 0.1 6 5 4 0.95 0.95 1.9 2.9 ±0.2 6 0.13 ±0.1 0.8 +0.2 1.1 –0.1 PPG152TA TRUTH TABLE OF SWITCHING BY CONDITION OF CONTROL VOLTAGE VCONT1 +3 V 0V OUT1 +3 V IN OUT1 IN OUT2 OUT2 VCONT2 OUT1 OUT1 0V IN OUT2 IN OUT2 EVALUATION BOARD UPG152TA 0.4 mm thickness teflon glass OUT1 OUT2 VCONT1 VCONT2 RF IN 7 PPG152TA RECOMMENDED SOLDERING CONDITIONS This Product should be soldered in the following recommended conditions. Other soldering methods and conditions than the recommended conditions are to be consulted with our sales representatives. Soldering process Soldering conditions Recommended condition symbol Infrared ray reflow Package peak temperature: 235 °C Hour: within 30 s. (more than 210 °C) Note Time: 3 times, Limited days: no. IR35-00-3 VPS Package peak temperature: 215 °C Hour: within 40 s. (more than 200 °C) Note Time: 3 times, Limited days: no. VP15-00-3 Wave Soldering Soldering tub temperature: less than 260 °C, Hour: within 10 s. Note Time: 1 time, Limited days: no. WS60-00-1 Pin part heating Pin area temperature: less than 300 °C, Hour: within 3 s. Note Limited days: no. Note It is the storage days after opening a dry pack, the storage conditions are 25 °C, less than 65 %, RH. Caution The combined use of soldering method is to be avoided (However, except the pin area heating method). For details of recommended soldering conditions for surface mounting, refer to information document SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E). 8 PPG152TA [MEMO] 9 PPG152TA [MEMO] 10 PPG152TA [MEMO] 11 PPG152TA Caution The Great Care must be taken in dealing with the devices in this guide. The reason is that the material of the devices is GaAs (Gallium Arsenide), which is designated as harmful substance according to the law concerned. Keep the law concerned and so on, especially in case of removal. The application circuits and their parameters are for reference only and are not intended for use in actual design-ins. No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this document. NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from use of a device described herein or any other liability arising from use of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Corporation or others. While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices, the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety measures in its design, such as redundancy, fire-containment, and anti-failure features. NEC devices are classified into the following three quality grades: "Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a customer designated "quality assurance program" for a specific application. The recommended applications of a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device before using it in a particular application. Standard: Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) Specific: Aircrafts, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems or medical equipment for life support, etc. The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books. If customers intend to use NEC devices for applications other than those specified for Standard quality grade, they should contact an NEC sales representative in advance. Anti-radioactive design is not implemented in this product. M4 96. 5