DATA SHEET GaAs INTEGRATED CIRCUIT μPG2406TB 0.01 to 3.0 GHz SPDT SWITCH DESCRIPTION The μPG2406TB is a GaAs MMIC for L, S-band SPDT (Single Pole Double Throw) switch which were designed for mobile phone and another L, S-band application. This device can operate 2 control switching by control voltage 1.8 to 5.3 V. This device can operate frequency from 0.01 to 3.0 GHz, having the low insertion loss and high isolation. This device is housed in a 6-pin super minimold package. And this package is able to high-density surface mounting. FEATURES • Switch control voltage : Vcont (H) = 1.8 to 5.3 V (2.7 V TYP.) : Vcont (L) = −0.2 to +0.2 V (0 V TYP.) • Low insertion loss : Lins = 0.40 dB TYP. @ f = 1.0 GHz, Vcont (H) = 2.7 V, Vcont (L) = 0 V : Lins = 0.47 dB TYP. @ f = 2.5 GHz, Vcont (H) = 2.7 V, Vcont (L) = 0 V • High isolation : ISL = 27 dB TYP. @ f = 1.0 GHz, Vcont (H) = 2.7 V, Vcont (L) = 0 V : ISL = 17 dB TYP. @ f = 2.5 GHz, Vcont (H) = 2.7 V, Vcont (L) = 0 V • Handling power : Pin (0.1 dB) = +29.0 dBm TYP. @ f = 2.0/2.5 GHz, Vcont (H) = 2.7 V, Vcont (L) = 0 V : Pin (1 dB) = +30.5 dBm TYP. @ f = 0.5 to 3.0 GHz, Vcont (H) = 2.7 V, Vcont (L) = 0 V • High-density surface mounting : 6-pin super minimold package (2.0× 1.25 × 0.9 mm) APPLICATIONS • L, S-band digital cellular or cordless telephone • W-LAN, WLL and BluetoothTM etc. ORDERING INFORMATION Part Number μPG2406TB-E4 Order Number μPG2406TB-E4-A Package 6-pin super minimold Marking G5L (Pb-Free) Supplying Form • Embossed tape 8 mm wide • Pin 4, 5, 6 face the perforation side of the tape • Qty 3 kpcs/reel Remark To order evaluation samples, contact your nearby sales office. Part number for sample order: μPG2406TB Caution Although this device is designed to be as robust as possible, ESD (Electrostatic Discharge) can damage this device. This device must be protected at all times from ESD. Static charges may easily produce potentials of several kilovolts on the human body or equipment, which can discharge without detection. Industry-standard ESD precautions must be employed at all times. The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. Not all products and/or types are available in every country. Please check with an NEC Electronics sales representative for availability and additional information. Document No. PG10747EJ01V0DS (1st edition) Date Published January 2009 NS Printed in Japan 2009 μPG2406TB PIN CONNECTIONS AND INTERNAL BLOCK DIAGRAM (Top View) (Top View) RF1 2 G5L 1 3 6 1 5 2 Pin No. Pin Name 1 RF1 2 GND 3 RF2 4 Vcont2 5 RFC 6 Vcont1 Vcont1 6 6 1 5 5 2 RFC GND Vcont2 RF2 4 (Bottom View) 3 4 4 3 SW TRUTH TABLE ON Path Vcont1 Vcont2 RFC-RF1 High Low RFC-RF2 Low High ABSOLUTE MAXIMUM RATINGS (TA = +25°C, unless otherwise specified) Parameter Symbol Ratings +6.0 Unit Note Switch Control Voltage Vcont V Input Power f = 0.01 to 0.5 GHz Pin1 +24.0 f = 0.5 to 3.0 GHz Pin2 +31.0 Operating Ambient Temperature TA −45 to +85 °C Storage Temperature Tstg −55 to +150 °C dBm Note ⎪Vcont1 − Vcont2⎪ ≤ 6.0 V RECOMMENDED OPERATING RANGE (TA = +25°C, unless otherwise specified) Parameter Symbol MIN. TYP. MAX. Unit Switch Control Voltage (H) Vcont (H) 1.8 2.7 5.3 V Switch Control Voltage (L) Vcont (L) −0.2 0 0.2 V 2 Data Sheet PG10747EJ01V0DS μPG2406TB ELECTRICAL CHARACTERISTICS (TA = +25°C, Vcont (H) = 2.7 V, Vcont (L) = 0 V, DC blocking capacitors = 56 pF, unless otherwise specified) Parameter Insertion Loss 1 Symbol Lins1 Test Conditions f = 0.01 to 0.05 GHz Note 1 Note 2 MIN. TYP. MAX. Unit − 0.40 − dB − 0.40 0.45 dB Insertion Loss 2 Lins2 f = 0.05 to 0.5 GHz Insertion Loss 3 Lins3 f = 0.5 to 1.0 GHz − 0.40 0.45 dB Insertion Loss 4 Lins4 f = 1.0 to 2.0 GHz − 0.45 0.50 dB Insertion Loss 5 Lins5 f = 2.0 to 2.5 GHz − 0.47 0.55 dB Insertion Loss 6 Lins6 f = 2.5 to 3.0 GHz − 0.53 0.60 dB − 27 − dB 23 27 − dB Isolation 1 ISL1 f = 0.01 to 0.05 GHz Note 1 Note 2 Isolation 2 ISL2 f = 0.05 to 0.5 GHz Isolation 3 ISL3 f = 0.5 to 1.0 GHz 23 27 − dB Isolation 4 ISL4 f = 1.0 to 2.0 GHz 16 19 − dB Isolation 5 ISL5 f = 2.0 to 2.5 GHz 14 17 − dB Isolation 6 ISL6 f = 2.5 to 3.0 GHz 14 17 − dB − 20 − dB 15 20 − dB 15 20 − dB − 20 − dB 15 20 − dB 15 20 − dB +26.0 +29.0 − dBm f = 0.5 to 3.0 GHz − +29.0 − dBm f = 0.5 to 3.0 GHz − +30.5 − dBm Input Return Loss 1 RLin1 f = 0.01 to 0.05 GHz Input Return Loss 2 RLin2 f = 0.05 to 0.5 GHz Input Return Loss 3 RLin3 f = 0.5 to 3.0 GHz Output Return Loss 1 RLout1 RLout2 f = 0.05 to 0.5 GHz Output Return Loss 3 RLout3 f = 0.5 to 3.0 GHz 0.1 dB Loss Compression Input Power Note 3 1 dB Loss Compression Input Power Pin (0.1 dB) Pin (1 dB) Note 2 f = 0.01 to 0.05 GHz Output Return Loss 2 Note 1 Note 1 Note 2 f = 2.0/2.5 GHz Note 4 2nd Harmonics 2f0 f = 2.0/2.5 GHz, Pin = +20 dBm 65 75 − dBc 3rd Harmonics 3f0 f = 2.0/2.5 GHz, Pin = +20 dBm 65 75 − dBc Intermodulation Intercept Point IIP3 f = 0.5 to 3.0 GHz, 2 tone, − +60 − dBm 5 MHz spicing Switch Control Current Icont No RF input − 0.2 20 μA Switch Control Speed tSW 50% CTL to 90/10% RF − 50 500 ns Notes 1. DC blocking capacitors = 10 000 pF at f = 0.01 to 0.05 GHz 2. DC blocking capacitors = 1 000 pF at f = 0.05 to 0.5 GHz 3. Pin (0.1 dB) is measured the input power level when the insertion loss increases more 0.1 dB than that of linear range. 4. Pin (1 dB) is measured the input power level when the insertion loss increases more 1 dB than that of linear range. Caution This device is used it is necessary to use DC blocking capacitors. The value of DC blocking capacitors should be chosen to accommodate the frequency of operation, bandwidth, switching speed and the condition with actual board of your system. The range of recommended DC blocking capacitor value is less than 56 pF. Data Sheet PG10747EJ01V0DS 3 μPG2406TB ELECTRICAL CHARACTERISTICS (TA = +25°C, Vcont (H) = 1.8 V, Vcont (L) = 0 V, DC blocking capacitors = 56 pF, unless otherwise specified) Parameter Insertion Loss 7 Symbol Lins7 Test Conditions f = 0.01 to 0.05 GHz Note 1 Note 2 MIN. TYP. MAX. Unit − 0.40 − dB − 0.40 0.46 dB Insertion Loss 8 Lins8 f = 0.05 to 0.5 GHz Insertion Loss 9 Lins9 f = 0.5 to 1.0 GHz − 0.40 0.47 dB Insertion Loss 10 Lins10 f = 1.0 to 2.0 GHz − 0.46 0.52 dB Insertion Loss 11 Lins11 f = 2.0 to 2.5 GHz − 0.48 0.57 dB Insertion Loss 12 Lins12 f = 2.5 to 3.0 GHz − 0.54 0.62 dB − 27 − dB 23 27 − dB Isolation 7 ISL7 f = 0.01 to 0.05 GHz Note 1 Note 2 Isolation 8 ISL8 f = 0.05 to 0.5 GHz Isolation 9 ISL9 f = 0.5 to 1.0 GHz 23 27 − dB Isolation 10 ISL10 f = 1.0 to 2.0 GHz 16 19 − dB Isolation 11 ISL11 f = 2.0 to 2.5 GHz 14 17 − dB Isolation 12 ISL12 f = 2.5 to 3.0 GHz 14 17 − dB − 20 − dB 15 20 − dB 15 20 − dB − 20 − dB 15 20 − dB 15 20 − dB +19.0 +22.0 − dBm f = 0.5 to 3.0 GHz − +22.0 − dBm f = 0.5 to 3.0 GHz − +25.0 − dBm Input Return Loss 4 RLin4 f = 0.01 to 0.05 GHz Input Return Loss 5 RLin5 f = 0.05 to 0.5 GHz Input Return Loss 6 RLin6 f = 0.5 to 3.0 GHz Output Return Loss 4 RLout4 RLout5 f = 0.05 to 0.5 GHz Output Return Loss 6 RLout6 f = 0.5 to 3.0 GHz 0.1 dB Loss Compression Input Power Note 3 1 dB Loss Compression Input Power Pin (0.1 dB) Pin (1 dB) Note 2 f = 0.01 to 0.05 GHz Output Return Loss 5 Note 1 Note 1 Note 2 f = 2.0/2.5 GHz Note 4 Switch Control Current Icont No RF input − 0.2 20 μA Switch Control Speed tSW 50% CTL to 90/10% RF − 50 500 ns Notes 1. DC blocking capacitors = 10 000 pF at f = 0.01 to 0.05 GHz 2. DC blocking capacitors = 1 000 pF at f = 0.05 to 0.5 GHz 3. Pin (0.1 dB) is measured the input power level when the insertion loss increases more 0.1 dB than that of linear range. 4. Pin (1 dB) is measured the input power level when the insertion loss increases more 1 dB than that of linear range. Caution This device is used it is necessary to use DC blocking capacitors. The value of DC blocking capacitors should be chosen to accommodate the frequency of operation, bandwidth, switching speed and the condition with actual board of your system. The range of recommended DC blocking capacitor value is less than 56 pF. 4 Data Sheet PG10747EJ01V0DS μPG2406TB EVALUATION CIRCUIT C2 C1 1 Vcont1 RF1 6 2 RFC 5 C1 Note 3 Vcont2 RF2 4 C1 C2 Note C1 : 0.01 to 0.05 GHz 10 000 pF : 0.05 to 0.5 GHz 1 000 pF : 0.5 to 3.0 GHz 56 pF C2 : 1 000 pF The application circuits and their parameters are for reference only and are not intended for use in actual design-ins. APPLICATION INFORMATION C1 Switch C1 LESD C1 • LESD provides a means to increase the ESD protection on a specific RF port, typically the port attached to the antenna. • The value may be tailored to provide specific electrical responses. • The RF ground connections should be kept as short as possible and connected to directly to a good RF ground for best performance. Data Sheet PG10747EJ01V0DS 5 μPG2406TB ILLUSTRATION OF THE TEST CIRCUIT ASSEMBLED ON EVALUATION BOARD Vcont1 Vc1 RF1 OUT 1 C2 C 1 IN C1 C 2 C1 G5L RFC C1 C2 C 1 C1 C2 OUT 2 RF2 Vc2 6pin SMM SPDT SW Vcont2 USING THE NEC EVALUATION BOARD Symbol C1 C2 6 Test Conditions Values f = 0.01 to 0.05 GHz 10 000 pF f = 0.05 to 0.5 GHz 1 000 pF f = 0.5 to 3.0 GHz 56 pF 1 000 pF Data Sheet PG10747EJ01V0DS μPG2406TB TYPICAL CHARACTERISTICS (TA = +25°C, DC blocking capacitors = 56 pF, unless otherwise specified) RFC-RF1/RF2 ISOLATION vs. FREQUENCY RFC-RF1/RF2 INSERTION LOSS vs. FREQUENCY 0 –0.1 Isolation ISL (dB) Insertion Loss Lins (dB) –5 –0.2 –0.3 Vcont (H) = 2.7 V –0.4 Vcont (H) = 1.8 V –15 –20 –25 2.7 V –30 –0.5 –35 1.8 V –0.6 0.0 0.5 1.0 2.0 1.5 2.5 –40 0.0 3.0 0.5 1.0 3.0 Frequency f (GHz) RFC-RF1/RF2 INPUT RETURN LOSS vs. FREQUENCY RFC-RF1/RF2 OUTPUT RETURN LOSS vs. FREQUENCY Output Return Loss RLout (dB) 0 –5 –10 –15 Vcont (H) = 2.7 V –20 –25 –5 –10 Vcont (H) = 2.7 V –15 –20 –25 1.8 V –30 0.0 0.5 1.0 2.0 1.5 1.8 V 2.5 –30 0.0 3.0 0.5 1.0 2.0 1.5 2.5 Frequency f (GHz) Frequency f (GHz) RFC-RF1/RF2 INSERTION LOSS, Icont vs. SWITCH CONTROL VOLTAGE (H) RFC-RF1/RF2 ISOLATION vs. SWITCH CONTROL VOLTAGE (H) 6 –0.4 5 f = 1.0 GHz 4 Lins 2.5 GHz –0.5 3 2 –0.6 Icont 1 –0.7 –0.8 1.5 2.0 2.5 3.0 3.5 4.0 4.5 0 5.0 –5 Isolation ISL (dB) –0.3 3.0 0 Switch Control Current Icont (μA) –0.2 Insertion Loss Lins (dB) 2.5 2.0 1.5 Frequency f (GHz) 0 Input Return Loss RLin (dB) –10 –10 –15 f = 2.5 GHz –20 –25 1.0 GHz –30 –35 –40 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 Switch Control Voltage (H) Vcont (H) (V) Switch Control Voltage (H) Vcont (H) (V) Remark The graphs indicate nominal characteristics. Data Sheet PG10747EJ01V0DS 7 μPG2406TB RFC-RF1/RF2 OUTPUT RETURN LOSS vs. SWITCH CONTROL VOLTAGE (H) 0 0 –5 –5 Output Return Loss RLout (dB) –10 –15 –20 f = 2.5 GHz –25 –30 1.0 GHz –35 –40 –45 –50 1.5 2.0 2.5 3.5 3.0 4.0 4.5 –10 –15 f = 2.5 GHz –20 –25 –30 1.0 GHz –35 –40 –45 –50 1.5 5.0 2.0 RFC-RF1/RF2 INSERTION LOSS, Icont vs. INPUT POWER 6 4 –1.0 1.8 V 3 –1.5 2 –2.0 2.7 V 1 –2.5 3 –1.5 2 –2.0 2.7 V 1 Icont 20 1.8 V 0 35 30 25 Input Power Pin (dBm) Input Power Pin (dBm) RFC-RF1/RF2 INPUT POWER vs. SWITCH CONTROL VOLTAGE (H) RFC-RF1/RF2 INPUT POWER vs. FREQUENCY 38 Input Power Pin (dBm) 30 Input Power Pin (dBm) 1.8 V –3.0 15 f = 2.5 GHz 28 Pin (0.1 dB) 26 24 22 This data has changed the value 36 of the DC blocking capacitors according to the frequency. 34 Vcont (H) = 2.7 V 32 30 28 Pin (0.1 dB) 26 24 22 2.0 2.5 3.0 3.5 4.0 4.5 5.0 20 0.0 Switch Control Voltage (H) Vcont (H) (V) 0.5 1.0 1.5 2.0 Frequency f (GHz) Remark The graphs indicate nominal characteristics. 8 4 –1.0 –2.5 0 35 30 25 5 Lins 1.8 V 20 f = 2.5 GHz Vcont (H) = 2.7 V 32 20 1.5 6 –0.5 Insertion Loss Lins (dB) 5 Icont 5.0 0 Switch Control Current Icont (μA) Insertion Loss Lins (dB) f = 1.0 GHz Lins –3.0 15 4.5 RFC-RF1/RF2 INSERTION LOSS, Icont vs. INPUT POWER 0 –0.5 4.0 3.5 3.0 Switch Control Voltage (H) Vcont (H) (V) Switch Control Voltage (H) Vcont (H) (V) Vcont (H) = 2.7 V 2.5 Data Sheet PG10747EJ01V0DS 2.5 3.0 Switch Control Current Icont (μA) Input Return Loss RLin (dB) RFC-RF1/RF2 INPUT RETURN LOSS vs. SWITCH CONTROL VOLTAGE (H) μPG2406TB MOUNTING PAD LAYOUT DIMENSIONS 6-PIN SUPER MINIMOLD (UNIT: mm) 1.9 0.8 0.4 0.65 0.65 Remark The mounting pad layout in this document is for reference only. Data Sheet PG10747EJ01V0DS 9 μPG2406TB PACKAGE DIMENSIONS 6-PIN SUPER MINIMOLD (UNIT: mm) 2.1±0.1 0.2+0.1 –0.05 0.65 0.65 1.3 2.0+0.15 –0.20 1.25±0.1 10 Data Sheet PG10747EJ01V0DS 0.15+0.1 –0.05 0 to 0.1 0.7 0.9±0.1 0.1 MIN. μPG2406TB RECOMMENDED SOLDERING CONDITIONS This product should be soldered and mounted under the following recommended conditions. For soldering methods and conditions other than those recommended below, contact your nearby sales office. Soldering Method Infrared Reflow Wave Soldering Soldering Conditions Condition Symbol Peak temperature (package surface temperature) : 260°C or below Time at peak temperature : 10 seconds or less Time at temperature of 220°C or higher : 60 seconds or less Preheating time at 120 to 180°C : 120±30 seconds Maximum number of reflow processes : 3 times Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below Peak temperature (molten solder temperature) : 260°C or below Time at peak temperature : 10 seconds or less IR260 WS260 Preheating temperature (package surface temperature) : 120°C or below Partial Heating Maximum number of flow processes : 1 time Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below Peak temperature (terminal temperature) : 350°C or below Soldering time (per side of device) : 3 seconds or less Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below HS350 Caution Do not use different soldering methods together (except for partial heating). Data Sheet PG10747EJ01V0DS 11 μPG2406TB Bluetooth is a trademark owned by Bluetooth SIG, Inc., U.S.A. • The information in this document is current as of January, 2009. The information is subject to change without notice. For actual design-in, refer to the latest publications of NEC Electronics data sheets or data books, etc., for the most up-to-date specifications of NEC Electronics products. Not all products and/or types are available in every country. Please check with an NEC Electronics sales representative for availability and additional information. • No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Electronics. NEC Electronics assumes no responsibility for any errors that may appear in this document. • NEC Electronics does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of NEC Electronics products listed in this document or any other liability arising from the use of such products. No license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Electronics or others. • Descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software and information in the design of a customer's equipment shall be done under the full responsibility of the customer. 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The recommended applications of an NEC Electronics product depend on its quality grade, as indicated below. Customers must check the quality grade of each NEC Electronics product before using it in a particular application. "Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots. "Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support). "Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems and medical equipment for life support, etc. The quality grade of NEC Electronics products is "Standard" unless otherwise expressly specified in NEC Electronics data sheets or data books, etc. If customers wish to use NEC Electronics products in applications not intended by NEC Electronics, they must contact an NEC Electronics sales representative in advance to determine NEC Electronics' willingness to support a given application. (Note) (1) "NEC Electronics" as used in this statement means NEC Electronics Corporation and also includes its majority-owned subsidiaries. (2) "NEC Electronics products" means any product developed or manufactured by or for NEC Electronics (as defined above). M8E 02. 11-1 12 Data Sheet PG10747EJ01V0DS μPG2406TB Caution GaAs Products This product uses gallium arsenide (GaAs). GaAs vapor and powder are hazardous to human health if inhaled or ingested, so please observe the following points. • Follow related laws and ordinances when disposing of the product. If there are no applicable laws and/or ordinances, dispose of the product as recommended below. 1. Commission a disposal company able to (with a license to) collect, transport and dispose of materials that contain arsenic and other such industrial waste materials. 2. Exclude the product from general industrial waste and household garbage, and ensure that the product is controlled (as industrial waste subject to special control) up until final disposal. • Do not burn, destroy, cut, crush, or chemically dissolve the product. • Do not lick the product or in any way allow it to enter the mouth.