IR-Lumineszenzdiode (850 nm) mit hoher Ausgangsleistung High Power Infrared Emitter (850 nm) Lead (Pb) Free Product - RoHS Compliant SFH 4250S Vorläufige Daten / Preliminary Data Wesentliche Merkmale Features • Infrarot LED mit sehr hoher Ausgangsleistung • Kurze Schaltzeiten • High Power Infrared LED • Short switching times Anwendungen Applications • Infrarotbeleuchtung für Kameras • IR-Datenübertragung • Sensorik • Infrared Illumination for cameras • IR Data Transmission • Optical sensors Sicherheitshinweise Safety Advices Je nach Betriebsart emittieren diese Bauteile hochkonzentrierte, nicht sichtbare InfrarotStrahlung, die gefährlich für das menschliche Auge sein kann. Produkte, die diese Bauteile enthalten, müssen gemäß den Sicherheitsrichtlinien der IEC-Normen 60825-1 und 62471 behandelt werden. Depending on the mode of operation, these devices emit highly concentrated non visible infrared light which can be hazardous to the human eye. Products which incorporate these devices have to follow the safety precautions given in IEC 60825-1 and IEC 62471. Typ Type Bestellnummer Ordering Code Strahlstärkegruppierung1) (IF = 70 mA, tp = 20 ms) Radiant Intensity Grouping1) Ie (mW/sr) SFH 4250S Q65111A0128 ≥ 12.5 (typ. 22) 1) gemessen bei einem Raumwinkel Ω = 0.01 sr / measured at a solid angle of Ω = 0.01 sr 2011-03-10 1 SFH 4250S Grenzwerte (TA = 25 °C) Maximum Ratings Bezeichnung Parameter Symbol Symbol Wert Value Einheit Unit Betriebs- und Lagertemperatur Operating and storage temperature range Top , Tstg – 40 … + 85 °C Sperrspannung Reverse voltage VR 5 V Vorwärtsgleichstrom Forward current IF 70 mA Stoßstrom, tp = 100 μs, D = 0 Surge current IFSM 700 mA Verlustleistung Power dissipation Ptot 245 mW 300 K/W 140 K/W Wärmewiderstand Sperrschicht - Umgebung bei RthJA Montage auf FR4 Platine, Padgröße je 16 mm2 Thermal resistance junction - ambient mounted on PC-board (FR4), padsize 16 mm2 each Wärmewiderstand Sperrschicht - Lötstelle bei RthJS Montage auf Metall-Block Thermal resistance junction - soldering point, mounted on metal block Kennwerte (TA = 25 °C) Characteristics Bezeichnung Parameter Symbol Symbol Wert Value Einheit Unit Wellenlänge der Strahlung Wavelength at peak emission IF = 70 mA λpeak 860 nm Centroid-Wellenlänge der Strahlung Centroid wavelength IF = 70 mA λcentroid 850 nm Spektrale Bandbreite bei 50% von Imax Spectral bandwidth at 50% of Imax IF = 70 mA Δλ 42 nm Abstrahlwinkel Half angle ϕ ± 60 Grad deg. Aktive Chipfläche Active chip area A 0.09 mm2 2011-03-10 2 SFH 4250S Kennwerte (TA = 25 °C) Characteristics (cont’d) Bezeichnung Parameter Symbol Symbol Wert Value Einheit Unit Abmessungen der aktiven Chipfläche Dimension of the active chip area L×B L×W 0.3 × 0.3 mm² Schaltzeiten, Ie von 10% auf 90% und von 90% auf 10%, bei IF = 70 mA, RL = 50 Ω Switching times, Ιe from 10% to 90% and from 90% to 10%, IF = 70 mA, RL = 50 Ω tr , tf 20,10 ns VF VF 3 (< 3.5) 4 (< 5.2) V V Sperrstrom Reverse current IR not designed for μA reverse operation Gesamtstrahlungsfluss Total radiant flux IF = 70 mA, tp = 20 ms Φe typ 70 mW Temperaturkoeffizient von Ie bzw. Φe, IF = 70 mA Temperature coefficient of Ie or Φe, IF = 70 mA TCI – 0.5 %/K Temperaturkoeffizient von VF, IF = 70 mA Temperature coefficient of VF, IF = 70 mA TCV –2 mV/K Temperaturkoeffizient von λ, IF = 70 mA Temperature coefficient of λ, IF = 70 mA TCλ + 0.3 nm/K Durchlassspannung Forward voltage IF = 70 mA, tp = 20 ms IF = 700 mA, tp = 100 µs 2011-03-10 3 SFH 4250S Strahlstärke Ie in Achsrichtung1) gemessen bei einem Raumwinkel Ω = 0.01 sr Radiant Intensity Ie in Axial Direction at a solid angle of Ω = 0.01 sr Bezeichnung Parameter Symbol Werte Values Einheit Unit SFH 4250S SFH 4250S SFH 4250S -R2 -S -T Strahlstärke Radiant intensity IF = 70 mA, tp = 20 ms Ie min Ie max 12.5 20 16 32 25 50 mW/sr mW/sr Strahlstärke Radiant intensity IF = 700 mA, tp = 25 μs Ie typ 125 185 290 mW/sr 1) Nur eine Gruppe in einer Verpackungseinheit (Streuung kleiner 2:1) / Only one bin in one packing unit (variation lower 2:1) Abstrahlcharakteristik Radiation Characteristics Irel = f (ϕ) 40˚ 30˚ 20˚ 10˚ 0˚ ϕ 50˚ OHL01660 1.0 0.8 0.6 60˚ 0.4 70˚ 0.2 80˚ 0 90˚ 100˚ 1.0 2011-03-10 0.8 0.6 0.4 0˚ 20˚ 40˚ 60˚ 80˚ 4 100˚ 120˚ SFH 4250S Relative Spectral Emission Irel = f (λ) Single pulse, tp = 25 μs OHF04135 100 Ie = f (IF) Ie 70 mA Radiant Intensity Max. Permissible Forward Current IF = f (TA), RthJA = 300 K/W 80 1.E+01 70 I rel % 60 80 1.E+00 I e / I e (70 m A ) 40 IF [m A ] . 50 60 40 1.E-01 30 20 1.E-02 20 10 0 700 1.E-03 1.E+00 750 800 nm 950 850 0.75 IF A IF [m A ] 100 10 1 3 4 VF [V] 5 t tP IF T 0.60 0.55 0.50 D= 0.45 0.005 0.01 0.40 0.02 0.35 0.05 0.30 0.1 0.2 0.25 0.5 0.20 1 0.15 0.10 0.05 0 -5 10 10-4 10-3 10-2 10-1 100 101 s 102 5 40 60 80 100 Permissible Pulse Handling Capability IF = f (τ), TA = 85 °C, duty cycle D = parameter OHF04490 D = TP 20 TA [°C] tp 2011-03-10 0 1.E+03 Permissible Pulse Handling Capability IF = f (τ), TA = 25 °C, duty cycle D = parameter 1000 2 1.E+02 IF [mA] λ Forward Current IF = f (VF) Single pulse, tp = 100 μs 0 1.E+01 0.75 IF A OHF04491 t D = TP tP IF T 0.60 0.55 0.50 D= 0.45 0.005 0.01 0.40 0.02 0.35 0.05 0.30 0.1 0.2 0.25 0.5 0.20 1 0.15 0.10 0.05 0 -5 10 10-4 10-3 10-2 10-1 100 101 s 102 tp SFH 4250S Maßzeichnung Package Outlines Maße in mm (inch) / Dimensions in mm (inch). Gehäuse / Package Power TOPLED®, klarer Verguss / Power TOPLED®, clear resin Anschlussbelegung Pin configuration Kathode: abgeschrägte Ecke Cathode: beveled edge 2011-03-10 6 SFH 4250S Empfohlenes Lötpaddesign Recommended Solder Pad Design Reflow Löten Reflow Soldering Padgeometrie für verbesserte Wärmeableitung 3.3 (0.130) Paddesign for improved heat dissipation 3.3 (0.130) 2.3 (0.091) 11.1 (0.437) 1.5 (0.059) 1.1 (0.043) 3.7 (0.146) 0.8 (0.031) 0.7 (0.028) Cu Fläche / <_ 16 mm 2 per pad Cu-area Lötstoplack Solder resist Empfohlenes Lötpaddesign Recommended Solder Pad Design OHFP3021 Wellenlöten TTW TTW Soldering 2 (0.079) 6.1 (0.240) Bewegungsrichtung der Platine PCB-direction 1 (0.039) 2 (0.079) 2 (0.079) 3 (0.118) 6 (0.236) 2.8 (0.110) 2.8 (0.110) 0.5 (0.020) Cu Fläche / > 16 mm 2 per pad Cu-area Padgeometrie für verbesserte Wärmeableitung Lötstoplack Solder resist Paddesign for improved heat dissipation 2011-03-10 7 OHPY3040 SFH 4250S Lötbedingungen Soldering Conditions Reflow Lötprofil für bleifreies Löten Reflow Soldering Profile for lead free soldering Vorbehandlung nach JEDEC Level 2 Preconditioning acc. to JEDEC Level 2 (nach J-STD-020-D.01) (acc. to J-STD-020-D.01) OHA04525 300 ˚C T 250 Tp 245 ˚C 240 ˚C tP 217 ˚C 200 tL 150 tS 100 50 25 ˚C 0 0 50 100 150 200 250 s 300 t Pb-Free (SnAgCu) Assembly Profile Feature Recommendation Max. Ratings Ramp-up Rate to Preheat* 25°C to 150°C 2°K / sec 3°K / sec Time ts from TSmin to TSmax (150°C to 200°C 100s min. 60sec max. 120sec Ramp-up Rate to Peak*) TSmax to TP 2°K / sec 3°K / sec ) Liquidus Temperture TL 217°C Time tL above TL 80sec max. 100sec Peak Temperature TP 245°C max. 260°C Time tP within 5°C of the specified peak temperature TP - 5K 20sec min. 10sec max. 30sec Ramp-down Rate* TP to 100°C 3°K / sec 6°K / sec maximum Time 25°C to Peak temperature max. 8 min. All temperatures refer to the center of the package, measured on the top of the component * slope calculation ΔT/Δt: Δt max. 5 sec; fulfillment for the whole T-range 2011-03-10 8 SFH 4250S Wellenlöten (TTW) TTW Soldering (nach CECC 00802) (acc. to CECC 00802) OHLY0598 300 C T 10 s 250 Normalkurve standard curve 235 C ... 260 C Grenzkurven limit curves 2. Welle 2. wave 200 1. Welle 1. wave 150 ca 200 K/s 2 K/s 5 K/s 100 C ... 130 C 100 2 K/s 50 Zwangskühlung forced cooling 0 0 50 100 150 200 s 250 t Published by OSRAM Opto Semiconductors GmbH Leibnizstraße 4, D-93055 Regensburg www.osram-os.com © All Rights Reserved. The information describes the type of component and shall not be considered as assured characteristics. Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances. For information on the types in question please contact our Sales Organization. Packing Please use the recycling operators known to you. We can also help you – get in touch with your nearest sales office. By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred. Components used in life-support devices or systems must be expressly authorized for such purpose! Critical components 1 , may only be used in life-support devices or systems 2 with the express written approval of OSRAM OS. 1 A critical component is a component usedin a life-support device or system whose failure can reasonably be expected to cause the failure of that life-support device or system, or to affect its safety or effectiveness of that device or system. 2 Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain and sustain human life. If they fail, it is reasonable to assume that the health of the user may be endangered. 2011-03-10 9