PSEMI PE43601

Product Specification
PE43601
50 Ω RF Digital Attenuator
6-bit, 15.75 dB, 9 kHz - 6.0 GHz
Product Description
The PE43601 is a HaRP™-enhanced, high linearity, 6-bit RF
Digital Step Attenuator (DSA). This highly versatile DSA
covers a 15.75 dB attenuation range in 0.25 dB steps. The
Peregrine 50Ω RF DSA provides a serial-addressable CMOS
control interface. It maintains high attenuation accuracy over
frequency and temperature and exhibits very low insertion loss
and low power consumption. Performance does not change
with VDD due to on-board regulator. This next generation
Peregrine DSA is available in a 5x5 mm 32-lead QFN footprint.
The PE43601 is manufactured on Peregrine’s UltraCMOS™
process, a patented variation of silicon-on-insulator (SOI)
technology on a sapphire substrate, offering the performance
of GaAs with the economy and integration of conventional
CMOS.
Features
• HaRP™-enhanced UltraCMOS™ device
• Attenuation: 0.25 dB steps to 15.75 dB
• High Linearity: Typical +58 dBm IIP3
•
Excellent low-frequency performance
• 3.3 V or 5.0 V Power Supply Voltage
• Fast switch settling time
• Programming Modes:
•
•
•
Direct Parallel
Latched Parallel
Serial-Addressable: Program up to
eight addresses 000 - 111
•
Figure 1. Package Type
Serial Two-Byte Protocol: Address and
Data Word
• High-attenuation state @ power-up (PUP)
32-lead 5x5x0.85 mm QFN Package
• CMOS Compatible
• No DC blocking capacitors required
• Packaged in a 32-lead 5x5x0.85 mm QFN
Figure 2. Functional Schematic Diagram
Switched Attenuator Array
RF Output
RF Input
Parallel Control
6
Serial In
Control Logic Interface
CLK
LE
A0
A1
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A2
P/S
©2008-2009 Peregrine Semiconductor Corp. All rights reserved.
Page 1 of 13
PE43601
Product Specification
Table 1. Electrical Specifications @ +25°C, VDD = 3.3 V or 5.0 V
Parameter
Test Conditions
Frequency
Min
Frequency Range
Typical
Max
9 kHz
Attenuation Range
6 GHz
0.25 dB Step
0 – 15.75
9 kHz ≤ 6 GHz
Insertion Loss
0 dB - 15.75 dB Attenuation settings
0 dB - 15.75 dB Attenuation settings
Attenuation Error
Relative Phase
All States
P1dB (note 1)
Input
IIP3
dB
±(0.2 + 4%)
±(0.4 + 8%)
dB
dB
18
dB
9 kHz - 6 GHz
20
deg
30
20 MHz - 6 GHz
Typical Spurious Value
2.8
9 kHz - 6 GHz
20 MHz - 6 GHz
Two tones at +18 dBm, 20 MHz spacing
dB
2.3
9 kHz < 4 GHz
4 GHz ≤ 6 GHz
Return Loss
Units
1 MHz
Video Feed Through
32
dBm
57
dBm
-110
dBm
10
mVpp
Switching Time
50% CTRL to 10% / 90% RF
650
ns
RF Trise/Tfall
10% / 90% RF
400
ns
Settling Time
RF settled to within 0.05 dB of final value
RBW = 5 MHz, Averaging ON.
4
µs
Note 1. Please note Maximum Operating Pin (50Ω) of +23dBm as shown in Table 3.
Performance Plots
Figure 3. 0.25 dB Step Error vs. Frequency*
200 MHz
3000 MHz
1.00
900 MHz
4000 MHz
1800 MHz
5000 MHz
Figure 4. 0.25dB Attenuation vs. Attenuation
State
Attenuation
2200 MHz
6000 MHz
Attenuation (dB)
dB
Step Error (dB)
0.75
0.50
0.25
0.00
-0.25
0
4
8
12
16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
16
900 MHz
2200 MHz
3800 MHz
5800 MHz
0
1
2
3
4
5
6
7
8
9 10 11 12 13 14 15 16
Attenuation Setting (dB)
Attenuation State
*Monotonicity is held so long as step-error does not cross below -0.25
Figure 5. 0.25 dB Major State Bit Error
0.25dB State
0.5dB State
1dB State
4dB State
8dB State
15.75dB State
Figure 6. 0.25 dB Attenuation Error vs. Frequency
2dB State
1.5
1.0
1.0
Attenuation Error (dB)
1.5
Bit Error (dB)
0.5
0.0
-0.5
-1.0
200 MHz
3000 MHz
900 MHz
4000 MHz
1800 MHz
5000 MHz
2200 MHZ
6000 MHz
0.5
0.0
-0.5
-1.0
-1.5
0
1000
2000
3000
4000
5000
Frequency (MHz)
©2008-2009 Peregrine Semiconductor Corp. All rights reserved.
Page 2 of 13
6000
-1.5
0
4
8
12
Attenuation Setting (dB)
Document No. 70-0253-05
│ UltraCMOS™ RFIC Solutions
16
PE43601
Product Specification
Figure 7. Insertion Loss vs. Temperature
-40C
+25C
Figure 8. Input Return Loss vs. Attenuation:
T =0dB+25C 0.25dB
0.5dB
1dB
+85C
0
2dB
0
-0.5
4dB
8dB
15.75dB
-10
-20
-1.5
Return Loss (dB)
Insertion Loss (dBm)
-1
-2
-2.5
-3
-3.5
-30
-40
-50
-4
-60
-4.5
-5
-70
0
1
2
3
4
5
6
7
8
9
0
1
2
3
4
0dB
2dB
0.25dB
4dB
0.5dB
8dB
1dB
15.75dB
7
8
9
-40C
25C
85C
0
-10
-10
-20
Return Loss (dB)
Return Loss (dB)
6
Figure 10. Input Return Loss vs. Temperature:
15.75 dB State
Figure 9. Output Return Loss vs. Attenuation:
T = +25C
0
5
Frequency (GHz)
Frequency (GHz)
-30
-40
-50
-20
-30
-40
-50
-60
-60
-70
0
1
2
3
4
5
6
7
8
0
9
1
2
3
4
25C
6
7
8
9
Figure 12. Relative Phase vs. Frequency
Figure 11. Output Return Loss vs. Temperature:
15.75 dB State
-40C
5
Frequency (GHz)
Frequency (GHz)
0dB
2dB
85C
0
40
-5
0.25dB
4dB
0.5dB
8dB
1dB
15.75dB
35
Relative Phase Error (Deg)
-10
Return Loss (dB)
-15
-20
-25
-30
-35
30
25
20
15
10
-40
5
-45
0
-50
0
1
2
3
4
5
Frequency (GHz)
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6
7
8
9
0
1
2
3
4
5
6
7
Frequency (GHz)
©2008-2009 Peregrine Semiconductor Corp. All rights reserved.
Page 3 of 13
8
PE43601
Product Specification
Figure 13. Relative Phase vs. Temperature:
15.75 dB State
900 MHz
1800 MHz
Figure 14. Attenuation Error vs. Attenuation
Setting: 900 MHz
+25 C
3000 MHz
10
-40C
+85C
1.5
9
1.0
Attenuation Error (dB)
8
Phase (deg)
7
6
5
4
3
2
0.5
0.0
-0.5
-1.0
1
-1.5
0
-40
-20
0
20
40
60
0
80
4
-40C
+85C
1.5
1.5
1.0
1.0
Attenuation Error (dB)
Attenuation Error (dB)
12
16
Figure 16. Attenuation Error vs. Attenuation
Setting: 3000 MHz
Figure 15. Attenuation Error vs. Attenuation
Setting: 1800 MHz
+25C
8
Attenuation Setting (dB)
Temperature (Deg. C)
0.5
0.0
-0.5
-1.0
+25C
-40C
+85C
0.5
0.0
-0.5
-1.0
-1.5
0
4
8
12
16
Attenuation Setting (dB)
-1.5
0
4
8
12
Attenuation Setting (dB)
Figure 17. Input IP3 vs. Frequency
0dB
0.25dB
0.5dB
1dB
2dB
4dB
8dB
70
65
Input IP3 (dBm)
60
55
50
45
40
35
30
0
1000
2000
3000
4000
5000
6000
7000
Frequency (MHz)
©2008-2009 Peregrine Semiconductor Corp. All rights reserved.
Page 4 of 13
Document No. 70-0253-05
│ UltraCMOS™ RFIC Solutions
16
PE43601
Product Specification
C0.25
C0.5
C1
C2
C4
C8
GND
SI
Figure 18. Pin Configuration (Top View)
32
31
30
29
28
27
26
25
NC
1
24
CLK
VDD
2
23
LE
P/S
3
22
A1
A0
4
21
A2
GND
5
20
GND
GND
6
19
GND
RF1
7
18
RF2
GND
8
17
GND
9
10
11
12
13
14
15
16
GND
GND
GND
GND
GND
GND
GND
GND
Exposed
Solder pad
Electrostatic Discharge (ESD) Precautions
When handling this UltraCMOS™ device, observe the
same precautions that you would use with other ESDsensitive devices. Although this device contains
circuitry to protect it from damage due to ESD,
precautions should be taken to avoid exceeding the
specified rating.
Latch-Up Avoidance
Unlike conventional CMOS devices, UltraCMOS™
devices are immune to latch-up.
Moisture Sensitivity Level
The Moisture Sensitivity Level rating for the PE43601 in
the 32-lead 5x5 QFN package is MSL1.
Switching Frequency
The PE43601 has a maximum 25 kHz switching rate.
Switching rate is defined to be the speed at which the
DSA can be toggled across attenuation states.
Table 2. Pin Descriptions
Pin No.
Pin Name
Description
1
N/C
No Connect
2
VDD
Power supply pin
3
P̅/S
Serial/Parallel mode select
4
A0
Address bit A0 connection
5, 6, 8 - 17,
19, 20, 26
GND
Ground
7
RF1
RF1 port
18
RF2
RF2 port
21
A2
Address bit A2 connection
22
A1
Address bit A1 connection
23
LE
Serial interface Latch Enable input
24
CLK
Serial interface Clock input
25
SI
Serial interface Data input
27
C8 (D5)
Parallel control bit, 8 dB
28
C4 (D4)
Parallel control bit, 4 dB
29
C2 (D3)
Parallel control bit, 2 dB
30
C1 (D2)
Parallel control bit, 1 dB
31
C0.5 (D1)
Parallel control bit, 0.5 dB
32
C0.25 (D0)
Parallel control bit, 0.25 dB
Paddle
GND
Ground for proper operation
Exposed Solder Pad Connection
The exposed solder pad on the bottom of the package
must be grounded for proper device operation.
Note: Ground C0.25, C0.5, C1 C2, C4, C8 if not in use.
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©2008-2009 Peregrine Semiconductor Corp. All rights reserved.
Page 5 of 13
PE43601
Product Specification
Table 3. Operating Ranges
Parameter
VDD Power Supply Voltage
Table 4. Absolute Maximum Ratings
Min
Typ
3.0
3.3
Max
Units
Symbol
V
VDD
VDD Power Supply Voltage
5.0
5.5
V
IDD Power Supply Current
70
350
µA
Digital Input High
2.6
PIN Input power (50Ω):
9 kHz ≤ 20 MHz
20 MHz ≤ 6 GHz
TOP Operating temperature
range
-40
5.5
V
See fig. 19
+23
dBm
dBm
25
85
°C
1
V
15
µA
Parameter/Conditions
Min
Max
Units
Power supply voltage
-0.3
6.0
V
VI
Voltage on any Digital input
-0.3
5.8
V
PIN
Input power (50Ω)
9 kHz ≤ 20 MHz
20 MHz ≤ 6 GHz
See fig. 19
+23
dBm
dBm
TST
Storage temperature range
150
°C
VESD
ESD voltage (HBM)1
ESD voltage (Machine Model)
500
100
V
V
-65
Note: 1. Human Body Model (HBM, MIL_STD 883 Method 3015.7)
Digital Input Low
0
Digital Input Leakage1
Exceeding absolute maximum ratings may cause
permanent damage. Operation should be restricted to
the limits in the Operating Ranges table. Operation
between operating range maximum and absolute
maximum for extended periods may reduce reliability.
Note 1. Input leakage current per Control pin
Figure 19. Maximum Power Handling Capability: Z0 = 50 Ω
30.0
25.0
Pin (dBm)
20.0
15.0
10.0
5.0
0.0
1.0E+03
1.0E+04
1.0E+05
1.0E+06
1.0E+07
1.0E+08
1.0E+09
Hz
©2008-2009 Peregrine Semiconductor Corp. All rights reserved.
Page 6 of 13
Document No. 70-0253-05
│ UltraCMOS™ RFIC Solutions
PE43601
Product Specification
Table 5. Control Voltage
State
Table 8. Address Word Truth Table
Bias Condition
Address Word
A0
Address
Setting
L
L
000
L
H
001
H
L
010
L
H
H
011
H
L
L
100
H
L
H
101
H
H
H
H
L
H
110
111
Low
0 to +1.0 Vdc at 2 µA (typ)
A7
(MSB)
High
+2.6 to +5 Vdc at 10 µA (typ)
X
X
X
X
X
L
X
X
X
X
X
L
X
X
X
X
X
L
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
Table 6. Latch and Clock Specifications
Latch Enable
Shift Clock
X
↑
↑
X
Function
Shift Register Clocked
Contents of shift register
transferred to attenuator core
Table 7. Parallel Truth Table
Parallel Control Setting
A6
A5
A4
A3
A2
A1
Table 9. Serial Attenuation Word Truth Table
Attenuation Word
D1
D0
(LSB)
Attenuation
Setting
RF1-RF2
D5
D4
D3
D2
D1
D0
Attenuation Setting
RF1-RF2
L
L
L
L
L
L
Reference I.L.
L
L
L
L
L
L
L
L
Reference I.L.
L
L
L
L
L
H
0.25 dB
L
L
L
L
L
L
L
H
0.25 dB
L
L
L
L
H
L
0.5 dB
L
L
L
L
L
L
H
L
0.5 dB
L
L
L
H
L
L
1 dB
L
L
L
L
L
H
L
L
1 dB
L
L
H
L
L
L
2 dB
L
L
L
L
H
L
L
L
2 dB
L
H
L
L
L
L
4 dB
L
L
L
H
L
L
L
L
4 dB
H
L
L
L
L
L
8 dB
L
L
H
L
L
L
L
L
8 dB
H
H
H
H
H
H
15.75 dB
L
L
H
H
H
H
H
H
15.75 dB
D7
D6
D5
D4
D3
D2
Table 10. Serial-Addressable Register Map
Bits can either be set to logic high or logic low
D6 and D7 must be set to logic low
MSB (last in)
LSB (first in)
Q15
Q14
Q13
Q12
Q11
Q10
Q9
Q8
Q7
Q6
Q5
Q4
Q3
Q2
Q1
Q0
A7
A6
A5
A4
A3
A2
A1
A0
D7
D6
D5
D4
D3
D2
D1
D0
Address Word
Attenuation Word
Attenuation Word is derived directly from the attenuation value. For example, to program the 12.75 dB state
at address 3:
Address Word: XXXXX011
Attenuation Word: Multiply by 4 and convert to binary → 4 * 12.75 dB → 51 → 00110011
Serial Input: XXXXX01100110011
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©2008-2009 Peregrine Semiconductor Corp. All rights reserved.
Page 7 of 13
PE43601
Product Specification
Programming Options
Parallel/Serial Selection
Either a parallel or serial-addressable interface can
be used to control the PE43601. The P̅/S bit
provides this selection, with P̅/S=LOW selecting the
parallel interface and P̅/S=HIGH selecting the serialaddressable interface.
Parallel Mode Interface
The parallel interface consists of six CMOScompatible control lines that select the desired
attenuation state, as shown in Table 7.
The parallel interface timing requirements are
defined by Fig. 21 (Parallel Interface Timing
Diagram), Table 12 (Parallel Interface AC
Characteristics), and switching speed (Table 1).
For latched-parallel programming the Latch Enable
(LE) should be held LOW while changing attenuation
state control values, then pulse LE HIGH to LOW
(per Fig. 21) to latch new attenuation state into
device.
For direct parallel programming, the Latch Enable
(LE) line should be pulled HIGH. Changing
attenuation state control values will change device
state to new attenuation. Direct Mode is ideal for
manual control of the device (using hardwire,
switches, or jumpers).
Serial-Addressable Interface
The serial-addressable interface is a 16-bit serial-in,
parallel-out shift register buffered by a transparent
latch. The 16-bits make up two words comprised of
8-bits each. The first word is the Attenuation Word,
which controls the state of the DSA. The second
word is the Address Word, which is compared to the
static (or programmed) logical states of the A0, A1
and A2 digital inputs. If there is an address match,
the DSA changes state; otherwise its current state
will remain unchanged. Fig. 20 illustrates an
example timing diagram for programming a state. It
is required that all parallel control inputs be
grounded when the DSA is used in serialaddressable mode.
The serial-addressable interface is controlled using
three CMOS-compatible signals: Serial-In (SI),
Clock (CLK), and Latch Enable (LE). The SI and
CLK inputs allow data to be serially entered into the
©2008-2009 Peregrine Semiconductor Corp. All rights reserved.
Page 8 of 13
shift register. Serial data is clocked in LSB first,
beginning with the Attenuation Word.
The shift register must be loaded while LE is held
LOW to prevent the attenuator value from changing
as data is entered. The LE input should then be
toggled HIGH and brought LOW again, latching the
new data into the DSA. Address word and
attenuation word truth tables are listed in Table 8 &
Table 9, respectively. A programming example of the
Serial-Addressable register is illustrated in Table 10.
The serial-addressable timing diagram is illustrated
in Fig. 20.
Power-up Control Settings
The PE43701 will always initialize to the maximum
attenuation setting (15.75 dB) on power-up for both
the serial-addressable and latched-parallel modes of
operation and will remain in this setting until the user
latches in the next programming word. In directparallel mode, the DSA can be preset to any state
within the 15.75 dB range by pre-setting the parallel
control pins prior to power-up. In this mode, there is
a 400-µs delay between the time the DSA is
powered-up to the time the desired state is
set. During this power-up delay, the device
attenuates to the maximum attenuation setting
(15.75 dB) before defaulting to the user defined
state. If the control pins are left floating in this mode
during power-up, the device will default to the
minimum attenuation setting (insertion loss state).
Dynamic operation between serial-addressable and
parallel programming modes is possible.
If the DSA powers up in serial-addressable mode (P̅/
S = HIGH), all the parallel control inputs DI[6:0] must
be set to logic low. Prior to toggling to parallel mode,
the DSA must be programmed serially to ensure
D[7] is set to logic low.
If the DSA powers up in either latched or directparallel mode, all parallel pins DI[6:0] must be set to
logic low prior to toggling to serial-addressable mode
(P̅/S = HIGH), and held low until the DSA has been
programmed serially to ensure bit D[7] is set to logic
low.
The sequencing is only required once on powerup. Once completed, the DSA may be toggled
between serial-addressable and parallel
programming modes at will.
Document No. 70-0253-05
│ UltraCMOS™ RFIC Solutions
PE43601
Product Specification
Figure 20. Serial-Addressable Timing Diagram
Bits can either be set to logic high or logic low
D[6] and D[7] must be set to logic low
DI[5:0]
TDISU
ADD[2:0]
TDIH
VALID
TASU
TAIH
P/S
TPSSU
TPSIH
D[0]
SI
TSISU
D[1]
D[2]
D[3]
D[4]
D[5]
D[6]
D[7]
A[0]
A[1]
A[2]
TSIH
CLK
TCLKL
TCLKH
TLESU
LE
TLEPW
DO[6:0]
TPD
VALID
Figure 21. Latched-Parallel/Direct-Parallel Timing Diagram
P/S
TPSSU
DI[5:0]
TPSIH
VALID
TDISU
TDIH
LE
TLEPW
DO[5:0]
VALID
TDIPD
TPD
Table 11. Serial-Addressable Interface
AC Characteristics
Table 12. Parallel and Direct Interface
AC Characteristics
VDD = 3.3 or 5.0 V, -40° C < TA < 85° C, unless otherwise specified
VDD = 3.3 or 5.0 V, -40° C < TA < 85° C, unless otherwise specified
Symbol
Parameter
Min
Max
Unit
FCLK
Serial clock frequency
-
10
MHz
TCLKH
Serial clock HIGH time
30
-
ns
TCLKL
Serial clock LOW time
30
-
ns
TLESU
Last serial clock rising edge
setup time to Latch Enable
rising edge
10
-
ns
TLEPW
Latch Enable min. pulse width
30
-
ns
TSISU
Serial data setup time
10
-
ns
TSIH
Serial data hold time
10
-
ns
TDISU
Parallel data setup time
100
-
ns
TDIH
Parallel data hold time
100
-
ns
TASU
Address setup time
100
-
ns
TAH
Address hold time
100
-
ns
TPSSU
Parallel/Serial setup time
100
-
ns
TPSH
Parallel/Serial hold time
100
-
ns
TPD
Digital register delay (internal)
-
10
ns
Document No. 70-0253-05 │ www.psemi.com
Symbol
Parameter
Min
Max
Unit
TLEPW
Latch Enable minimum
pulse width
30
-
ns
TDISU
Parallel data setup time
100
-
ns
TDIH
Parallel data hold time
100
-
ns
TPSSU
Parallel/Serial setup time
100
-
ns
TPSIH
Parallel/Serial hold time
100
-
ns
TPD
Digital register delay
(internal)
-
10
ns
Digital register delay
(internal, direct mode only)
-
5
ns
TDIPD
©2008-2009 Peregrine Semiconductor Corp. All rights reserved.
Page 9 of 13
PE43601
Product Specification
Evaluation Kit
Figure 22. Evaluation Board Layout
The Digital Attenuator Evaluation Kit board was
designed to ease customer evaluation of the
PE43601 Digital Step Attenuator.
Peregrine Specification 101-0312
Direct-Parallel Programming Procedure
For automated direct-parallel programming,
connect the test harness provided with the EVK
from the parallel port of the PC to the J1 & Serial
header pin and set the D0-D5 SP3T switches to
the ‘MIDDLE’ toggle position. Position the
Parallel/Serial (P̅/S) select switch to the Parallel
(or left) position. The evaluation software is
written to operate the DSA in either Parallel or
Serial-Addressable Mode. Ensure that the
software is set to program in Direct-Parallel mode.
Using the software, enable or disable each setting
to the desired attenuation state. The software
automatically programs the DSA each time an
attenuation state is enabled or disabled.
For manual direct-parallel programming,
disconnect the test harness provided with the EVK
from the J1 and Serial header pins. Position the
Parallel/Serial (P̅/S) select switch to the Parallel
(or left) position. The LE pin on the Serial header
must be tied to logic high. Switches D0-D5 are
SP3T switches which enable the user to manually
program the parallel bits. When any input D0-D5
is toggled ‘UP’, logic high is presented to the
parallel input. When toggled ‘DOWN’, logic low is
presented to the parallel input. Setting D0-D5 to
the ‘MIDDLE’ toggle position presents an OPEN,
which forces an on-chip logic low. Table 7 depicts
the parallel programming truth table and Fig. 21
illustrates the parallel programming timing
diagram.
Latched-Parallel Programming Procedure
For automated latched-parallel programming, the
procedure is identical to the direct-parallel
method. The user only must ensure that LatchedParallel is selected in the software.
©2008-2009 Peregrine Semiconductor Corp. All rights reserved.
Page 10 of 13
Note: Reference Fig. 23 for Evaluation Board Schematic
For manual latched-parallel programming, the
procedure is identical to direct-parallel except now
the LE pin on the Serial header must be logic low
as the parallel bits are applied. The user must
then pulse LE from 0V to VDD and back to 0V to
latch the programming word into the DSA. LE
must be logic low prior to programming the next
word.
Serial-Addressable Programming Procedure
Position the Parallel/Serial (P̅/S) select switch to
the Serial (or right) position. Prior to
programming, the user must define an address
setting using the ADD header pin. Jump the
middle pins on the ADD header A0-A2 (or lower)
row of pins to set logic high, or jump the middle
pins to the upper row of pins to set logic low. If
the ADD pins are left open, then 000 become the
default address. The evaluation software is
written to operate the DSA in either Parallel or
Serial-Addressable Mode. Ensure that the
software is set to program in Serial-Addressable
mode. Using the software, enable or disable each
setting to the desired attenuation state. The
software automatically programs the DSA each
time an attenuation state is enabled or disabled.
Document No. 70-0253-05
│ UltraCMOS™ RFIC Solutions
PE43601
Product Specification
Figure 23. Evaluation Board Schematic
Peregrine Specification 102-0381
4
2
1
4
2
1
4
3
3
3
D4
D5
D6
3
D2
D6
3
3
2
1
4
2
1
4
2
1
4
2
1
4
D1
D5
D4
D3
D2
3
5
P/S
_
D1
D0
D0
P/S
D3
_
2
1
6
4
VDD
J1
HEADER 14
2
4
6
8
10
12
14
2
4
6
8
10
12
14
1
3
5
7
9
11
13
D0
1
3
5
7
9
11
13
D1
D2
D3
D4
D5
D6
SERIAL
HEADER 4
CLK 1
2
3
4
SI
LE
CLOCK
SI
LE
GND
VDD
C3
ADD
25
SI
D5
D6
26
C16
D4
6
GND
GND
19
7
RF1
RF2
18
8
GND
GND 17
R2
J5
Z=50 Ohm
C11
0.1uF
C12
CON2
100pf
0 OHM
SMA
1
2
GND
0 OHM
1
2
2
2
27
A2
20
9
1
28
21
VSS
U1
PE43XOX DSA 50 OHM 5X5 MLPQ32
VSS
R1
16
SMA
1
C8
A2
GND
GND
2
J7
Z=50 Ohm
SMA
C4
A0
5
15
De-embeding trace
J6
D2
4
GND
1
D3
A1
GND
Z=50 Ohm
SMA
29
22
A0
J4
30
23
A1
14
C14
100pF
C2
LE
PS
13
C13
100pF
31
VDD
3
GND
C8
100pF
A2_1
A1_1
A0_1
J2
2
GND
100pF
0.1µF
24
P/S
12
C10
A0 VDD
A1 VDD
A2 VDD
HEADER3X3
CLK
VDD
_
C9
11
1
2
GND
C1
1
CP5
100pF
GND
100pF
J3
CON2
10
100pF
100pF
D1
D0
C0
32
C2
CP25
C4
VDD
A0_2
A1_2
A2_2
100pF
100pF
100pF
C6
C1
GND
C5
Note: Pin 26 is grounded. On the PE43601 pin 20 (shown as
VSS) must also be grounded.
Figure 24. Package Drawing
QFN 5x5 mm
A
MAX
0.900
NOM
0.850
MIN
0.800
Document No. 70-0253-05 │ www.psemi.com
©2008-2009 Peregrine Semiconductor Corp. All rights reserved.
Page 11 of 13
PE43601
Product Specification
Figure 25. Tape and Reel Drawing
Tape Feed Direction
Pin 1
Top of
Device
Device Orientation in Tape
Figure 26. Marking Specifications
43601
YYWW
ZZZZZ
YYWW = Date Code
ZZZZZ = Last five digits of Lot Number
Table 13. Ordering Information
Order Code Part Marking
Description
Package
Shipping Method
43601
PE43601 G - 32QFN 5x5mm-75A
Green 32-lead 5x5mm QFN
Bulk or tape cut from reel
PE43601MLI-Z
43601
PE43601 G – 32QFN 5x5mm-3000C
Green 32-lead 5x5mm QFN
3000 units / T&R
EK43601-01
43601
PE43601 – 32QFN 5x5mm-EK
Evaluation Kit
1 / Box
PE43601MLI
©2008-2009 Peregrine Semiconductor Corp. All rights reserved.
Page 12 of 13
Document No. 70-0253-05
│ UltraCMOS™ RFIC Solutions
PE43601
Product Specification
Sales Offices
The Americas
Peregrine Semiconductor Corporation
Peregrine Semiconductor, Asia Pacific (APAC)
9380 Carroll Park Drive
San Diego, CA 92121
Tel: 858-731-9400
Fax: 858-731-9499
Shanghai, 200040, P.R. China
Tel: +86-21-5836-8276
Fax: +86-21-5836-7652
Europe
Peregrine Semiconductor Europe
Bâtiment Maine
13-15 rue des Quatre Vents
F-92380 Garches, France
Tel: +33-1-4741-9173
Fax : +33-1-4741-9173
High-Reliability and Defense Products
Peregrine Semiconductor, Korea
#B-2607, Kolon Tripolis, 210
Geumgok-dong, Bundang-gu, Seongnam-si
Gyeonggi-do, 463-943 South Korea
Tel: +82-31-728-3939
Fax: +82-31-728-3940
Peregrine Semiconductor K.K., Japan
Teikoku Hotel Tower 10B-6
1-1-1 Uchisaiwai-cho, Chiyoda-ku
Tokyo 100-0011 Japan
Tel: +81-3-3502-5211
Fax: +81-3-3502-5213
Americas
San Diego, CA, USA
Phone: 858-731-9475
Fax: 848-731-9499
Europe/Asia-Pacific
Aix-En-Provence Cedex 3, France
Phone: +33-4-4239-3361
Fax: +33-4-4239-7227
For a list of representatives in your area, please refer to our Web site at: www.psemi.com
Data Sheet Identification
Advance Information
The product is in a formative or design stage. The data
sheet contains design target specifications for product
development. Specifications and features may change in
any manner without notice.
Preliminary Specification
The data sheet contains preliminary data. Additional data
may be added at a later date. Peregrine reserves the right
to change specifications at any time without notice in order
to supply the best possible product.
Product Specification
The data sheet contains final data. In the event Peregrine
decides to change the specifications, Peregrine will notify
customers of the intended changes by issuing a CNF
(Customer Notification Form).
Document No. 70-0253-05 │ www.psemi.com
The information in this data sheet is believed to be reliable.
However, Peregrine assumes no liability for the use of this
information. Use shall be entirely at the user’s own risk.
No patent rights or licenses to any circuits described in this
data sheet are implied or granted to any third party.
Peregrine’s products are not designed or intended for use in
devices or systems intended for surgical implant, or in other
applications intended to support or sustain life, or in any
application in which the failure of the Peregrine product could
create a situation in which personal injury or death might occur.
Peregrine assumes no liability for damages, including
consequential or incidental damages, arising out of the use of
its products in such applications.
The Peregrine name, logo, and UTSi are registered trademarks
and UltraCMOS, HaRP, MultiSwitch and DuNE are trademarks
of Peregrine Semiconductor Corp.
©2008-2009 Peregrine Semiconductor Corp. All rights reserved.
Page 13 of 13