RICHTEK RT9108NL

®
RT9108NL
9W Stereo Class-D Audio Power Amplifier
General Description
Features
The RT9108NL is a high efficiency Class D stereo audio
amplifier for driving Bridge Tied Load (BTL) speakers. The
RT9108NL can drive stereo speakers with load as low as
4Ω. Its high efficiency eliminates the need for an extra
heat sink when playing music. The gain of the amplifier
can be controlled by two gain select pins. The outputs
are fully protected against shorts to GND, PVCC, and
z
output to output with an auto recovery feature and
monitored output.
z
Ordering Information
Applications
RT9108NL
Note :
z
z
z
z
z
z
8V to 16V Input Supply Range
9W/CH into an 8Ω
Ω Load from 12V Supply at 10%
THD+N
88% Efficiency Eliminates Need for Heat Sinks
Four Selectable or Fixed Gain Settings
Robust Pin-to-Pin Short Circuit Protection
Thermal Protection with Auto Recovery Option
Surface Mount TSSOP-28 (Exposed Pad) Package
RoHS Compliant and Halogen Free
z
LCD-TV
Package Type
CP : TSSOP-28 (Exposed Pad-Option 3)
z
Monitors
DVD Players
Lead Plating System
Z : ECO (Ecological Element with
Halogen Free and Pb free)
Pin Configurations
z
(TOP VIEW)
Richtek products are :
`
SD
FAULT
LINP
LINN
GAIN0
GAIN1
AVCC
AGND
GVDD
PLIMIT
RINN
RINP
NC
MUTE
RoHS compliant and compatible with the current requirements of IPC/JEDEC J-STD-020.
`
Suitable for use in SnPb or Pb-free soldering processes.
Marking Information
RT9108NLZCP : Product Number
RT9108NL
ZCPYMDNN
YMDNN : Date Code
28
2
27
3
26
4
25
5
24
6
7
8
23
AGND
22
21
9
20
10
19
11
18
12
17
13
14
29
16
15
PVCCL
NC
BSPL
OUTPL
PGND
OUTNL
BSNL
BSNR
OUTNR
PGND
OUTPR
BSPR
NC
PVCCR
TSSOP-28 (Exposed Pad)
Simplified Application Circuit
RT9108NL
PVCC
PVCCx
LINP
Audio
Source
BSPL
OUTPL
PGND
OUTNL
FB
GAIN0
GAIN0
BSNL
FB
GAIN1
BSNR
OUTNR
FB
GAIN1
RINP
PGND
OUTPR
BSPR
FB
AGND
Copyright © 2012 Richtek Technology Corporation. All rights reserved.
DS9108NL-01
June 2012
is a registered trademark of Richtek Technology Corporation.
www.richtek.com
1
RT9108NL
Functional Pin Description
Pin No.
1
2
Pin Name
SD
FAULT
Pin Function
Shutdown Logic Input for Audio Amp (High = outputs enabled). TTL logic levels
with compliance to AVCC.
Open Drain Output used to Display Short Circuit Fault Status. Voltage compliant
to AVCC. Short circuit faults can be set to auto recovery by connecting FAULT pin
to SD pin.
3
LINP
Positive Audio Input for Left Channel. Biased at 2V.
4
LINN
Negative Audio Input for Left Channel. Biased at 2V.
5
GAIN0
Gain Select Least Significant Bit.
6
GAIN1
Gain Select Most Significant Bit.
7
AVCC
Analog Supply Input.
8,
AGND
29 (Exposed Pad)
Analog Ground. Connect to the thermal pad. The exposed pad must be soldered
to a large PCB and connected to AGND for maximum power dissipation.
9
10
GVDD
PLIMIT
High Side FET Gate Drive Supply. Nominal voltage is 4.6V.
Power Limit Level Adjustment.
11
RINN
Negative Audio Input for Right Channel. Biased at 2V.
12
RINP
Positive Audio Input for Right Channel. Biased at 2V.
NC
No Internal Connection.
14
MUTE
Mute Logic Input for Audio Amp (Low = outputs enabled).
15
PVCCR
Power Supply Input for Right Channel H-Bridge. Right channel and left channel
power supply inputs are connected internally.
17
BSPR
Bootstrap I/O for Right Channel. Positive high side FET.
18
OUTPR
Class-D H-Bridge Positive Output for Right Channel.
PGND
Power Ground for H-Bridges.
20
OUTNR
Class-D H-Bridge Negative Output for Right Channel.
21
BSNR
Bootstrap I/O for Right Channel. Negative high side FET.
22
BSNL
Bootstrap I/O for Left Channel. Negative high side FET.
23
OUTNL
Class-D H-Bridge Negative Output for Left Channel.
25
OUTPL
Class-D H-Bridge Positive Output for Left Channel.
26
BSPL
Bootstrap I/O for Left Channel. Positive high side FET.
28
PVCCL
Power Supply Input for Left Channel H-Bridge. Right channel and left channel
power supply inputs are connected internally.
13, 16, 27
19, 24
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is a registered trademark of Richtek Technology Corporation.
DS9108NL-01
June 2012
RT9108NL
Function Block Diagram
SD
PVCCL
GVDD
VDDP
FAULT
BSNL
DRIVER
OUTNL
BSPL
PLIMIT
DRIVER
OUTPL
LINN
PGND
LINP
Modulator
PVCCR
VDDP
RINN
BSNR
RINP
DRIVER
OUTNR
BSPR
DRIVER
OUTPR
MUTE
GAIN0
PGND
GAIN
Control
GAIN1
AVCC
UVLO
OVP
OTP
OCP
AGND
Copyright © 2012 Richtek Technology Corporation. All rights reserved.
DS9108NL-01
June 2012
is a registered trademark of Richtek Technology Corporation.
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3
RT9108NL
Operation
The RT9108NL is a 9W (per channel) efficient Class-D
audio power amplifier for driving bridged-tied stereo
speakers. The RT9108NL uses the three-level modulation
scheme (BD model) that allows operation without the
classic LC reconstruction filter when the amplifier drives
is driving an inductive load. The internal close-loop
modulator enables the negative error feedback, which
improves the THD+N of output signal.
An adjustable power limiter is included in the modulator
to protect the load speaker. The adjustable power limiter
allows the user to set a “virtual” voltage rail lower than
the chip supply to limit the amount of current through the
speaker.
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RT9108NL has protection from over current conditions
caused by a short circuit on the output stage. The short
circuit protection fault is reported on the FAULT pin as a
low state. The amplifier outputs are switched to a Hi-Z
state when the short circuit protection latch is engaged.
The latch can be cleared by cycling the SD pin through
the low state. If automatic recovery from the short circuit
protection latch is desired, connect the FAULT pin directly
to the SD pin. This allows the FAULT pin function to
automatically drive the SD pin low which clears the shortcircuit protection latch.
The RT9108NL can drive stereo speakers as low as 4Ω.
The high efficiency of the RT9108NL, 88%, eliminates the
need for an external heat sink when playing music.
is a registered trademark of Richtek Technology Corporation.
DS9108NL-01
June 2012
RT9108NL
Absolute Maximum Ratings
z
z
z
z
z
z
z
z
z
z
z
(Note 1)
Supply Input Voltage, PVCCL, PVCCR, AVCC ------------------------------------------------------Input Voltage, SD, GAIN0, GAIN1, FAULT -------------------------------------------------------------Output Voltage, OUTPR, OUTPL, OUTNR, OUTNL -------------------------------------------------Bootstrap Voltage, BSPR, BSPL, BSNR, BSNL ----------------------------------------------------Other Pins -----------------------------------------------------------------------------------------------------Power Dissipation, PD @ TA = 25°C
TSSOP-28 (Exposed pad) ---------------------------------------------------------------------------------Package Thermal Resistance (Note 2)
TSSOP-28 (Exposed pad), θJA ---------------------------------------------------------------------------TSSOP-28 (Exposed pad), θJC --------------------------------------------------------------------------Junction Temperature ---------------------------------------------------------------------------------------Lead Temperature (Soldering, 10 sec.) -----------------------------------------------------------------Storage Temperature Range ------------------------------------------------------------------------------ESD Susceptibility (Note 3)
HBM (Human Body Model) --------------------------------------------------------------------------------MM (Machine Model) ----------------------------------------------------------------------------------------
Recommended Operating Conditions
z
z
z
−0.3V to 22V
−0.3V to (AVCC + 0.3V)
−0.3V to (PVCCx + 0.3V)
−0.3V to (PVCCx + GVDD)
−0.3V to (GVDD + 0.3V)
3.571W
28°C/W
7°C/W
150°C
260°C
−65°C to 150°C
2kV
200V
(Note 4)
Supply Input Voltage, PVCC ------------------------------------------------------------------------------- 8V to 16V
Junction Temperature Range ------------------------------------------------------------------------------- −40°C to 125°C
Ambient Temperature Range ------------------------------------------------------------------------------- −40°C to 85°C
Electrical Characteristics
(PVCCx = 12V, RL = 8Ω, TA = 25°C, unless otherwise specified)
Parameter
SD, GAIN0,
GAIN1, MUTE
Input Voltage
Symbol
Test Conditions
Min
Typ
Max
Logic-High
VIH
3
--
--
Logic-Low
VIL
--
--
0.8
Unit
V
Low Level Output Voltage
VOL
FAULT, RPULL-UP = 100kΩ
--
--
0.8
V
High Level Input Current
IIH
SD, GAIN0, GAIN1, MUTE, VI = 3V
--
--
50
μA
Low Level Input Current
IIL
SD, GAIN0, GAIN1, MUTE, VI = 0.8V
--
--
10
μA
|VOS |
VI = 0V, Gain = 36dB
--
5
30
mV
IQ
VSD = 3V, no load
--
20
50
mA
IQ_SD
VSD = 0.8V, no load
--
250
400
μA
RDS(ON)
IO = 500mA, TJ =
25°C
High Side
Low Side
---
250
250
---
mΩ
VGAIN0 = 0.8V
19
20
21
VGAIN0 = 3V
25
26
27
VGAIN0 = 0.8V
31
32
33
VGAIN0 = 3V
35
36
37
Class-D Output Offset Voltage
(measured differentially)
Quiescent Supply Current
Quiescent Supply Current in
Shutdown Mode
Drain-Source On-State
Resistance
VGAIN1 = 0.8V
Gain
G
VGAIN1 = 3V
Copyright © 2012 Richtek Technology Corporation. All rights reserved.
DS9108NL-01
June 2012
dB
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RT9108NL
Parameter
PVCC Over Voltage
Lockout
Turn-On Time
Symbol
PVCC_OV
tON
Turn-Off Time
Min
Typ
Max
Unit
--
18
--
V
VSD = 3V
--
50
--
ms
tOFF
VSD = 0.8V
--
2
--
ms
Gate Drive Supply
VGVDD
IGVDD = 2mA
4.2
4.6
5
V
Power Supply Ripple
Rejection
PSRR
200mVPP ripple at 1kHz, Gain = 20dB,
Inputs ac-coupled to AGND
--
−60
--
dB
Continuous Output Power
PO
THD + N = 10%, fIN = 1kHz, PVCC = 13V
--
10
--
W
Total Harmonic Distortion +
Noise
THD + N
--
0.15
--
%
Output Integrated Noise
VN
----
120
−80
−80
----
μV
dBV
dB
--
95
--
dB
Crosstalk
Test Conditions
fIN = 1kHz, PO = 7.5W (half-power),
R L = 8Ω
20Hz to 22kHz, A-weighted filter,
Gain = 20dB
VO = 1VRMS, Gain = 20dB, fIN = 1kHz
Maximum output at THD + N < 1%,
fIN = 1kHz, Gain = 20dB, A-weighted
filter
Signal-to-Noise Ratio
SNR
Oscillator Frequency
fOSC
220
300
380
kHz
Thermal Trip Point
TSD
--
150
--
°C
Thermal Hysteresis
ΔTSD
--
15
--
°C
Note 1. Stresses beyond those listed “Absolute Maximum Ratings” may cause permanent damage to the device. These are
stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in
the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions may
affect device reliability.
Note 2. θJA is measured at TA = 25°C on a low effective thermal conductivity single-layer test board per JEDEC 51-3. θJC is
measured at the exposed pad of the package.
Note 3. Devices are ESD sensitive. Handling precaution is recommended.
Note 4. The device is not guaranteed to function outside its operating conditions.
Copyright © 2012 Richtek Technology Corporation. All rights reserved.
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is a registered trademark of Richtek Technology Corporation.
DS9108NL-01
June 2012
RT9108NL
Typical Application Circuit
PVCC
RT9108NL
PVCC
PVCCL
28
100k
1k
SD
1
SD
2
FAULT
3
LINP
0.22µF
0.22µF
4
5
GAIN0
6
GAIN1
PVCC
10
Audio
Source
1µF
7
8,
29 (Exposed Pad)
9
1µF
10
0.22µF
0.22µF
LINN
GAIN0
100µF
BSPL
AGND
GVDD
12
FB
1nF
1nF
FB
0.22µF
GAIN1
AVCC
1nF
0.22µF
25
OUTPL
24
PGND
23
OUTNL
22
BSNL
21
BSNR
20
OUTNR
19
PGND
18
OUTPR
17
BSPR
0.22µF
FB
1nF
1nF
FB
0.22µF
PLIMIT
PVCC
PVCCR
11
26
0.1µF
15
100µF
RINN
RINP
MUTE 14
0.1µF
1nF
0.1µF
1nF
MUTE
Figure 1. Typical Application Circuit
PVCC
PVCC
RT9108NL
PVCCL
28
100k
1k
SD
1
SD
2
FAULT
3
LINP
0.22µF
0.22µF
4
5
GAIN0
6
GAIN1
PVCC
10
Audio
Source
1µF
7
8,
29 (Exposed Pad)
9
1µF
10
0.22µF
0.22µF
LINN
GAIN0
100µF
BSPL
AGND
GVDD
12
22µH
0.47µF
22µH
21
BSNR
20
OUTNR
19
PGND
18
OUTPR
17
BSPR
0.22µF
22µH
0.47µF
22µH
0.47µF
0.22µF
PLIMIT
PVCC
15
100µF
RINN
RINP
0.47µF
0.22µF
GAIN1
AVCC
0.22µF
25
OUTPL
24
PGND
23
OUTNL
22
BSNL
PVCCR
11
26
MUTE 14
0.1µF
1nF
MUTE
Figure 2. Typical LC Output Filter
Copyright © 2012 Richtek Technology Corporation. All rights reserved.
DS9108NL-01
June 2012
is a registered trademark of Richtek Technology Corporation.
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7
RT9108NL
Typical Operating Characteristics
Efficiency vs. Output Power
100
90
90
80
80
70
70
Efficiency (%)
Efficiency (%)
Efficiency vs. Output Power
100
60
50
40
30
20
60
50
40
30
20
ZL = 4Ω, LC Filter = 22μH + 0.47μF,
PVCC = 12V, f = 1kHz, Gain = 20dB
10
ZL = 8Ω, LC Filter = 22μH + 0.47μF,
PVCC = 12V, f = 1kHz, Gain = 20dB
10
0
0
0
1
2
3
4
5
6
7
8
9
10
0
1
2
3
Output Power (W)
2
1
0.5
2
1
0.5
1kHz
0.2
0.1
10kHz
20Hz
0.002
PVCC = 12V, RL = 4Ω, Gain = 20dB
0.001
10m 20m 50m 100m 200m
1
2
5 10 20
20Hz
Output Power (W)
2
1
0.5
1W
THD+N (%)
THD+N (%)
THD+N vs. Frequency
2
1
0.5
10W
5W
PVCC = 12V, RL = 4Ω, Gain = 20dB
500 1k
2k
5k
10k 20k
Frequency (Hz)
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8
10
0.002
PVCC = 12V, RL = 8Ω, Gain = 20dB
0.001
10m 20m 50m 100m 200m
1
2
5 10 20
10
5
100 200
9
10kHz
THD+N vs. Frequency
50
8
1kHz
0.05
0.02
0.01
0.005
10
5
0.002
0.001
20
7
0.2
0.1
Output Power (W)
0.05
0.02
0.01
0.005
6
THD+N vs. Output Power
20
10
5
THD+N (%)
THD+N (%)
THD+N vs. Output Power
0.2
0.1
5
Output Power (W)
20
10
5
0.05
0.02
0.01
0.005
4
7W
0.2
0.1
0.05
0.02
0.01
0.005
0.002
0.001
20
0.5W
1W
PVCC = 12V, RL = 8Ω, Gain = 20dB
50
100 200
500 1k
2k
5k
10k 20k
Frequency (Hz)
is a registered trademark of Richtek Technology Corporation.
DS9108NL-01
June 2012
RT9108NL
Output Power vs. Supply Voltage
Crosstalk vs. Frequency
30
-20
-30
25
Output Power (W)
-40
Crosstalk (dB)
-50
-60
-70
-80
R to L
-90
-100
-110
15
THD + N = 10%
10
THD + N = 1%
5
L to R
-120
-130
20
PVCC = 12V, RL = 8Ω, Gain = 20dB
ZL = 8Ω + 66μH, Gain = 20dB, Stereo Out
0
20
50 100 200
500
1k
2k
5k
10k 20k
Frequency (Hz)
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DS9108NL-01
June 2012
8
10
12
14
16
Supply Power (V)
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9
RT9108NL
Application Information
Amplifier Gain Setting
The gain of the RT9108NL amplifier can be set by two
input terminals, GAIN0 and GAIN1, shown as Table 1.
The gain setting is realized by changing the taps on the
input resistors and feedback resistors inside the amplifier.
This causes the input impedance (ZI) to be dependent on
the gain setting. The actual gain settings are controlled
by the ratios of the resistors, so the gain variation from
part-to-part is small. However, the input impedance from
part-to-part at the same gain may shift by ±20% due to
shifts in the actual resistance of the input resistor.
GAIN1
0
0
1
1
Table 1. Gain Setting
Amplifier
Input Impedance
GAIN (dB)
(Ω)
GAIN0
Typ
Typ
0
20
100k
1
0
1
26
32
36
50k
25k
12.5k
SD Operation
The RT9108NL employs a shutdown mode operation
designed to reduce supply current (ICC) to the absolute
minimum level for power saring. The SD input terminal
should be held high (see specification table for trip point)
in normal operation. Pulling SD low causes the outputs
to mute and the amplifier to enter a low current state.
Leaving SD floating will cause the, amplifier operation to
be unpredictable. Never leave SD pin unconnected!
For the best power off pop performance, tarn off the
amplifier in the shutdown mode prior to removing the power
supply voltage.
GVDD Supply
The GVDD Supply is used to supply the gate drivers for
the output full bridge transistors. Connect a 1μF capacitor
from this pin to ground. The typical GVDD output voltage
is 4.6V.
Power LIMIT
The voltage at pin 10 can used to limit the power to levels
below the supply rail. Add a resistor divider from GVDD to
ground to set the voltage at the PLIMLT pin. An external
reference may also be used if tighter tolerance is required.
Also add a 1μF capacitor from pin 10 to ground.
There are five steps to sets a limit on the output peak-topeak voltage. The limiting is done by limiting the duty
cycle to fixed maximum value. PLIMIT pin directly connect
to GVDD for no power limit.
2
Output Power = PVCC × ( Width_Factor )
RL × 1.35
Table 2. PLIMIT Width Limit
PLIMIT Voltage (V)
4.6 (GVDD)
2.7 to 2.9
2.3 to 2.5
1.9 to 2.1
1.6 to 1.7
1.2 to 1.3
Width_Factor
1
0.765
0.578
0.410
0.265
0.149
Table 3. Typical PLIMIT Operation at 12V Power Supply
PVCC = 12V,
VIN = 1.5VRMS ,RL=8Ω
PLIMIT Voltage (V)
Gain = 20dB
Gain = 26dB
Gain = 32dB
Output Power (W) Output Power (W) Output Power (W)
Gain = 36dB
Output Power (W)
4.6 (GVDD)
11.6
13.3
14
14.3
2.7 to 2.9
9.13
10.2
10.7
10.8
2.3 to 2.5
7.01
7.67
7.95
8.2
1.9 to 2.1
5.07
5.36
5.47
5.6
1.6 to 1.7
3.36
3.43
3.55
3.6
1.2 to 1.3
1.95
1.97
1.98
2
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is a registered trademark of Richtek Technology Corporation.
DS9108NL-01
June 2012
RT9108NL
The RT9108NL has protection from over current conditions
caused by a short circuit on the output stage. The short
circuit protection fault is reported on the FAULT pin as a
low state. The amplifier outputs are switched to a Hi-Z
state when the short circuit protection latch is engaged.
The latch can be cleared by cycling the SD pin through
the low state.
If automatic recovery from the short circuit protection latch
is desired, connect the FAULT pin directly to the SD pin.
This allows the FAULT pin function to automatically drive
the SD pin low which clears the short-circuit protection
latch.
Thermal Protection
Thermal protection on the RT9108NL prevents damage
to the device when the internal die temperature exceeds
150°C. There is a ±15°C tolerance on this trip point from
device to device. Once the die temperature exceeds the
thermal set point, the device enters shutdown state and
the outputs are disabled. This is not a latched fault. The
thermal fault is cleared once the temperature of the die is
reduced by 15°C. The device begins normal operation at
this point with no external system interaction.
Thermal protection faults are NOT reported on the FAULT
terminal.
For recommended operating condition specifications, the
maximum junction temperature is 125°C. The junction to
ambient thermal resistance, θJA, is layout dependent. For
TSSOP-28 (Exposed Pad) package, the thermal
resistance, θJA, is 28°C/W on a standard JEDEC 51-3
single-layer thermal test board. The maximum power
dissipation at TA = 25°C can be calculated by the following
formula :
PD(MAX) = (125°C − 25°C) / (28°C/W) = 3.571W for
TSSOP-28 (Exposed Pad) package
The maximum power dissipation depends on the operating
ambient temperature for fixed T J (MAX) and thermal
resistance, θJA. The derating curve in Figure 3 allows the
designer to see the effect of rising ambient temperature
on the maximum power dissipation.
4.0
Maximum Power Dissipation (W)1
Short Circuit Protection and Automatic Recovery
Single-Layer PCB
3.6
3.2
2.8
2.4
2.0
1.6
1.2
0.8
0.4
0.0
0
25
50
75
100
125
Ambient Temperature (°C)
Thermal Considerations
For continuous operation, do not exceed absolute
maximum junction temperature. The maximum power
dissipation depends on the thermal resistance of the IC
package, PCB layout, rate of surrounding airflow, and
difference between junction and ambient temperature. The
maximum power dissipation can be calculated by the
following formula :
Figure 3. Derating Curve of Maximum Power Dissipation
PD(MAX) = (TJ(MAX) − TA) / θJA
where TJ(MAX) is the maximum junction temperature, TA is
the ambient temperature, and θJA is the junction to ambient
thermal resistance.
Copyright © 2012 Richtek Technology Corporation. All rights reserved.
DS9108NL-01
June 2012
is a registered trademark of Richtek Technology Corporation.
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11
RT9108NL
Layout Considerations
`
For the best performance of the RT9108NL, the below
PCB Layout guidelines must be strictly followed.
Keep the differential output traces as wide and short as
possible.
`
The traces of (LINP & LINN, RINP & RINN) and (OUTPL
& OUTNL, OUTPR & OUTNR) should be kept equal width
and length respectively.
`
The thermal pad must be soldered to the PCB for proper
thermal performance and optimal reliability. The
dimensions of the thermal pad and thermal land should
be larger for application. The vias should connect to a
solid copper plane, either on an internal layer or on the
bottom layer of the PCB.
`
Place the decoupling capacitors as close as possible
to the AVCC, PVCCL, PVCCR and GND pins. For
achieving a good quality, consider adding a small, good
performance low ESR ceramic capacitor between 220
pF and 1000pF and a larger mid-frequency capacitor
between 0.1μF and 1μF to the PVCC pins of the chip.
Do not trace out the NC pins (Pin13, 16 and Pin27) to
avoid the pin short issue.
GND
The decoupling
capacitor (CS)
must be placed
as close to the
IC as possible
SD
FAULT
LINP
Audio
CIN
Input
LINN
GAIN0
GAIN1
PVCC
CS AVCC
AGND
GVDD
GND
CG
PLIMIT
RINN
Audio
CIN
Input
RINP
NC
MUTE
28
2
27
3
26
4
25
5
24
6
23
7
8
AGND
22
21
9
20
10
19
11
18
12
17
13
14
29
16
15
CS
PVCCL
NC
BSPL
OUTPL
PGND
OUTNL
BSNL
BSNR
OUTNR
PGND
OUTPR
BSPR
NC
PVCCR
CS
CB
Do not
trace out
The decoupling
capacitor (CS)
must be placed
as close to the
IC as possible
FB
GND
FB
CB
CB
FB
GND
FB
Do not
trace out
GND
The decoupling
capacitor (CS)
must be placed
as close to the
IC as possible
Figure 4. PCB Layout Guide
Copyright © 2012 Richtek Technology Corporation. All rights reserved.
www.richtek.com
12
is a registered trademark of Richtek Technology Corporation.
DS9108NL-01
June 2012
RT9108NL
Outline Dimension
Dimensions In Millimeters
Symbol
Dimensions In Inches
Min
Max
Min
Max
A
1.000
1.200
0.039
0.047
A1
0.000
0.150
0.000
0.006
A2
0.800
1.050
0.031
0.041
b
0.190
0.300
0.007
0.012
D
9.600
9.800
0.378
0.386
e
0.650
0.026
E
6.300
6.500
0.248
0.256
E1
4.300
4.500
0.169
0.177
L
0.450
0.750
0.018
0.030
U
4.410
5.510
0.174
0.217
V
2.400
3.000
0.094
0.118
U
5.500
6.170
0.217
0.243
V
1.600
2.210
0.063
0.087
U
5.800
6.200
0.228
0.244
V
2.600
3.000
0.102
0.118
Option 1
Option 2
Option 3
28-Lead TSSOP (Exposed Pad) Plastic Package
Richtek Technology Corporation
5F, No. 20, Taiyuen Street, Chupei City
Hsinchu, Taiwan, R.O.C.
Tel: (8863)5526789
Richtek products are sold by description only. Richtek reserves the right to change the circuitry and/or specifications without notice at any time. Customers should
obtain the latest relevant information and data sheets before placing orders and should verify that such information is current and complete. Richtek cannot
assume responsibility for use of any circuitry other than circuitry entirely embodied in a Richtek product. Information furnished by Richtek is believed to be
accurate and reliable. However, no responsibility is assumed by Richtek or its subsidiaries for its use; nor for any infringements of patents or other rights of third
parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Richtek or its subsidiaries.
DS9108NL-01
June 2012
www.richtek.com
13