STMICROELECTRONICS STL6N2VH5

STL6N2VH5
N-channel 20 V, 0.025 Ω typ., 6 A STripFET™ V
Power MOSFET in PowerFLAT™ 2x2 package
Datasheet − preliminary data
Features
Order code VDSS
STL6N2VH5 20 V
RDS(on) max.
ID
PTOT
2
0.03 Ω (VGS=4.5 V)
6 A 2.4 W
0.04 Ω (VGS=2.5 V)
■
Very low switching gate charge
■
Very low thermal resistance
■
Conduction losses reduced
■
Switching losses reduced
■
2.5 V gate drive
■
Very low threshold device
3
6
1
5
2
4
3
PowerFLAT™ 2x2
Figure 1.
Applications
■
1
Internal schematic diagram
2(D)
1(D)
Switching applications
3(G)
Description
This device is an N-channel Power MOSFET
developed using STMicroelectronics’
STripFET™V technology. The device has been
optimized to achieve very low on-state resistance,
contributing to an FOM that is among the best in
its class.
D
6(D)
S
5(D)
4(S)
AM11269v1
Table 1.
Device summary
Order code
Marking
Package
Packaging
STL6N2VH5
STD1
PowerFLAT™ 2x2
Tape and reel
January 2013
Doc ID 023150 Rev 2
This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to
change without notice.
1/12
www.st.com
12
Contents
STL6N2VH5
Contents
1
Electrical ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
2
Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
3
Test circuits
4
Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
5
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
2/12
.............................................. 6
Doc ID 023150 Rev 2
STL6N2VH5
1
Electrical ratings
Electrical ratings
Table 2.
Absolute maximum ratings
Symbol
Parameter
Value
Unit
VDS
Drain-source voltage
20
V
VGS
Gate-source voltage
±8
V
ID(1)
Drain current (continuous) at Tpcb = 25 °C
6
A
ID (1)
Drain current (continuous) at Tpcb = 100 °C
3.75
A
Drain current (pulsed)
24
A
Total dissipation at Tpcb = 25 °C
2.4
W
Operating junction temperature
Storage temperature
-55 to 150
°C
Value
Unit
52
°C/W
IDM
(1),(2)
PTOT
(1)
TJ
Tstg
1. The value is rated according Rthj-pcb
2. Pulse width limited by safe operating area.
Table 3.
Symbol
Rthj-pcb (1)
Thermal resistance
Parameter
Thermal resistance junction-pcb
1. When mounted on FR-4 board of 1inch², 2oz Cu, t < 10 sec
Doc ID 023150 Rev 2
3/12
Electrical characteristics
2
STL6N2VH5
Electrical characteristics
(TCASE = 25 °C unless otherwise specified)
Table 4.
Symbol
Parameter
Test conditions
Drain-source breakdown
voltage
ID = 250 µA, VGS = 0
IDSS
Zero gate voltage drain
current (VGS = 0)
VDS = 20 V,
VDS = 20 V, TJ = 125 °C
IGSS
Gate body leakage current
(VDS = 0)
VGS = ±8 V
VGS(th)
Gate threshold voltage
VDS = VGS, ID = 250 µA
RDS(on)
Static drain-source onresistance
VGS = 4.5 V, ID = 3 A
VGS =2.5 V, ID = 3 A
V(BR)DSS
Table 5.
Symbol
Min.
Typ.
Max.
20
Unit
V
1
10
µA
µA
±100
nA
0.7
V
0.025
0.031
0.03
0.04
Ω
Ω
Min.
Typ.
Max.
Unit
Dynamic
Parameter
Test conditions
Ciss
Coss
Crss
Input capacitance
Output capacitance
Reverse transfer
capacitance
VDS = 16 V, f=1 MHz,
VGS=0
-
550
110
16
-
pF
pF
pF
Qg
Qgs
Qgd
Total gate charge
Gate-source charge
Gate-drain charge
VDD = 10 V, ID = 6 A
VGS = 4.5 V
(see Figure 3)
-
6
TBD
TBD
-
nC
nC
nC
Table 6.
Switching times
Symbol
Parameter
td(on)
tr
td(off)
tf
4/12
On/off states
Turn-on delay time
Rise time
Turn-off delay time
Fall time
Test conditions
VDD= 10 V, ID = 3 A,
RG = 4.7 Ω, VGS = 4.5 V
(see Figure 2)
Doc ID 023150 Rev 2
Min.
Typ.
-
TBD
TBD
TBD
TBD
Max.
Unit
-
ns
ns
ns
ns
STL6N2VH5
Electrical characteristics
Table 7.
Symbol
Parameter
Test conditions
Min
Typ.
Max
Unit
Source-drain current
-
6
A
(1)
Source-drain current (pulsed)
-
24
A
(2)
Forward on voltage
ISD = 6 A, VGS = 0
-
1.1
V
Reverse recovery time
Reverse recovery charge
Reverse recovery current
ISD = 6 A,
di/dt = 100 A/µs,
VDD= 16 V, TJ = 150 °C
-
ISD
ISDM
VSD
Source drain diode
trr
Qrr
IRRM
TBD
TBD
TBD
ns
nC
A
1. Pulse width limited by safe operating area
2. Pulsed: pulse duration=300µs, duty cycle 1.5%
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Test circuits
STL6N2VH5
3
Test circuits
Figure 2.
Switching times test circuit for
resistive load
Figure 3.
Gate charge test circuit
VDD
12V
47kΩ
1kΩ
100nF
3.3
μF
2200
RL
μF
VGS
IG=CONST
VDD
100Ω
Vi=20V=VGMAX
VD
RG
2200
μF
D.U.T.
D.U.T.
VG
2.7kΩ
PW
47kΩ
1kΩ
PW
AM01468v1
Figure 4.
AM01469v1
Test circuit for inductive load
Figure 5.
switching and diode recovery times
A
A
D.U.T.
FAST
DIODE
B
B
Unclamped inductive load test
circuit
L
A
D
G
VD
L=100μH
S
3.3
μF
B
25 Ω
1000
μF
D
VDD
2200
μF
3.3
μF
VDD
ID
G
RG
S
Vi
D.U.T.
Pw
AM01470v1
Figure 6.
Unclamped inductive waveform
AM01471v1
Figure 7.
Switching time waveform
ton
V(BR)DSS
tdon
VD
toff
tr
tdoff
tf
90%
90%
IDM
10%
ID
VDD
10%
0
VDD
VDS
90%
VGS
AM01472v1
6/12
0
Doc ID 023150 Rev 2
10%
AM01473v1
STL6N2VH5
4
Package mechanical data
Package mechanical data
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
Doc ID 023150 Rev 2
7/12
Package mechanical data
Table 8.
STL6N2VH5
PowerFLAT™ 2x2 mechanical data
mm.
Dim.
Min.
Typ.
Max.
A
0.70
0.75
0.80
A1
0.00
0.02
0.05
A3
8/12
0.20
b
0.25
0.30
0.35
D
1.90
2.00
2.10
E
1.90
2.00
2.10
D2
0.90
1.00
1.10
E2
0.80
0.90
1.00
e
0.55
0.65
0.75
K
0.15
0.25
0.35
K1
0.20
0.30
0.40
K2
0.25
0.35
0.45
L
0.20
0.25
0.30
L1
0.65
0.75
0.85
Doc ID 023150 Rev 2
STL6N2VH5
Figure 8.
Package mechanical data
PowerFLAT™ 2 x 2 drawing
8368575_REV_C
Doc ID 023150 Rev 2
9/12
Package mechanical data
Figure 9.
STL6N2VH5
PowerFLAT™ 2 x 2 recommended footprint (dimensions in millimeters)
Footprint
10/12
Doc ID 023150 Rev 2
STL6N2VH5
5
Revision history
Revision history
Table 9.
Document revision history
Date
Revision
Changes
24-Apr-2012
1
First release.
10-Jan-2013
2
– Modified: RDS(on) values
– Document status promoted from target data to preliminary data
Doc ID 023150 Rev 2
11/12
STL6N2VH5
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