SYNC-POWER SPN9910T251TGB

SPN9910
N-Channel Enhancement Mode MOSFET
DESCRIPTION
The SPN9910 is the N-Channel logic enhancement mode
power field effect transistors are produced using high cell
density, DMOS trench technology. This high density
process is especially tailored to minimize on-state
resistance. These devices are particularly suited for most
of synchronous buck converter applications.
FEATURES
‹
60V/60A, RDS(ON)= 10mΩ@VGS= 10V
‹
60V/60A, RDS(ON)= 12.0mΩ@VGS=4.5V
‹
Super high density cell design for extremely low
RDS (ON)
‹
Exceptional on-resistance and maximum DC
current capability
‹
TO-252 . TO-251 package design
APPLICATIONS
z DC/DC Converter
z
Load Switch
Synchronous Buck Converter
z
PIN CONFIGURATION
TO-252
TO-251
PART MARKING
2011 / 08 / 22 Ver.1
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SPN9910
N-Channel Enhancement Mode MOSFET
PIN DESCRIPTION
Pin
Symbol
Description
1
G
Gate
2
S
3
D
Source
Drain
ORDERING INFORMATION
Part Number
Package
Part
Marking
SPN9910T252RGB
TO-252
SPN9910
SPN9910T251TGB
TO-251
SPN9910
※ SPN9910T252RGB: Tape Reel ; Pb – Free; Halogen – Free
※ SPN9910T251TGB: Tube ; Pb – Free; Halogen – Free
ABSOULTE MAXIMUM RATINGS
(TA=25℃ Unless otherwise noted)
Parameter
Symbol
Typical
Unit
Drain-Source Voltage
VDSS
60
V
Gate –Source Voltage
VGSS
±20
V
Continuous Drain Current(TJ=150℃)
TA=25℃
TA=100℃
ID
60
47
A
Pulsed Drain Current
IDM
120
A
Avalanche Current
IAS
38
A
PD
40
W
EAS
123
mJ
TJ
-55/150
℃
Storage Temperature Range
TSTG
-55/150
℃
Thermal Resistance-Junction to Ambient
RθJA
62
℃/W
Power Dissipation
TA=25℃
Avalanche Energy with Single Pulse
( Tj=25℃, L = 0.1mH , IAS = 38A , VDD = 25V. )
Operating Junction Temperature
2011 / 08 / 22 Ver.1
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SPN9910
N-Channel Enhancement Mode MOSFET
ELECTRICAL CHARACTERISTICS
(TA=25℃ Unless otherwise noted)
Parameter
Symbol
Conditions
Min.
Typ
Max.
Unit
Static
Drain-Source Breakdown Voltage
Gate Threshold Voltage
V(BR)DSS VGS=0V,ID=250uA
VGS(th) VDS=VGS,ID=250uA
Gate Leakage Current
IGSS
Zero Gate Voltage Drain Current
IDSS
On-State Drain Current
ID(on)
VDS≥5V,VGS =10V
Forward Transconductance
gfs
Diode Forward Voltage
VSD
IS=60A,VGS =0V
RDS(on)
1.0
2.5
VDS=0V,VGS=±20V
VDS=48V,VGS=0V
VDS=48V,VGS=0V
TJ = 55 °C
VGS= 10V,ID=15A
VGS= 4.5V,ID=10A
VDS=5V,ID=15A
Drain-Source On-Resistance
60
±100
1
5
60
V
nA
uA
A
10
12
47
12
15
mΩ
S
1.2
V
Dynamic
Total Gate Charge
Qg
Gate-Source Charge
Qgs
Gate-Drain Charge
Qgd
Input Capacitance
Ciss
Output Capacitance
Coss
Reverse Transfer Capacitance
Crss
Turn-On Time
Turn-Off Time
2011 / 08 / 22 Ver.1
VDS=48V,VGS=4.5V
ID= 12A
td(off)
tf
6.9
nC
10
VDS=15V,VGS=0V
f=1MHz
td(on)
tr
24
3200
210
pF
145
20
VDD=30V, ID=2A,
VGEN=10V, RG=3.3Ω
4
84.5
nS
6.5
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SPN9910
N-Channel Enhancement Mode MOSFET
TYPICAL CHARACTERISTICS
Fig. 1 Typical Output Characteristics
Fig. 2 On-Resistance vs. Gate Voltage
Fig. 3 Forward Characteristics
Reverse Diodes
Fig. 4 Gate Charge Characteristics
Fig. 5 Vgs vs. Junction Temperature
Fig. 6 On-Resistance vs. Temperature
2011 / 08 / 22 Ver.1
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SPN9910
N-Channel Enhancement Mode MOSFET
TYPICAL CHARACTERISTICS
Fig. 7 Typical Capacitance Characteristics
Fig. 8 Maximum Safe Operation Area
Fig. 9 Effective Transient Thermal Impedance
Fig. 10 Switching Time Waveform
2011 / 08 / 22 Ver.1
Fig. 11 Unclamped Inductive Waveform
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SPN9910
N-Channel Enhancement Mode MOSFET
TO-252 PACKAGE OUTLINE
2011 / 08 / 22 Ver.1
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SPN9910
N-Channel Enhancement Mode MOSFET
TO-251 PACKAGE OUTLINE
2011 / 08 / 22 Ver.1
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SPN9910
N-Channel Enhancement Mode MOSFET
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2011 / 08 / 22 Ver.1
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