ZMD-Standard November 2001 Package PDIP28 (300 mil) MDS 735 Supersedes Edition 11.95 Dimensions in millimetres Based on JEDEC JEP95: MS-001 BF und GS-003 Seating Plane E L A A1 1 Dimensions b1 e 0,254 Z M c ° e1 28 1 D Pin 1 Index area Dimensions of Sub -Group B1 Amax A1min b1min ** b1max ** Dimensions of Sub-Group C1 5,10 Amin 3,00 0,38 A1max 1,80 0,35 Lmax 5,00 0,59 Dmin * 34,40 * 35,00 cmin 0,20 Dmax cmax 0,36 °min 0 enom 2,54 °max 15 7,62 * Emin* 7,00 ** Emax* 7,62 Lmin 2,60 Zmax 1,00 e1nom 2 Weight 2,0 g 3 Package Body Material Low Stress Epoxy 4 Lead Material FeNi-Alloy or Cu-Alloy 5 Lead Finish solder plating without mold-flash The lead position tolerance requires slots with a minimum diameter of 0,7mm. The spacing between adjacent slots is 2,54mm. Zentrum Mikroelektronik Dresden AG Editor: signed Schoder Date: 27.11.2001 Check: signed Marx Quality: signed Lorenz Als Betriebsgeheimnis anvertraut. Alle Rechte vorbehalten. Doc-No. QS-000735-HD-03 Proprietary data, company confidential. All rights reserved.