AOSMD AOZ8001KIL

AOS Semiconductor
Product Reliability Report
AOZ8001KIL, rev A
Plastic Encapsulated Device
ALPHA & OMEGA Semiconductor, Inc
495 Mercury Drive
Sunnyvale, CA 94085
U.S.
Tel: (408) 830-9742
1
www.aosmd.com
This AOS product reliability report summarizes the qualification result for AOZ8001KIL.
Review of the electrical test results confirm that AOZ8001KIL pass AOS quality and reliability
requirements for product release. The continuous qualification testing and reliability monitoring program
ensure that all outgoing products will continue to meet AOS quality and reliability standards.
Table of Contents:
I.
II.
III.
IV.
V.
Product Description
Package and Die information
Qualification Test Requirements
Qualification Tests Result
Reliability Evaluation
I. Product Description:
The AOZ8001KIL is a transient voltage suppressor array to protect high speed data lines from ESD and
lightning.
.
Absolute Maximum Ratings
Parameter
VP-VN
6v
Peak Pulse Current (Ipp), tp=8/20uS
5A
Storage Temperature (TS)
-65°C to +150°C
(1)
ESD Rating per IEC61000-4-2, contact
±8kV
(2)
ESD Rating per IEC61000-4-2, air
±15kV
(2)
ESD Rating per Human Body Model
±15kV
Junction Temperature (Tj)
-40°C to +85°C
Notes:
(1) IEC-61000-4-2 discharge with CDischarge=150pF, RDischarge=330Ω
(2) Human Body Discharge per MIL-STD-883, Method 3015 CDischarge=100pF, RDischarge=1.5kΩ
II. Package and Die Information:
Product ID
Process
Package Type
Lead Frame
Die attach material
Die bond wire
Mold Material
MSL level
AOZ8001KIL
HHNEC HV003A1
SC89A
Cu
8006NS
Au, 1 mil
E670CB
Up to Level 1
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III. Qualification Tests Requirements
•
•
2 lots of AOZ8001KIL up to 500 hrs of HTOL for New Product release.
3 lots of package qual testing (PCT, 500 cycles TC, HAST) for package release to manufacturing.
IV. Qualification Tests Result
Test Item
Test Condition
Sample Size
Result
PreConditioning
Per JESD 22-A113
168hrs @85 °C
/85%RH+3 cyc
reflow@260°C
3 lots
pass
HTOL
Per JESD 22-A108_B
Vdd= 6v
Temp = 125°C
2 lots (80 /lot)
pass
Temperature
Cycle
'-65 °C to +150 °C,
air to air (2cyc/hr)
3 lots (82 /lot)
pass
Pressure Pot
121°C, 29.7psi,
RH= 100%
3 lots (82 /lot)
pass
HAST
'130 +/- 2°C, 85%RH,
33.3 psi, at VCC min
power dissipation.
3 lots (60 /lot)
pass
Comment
ESD Rating
Per IEC-61000-4-2,
contact
3 lots (5 /lot)
pass
±8kV contact
ESD Rating
Per IEC-61000-4-2, air
discharge
3 lots (5 /lot)
pass
±15kV contact
Lightning
Surge rating
Per IEC-61000-4-5
3 lots (5 /lot)
pass
5A surge
The qualification test results confirm that AOZ8001KIL pass AOS quality and reliability
requirements for product release.
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V. Reliability Evaluation
FIT rate (per billion): 44
MTTF = 2575 years
The presentation of FIT rate for the individual product reliability is restricted by the actual burn-in sample size of the
selected product. Failure Rate Determination is based on JEDEC Standard JESD 85. FIT means one failure per
billion device hours.
2
9
Failure Rate = Chi x 10 / [2 (N) (H) (Af)] = 1.83 x 10
9
7
MTTF = 10 / FIT =2.26 x10 hrs= 2575 years
9
/ [2x2x80x500x258] = 44
Chi² = Chi Squared Distribution, determined by the number of failures and confidence interval
N = Total Number of units from HTRB and HTGB tests
H = Duration of HTRB/HTGB testing
Af = Acceleration Factor from Test to Use Conditions (Ea = 0.7eV and Tuse = 55°C)
Acceleration Factor [Af] = Exp [Ea / k (1/Tj u – 1/Tj s)]
Acceleration Factor ratio list:
Af
55 deg C
70 deg C
85 deg C
100 deg C
115 deg C
130 deg C
150 deg C
258
87
32
13
5.64
2.59
1
Tj s = Stressed junction temperature in degree (Kelvin), K = C+273.16
Tj u =The use junction temperature in degree (Kelvin), K = C+273.16
k = Boltzmann’s constant, 8.617164 X 10-5eV / K
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