AP70T03AS/P
Advanced Power
Electronics Corp.
▼ Simple Drive Requirement
N-CHANNEL ENHANCEMENT MODE
POWER MOSFET
D
▼ Low Gate Charge
▼ Fast Switching
BVDSS
30V
RDS(ON)
9mΩ
ID
G
60A
S
Description
G D
The Advanced Power MOSFETs from APEC provide the
designer with the best combination of fast switching,
ruggedized device design, low on-resistance and cost-effectiveness.
The TO-263 package is universally preferred for all commercialindustrial surface mount applications and suited for low voltage
applications such as DC/DC converters. The through-hole version
(AP70T03AP) are available for low-profile applications.
G
D
S
TO-263(S)
TO-220(P)
S
Absolute Maximum Ratings
Parameter
Symbol
Rating
Units
VDS
Drain-Source Voltage
30
V
VGS
Gate-Source Voltage
± 20
V
ID@TA=25℃
Continuous Drain Current, VGS @ 10V
60
A
ID@TA=100℃
Continuous Drain Current, VGS @ 10V
43
A
195
A
1
IDM
Pulsed Drain Current
PD@TA=25℃
Total Power Dissipation
53
W
Linear Derating Factor
0.36
W/℃
TSTG
Storage Temperature Range
-55 to 175
℃
TJ
Operating Junction Temperature Range
-55 to 175
℃
Thermal Data
Symbol
Parameter
Value
Unit
Rthj-c
Thermal Resistance Junction-case
Max.
2.8
℃/W
Rthj-a
Thermal Resistance Junction-ambient
Max.
62
℃/W
Data and specifications subject to change without notice
200909032
AP70T03AS/P
Electrical Characteristics@T j=25oC(unless otherwise specified)
Symbol
Parameter
Test Conditions
Min.
Typ.
Max. Units
30
-
-
V
BVDSS
Drain-Source Breakdown Voltage
ΔBVDSS/ΔTj
Breakdown Voltage Temperature Coefficient Reference to 25℃, ID=1mA
-
0.032
-
V/℃
RDS(ON)
Static Drain-Source On-Resistance
VGS=10V, ID=33A
-
-
9
mΩ
VGS=4.5V, ID=20A
-
-
18
mΩ
VDS=VGS, ID=250uA
1
-
3
V
VDS=10V, ID=33A
-
35
-
S
VDS=30V, VGS=0V
-
-
1
uA
Drain-Source Leakage Current (Tj=175 C)
VDS=24V ,VGS=0V
-
-
250
uA
Gate-Source Leakage
VGS= ± 20V
-
-
±100
nA
ID=33A
-
16.5
-
nC
VGS(th)
VGS=0V, ID=250uA
Gate Threshold Voltage
gfs
o
IDSS
Drain-Source Leakage Current (Tj=25 C)
o
IGSS
2
Qg
Total Gate Charge
Qgs
Gate-Source Charge
VDS=20V
-
5
-
nC
Qgd
Gate-Drain ("Miller") Charge
VGS=4.5V
-
10.3
-
nC
VDS=15V
-
8.2
-
ns
2
td(on)
Turn-on Delay Time
tr
Rise Time
ID=33A
-
105
-
ns
td(off)
Turn-off Delay Time
RG=3.3Ω,VGS=10V
-
21.4
-
ns
tf
Fall Time
RD=0.45Ω
-
8.5
-
ns
Ciss
Input Capacitance
VGS=0V
-
1485
-
pF
Coss
Output Capacitance
VDS=25V
-
245
-
pF
Crss
Reverse Transfer Capacitance
f=1.0MHz
-
170
-
pF
Min.
Typ.
-
-
60
A
-
-
195
A
-
-
1.3
V
Source-Drain Diode
Symbol
IS
ISM
VSD
Parameter
Test Conditions
VD=VG=0V , VS=1.3V
Continuous Source Current ( Body Diode )
1
Pulsed Source Current ( Body Diode )
Forward On Voltage
2
Notes:
1.Pulse width limited by safe operating area.
2.Pulse width <300us , duty cycle <2%.
Tj=25℃, IS=60A, VGS=0V
Max. Units
AP70T03AS/P
120
200
o
T C =25 C
90
ID , Drain Current (A)
150
ID , Drain Current (A)
10V
8.0V
6.0V
T C =175 o C
10V
8.0V
6.0V
100
V GS =4.0V
50
60
V GS =4.0V
30
0
0
0.0
1.5
3.0
0.0
4.5
V DS , Drain-to-Source Voltage (V)
1.5
3.0
4.5
V DS , Drain-to-Source Voltage (V)
Fig 1. Typical Output Characteristics
Fig 2. Typical Output Characteristics
2
60
I D =33A
T C =25 ℃
I D =33A
V GS =10V
1.6
Normalized RDS(ON)
RDS(ON) (mΩ )
40
20
1.2
0.8
0.4
0
0
4
8
12
-50
16
Fig 4. Normalized On-Resistance
v.s. Junction Temperature
2.5
100
2
VGS(th) (V)
1000
IS(A)
175
T j , Junction Temperature ( C)
Fig 3. On-Resistance v.s. Gate Voltage
Tj=175 o C
100
o
V GS , Gate-to-Source Voltage (V)
10
25
Tj=25 o C
1.5
1
1
0.1
0.5
0
0.5
1
V SD , Source-to-Drain Voltage (V)
Fig 5. Forward Characteristic of
Reverse Diode
1.5
-50
25
100
T j , Junction Temperature (
175
o
C)
Fig 6. Gate Threshold Voltage v.s.
Junction Temperature
AP70T03AS/P
12
f=1.0MHz
10000
V DS =16V
V DS =20V
V DS =24V
9
Ciss
1000
C (pF)
VGS , Gate to Source Voltage (V)
I D =33A
6
Coss
Crss
100
3
10
0
0
10
20
1
30
8
15
22
29
V DS , Drain-to-Source Voltage (V)
Q G , Total Gate Charge (nC)
Fig 7. Gate Charge Characteristics
Fig 8. Typical Capacitance Characteristics
1000
Normalized Thermal Response (Rthjc)
1
10us
ID (A)
100
100us
10
1ms
o
T C =25 C
Single Pulse
10ms
100ms
DC
1
Duty Factor = 0.5
0.2
0.1
0.1
0.05
0.02
PDM
t
0.01
T
Single Pulse
Duty Factor = t/T
Peak Tj = PDM x Rthjc + T C
0.01
0.1
1
10
100
0.00001
0.0001
V DS , Drain-to-Source Voltage (V)
0.001
0.01
0.1
1
t , Pulse Width (s)
Fig 9. Maximum Safe Operating Area
Fig10. Effective Transient Thermal Impedance
VG
VDS
90%
QG
4.5V
QGS
QGD
10%
VGS
td(on) tr
td(off) t
f
Fig 11. Switching Time Waveform
Charge
Fig 12. Gate Charge Waveform
Q