TPS20xxC, TPS20xxC-2 www.ti.com SLVSAU6G – JUNE 2011 – REVISED JULY 2013 Current-Limited, Power-Distribution Switches FEATURES DESCRIPTION • • • • • • • The TPS20xxC and TPS20xxC-2 power-distribution switch family is intended for applications such as USB where heavy capacitive loads and short-circuits are likely to be encountered. This family offers multiple devices with fixed current-limit thresholds for applications between 0.5 A and 2 A. 1 • • • • Single Power Switch Family Pin for Pin with Existing TI Switch Portfolio Rated currents of 0.5 A, 1 A, 1.5 A, 2 A ±20% Accurate, Fixed, Constant Current Limit Fast Over-Current Response – 2 µs Deglitched Fault Reporting Selected Parts with (TPS20xxC) and without (TPS20xxC-2) Output Discharge Reverse Current Blocking Built-in Softstart Ambient Temperature Range: –40°C to 85°C UL Listed and CB-File No. E169910 The TPS20xxC and TPS20xxC-2 family limits the output current to a safe level by operating in a constant-current mode when the output load exceeds the current-limit threshold. This provides a predictable fault current under all conditions. The fast overload response time eases the burden on the main 5 V supply to provide regulated power when the output is shorted. The power-switch rise and fall times are controlled to minimize current surges during turn-on and turn-off. APPLICATIONS • • • • USB Ports/Hubs, Laptops, Desktops High-Definition Digital TVs Set Top Boxes Short-Circuit Protection DGN, DGK DBV (Top View) (Top View) GND IN IN EN or EN 1 2 3 4 PAD 2 8 7 6 5 OUT OUT OUT FLT OUT 1 5 IN GND FLT 2 3 4 EN or EN DGN, DGK DGN Only (Top V IN Fault Signal 150 mF FLT EN or EN Control Signal VOUT OUT 0.1 mF VIN RFLT 10 kW GND Pad* * DGN only Figure 1. Typical Application Table 1. DEVICES (1) (1) MAXIMUM OPERATING CURRENT DEVICES 0.5 STATUS MSOP-8 ( PowerPad™) SOT23-5 MSOP-8 TPS2041C and 51C — Active and Active — 1 TPS2061C and 65C Active and Active Active and Active — 1 TPS2065C-2 Active Active — 1.5 TPS2068C and 69C Active and Active — and Active — 1.5 TPS2069C-2 Active — — 2 TPS2000C and 01C Active and Active — Active and Active For more details, see the DEVICE INFORMATION table. 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PowerPad is a trademark of Texas Instruments. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2011–2013, Texas Instruments Incorporated TPS20xxC, TPS20xxC-2 SLVSAU6G – JUNE 2011 – REVISED JULY 2013 www.ti.com This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. DEVICE INFORMATION (1) (1) (2) MAXIMUM OPERATING CURRENT OUTPUT DISCHARGE 0.5 0.5 1 ENABLE BASE PART NUMBER Y Low TPS2041C Y High TPS2051C Y Low 1 Y 1 N 1.5 PACKAGED DEVICE AND MARKING (2) MSOP-8 (DGN) PowerPAD™ SOT23-5 (DBV) MSOP-8 (DGK) – PYJI – – VBYQ – TPS2061C PXMI PXLI – High TPS2065C VCAQ VCAQ – High TPS2065C-2 PYRI PYQI – Y Low TPS2068C PXNI – – 1.5 Y High TPS2069C VBUQ PYKI – 1.5 N High TPS2069C-2 PYSI – – 2 Y Low TPS2000C BCMS – PXFI 2 Y High TPS2001C VBWQ – PXGI For the most current packaging and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com. "-" indicates the device is not available in this package. ABSOLUTE MAXIMUM RATINGS (1) (2) VALUE Voltage range on IN, OUT, EN or EN, FLT (3) MIN MAX UNIT –0.3 6 V Voltage range from IN to OUT –6 6 V Maximum junction temperature, TJ Internally Limited Electrostatic Discharge HBM 2 CDM 500 IEC 61000-4-2, Contact / Air (1) (2) (3) (4) (4) 8 kV V 15 kV Absolute maximum ratings apply over recommended junction temperature range. Voltages are with respect to GND unless otherwise noted. See the Input and Output Capacitance section. VOUT was surged on a pcb with input and output bypassing per Figure 1 (except input capacitor was 22 µF) with no device failures. THERMAL INFORMATION THERMAL METRIC (1) (See DEVICE INFORMATION table.) 0.5 A or 1 A Rated 1.5 A or 2 A Rated 0.5 A or 1 A Rated 1.5 A or 2 A Rated 2A Rated DBV DBV DGN DGN DGK 5 PINS 5 PINS 8 PINS 8 PINS 8 PINS θJA Junction-to-ambient thermal resistance 224.9 220.4 72.1 67.1 205.5 θJCtop Junction-to-case (top) thermal resistance 95.2 89.7 87.3 80.8 94.3 θJB Junction-to-board thermal resistance 51.4 46.9 42.2 37.2 126.9 ψJT Junction-to-top characterization parameter 6.6 5.2 7.3 5.6 24.7 ψJB Junction-to-board characterization parameter 50.3 46.2 42.0 36.9 125.2 θJCbot Junction-to-case (bottom) thermal resistance N/A N/A 39.2 32.1 N/A 139.3 134.9 66.5 61.3 110.3 See the Power DIssipation and Junction θJACustom Temperature section (1) 2 UNITS °C/W For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. Submit Documentation Feedback Copyright © 2011–2013, Texas Instruments Incorporated TPS20xxC, TPS20xxC-2 www.ti.com SLVSAU6G – JUNE 2011 – REVISED JULY 2013 RECOMMENDED OPERATING CONDITIONS MIN VIN Input voltage, IN VEN NOM MAX UNIT 4.5 5.5 V Input voltage, EN or EN 0 5.5 V VIH High-level input voltage, EN or EN 2 VIL Low-level input voltage, EN or EN V 0.7 TPS2041C and TPS2051C IOUT Continuous output current, OUT (1) TJ Operating junction temperature IFLT Sink current into FLT TPS2061C, TPS2065C and TPS2065C-2 1 TPS2068C, TPS2069C and TPS2069C-2 1.5 TPS2000C and TPS2001C (1) V 0.5 A 2 –40 125 °C 0 5 mA Some package and current rating may request an ambient temperature derating of 85°C. ELECTRICAL CHARACTERISTICS: TJ = TA = 25°C (1) Unless otherwise noted:, VIN = 5 V, VEN = VIN or VEN = GND, IOUT = 0 A. See the 'Device Information' table for the rated current of each part number. Parametrics over a wider operational range are shown in the second 'Electrical Characteristics' table. TEST CONDITIONS (1) PARAMETER MIN TYP MAX UNIT POWER SWITCH 0.5 A rated output, 25°C DBV 97 110 mΩ 0.5 A rated output, –40°C ≤ (TJ , TA) ≤ 85°C DBV 96 130 mΩ DBV 96 110 DGN 86 100 DBV 96 130 DGN 86 120 DBV 76 91 mΩ DGN 69 84 mΩ 1.5 A rated output, –40°C ≤ (TJ , TA) ≤ 85°C DBV 76 106 mΩ DGN 69 98 mΩ 2 A rated output, 25°C DGN, DGK 72 84 mΩ 2 A rated output, –40°C ≤ (TJ , TA) ≤ 85°C DGN, DGK 72 98 mΩ 0.5A rated output TPS20xxC 0.67 0.85 1.01 TPS20xxC 1.3 1.55 1.8 1.18 1.53 1.88 1.7 2.15 2.5 TPS20xxC-2 1.71 2.23 2.75 TPS20xxC 2.35 2.9 3.4 0.01 1 1 A rated output, 25°C RDS(on) Input – output resistance 1 A rated output, –40°C ≤ (TJ , TA) ≤ 85°C 1.5 A rated output, 25°C mΩ mΩ CURRENT LIMIT 1 A rated output IOS (2) Current-limit, See Figure 7 1.5 A rated output 2 A rated output TPS20xxC-2 TPS20xxC A SUPPLY CURRENT ISD Supply current, switch disabled ISE Supply current, switch enabled Ilkg (1) (2) Leakage current IOUT = 0 A –40°C ≤ (TJ , TA) ≤ 85°C, VIN = 5.5 V, IOUT = 0 A 2 IOUT = 0 A 60 –40°C ≤ (TJ , TA) ≤ 85°C, VIN = 5.5 V, IOUT = 0 A VOUT = 0 V, VIN = 5 V, disabled, measure IVIN –40°C ≤ (TJ , TA) ≤ 85°C, VOUT = 0 V, VIN = 5 V, disabled, measure IVIN 70 85 0.05 µA µA 1 TPS20xxC-2 µA 2 Pulsed testing techniques maintain junction temperature approximately equal to ambient temperature See CURRENT LIMIT section for explanation of this parameter. Copyright © 2011–2013, Texas Instruments Incorporated Submit Documentation Feedback 3 TPS20xxC, TPS20xxC-2 SLVSAU6G – JUNE 2011 – REVISED JULY 2013 www.ti.com ELECTRICAL CHARACTERISTICS: TJ = TA = 25°C(1) (continued) Unless otherwise noted:, VIN = 5 V, VEN = VIN or VEN = GND, IOUT = 0 A. See the 'Device Information' table for the rated current of each part number. Parametrics over a wider operational range are shown in the second 'Electrical Characteristics' table. TEST CONDITIONS (1) PARAMETER MIN VOUT = 5 V, VIN = 0 V, measure IVOUT IREV Reverse leakage current TYP MAX 0.1 1 –40°C ≤ (TJ , TA) ≤ 85°C, VOUT = 5 V, VIN = 0 V, measure IVOUT 5 UNIT µA OUTPUT DISCHARGE Output pull-down resistance (3) RPD (3) VIN = VOUT = 5 V, disabled TPS20xxC 400 470 600 Ω These parameters are provided for reference only, and do not constitute part of TI's published device specifications for purposes of TI's product warranty. ELECTRICAL CHARACTERISTICS: –40°C ≤ TJ ≤ 125°C Unless otherwise noted:4.5 V ≤ VIN ≤ 5.5 V, VEN = VIN or VEN = GND, IOUT = 0 A, typical values are at 5 V and 25°C. See the DEVICE INFORMATION table for the rated current of each part number. TEST CONDITIONS (1) PARAMETER MIN TYP MAX UNIT DBV 97 154 mΩ DBV 96 154 DGN 86 140 DBV 76 121 mΩ DGN 69 112 mΩ DGN, DGK 72 112 mΩ POWER SWITCH 0.5 A rated output 1 A rated output RDS(ON) Input – output resistance 1.5 A rated output 2 A rated output mΩ ENABLE INPUT (EN or EN) Threshold Input rising 1 1.45 2 0.07 0.13 0.20 V –1 0 1 µA 0.5A / 1A Rated 1 1.4 1.8 1.5A / 2A Rated 1.2 1.7 2.2 0.5A and 1A Rated 1.3 1.65 2 1.5A / 2A Rated 1.7 2.1 2.5 0.5A / 1A Rated 0.4 0.55 0.7 1.5A / 2A Rated 0.5 0.7 1.0 0.5A / 1A Rated 0.25 0.35 0.45 1.5A / 2A Rated 0.3 0.43 0.55 TPS20xxC 0.65 0.85 1.05 TPS20xxC 1.2 1.55 1.9 TPS20xxC-2 1.1 1.53 1.96 TPS20xxC 1.6 2.15 2.7 TPS20xxC-2 1.6 2.23 2.86 TPS20xxC 2.3 2.9 3.6 Hysteresis Leakage current (VEN or VEN) = 0 V or 5.5 V V VIN = 5 V, CL = 1 µF, RL = 100 Ω, EN ↑ or EN ↓. See Figure 2, Figure 4, and Figure 5 tON Turnon time ms VIN = 5 V, CL = 1 µF, RL = 100 Ω, EN ↓ or EN ↑. See Figure 2, Figure 4, and Figure 5 tOFF Turnoff time ms CL = 1 µF, RL = 100 Ω, VIN = 5 V. See Figure 3 tR Rise time, output ms CL = 1 µF, RL = 100 Ω, VIN = 5 V. See Figure 3 tF Fall time, output ms CURRENT LIMIT 0.5 A rated output 1 A rated output IOS (2) Current-limit, See Figure 10 1.5 A rated output 2 A rated output (1) (2) 4 A Pulsed testing techniques maintain junction temperature approximately equal to ambient temperature See CURRENT LIMIT section for explanation of this parameter. Submit Documentation Feedback Copyright © 2011–2013, Texas Instruments Incorporated TPS20xxC, TPS20xxC-2 www.ti.com SLVSAU6G – JUNE 2011 – REVISED JULY 2013 ELECTRICAL CHARACTERISTICS: –40°C ≤ TJ ≤ 125°C (continued) Unless otherwise noted:4.5 V ≤ VIN ≤ 5.5 V, VEN = VIN or VEN = GND, IOUT = 0 A, typical values are at 5 V and 25°C. See the DEVICE INFORMATION table for the rated current of each part number. TEST CONDITIONS (1) PARAMETER Short-circuit response time (3) tIOS MIN VIN = 5 V (see Figure 7), One-half full load → RSHORT = 50 mΩ, Measure from application to when current falls below 120% of final value TYP MAX 2 UNIT µs SUPPLY CURRENT ISD Supply current, switch disabled IOUT = 0 A 0.01 10 µA ISE Supply current, switch enabled IOUT = 0 A 65 90 µA Ilkg Leakage current VOUT = 0 V, VIN = 5 V, disabled, measure IVIN IREV Reverse leakage current VOUT = 5.5 V, VIN = 0 V, measure IVOUT TPS20XXC-2 0.05 µA 0.2 20 µA 3.75 4 V UNDERVOLTAGE LOCKOUT VUVLO Rising threshold VIN↑ Hysteresis (3) VIN↓ Output low voltage, FLT IFLT = 1 mA Off-state leakage VFLT = 5.5 V FLT deglitch FLT assertion or deassertion deglitch 3.5 0.14 V FLT tFLT 0.2 V 1 µA ms 6 9 12 OUTPUT DISCHARGE RPD Output pull-down resistance VIN = 4 V, VOUT = 5 V, disabled TPS20XXC 350 560 1200 VIN = 5 V, VOUT = 5 V, disabled TPS20XXC 300 470 800 Ω THERMAL SHUTDOWN Rising threshold (TJ) Hysteresis (3) (4) In current limit 135 Not in current limit 155 (4) °C 20 These parameters are provided for reference only, and do not constitute part of TI's published device specifications for purposes of TI's product warranty. These parameters are provided for reference only, and do not constitute part of TI's published device specifications for purposes of TI's product warranty. OUT RL VOUT CL Figure 2. Output Rise / Fall Test Load VEN 50% tON tR 10% 50% 50% tOFF tOFF tON 90% VOUT 90% Figure 3. Power-On and Off Timing V/EN 50% tF 90% VOUT 10% Figure 4. Enable Timing, Active High Enable Copyright © 2011–2013, Texas Instruments Incorporated 10% Figure 5. Enable Timing, Active Low Enable Submit Documentation Feedback 5 TPS20xxC, TPS20xxC-2 SLVSAU6G – JUNE 2011 – REVISED JULY 2013 www.ti.com 120% x IOS IOUT IOS 0A tIOS Figure 6. Output Short Circuit Parameters VIN Decreasing Load Resistance VOUT Slope = -RDS(ON) 0V 0A IOUT IOS Figure 7. Output Characteristic Showing Current Limit FUNCTIONAL BLOCK DIAGRAM Current Sense IN Charge Pump EN or EN OUT Current Limit (Disabled+ UVLO) Driver UVLO GND CS FLT OTSD Thermal Sense 9-ms Deglitch Figure 8. TPS20xxC Block Diagram 6 Submit Documentation Feedback Copyright © 2011–2013, Texas Instruments Incorporated TPS20xxC, TPS20xxC-2 www.ti.com SLVSAU6G – JUNE 2011 – REVISED JULY 2013 Current Sense IN Charge Pump EN or EN CS OUT Current Limit Driver UVLO GND FLT OTSD Thermal Sense 9-ms Deglitch Figure 9. TPS20xxC-2 Block Diagram DEVICE INFORMATION PIN FUNCTIONS NAME PINS DESCRIPTION 8-PIN PACKAGE EN or EN 4 Enable input, logic high turns on power switch GND 1 Ground connection IN 2, 3 FLT 5 OUT 6, 7, 8 PowerPAD (DGN ONLY) PAD Input voltage and power-switch drain; connect a 0.1 µF or greater ceramic capacitor from IN to GND close to the IC Active-low open-drain output, asserted during over-current, or over-temperature conditions Power-switch output, connect to load Internally connected to GND. Connect PAD to GND plane as a heatsink for the best thermal performance. PAD may be left floating if desired. See POWER DISSIPATION AND JUNCTION TEMPERATURE section for guidance. 5-PIN PACKAGE EN or EN 4 Enable input, logic high turns on power switch GND 2 Ground connection IN 5 Input voltage and power-switch drain; connect a 0.1 µF or greater ceramic capacitor from IN to GND close to the IC FLT 3 Active-low open-drain output, asserted during over-current, or over-temperature conditions OUT 1 Power-switch output, connect to load. Copyright © 2011–2013, Texas Instruments Incorporated Submit Documentation Feedback 7 TPS20xxC, TPS20xxC-2 SLVSAU6G – JUNE 2011 – REVISED JULY 2013 www.ti.com TYPICAL CHARACTERISTICS IN IN1 680mF3 Enable Signal OUT OUT1 OUT1 VIN 2 EN or EN Pad1 VOUT 150µF IOUT VIN RLOAD 3.01kW2 FLT GND (1) Not every package has all pins (2) These parts are for test purposes (3) Helps with output shorting tests when external supply is used. Fault Signal Figure 10. Test Circuit for System Operation in Typical Characteristics Section FLT 1.75 8 1.50 7 1.25 6 5 1.00 4 0.75 3 0.50 EN 2 1 Output Voltage 0 −1 −2m 0 2m 4m 6m VIN = 5 V, COUT = 150 µF, RLOAD = 100 Ω, TPS2065C Output Current 0.75 4 EN 3 0.50 2 0.25 0.00 1 0.00 0 −0.25 −0.50 8m 10m 12m 14m 16m 18m 20m Time (s) −1 −2m 0 2m 4m 6m G001 −0.50 8m 10m 12m 14m 16m 18m 20m Time (s) 2.00 2.00 9 VIN = 5 V, COUT = 150 µF, RLOAD = 50 mΩ, TPS2065C 8 1.50 7 6 1.25 6 1.20 5 1.00 FLT Output Current 1.00 4 0.75 3 0.50 EN 2 Output Voltage 1 0 2m 4m 4 FLT EN 1.80 1.50 0.75 0.50 0.25 2 0.25 0.00 1 0.00 −0.50 6m 8m 10m 12m 14m 16m 18m Time (s) Figure 13. TPS2065C Enable into Output Short Submit Documentation Feedback Output Current 3 −0.25 0 −1 −2m Amplitude (V) 1.75 5 G002 Figure 12. TPS2065C Output Rise / Fall 100Ω Current (A) Amplitude (V) 1.25 1.00 5 7 8 8 FLT 0.25 −0.25 VIN = 5 V, COUT = 150 µF, RLOAD = 0 Ω, TPS2065C 1.75 1.50 Output Voltage Figure 11. TPS2065C Output Rise / Fall 5Ω 9 2.00 Current (A) Amplitude (V) 6 9 −0.25 0 −1 −2.5m G003 Current (A) Output Current 7 2.00 Amplitude (V) 8 VIN = 5 V, COUT = 150 µF, RLOAD = 5 Ω, TPS2065C Current (A) 9 Output Voltage 2.5m 7.5m 12.5m Time (s) 17.5m −0.50 22.5m25m G004 Figure 14. TPS2065C Pulsed Short Applied Copyright © 2011–2013, Texas Instruments Incorporated TPS20xxC, TPS20xxC-2 www.ti.com SLVSAU6G – JUNE 2011 – REVISED JULY 2013 4u 30 6 VIN = 5 V, COUT = 0 µF, RLOAD = 50 mΩ, TPS2065C 4 15 3 VOUT 2 10 1 5 0 0 −1 −1u 0 1u 2u 3u 4u G006 Figure 16. TPS2065C Pulsed 1.45-A Load 2.00 9 8 2.0 VIN = 5 V, COUT = 150 µF, RLOAD = 7.5Ω, TPS2065C 1.75 1.50 1.0 3 IOUT 0.5 VOUT 1 0.0 Output Voltage 6 Amplitude (V) 1.5 4 Output Current (A) Output Voltage (V) 7 1.00 EN, VIN 4 0.75 0.50 3 FLT 2 −0.5 −1 −100u 0 100u 200u 300u Time (s) 400u 500u −1.0 600u −0.25 −1 −5m −4m −3m −2m −1m 0 1m Time (s) G007 2.00 7 1.50 6 1.25 5 1.00 FLT EN, VIN 4 0.75 3 0.50 2 0.25 Output Current 1 0.00 0 −0.25 Output Voltage −1 −40m −30m −20m −10m 0 10m Time (s) 20m 30m 3m 4m −0.50 5m G008 VIN = 5 V, COUT = 150 µF, RLOAD = 2.5 Ω, TPS2001C Output Current 7 3.2 2.8 2.4 FLT 2.0 1.6 5 1.2 0.8 3 EN 1 Output Voltage 0.4 0.0 −0.4 −0.50 40m Figure 19. TPS2065C Power Down - Enabled Copyright © 2011–2013, Texas Instruments Incorporated 9 1.75 Amplitude (V) VIN = 5 V, COUT = 150 µF, RLOAD = 7.5Ω, TPS2065C 2m Figure 18. TPS2065C Power Up - Enabled Current (A) Amplitude (V) 8 0.00 0 Figure 17. TPS2065C 50 mΩ Short Circuit 9 0.25 Output Current 1 0 1.25 5 Current (A) VIN = 5 V, COUT = 0 µF, RLOAD = 50 mΩ, TPS2065C Current (A) 2.5 6 2 −5 Time (s) G005 Figure 15. TPS2065C Short Applied 5 20 IOUT Output Current (A) 25 5 Output Voltage (V) 26 24 22 20 18 16 14 12 10 8 6 4 2 0 Current (A) Voltage (V) TYPICAL CHARACTERISTICS (continued) 10 VIN = 5 V, COUT = 0 µF, TPS2065C 9 8 Input Voltage 7 6 5 4 3 Output Voltage 2 1 0 Output Current −1 −2 −3 −1u 0 1u 2u 3u Time (s) −1 −2m G009 0 2m 4m 6m −0.8 8m 10m 12m 14m 16m 18m Time (s) G010 Figure 20. TPS2001C Turn ON into 2.5Ω Submit Documentation Feedback 9 TPS20xxC, TPS20xxC-2 SLVSAU6G – JUNE 2011 – REVISED JULY 2013 www.ti.com TYPICAL CHARACTERISTICS (continued) EN 5 FLT 8 2.8 7 2.4 6 2.0 1.6 3 1.2 2 Output Voltage 0.8 1 0.4 1 0 0.0 0 0 2m 4m −0.4 6m 8m 10m 12m 14m 16m 18m Time (s) Output Current 1.6 Output Voltage 3 FLT Output Voltage Amplitude (V) 6 FLT 5 G011 1.4 9 1.2 8 1.0 7 0.8 6 1.0 5 0.8 4 0.6 0.6 0.4 3 0.2 EN 1 0 −1 −2m 0 2m 4m 2 −0.2 1 −0.4 0 −1 −2m 0.4 EN Output Voltage FLT 0 0.8 5 0.6 EN 2 FLT 0.0 1 Output Voltage −0.2 −1 −2.5m 0 −0.6 2.5m 5m 7.5m 10m 12.5m 15m 17.5m 20m 22.5m Time (s) Figure 25. TPS2051C Pulsed Output Short Submit Documentation Feedback 4m 6m −0.4 8m 10m 12m 14m 16m 18m Time (s) VIN = 5 V, COUT = 150 µF, RLOAD = 3.3 Ω, TPS2069C G014 2.5 2.0 10 1.5 8 6 EN Output Current 1.0 0.5 4 0.0 2 FLT Output Voltage 0 −0.4 0 10 0.4 0.2 3 2m 1.0 6 4 12 1.2 Amplitude (V) Output Current 0.0 Figure 24. TPS2051C Enable into Short Current (A) Amplitude (V) 7 0.2 −0.2 G013 1.4 VIN = 5 V, COUT = 150 µF, RLOAD = 50mΩ, TPS2051C 1.4 1.2 Output Current Figure 23. TPS2051C Turn ON into 10Ω 8 G012 1.6 VIN = 5 V, COUT = 150 µF, RLOAD = 50 mΩ, TPS2051C 3 0.0 −0.6 6m 8m 10m 12m 14m 16m 18m Time (s) 9 −0.4 2.5m 5m 7.5m 10m 12.5m 15m 17.5m 20m 22.5m Time (s) Figure 22. TPS2001C Pulsed Output Short 4 2 0.4 0.0 −1 −2.5m 0 Amplitude (V) Output Current 7 1.2 0.8 2 Current (A) VIN = 5 V, COUT = 150 µF, RLOAD = 10 Ω, TPS2051C 8 2.8 2.0 4 Figure 21. TPS2001C Enable into Short 9 3.2 2.4 EN 5 4 −1 −2m 3.6 VIN = 5 V, COUT = 150 µF, RLOAD = 50mΩ, TPS2001C Current (A) Amplitude (V) 6 9 3.2 Current (A) Output Current 7 3.6 Current (A) VIN = 5 V, COUT = 150 µF, RLOAD = 50 mΩ, TPS2001C Amplitude (V) 8 Current (A) 9 −2 −4m −2m G015 0 2m 4m −0.5 −1.0 6m 8m 10m 12m 14m 16m Time (s) G016 Figure 26. TPS2069C Turn ON into 3.3Ω Copyright © 2011–2013, Texas Instruments Incorporated TPS20xxC, TPS20xxC-2 www.ti.com SLVSAU6G – JUNE 2011 – REVISED JULY 2013 TYPICAL CHARACTERISTICS (continued) 3.0 3.0 10 VIN = 5 V, COUT = 150 µF, RLOAD = 50 mΩ, TPS2069C Amplitude (V) 6 2.5 EN 2.0 1.5 4 1.0 2 FLT 0 −2 2.5 8 Amplitude (V) Output Current EN Current (A) 8 VIN = 5 V, COUT = 150 µF, RLOAD = 50 mΩ, TPS2069C 6 2.0 4 1.5 2 0.5 0 0.0 −2 0 2m 4m 6m 0.5 0.0 Output Voltage −0.5 8m 10m 12m 14m 16m 18m Time (s) 1.0 Output Current Output Voltage −4 −2m Current (A) 10 −4 −12.5m FLT −7.5m −2.5m 2.5m Time (s) G017 Figure 27. TPS2069C Enable into Short −0.5 12.5m 7.5m G018 Figure 28. TPS2069C Pulsed Output Short 9.3 14 VIN = 5 V All Versions, 5 V 85°C 12 IOUT sinking (mA) tFLT (ms) 9.2 9.1 9.0 25°C 10 8 −40°C 6 125°C 4 8.9 2 8.8 −40 −20 0 20 40 60 80 100 Junction Temperature (°C) 120 0 0.0 140 0.5 1.0 1.5 G019 Figure 29. Deglitch Period (tFLT) vs Temperature 2.0 2.5 3.0 3.5 Output Voltage (V) 4.0 4.5 5.0 5.5 G020 Figure 30. Output Discharge Current vs Output Voltage 3.5 7 2-A Rated VIN = 5 V All Unit Types, 5 V 6 3.0 5 IOS (A) 2.0 IREV (µA) 1.5-A Rated 2.5 1-A Rated 1.5 0.5-A Rated 3 2 1 1.0 0.5 −40 4 0 −20 0 20 40 60 80 100 Junction Temperature (°C) 120 140 G021 Figure 31. Short Circuit Current (IOS) vs Temperature Copyright © 2011–2013, Texas Instruments Incorporated −1 −40 −20 0 20 40 60 80 100 Junction Temperature (°C) 120 140 G022 Figure 32. Reverse Leakage Current (IREV) vs Temperature Submit Documentation Feedback 11 TPS20xxC, TPS20xxC-2 SLVSAU6G – JUNE 2011 – REVISED JULY 2013 www.ti.com TYPICAL CHARACTERISTICS (continued) 1.0 1.0 All Unit Types 0.8 0.8 0.6 0.6 0.4 0.2 0.0 0.0 −20 0 20 40 60 80 100 Junction Temperature (°C) 120 4.50 4.75 5.00 Input Voltage (V) All Unit Types, VIN = 5.5 V 70 65 60 55 50 −40 5.50 −20 0 G025 125°C 120 140 G026 COUT = 1 µF, RLOAD = 100 Ω 0.450 0.425 tf (ms) 60 55 0.400 1.5-A and 2-A Rated, VIN = 4.5 V 1.5-A and 2-A Rated, VIN = 5 V 0.375 1.5-A and 2-A Rated, VIN = 5.5 V 50 0.350 25°C 45 −40°C 4.25 4.50 4.75 5.00 Input Voltage (V) 0.5-A and 1-A Rated, VIN = 5 V 5.25 5.50 G027 Figure 37. Enabled Supply Current (ISE) vs Input Voltage 12 20 40 60 80 100 Junction Temperature (°C) Figure 36. Enabled Supply Current (ISE) vs Temperature 65 40 4.00 G024 75 0.475 85°C 5.50 80 80 75 5.25 Figure 34. Disabled Supply Current (ISD) vs Input Voltage Figure 35. Reverse Leakage Current (IREV) vs Output Voltage 70 −40°C and 25°C 4.25 G023 ISE (µA) 6.0 All unit types, VIN = 0 V 5.5 5.0 4.5 125°C 4.0 3.5 3.0 2.5 2.0 85°C 1.5 25°C −40°C 1.0 0.5 0.0 −0.5 4.00 4.25 4.50 4.75 5.00 5.25 Output Voltage (V) 85°C −0.2 4.00 140 Figure 33. Disabled Supply Current (ISD) vs Temperature IREV (µA) 0.4 0.2 −0.2 −40 ISE (µA) 125°C ISD (µA) ISD (µA) Input Voltage = 5.5 V Submit Documentation Feedback 0.325 −40 −20 0 20 40 60 80 100 Junction Temperature (°C) 120 140 G028 Figure 38. Output Fall Time (tF) vs Temperature Copyright © 2011–2013, Texas Instruments Incorporated TPS20xxC, TPS20xxC-2 www.ti.com SLVSAU6G – JUNE 2011 – REVISED JULY 2013 TYPICAL CHARACTERISTICS (continued) 0.85 140 COUT = 1 µF, RLOAD = 100 Ω VIN = 5 V 130 1.5 A, 2 A, 5.5 V 0.80 120 0.5-A, 1-A Rated 110 RDSON (mΩ) tr (ms) 0.75 0.70 0.65 0.5 A, 1 A, 5 V 0.60 90 80 70 1.5 A, 2 A, 5 V 1.5-A, 2-A Rated 60 1.5 A, 2 A, 4.5 V 0.55 100 50 0.50 −40 −20 0 20 40 60 80 100 Junction Temperature (°C) 120 40 −40 140 −20 G029 Figure 39. Output Rise Time (tR) vs Temperature 0 20 40 60 80 100 Junction Temperature (°C) 120 140 G030 Figure 40. Input-Output Resistance (RDS(ON)) vs Temperature 100 Recovery Time (µs) VIN = 5 V, CIN = 730 µF, TPS2065C, IEND = 1.68 A IOS 10 1 0 5 10 15 IPK (Shorted) (A) 20 25 G031 Figure 41. Recovery vs Current Peak Copyright © 2011–2013, Texas Instruments Incorporated Submit Documentation Feedback 13 TPS20xxC, TPS20xxC-2 SLVSAU6G – JUNE 2011 – REVISED JULY 2013 www.ti.com DETAILED DESCRIPTION The TPS20xxC and TPS20xxC-2 are current-limited, power-distribution switches providing between 0.5 A and 2 A of continuous load current in 5 V circuits. These parts use N-channel MOSFETs for low resistance, maintaining voltage regulation to the load. They are designed for applications where short circuits or heavy capacitive loads will be encountered. Device features include enable, reverse blocking when disabled, output discharge pulldown, overcurrent protection, over-temperature protection, and deglitched fault reporting. UVLO The undervoltage lockout (UVLO) circuit disables the power switch until the input voltage reaches the UVLO turnon threshold. Built-in hysteresis prevents unwanted on/off cycling due to input voltage drop from large current surges. FLT is high impedance when the TPS20xxC and TPS20xxC-2 are in UVLO. ENABLE The logic enable input (EN, or EN), controls the power switch, bias for the charge pump, driver, and other circuits. The supply current is reduced to less than 1 µA when the TPS20xxC and TPS20xxC-2 are disabled. Disabling the TPS20xxC and TPS20xxC-2 will immediately clear an active FLT indication. The enable input is compatible with both TTL and CMOS logic levels. The turnon and turnoff times (tON, tOFF) are composed of a delay and a rise or fall time (tR, tF). The delay times are internally controlled. The rise time is controlled by both the TPS20xxC and TPS20xxC-2 and the external loading (especially capacitance). TPS20xxC fall time is controlled by the loading (R and C), and the output discharge (RPD). TPS20xxC-2 does not have the output discharge (RPD), fall time is controlled by the loading (R and C). An output load consisting of only a resistor will experience a fall time set by the TPS20xxC and TPS20xxC-2. An output load with parallel R and C elements will experience a fall time determined by the (R × C) time constant if it is longer than the TPS20xxC and TPS20xxC-2’s tF. The enable should not be left open, and may be tied to VIN or GND depending on the device. INTERNAL CHARGE PUMP The device incorporates an internal charge pump and gate drive circuitry necessary to drive the N-channel MOSFET. The charge pump supplies power to the gate driver circuit and provides the necessary voltage to pull the gate of the MOSFET above the source. The driver incorporates circuitry that controls the rise and fall times of the output voltage to limit large current and voltage surges on the input supply, and provides built-in soft-start functionality. The MOSFET power switch will block current from OUT to IN when turned off by the UVLO or disabled. CURRENT LIMIT The TPS20xxC and TPS20xxC-2 responds to overloads by limiting output current to the static IOS levels shown in the Electrical Characteristics table. When an overload condition is present, the device maintains a constant output current, with the output voltage determined by (IOS × RLOAD). Two possible overload conditions can occur. The first overload condition occurs when either: 1) input voltage is first applied, enable is true, and a short circuit is present (load which draws IOUT > IOS), or 2) input voltage is present and the TPS20xxC and TPS20xxC-2 are enabled into a short circuit. The output voltage is held near zero potential with respect to ground and the TPS20xxC and TPS20xxC-2 ramps the output current to IOS. The TPS20xxC and TPS20xxC-2 will limit the current to IOS until the overload condition is removed or the device begins to thermal cycle. This is demonstrated in Figure 13 where the device was enabled into a short, and subsequently cycles current off and on as the thermal protection engages. The second condition is when an overload occurs while the device is enabled and fully turned on. The device responds to the overload condition within tIOS (Figure 6 and Figure 7) when the specified overload (per Electrical Characteristics table) is applied. The response speed and shape will vary with the overload level, input circuit, and rate of application. The current-limit response will vary between simply settling to IOS, or turnoff and controlled return to IOS. Similar to the previous case, the TPS20xxC and TPS20xxC-2 will limit the current to IOS until the overload condition is removed or the device begins to thermal cycle. This is demonstrated by Figure 14, Figure 15, and Figure 16. 14 Submit Documentation Feedback Copyright © 2011–2013, Texas Instruments Incorporated TPS20xxC, TPS20xxC-2 www.ti.com SLVSAU6G – JUNE 2011 – REVISED JULY 2013 The TPS20xxC and TPS20xxC-2 thermal cycles if an overload condition is present long enough to activate thermal limiting in any of the above cases. This is due to the relatively large power dissipation [(VIN – VOUT) x IOS] driving the junction temperature up. The device turns off when the junction temperature exceeds 135°C (min) while in current limit. The device remains off until the junction temperature cools 20°C and then restarts. There are two kinds of current limit profiles typically available in TI switch products similar to the TPS20xxC and TPS20xxC-2. Many older designs have an output I vs V characteristic similar to the plot labeled "Current Limit with Peaking" in Figure 42. This type of limiting can be characterized by two parameters, the current limit corner (IOC), and the short circuit current (IOS). IOC is often specified as a maximum value. The TPS20xxC and TPS20xxC-2 family of parts does not present noticeable peaking in the current limit, corresponding to the characteristic labeled "Flat Current Limit" in Figure 42. This is why the IOC parameter is not present in the Electrical Characteristics tables. Current Limit with Peaking Flat Current Limit VIN Decreasing Load Resistance Decreasing Load Resistance Slope = -RDS(ON) VOUT VO UT Slope = -RDS(ON) VIN 0V 0V 0A IOUT IOS IOC 0A IOUT I OS Figure 42. Current Limit Profiles FLT The FLT open-drain output is asserted (active low) during an overload or over-temperature condition. A 9 ms deglitch on both the rising and falling edges avoids false reporting at startup and during transients. A current limit condition shorter than the deglitch period will clear the internal timer upon termination. The deglitch timer will not integrate multiple short overloads and declare a fault. This is also true for exiting from a faulted state. An input voltage with excessive ripple and large output capacitance may interfere with operation of FLT around IOS as the ripple will drive the TPS20xxC and TPS20xxC-2 in and out of current limit. If the TPS20xxC and TPS20xxC-2 are in current limit and the over-temperature circuit goes active, FLT will go true immediately (see Figure 14) however exiting this condition is deglitched (see Figure 16). FLT is tripped just as the knee of the constant-current limiting is entered. Disabling the TPS20xxC and TPS20xxC-2 will clear an active FLT as soon as the switch turns off (see Figure 13). FLT is high impedance when the TPS20xxC and TPS20xxC-2 are disabled or in under-voltage lockout (UVLO). OUTPUT DISCHARGE A 470Ω (typical) output discharge will dissipate stored charge and leakage current on OUT when the TPS20xxC is in UVLO or disabled. The pull-down circuit will lose bias gradually as VIN decreases, causing a rise in the discharge resistance as VIN falls towards 0 V. The TPS20xxC-2 does not have this function. The output is be controlled by an external loadings when the device is in ULVO or disabled. Copyright © 2011–2013, Texas Instruments Incorporated Submit Documentation Feedback 15 TPS20xxC, TPS20xxC-2 SLVSAU6G – JUNE 2011 – REVISED JULY 2013 www.ti.com APPLICATION INFORMATION INPUT AND OUTPUT CAPACITANCE Input and output capacitance improves the performance of the device; the actual capacitance should be optimized for the particular application. For all applications, a 0.1 µF or greater ceramic bypass capacitor between IN and GND is recommended as close to the device as possible for local noise decoupling. All protection circuits such as the TPS20xxC and TPS20xxC-2 will have the potential for input voltage overshoots and output voltage undershoots. Input voltage overshoots can be caused by either of two effects. The first cause is an abrupt application of input voltage in conjunction with input power bus inductance and input capacitance when the IN terminal is high impedance (before turn on). Theoretically, the peak voltage is 2 times the applied. The second cause is due to the abrupt reduction of output short circuit current when the TPS20xxC and TPS20xxC-2 turns off and energy stored in the input inductance drives the input voltage high. Input voltage droops may also occur with large load steps and as the TPS20xxC and TPS20xxC-2 output is shorted. Applications with large input inductance (e.g. connecting the evaluation board to the bench power-supply through long cables) may require large input capacitance reduce the voltage overshoot from exceeding the absolute maximum voltage of the device. The fast current-limit speed of the TPS20xxC and TPS20xxC-2 to hard output short circuits isolates the input bus from faults. However, ceramic input capacitance in the range of 1µF to 22µF adjacent to the TPS20xxC and TPS20xxC-2 input aids in both speeding the response time and limiting the transient seen on the input power bus. Momentary input transients to 6.5V are permitted. Output voltage undershoot is caused by the inductance of the output power bus just after a short has occurred and the TPS20xxC and TPS20xxC-2 has abruptly reduced OUT current. Energy stored in the inductance will drive the OUT voltage down and potentially negative as it discharges. Applications with large output inductance (such as from a cable) benefit from use of a high-value output capacitor to control the voltage undershoot. When implementing USB standard applications, a 120 µF minimum output capacitance is required. Typically a 150 µF electrolytic capacitor is used, which is sufficient to control voltage undershoots. However, if the application does not require 120 µF of capacitance, and there is potential to drive the output negative, a minimum of 10 µF ceramic capacitance on the output is recommended. The voltage undershoot should be controlled to less than 1.5 V for 10 µs. POWER DISSIPATION AND JUNCTION TEMPERATURE It is good design practice to estimate power dissipation and maximum expected junction temperature of the TPS20xxC and TPS20xxC-2. The system designer can control choices of package, proximity to other power dissipating devices, and printed circuit board (PCB) design based on these calculations. These have a direct influence on maximum junction temperature. Other factors, such as airflow and maximum ambient temperature, are often determined by system considerations. It is important to remember that these calculations do not include the effects of adjacent heat sources, and enhanced or restricted air flow. Addition of extra PCB copper area around these devices is recommended to reduce the thermal impedance and maintain the junction temperature as low as practical. The lower junction temperatures achieved by soldering the pad improve the efficiency and reliability of both TPS20xxC and TPS20xxC-2 parts and the system. The following examples were used to determine the θJACustom thermal impedances noted in the THERMAL INFORMATION table. They were based on use of the JEDEC high-k circuit board construction (2 signal and 2 plane) with 4, 1oz. copper weight, layers. While it is recommended that the DGN package PAD be soldered to circuit board copper fill and vias for low thermal impedance, there may be cases where this is not desired. For example, use of routing area under the IC. Some devices are available in packages without the Power Pad (DGK) specifically for this purpose. The θJA for the DGN package with the pad not soldered and no extra copper, is approximately 141°C/W for 0.5 - A and 1- A rated parts, and 139°C/W for the 1.5 - A and 2- A rated parts. The θJA for the DGK mounted per Figure 45 is 110.3C/W. These values may be used in Equation 1 to determine the maximum junction temperature. 16 Submit Documentation Feedback Copyright © 2011–2013, Texas Instruments Incorporated TPS20xxC, TPS20xxC-2 www.ti.com SLVSAU6G – JUNE 2011 – REVISED JULY 2013 GND: 0.052in2 Total & 3 x 0.018in vias GND: 0.056in2 total area & 3 x 0.018in vias COUT COUT 0.050in trace CIN 0.050in trace CIN 4 x 0.01in vias 2 2 VIN : 0.00925in VOUT: 0.041in total & 3 x 0.018in vias Figure 43. DBV Package PCB Layout Example 0.100 x 0.175 & 5 18 mil vias 0.185 x 0.045 & 3 18 mil vias VIN: 0.0145in2 area & 2 x 0.018in vias VOUT: 0.048in2 total area 5 x 0.01in vias Figure 44. DGN Package PCB Layout Example 0.08 x 0.250 0.15 x 0.15 50 mil trace 0.100 x 0.060 & 3 18 mil vias to inner plane 2 0.07 x 0.08 10 mil trace 10 mil trace Figure 45. DGK Package PCB Layout Example The following procedure requires iteration because power loss is due to the internal MOSFET I2 × RDS(ON), and RDS(ON) is a function of the junction temperature. As an initial estimate, use the RDS(ON) at 125°C from the TYPICAL CHARACTERISTICS, and the preferred package thermal resistance for the preferred board construction from the THERMAL INFORMATION table. TJ = TA + ((IOUT2 x RDS(ON)) x θJA) (1) Where: IOUT = rated OUT pin current (A) RDS(ON) = Power switch on-resistance at an assumed TJ (Ω) TA = Maximum ambient temperature (°C) TJ = Maximum junction temperature (°C) θJA = Thermal resistance (°C/W) If the calculated TJ is substantially different from the original assumption, estimate a new value of RDS(ON) using the typical characteristic plot and recalculate. If the resulting TJ is not less than 125°C, try a PCB construction and/or package with lower θJA . Copyright © 2011–2013, Texas Instruments Incorporated Submit Documentation Feedback 17 TPS20xxC, TPS20xxC-2 SLVSAU6G – JUNE 2011 – REVISED JULY 2013 www.ti.com REVISION HISTORY Changes from Original (June 2011) to Revision A Page • Changed the TPS2051C, TPS2065C, and TPS2069C Devices Status From: Preview To: Active ...................................... 1 • Corrected pinout numbers for the 5-PIN PACKAGE ............................................................................................................ 7 Changes from Revision A (July 2011) to Revision B Page • Added the DGK Package Information throughout the data sheet ........................................................................................ 1 • Changed title of Figure 17 From: NEW FIG To: TPS2065C 50 Ω Short Circuit ................................................................... 9 Changes from Revision B (September 2011) to Revision C Page • Changed TPS2000C (MSOP-8) status From: Preview To: Active in Table 1 ...................................................................... 1 • Changed From: PXF1 To: PXFI and From: PSG1 To: PXGI in the DEVICE INFORMATION table MOSP-8 (DGK) column .................................................................................................................................................................................. 2 • Changed the θJACustom 2 A Rated DGK value from N/A to 110.3 .................................................................................... 2 • Added Figure 45 - DGK Package PCB Layout Example .................................................................................................... 17 Changes from Revision C (October 2011) to Revision D Page • Added Feature UL Listed and CB-File No. E169910 (See Table 1) .................................................................................... 1 • Added table Note 2, UL listed and CB complete. ................................................................................................................. 1 • Added VIH and VIL information to the ROC Table ................................................................................................................. 3 Changes from Revision D (February 2012) to Revision E • 18 Page Changed the POWER DISSIPATION AND JUNCTION TEMPERATURE section. Replaced paragraph " While it is recommended..." ................................................................................................................................................................. 16 Submit Documentation Feedback Copyright © 2011–2013, Texas Instruments Incorporated TPS20xxC, TPS20xxC-2 www.ti.com SLVSAU6G – JUNE 2011 – REVISED JULY 2013 Changes from Revision E (April 2012) to Revision F Page • Added device TPS20xxC-2 ................................................................................................................................................... 1 • Changed Feature From: Ouput Discharge When TPS20XXC is Disabled To: Selected parts with (TPS20xxC) and without (TPS20xxC-2) Output Discharge .............................................................................................................................. 1 • Added devices TPS2041C, TPS2061C, TPS2065C-2, TPS2068C, and TPS2069C-2 to Table 1 and removed Product Preview .................................................................................................................................................................... 1 • Added the TPS2069C-2 Device ............................................................................................................................................ 1 • Added devices TPS2041C, TPS2061C, TPS2065C-2, TPS2068C, and TPS2069C-2 to the Device Information table ..... 2 • Added PXKI in the DEVICE INFORMATION table SOT23-5 (DBV) column (TPS2069C) ................................................... 2 • Added Note 1 to the RECOMMENDED OPERATING CONDITIONS table ......................................................................... 3 • Added TPS2041C, TPS2061C, TPS2068C, TPS2065C-2 and TPS2069C-2 devices to IOUT in the RECOMMENDED OPERATING CONDITIONS table ........................................................................................................................................ 3 • Added the DBV option to Power Switch RDS(on) 1.5 A rated output, 25°C mΩ ..................................................................... 3 • Added the DBV option to Power Switch RDS(on) 1.5 A rated output ...................................................................................... 3 • Changed ISO Current Limit .................................................................................................................................................... 3 • Added Leakage Current ........................................................................................................................................................ 3 • Added the DBV option to Power Switch RDS(on) 1.5 A rated output . .................................................................................... 4 • Changed ISO Current Limit .................................................................................................................................................... 4 • Added Leakage Current ........................................................................................................................................................ 5 • Changed the second para graph of the ENABLE section .................................................................................................. 14 • Added sentence to end of paragraph in the OUTPUT DISCHARGE section .................................................................... 15 Changes from Revision F (August 2012) to Revision G Page • Deleted (See Table 1) from Feature: UL Listed and CB-File No. E169910 ......................................................................... 1 • Deleted Note 2 from Table 1: "UL listed and CB complete" ................................................................................................. 1 • Changed From: PXKI To: PYKI in the DEVICE INFORMATION table SOT23-5 (DBV) column (TPS2069C) .................... 2 Copyright © 2011–2013, Texas Instruments Incorporated Submit Documentation Feedback 19 PACKAGE OPTION ADDENDUM www.ti.com 18-Oct-2013 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) 905X0205100 ACTIVE SOT-23 DBV 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 85 VBYQ TPS2000CDGK ACTIVE VSSOP DGK 8 80 Green (RoHS & no Sb/Br) CU NIPDAUAG Level-2-260C-1 YEAR -40 to 85 PXFI TPS2000CDGKR ACTIVE VSSOP DGK 8 2500 Green (RoHS & no Sb/Br) CU NIPDAUAG Level-2-260C-1 YEAR -40 to 85 PXFI TPS2000CDGN ACTIVE MSOPPowerPAD DGN 8 80 Green (RoHS & no Sb/Br) CU NIPDAU | CU NIPDAUAG Level-2-260C-1 YEAR -40 to 85 BCMS TPS2000CDGNR ACTIVE MSOPPowerPAD DGN 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU | CU NIPDAUAG Level-2-260C-1 YEAR -40 to 85 BCMS TPS2001CDGK ACTIVE VSSOP DGK 8 80 Green (RoHS & no Sb/Br) CU NIPDAUAG Level-2-260C-1 YEAR -40 to 85 PXGI TPS2001CDGKR ACTIVE VSSOP DGK 8 2500 Green (RoHS & no Sb/Br) CU NIPDAUAG Level-2-260C-1 YEAR -40 to 85 PXGI TPS2001CDGN ACTIVE MSOPPowerPAD DGN 8 80 Green (RoHS & no Sb/Br) CU NIPDAU | CU NIPDAUAG Level-2-260C-1 YEAR -40 to 85 VBWQ TPS2001CDGNR ACTIVE MSOPPowerPAD DGN 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU | CU NIPDAUAG Level-2-260C-1 YEAR -40 to 85 VBWQ TPS2041CDBVR ACTIVE SOT-23 DBV 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 85 PYJI TPS2041CDBVT ACTIVE SOT-23 DBV 5 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 85 PYJI TPS2051CDBVR ACTIVE SOT-23 DBV 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 85 VBYQ TPS2051CDBVT ACTIVE SOT-23 DBV 5 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 85 VBYQ TPS2061CDBVR ACTIVE SOT-23 DBV 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 85 PXLI TPS2061CDBVT ACTIVE SOT-23 DBV 5 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 85 PXLI TPS2061CDGN ACTIVE MSOPPowerPAD DGN 8 80 Green (RoHS & no Sb/Br) CU NIPDAUAG Level-2-260C-1 YEAR -40 to 85 PXMI TPS2061CDGNR ACTIVE MSOPPowerPAD DGN 8 2500 Green (RoHS & no Sb/Br) CU NIPDAUAG Level-2-260C-1 YEAR -40 to 85 PXMI Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com Orderable Device 18-Oct-2013 Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) TPS2065CDBVR ACTIVE SOT-23 DBV 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 85 VCAQ TPS2065CDBVR-2 ACTIVE SOT-23 DBV 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 85 PYQI TPS2065CDBVT ACTIVE SOT-23 DBV 5 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 85 VCAQ TPS2065CDBVT-2 ACTIVE SOT-23 DBV 5 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 85 PYQI TPS2065CDGN ACTIVE MSOPPowerPAD DGN 8 80 Green (RoHS & no Sb/Br) CU NIPDAU | CU NIPDAUAG Level-2-260C-1 YEAR -40 to 85 VCAQ TPS2065CDGN-2 ACTIVE MSOPPowerPAD DGN 8 80 Green (RoHS & no Sb/Br) CU NIPDAUAG Level-2-260C-1 YEAR -40 to 85 PYRI TPS2065CDGNR ACTIVE MSOPPowerPAD DGN 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU | CU NIPDAUAG Level-2-260C-1 YEAR -40 to 85 VCAQ TPS2065CDGNR-2 ACTIVE MSOPPowerPAD DGN 8 2500 Green (RoHS & no Sb/Br) CU NIPDAUAG Level-2-260C-1 YEAR -40 to 85 PYRI TPS2068CDGN ACTIVE MSOPPowerPAD DGN 8 80 Green (RoHS & no Sb/Br) CU NIPDAUAG Level-2-260C-1 YEAR -40 to 85 PXNI TPS2068CDGNR ACTIVE MSOPPowerPAD DGN 8 2500 Green (RoHS & no Sb/Br) CU NIPDAUAG Level-2-260C-1 YEAR -40 to 85 PXNI TPS2069CDBVR ACTIVE SOT-23 DBV 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 85 PYKI TPS2069CDBVT ACTIVE SOT-23 DBV 5 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 85 PYKI TPS2069CDGN ACTIVE MSOPPowerPAD DGN 8 80 Green (RoHS & no Sb/Br) CU NIPDAU | CU NIPDAUAG Level-2-260C-1 YEAR -40 to 85 VBUQ TPS2069CDGN-2 ACTIVE MSOPPowerPAD DGN 8 80 Green (RoHS & no Sb/Br) CU NIPDAUAG Level-2-260C-1 YEAR -40 to 85 PYSI TPS2069CDGNR ACTIVE MSOPPowerPAD DGN 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU | CU NIPDAUAG Level-2-260C-1 YEAR -40 to 85 VBUQ TPS2069CDGNR-2 ACTIVE MSOPPowerPAD DGN 8 2500 Green (RoHS & no Sb/Br) CU NIPDAUAG Level-2-260C-1 YEAR -40 to 85 PYSI (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. Addendum-Page 2 Samples PACKAGE OPTION ADDENDUM www.ti.com 18-Oct-2013 PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. 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Addendum-Page 3 PACKAGE MATERIALS INFORMATION www.ti.com 8-Jul-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant TPS2000CDGKR VSSOP DGK 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 TPS2000CDGNR MSOPPower PAD DGN 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 TPS2001CDGKR VSSOP DGK 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 TPS2001CDGNR MSOPPower PAD DGN 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 TPS2041CDBVR SOT-23 DBV 5 3000 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3 TPS2051CDBVR SOT-23 DBV 5 3000 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3 TPS2061CDBVR SOT-23 DBV 5 3000 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3 TPS2061CDGNR MSOPPower PAD DGN 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 TPS2065CDBVR SOT-23 DBV 5 3000 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3 TPS2065CDBVR-2 SOT-23 DBV 5 3000 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3 TPS2065CDGNR MSOPPower PAD DGN 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 TPS2065CDGNR-2 MSOPPower DGN 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 8-Jul-2013 Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant PAD TPS2068CDGNR MSOPPower PAD DGN 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 TPS2069CDBVR SOT-23 DBV 5 3000 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3 TPS2069CDGNR MSOPPower PAD DGN 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 TPS2069CDGNR-2 MSOPPower PAD DGN 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TPS2000CDGKR VSSOP DGK 8 2500 366.0 364.0 50.0 TPS2000CDGNR MSOP-PowerPAD DGN 8 2500 360.0 162.0 98.0 TPS2001CDGKR VSSOP DGK 8 2500 366.0 364.0 50.0 TPS2001CDGNR MSOP-PowerPAD DGN 8 2500 360.0 162.0 98.0 TPS2041CDBVR SOT-23 DBV 5 3000 180.0 180.0 18.0 TPS2051CDBVR SOT-23 DBV 5 3000 180.0 180.0 18.0 TPS2061CDBVR SOT-23 DBV 5 3000 180.0 180.0 18.0 TPS2061CDGNR MSOP-PowerPAD DGN 8 2500 366.0 364.0 50.0 Pack Materials-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 8-Jul-2013 Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TPS2065CDBVR SOT-23 DBV 5 3000 180.0 180.0 18.0 TPS2065CDBVR-2 SOT-23 DBV 5 3000 180.0 180.0 18.0 TPS2065CDGNR MSOP-PowerPAD DGN 8 2500 360.0 162.0 98.0 TPS2065CDGNR-2 MSOP-PowerPAD DGN 8 2500 366.0 364.0 50.0 TPS2068CDGNR MSOP-PowerPAD DGN 8 2500 366.0 364.0 50.0 TPS2069CDBVR SOT-23 DBV 5 3000 180.0 180.0 18.0 TPS2069CDGNR MSOP-PowerPAD DGN 8 2500 360.0 162.0 98.0 TPS2069CDGNR-2 MSOP-PowerPAD DGN 8 2500 366.0 364.0 50.0 Pack Materials-Page 3 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. 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