TI TPS22944DCKR

TPS22941, TPS22942, TPS22943, TPS22944, TPS22945
www.ti.com
SLVS832C – NOVEMBER 2008 – REVISED NOVEMBER 2009
LOW-INPUT-VOLTAGE CURRENT-LIMITED LOAD SWITCHES
WITH SHUT OFF AND AUTO-RESTART FEATURE
Check for Samples: TPS22941 TPS22942 TPS22943 TPS22944 TPS22945
FEATURES
1
•
•
•
•
•
•
•
•
•
•
•
•
DESCRIPTION
Input Voltage Range: 1.62 V to 5.5 V
Low ON resistance
– rON = 0.4 Ω at VIN = 5.5 V
– rON = 0.5 Ω at VIN = 3.3 V
– rON = 0.6 Ω at VIN = 2.5 V
– rON = 0.8 Ω at VIN = 1.8 V
Minimum Current Limit: 40 mA or 100 mA
Undervoltage Lockout
Thermal Shutdown
Shutdown Current < 1 μA
Fast Current Limit Response Time
Fault Blanking
Auto Restart
1.8-V Compatible Control Input Thresholds
ESD Performance Tested Per JESD 22
– 4000-V Human-Body Model
(A114-B, Class II)
– 1000-V Charged-Device Model (C101)
Tiny SC-70 (DCK) Package
The TPS2294x load switches provide protection to
systems and loads in high-current conditions. The
devices contain a 400-mΩ current-limited P-channel
MOSFET that can operate over an input voltage
range of 1.62 V to 5.5 V. Current is prevented from
flowing when the MOSFET is off. The switch is
controlled by an on/off input (ON), which is capable of
interfacing directly with low-voltage control signals.
The TPS2294x includes thermal shutdown protection
that prevents damage to the device when a
continuous over-current condition causes excessive
heating by turning off the switch.
When the switch current reaches the maximum limit,
the TPS22941/2/3/4/5 operates in a constant-current
mode to prohibit excessive currents from causing
damage. TPS22941/3 has a current limit of 40 mA
and TPS22942/4/5 has a current limit of 100 mA.
For the TPS22941/2/5, if the constant current
condition still persists after 10ms, these parts shut off
the switch and pull the fault signal pin (OC) low. The
TPS22941/2/5, have an auto-restart feature that turns
the switch on again after 80 ms if the ON pin is still
active. A current limit condition on the TPS22943 and
on the TPS22944 immediately pull the fault signal pin
low (OC pin) and the part remains in the
constant-current mode until the switch current falls
below the current limit.
APPLICATIONS
•
•
•
•
•
•
•
Low-Current Sensor Protection
HDMI Connector Protection
Notebooks
PDAs
GPS Devices
MP3 Players
Peripheral Ports
The TPS2294x is available in a SC70-5 (DCK)
package. It is characterized for operation over the
free-air temperature range of –40°C to 85°C.
Table 1. Feature List
MINIMUM CURRENT LIMIT
(mA)
CURRENT LIMIT
BLANKING TIME (ms)
AUTO-RESTART TIME (ms)
ON PIN ACTIVITY
TPS22941
40
10
80
Active LOW
TPS22942
100
10
80
Active LOW
TPS22943
40
0
N/A
Active HIGH
TPS22944
100
0
N/A
Active HIGH
TPS22945
100
10
80
Active HIGH
DEVICE
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2008–2009, Texas Instruments Incorporated
TPS22941, TPS22942, TPS22943, TPS22944, TPS22945
SLVS832C – NOVEMBER 2008 – REVISED NOVEMBER 2009
www.ti.com
ORDERING INFORMATION (1)
PACKAGE (2)
TA
–40°C to 85°C
(1)
(2)
(3)
SOT (SC70) – DCK
TOP-SIDE MARKING (3)
ORDERABLE PART NUMBER
Tape and reel
TPS22941DCKR
4A_
TPS22942DCKR
4B_
TPS22943DCKR
4C_
TPS22944DCKR
4D_
TPS22945DCKR
4E_
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
The actual top-side marking has one additional character that designates the wafer fab/assembly site.
BLOCK DIAGRAM
VIN
5
UVLO
ON
4
Control
Logic
Current
Limit
1
Thermal
Shutdown
VOUT
3
OC
2
GND
2
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TPS22941, TPS22942, TPS22943, TPS22944, TPS22945
www.ti.com
SLVS832C – NOVEMBER 2008 – REVISED NOVEMBER 2009
DCK PACKAGE
(TOP VIEW)
VOUT
1
GND
2
OC
3
5
VIN
4
ON
TERMINAL FUNCTIONS
TERMINAL
TYPE
DESCRIPTION
SOT (DCK)
PIN NO.
NAME
1
VOUT
O
Switch output: output of the power switch
2
GND
–
Ground
3
OC
O
Over current output flag: active LOW, open drain output that indicates an over current,
supply under voltage, or over temperature state.
4
ON
I
ON control input
5
VIN
I
Supply input: input to the power switch and the supply voltage for the IC
–
DNU
–
Do not use
Copyright © 2008–2009, Texas Instruments Incorporated
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TPS22941, TPS22942, TPS22943, TPS22944, TPS22945
SLVS832C – NOVEMBER 2008 – REVISED NOVEMBER 2009
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ABSOLUTE MAXIMUM RATINGS (1)
MIN
MAX
–0.3
6
V
Operating junction temperature range
–40
125
°C
Tstg
Storage temperature range
–65
150
°C
ESD
Electrostatic discharge protection
VI
Input voltage range
TJ
(1)
VIN, VOUT, ON
Human-Body Model (HBM)
4
Charged-Device Model (CDM)
1
UNIT
kV
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
THERMAL IMPEDANCE RATINGS
UNIT
θJA
(1)
Package thermal impedance
(1)
DCK package
259
°C/W
The package thermal impedance is calculated in accordance with JESD 51-7.
RECOMMENDED OPERATING CONDITIONS
VIN
Input voltage
VOUT
Output voltage
TA
Ambient free-air temperature
MIN
MAX
1.62
5.5
UNIT
V
VIN
–40
85
°C
ELECTRICAL CHARACTERISTICS
VIN = 1.62 V to 5.5 V, TA = –40°C to 85°C (unless otherwise noted)
PARAMETER
IIN
TEST CONDITIONS
TA
μA
Full
1
μA
Full
1
μA
IOUT = 0 mA,
VIN = 1.62 V to 5.5 V
Full
OFF-State supply current
VON = 0 V (TPS22943/4/5)
or
VON = VIN (TPS22941/2)
VIN = 3.6 V,
VOUT open
IOUT(LEAKAGE) OFF-State switch current
VON = 0 V (TPS22943/4/5)
or
VON = VIN (TPS22941/2)
VIN = 3.6 V,
VOUT short to GND
VIN = 5.5 V
VIN = 3.3 V
rON
ON-state resistance
IOUT = 20 mA
VIN = 2.5 V
VIN = 1.8 V
VIN = 1.62 V
ION
ILIM
ON input leakage current
Current limit
VON = VIN or GND
VIN = 3.3 V, VOUT = 3 V
25°C
Return from shutdown
TPS22942/4/5
4
0.5
Full
0.6
0.7
25°C
0.6
Full
0.7
0.8
25°C
0.8
Full
Ω
0.9
1.1
25°C
0.9
Full
Full
0.5
0.6
25°C
1.1
1.2
1
40
65
80
100
150
200
μA
mA
140
Full
Hysteresis
(1)
0.4
Full
Shutdown threshold
Thermal shutdown
40
Full
TPS22941/3
UNIT
80
Quiescent current
IIN(OFF)
MIN TYP (1) MAX
130
°C
10
Typical values are at VIN = 3.3 V and TA = 25°C.
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SLVS832C – NOVEMBER 2008 – REVISED NOVEMBER 2009
ELECTRICAL CHARACTERISTICS (continued)
VIN = 1.62 V to 5.5 V, TA = –40°C to 85°C (unless otherwise noted)
PARAMETER
UVLO
TEST CONDITIONS
Undervoltage shutdown
VIN increasing
Undervoltage shutdown
hysteresis
TA
MIN TYP (1) MAX
Full
1.32
1.42
Full
1.52
45
UNIT
V
mV
Control Output (OC)
Vol
OC output logic low
voltage
Ioz
OC output high leakage
current voltage
VIN = 5 V, ISINK = 10 mA
Full
VIN = 1.8 V, ISINK = 10 mA
0.1
0.2
0.1
0.3
0.5
V
μA
VIN = 5 V, Switch ON
Full
VIN = 1.8 V
Full
1.1
V
VIN = 2.5 V
Full
1.3
V
VIN = 3.3 V
Full
1.4
V
VIN = 5.5 V
Full
1.7
VIN = 1.8 V
Full
0.5
V
VIN = 2.5 V
Full
0.7
V
VIN = 3.3 V
Full
0.8
V
VIN = 5.5 V
Full
0.9
V
VIN = 1.8 V to 5 V, Switch ON
Full
1
μA
Control Input (ON)
Vih
Vil
Ii
ON high-level input
voltage
ON low-level input voltage
ON high-level input
leakage current
V
SWITCHING CHARACTERISTICS
VIN = 3.3 V, RL = 500 Ω, CL = 0.1 μF, TA = 25°C (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
tON
Turn-ON time
RL = 500 Ω,
CL = 0.1 μF
60
μs
tOFF
Turn-OFF time
RL = 500 Ω,
CL = 0.1 μF
30
μs
tr
VOUT rise time
RL = 500 Ω,
CL = 0.1 μF
10
μs
tf
VOUT fall time
RL = 500 Ω,
CL = 0.1 μF
tBLANK
Over current blanking time
TPS22941/2/5
5
10
20
ms
tRSTART
Auto-restart time
TPS22941/2/5
40
80
160
ms
Short-circuit response time
μs
90
VIN = VON = 3.3 V, moderate overcurrent condition
9
μs
VIN = VON = 3.3 V, hard short
4
μs
Copyright © 2008–2009, Texas Instruments Incorporated
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SLVS832C – NOVEMBER 2008 – REVISED NOVEMBER 2009
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TYPICAL PERFORMANCE
1.0
ON-State Resistance, rON (W)
0.9
0.8
0.7
0.6
0.5
0.4
0.3
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
Input Voltage, VIN (V)
Figure 1. rON vs VIN
1.0
42
41
0.9
VIN = 1.8 V
40
39
Quiescent Current (uA)
ON-State Resistance (W)
0.8
0.7
VIN = 3.3 V
0.6
0.5
0.4
36
35
33
32
0.2
–40
–10
25
50
Temperature (°C)
Figure 2. rON vs Temperature
6
37
34
VIN = 5 V
VIN = 3.6 V
0.3
38
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85
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
Supply Voltage (V)
Figure 3. Quiescent Current vs VIN
Copyright © 2008–2009, Texas Instruments Incorporated
Product Folder Link(s): TPS22941 TPS22942 TPS22943 TPS22944 TPS22945
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SLVS832C – NOVEMBER 2008 – REVISED NOVEMBER 2009
TYPICAL PERFORMANCE (continued)
50
600
500
VIN = 5.5 V
400
VIN = 3.3 V
40
IIN(leakage) Current (nA)
Quiescent Current (mA)
45
35
VIN = 1.8 V
30
VIN = 3.3 V
300
200
VIN = 1.8 V
100
0
25
–40
–10
25
50
85
–40
–10
Temperature (°C)
25
50
85
Temperature (°C)
Figure 4. Quiescent Current vs Temperature
Figure 5. IIN(leakage) vs Temperature
250
500
450
VIN = 3.3 V
200
350
IIN(off) Current (nA)
IIN(leakage) Current (nA)
400
300
250
200
150
100
150
VIN = 1.8 V
100
50
50
0
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
0
–40
Supply Voltage (V)
Figure 6. IIN(Leakage) vs VIN
Copyright © 2008–2009, Texas Instruments Incorporated
–10
25
50
85
Temperature (°C)
Figure 7. IIN(off) vs Temperature
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SLVS832C – NOVEMBER 2008 – REVISED NOVEMBER 2009
www.ti.com
TYPICAL PERFORMANCE (continued)
500
100
450
50
400
0
IOUT(leakage) Current (nA)
IIN(off) Current (nA)
350
300
250
200
150
VIN = 1.8 V
–50
–100
VIN = 3.3 V
–150
–200
100
–250
50
0
1.0
–300
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
–40
–10
Supply Voltage (V)
Figure 8. IIN(off) vs VIN
85
0.18
5.5
VIN = 1.62 V
5.0
VIN = 1.8 V
4.5
VIN = 1.95 V
4.0
VIN = 2.3 V
3.5
VIN = 2.5 V
3.0
VIN = 2.7 V
0.16
0.12
VIN = 3.0 V
2.5
VIN = 3.3 V
2.0
VIN = 3.6 V
1.5
85°C
0.14
Output Current (A)
VOUT (V)
50
Figure 9. IOUT(leakage) vs Temperature
6.0
–40°C
25°C
0.10
0.08
0.06
VIN = 4.5 V
1.0
VIN = 5.0 V
0.5
VIN = 5.5 V
0.04
0.02
0.0
-0.5
0.0
0.00
0.2
0.4
0.6
0.8
1.0
1.2
Input Voltage, VON (V)
Figure 10. ON Treshold
8
25
Temperature (°C)
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1.4
1.6
1.8
2.0
0.0
0.4
0.8
1.2
1.6
2.0
2.4
2.8
3.2
VIN-VOUT (V)
Figure 11. ILIM vs Output Voltage (TPS22942, TPS22944,
TPS22945)
Copyright © 2008–2009, Texas Instruments Incorporated
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SLVS832C – NOVEMBER 2008 – REVISED NOVEMBER 2009
TYPICAL PERFORMANCE (continued)
180
80
TA = –40°C
160
TA = 85°C
TA = 25°C
70
140
Current Limit, ILIM (mA)
Current Limit (mA)
60
120
100
80
60
50
40
30
40
20
20
10
0
–40
25
0
85
0
Junction Temperature, TJ (°C)
0.5
1.5
1
2.5
2
3
3.5
VIN – VOUT (V)
Figure 12. ILIM vs Temperature (TPS22942, TPS22944,
TPS22945)
Figure 13. ILIM vs Output Voltage (TPS22941, TPS22943)
80
90
80
70
tfall
60
trise/tfall (ms)
Current Limit, ILIM (mA)
75
70
50
40
CL = 0.1 mF
RL = 350 Ω
VIN = 3.3 V
30
65
20
trise
10
60
–40
25
Junction Temperature, TJ (°C)
85
Figure 14. ILIM vs Temperature (TPS22941, TPS22943)
Copyright © 2008–2009, Texas Instruments Incorporated
0
–50
–35
–20
–5
10
25
40
55
70
85
100
Temperature (°C)
Figure 15. trise/tfall
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SLVS832C – NOVEMBER 2008 – REVISED NOVEMBER 2009
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TYPICAL PERFORMANCE (continued)
13.5
70
CL = 0.1 mF
RL = 350 Ω
VIN = 3.3 V
65
tON
60
13.0
Blanking Time (ms)
tOFF/tON (ms)
55
50
45
40
35
12.5
12.0
11.5
tOFF
30
11.0
25
20
–50
–35
–20
–5
10
25
40
55
70
85
100
10.5
–40
Temperature (°C)
–10
25
50
85
Temperature (°C)
Figure 16. tON/tOFF
Figure 17. tBLANK vs Temperature (VIN = 3.3 V)
VDRV signal forces the device to go into over-current mode.
100
VDRV
2 V/DIV
90
VOUT
2 V/DIV
Restart Time (ms)
80
70
IOUT
100 mA/DIV
60
VOC
2 V/DIV
50
40
–40
–10
25
50
85
2 ms/DIV
Temperature (°C)
Figure 18. tRESTART vs Temperature (VIN = 3.3 V)
Figure 19. tBLANK Response
VDRV signal forces the device to go into over-current mode.
10
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SLVS832C – NOVEMBER 2008 – REVISED NOVEMBER 2009
TYPICAL PERFORMANCE (continued)
5.0
10
4.5
9
4.0
8
IOUT
3.5
7
3.0
Control Input Voltage (V)
VOUT
2 V/DIV
IOUT
100 mA/DIV
VOC
2 V/DIV
6
2.5
5
VON
2.0
4
1.5
3
1.0
2
0.5
1
0.0
0
–0.5
–1
–1.0
–2
–1.5
CL = 0.1 mF
–3
–2.0
RL = 500 W
VIN = 3.3 V
–4
–2.5
–3.0
–50
0
50
100
150
200
250
300
350
400
Output Current (mA)
VDRV
2 V/DIV
–5
–6
450
Time (ms)
20 ms/DIV
Figure 20. tRESTART Response
5.0
10
4.5
9
3.5
7
3.0
6
2.5
5
2.0
4
1.5
3
1.0
2
VON
0.5
1
0.0
0
–0.5
–1
–1.0
–2
–1.5
CL = 0.1 mF
–3
–2.0
RL = 500 W
VIN = 3.3 V
–4
–2.5
–3.0
–50
0
VIN
2 V/DIV
8
IOUT
50
100
150
200
250
300
350
400
CIN = 10 mF
COUT = 1 mF
Output Current (mA)
4.0
Control Input Voltage (V)
Figure 21. tON Response
IOUT
400 mA/DIV
VOUT
2 V/DIV
–5
–6
450
Time (ms)
10 ms/DIV
Figure 22. tON Response
Copyright © 2008–2009, Texas Instruments Incorporated
Figure 23. Short-Circuit Response Time (Output Shorted to
Ground)
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TYPICAL PERFORMANCE (continued)
VIN
2 V/DIV
CIN = 10 mF
COUT = 1 mF
CIN = 10 mF
VIN/VON
1 V/DIV
COUT = 1 mF
VON
2 V/DIV
IOUT
100 mA/DIV
IOUT
100 mA/DIV
VOUT
Shorted to
Ground
20 ms/DIV
Figure 24. Short-Circuit Response Time (Switch Powerup to
Hard Short)
12
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20 ms/DIV
Figure 25. Current Limit Response Time
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SLVS832C – NOVEMBER 2008 – REVISED NOVEMBER 2009
APPLICATION INFORMATION
VOUT
VIN
100 kW
On
5.5-V
Battery
ON
10 µF
Off
OC
GND
0.1 µF
500 W
Figure 26. Typical Application Circuit, Active-High Enabled Device
(TPS22943, TPS22944 and TPS22945 Only)
On/Off Control
The ON pin controls the state of the switch. Activating ON continuously holds the switch in the on state as long
as there is no fault. An undervoltage on VIN or a junction temperature in excess of 150°C overrides the ON
control to turn off the switch. ON is active high and has a low threshold, making it capable of interfacing with
low-voltage signals.
Undervoltage Lockout
The undervoltage lockout turns off the switch if the input voltage (VIN) drops below the undervoltage lockout
threshold. With the ON pin active, the input voltage rising above the undervoltage lockout threshold causes a
controlled turn-on of the switch, which limits current overshoots.
Thermal Shutdown
Thermal shutdown protects the part from internally or externally generated excessive temperatures. During an
overtemperature condition the switch is turned off. The switch automatically turns on again if the temperature of
the die drops below the threshold temperature.
Reverse Voltage
If the voltage at the VOUT pin is larger than the VIN pin, large currents may flow and can cause permanent
damage to the device. TPS2294x is designed to control current flow only from VIN to VOUT.
Fault Reporting
When an overcurrent, input undervoltage, or overtemperature condition is detected, OC is set active low to signal
the fault mode. OC is an open-drain MOSFET and requires a pullup resistor between VIN and OC. During
shutdown, the pulldown on OC is disabled, reducing current draw from the supply.
Current Limiting
When the switch current reaches the maximum limit, the TPS22921/2/3/4/5 operates in a constant-current mode
to prohibit excessive currents from causing damage. TPS22921/3 has a current limit of 40 mA and TPS22922/4/5
has a current limit of 100 mA. A current limit condition immediately pulls the fault signal pin low (OC pin), and the
part remains in the constant-current mode until the switch current falls below the current limit.
Input Capacitor
To limit the voltage drop on the input supply caused by transient in-rush currents when the switch turns-on into a
discharged load capacitor or a short-circuit, a capacitor needs to be placed between VIN and GND. A 1-μF
ceramic capacitor, CIN, placed close to the pins is usually sufficient. Higher values of CIN can be used to further
reduce the voltage drop.
Copyright © 2008–2009, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Link(s): TPS22941 TPS22942 TPS22943 TPS22944 TPS22945
13
TPS22941, TPS22942, TPS22943, TPS22944, TPS22945
SLVS832C – NOVEMBER 2008 – REVISED NOVEMBER 2009
www.ti.com
Output Capacitor
A 0.1-μF capacitor, COUT, should be placed between VOUT and GND. This capacitor will prevent parasitic board
inductances from forcing VOUT below GND when the switch turns off. For the TPS2294x, the total output
capacitance needs to be kept below a maximum value, COUT(max), to prevent the part from registering an
over-current condition and turning-off the switch. The maximum output capacitance can be determined from the
following formula, COUT = ILIM(MAX) x tBLANK(MIN) ÷ VIN
Due to the integral body diode in the PMOS switch, a CIN greater than COUT is highly recommended. A COUT
greater than CIN can cause VOUT to exceed VIN when the system supply is removed. This could result in current
flow through the body diode from VOUT to VIN.
Power Dissipation
During normal operation as a switch, the power dissipation is small and has little effect on the operating
temperature of the part. The parts with the higher current limits will dissipate the most power and that will only
be,
P = (ILIM)2 × rON = (0.2)2 × 0.4 = 16 mW when VIN= 5.5 V
If the part goes into current limit the maximum power dissipation will occur when the output is shorted to ground.
For TPS22941/2/5, the power dissipation scales by the auto-restart time (tRESTART) and the overcurrent blanking
time (tBLANK) so that the maximum power dissipated is:
P(max) = (tBLANK ÷ (tRESTART + tBLANK)) × (VIN(max)) × ILIM(max) = (10 ÷ (80 + 10) × 5.5 × 0.2 = 122 mW
When using the TPS22943 and TPS22944, a short on the output causes the part to operate in a constant current
state, dissipating a worst-case power as calculated above until the thermal shutdown activates. It then cycles in
and out of thermal shutdown so long as the ON pin is active and the short is present.
Board Layout
For best performance, all traces should be as short as possible. To be most effective, the input and output
capacitors should be placed close to the device to minimize the effects that parasitic trace inductances may have
on normal and short-circuit operation. Using wide traces for VIN, VOUT, and GND will help minimize parasitic
electrical effects along with minimizing the case to ambient thermal impedance.
14
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Copyright © 2008–2009, Texas Instruments Incorporated
Product Folder Link(s): TPS22941 TPS22942 TPS22943 TPS22944 TPS22945
PACKAGE OPTION ADDENDUM
www.ti.com
13-Nov-2009
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
TPS22941DCKR
ACTIVE
SC70
DCK
5
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TPS22942DCKR
ACTIVE
SC70
DCK
5
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TPS22942DCKRG4
ACTIVE
SC70
DCK
5
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TPS22943DCKR
ACTIVE
SC70
DCK
5
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TPS22944DCKR
ACTIVE
SC70
DCK
5
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TPS22945DCKR
ACTIVE
SC70
DCK
5
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TPS22945DCKRG4
ACTIVE
SC70
DCK
5
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
Lead/Ball Finish
MSL Peak Temp (3)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
13-Nov-2009
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
TPS22941DCKR
SC70
DCK
5
3000
180.0
9.2
2.24
2.34
1.22
4.0
8.0
Q3
TPS22942DCKR
SC70
DCK
5
3000
179.0
8.4
2.2
2.5
1.2
4.0
8.0
Q3
TPS22945DCKR
SC70
DCK
5
3000
179.0
8.4
2.2
2.5
1.2
4.0
8.0
Q3
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
13-Nov-2009
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
TPS22941DCKR
SC70
DCK
5
3000
205.0
200.0
33.0
TPS22942DCKR
SC70
DCK
5
3000
195.0
200.0
45.0
TPS22945DCKR
SC70
DCK
5
3000
195.0
200.0
45.0
Pack Materials-Page 2
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