IXYS CMA30E1600PB

CMA30E1600PB
Thyristor
VRRM
=
1600 V
I TAV
=
30 A
VT
=
1.42 V
Single Thyristor
Part number
CMA30E1600PB
Backside: anode
2
1
3
Features / Advantages:
Applications:
Package: TO-220
● Thyristor for line frequency
● Planar passivated chip
● Long-term stability
● Line rectifying 50/60 Hz
● Softstart AC motor control
● DC Motor control
● Power converter
● AC power control
● Lighting and temperature control
● Industry standard outline
● RoHS compliant
● Epoxy meets UL 94V-0
IXYS reserves the right to change limits, conditions and dimensions.
© 2013 IXYS all rights reserved
Data according to IEC 60747and per semiconductor unless otherwise specified
20130118a
CMA30E1600PB
Ratings
Thyristor
Conditions
Symbol
V RSM/DSM
Definition
max. non-repetitive reverse/forward blocking voltage
TVJ = 25°C
max.
1700
Unit
V
V RRM/DRM
max. repetitive reverse/forward blocking voltage
TVJ = 25°C
1600
V
I R/D
reverse current, drain current
VR/D = 1600 V
TVJ = 25°C
10
µA
VR/D = 1600 V
TVJ = 125°C
2
mA
TVJ = 25°C
1.42
V
1.80
V
1.42
V
VT
IT =
forward voltage drop
30 A
IT =
60 A
IT =
30 A
IT =
60 A
I TAV
average forward current
TC = 115°C
180° sine
I T(RMS)
RMS forward current
VT0
threshold voltage
rT
slope resistance
R thJC
thermal resistance junction to case
R thCH
thermal resistance case to heatsink
total power dissipation
I TSM
max. forward surge current
value for fusing
typ.
TVJ = 125 °C
for power loss calculation only
Ptot
I²t
min.
1.92
V
T VJ = 150 °C
30
A
47
A
TVJ = 150 °C
0.90
V
250
W
t = 10 ms; (50 Hz), sine
TVJ = 45°C
260
A
t = 8,3 ms; (60 Hz), sine
VR = 0 V
280
A
t = 10 ms; (50 Hz), sine
TVJ = 150 °C
220
A
t = 8,3 ms; (60 Hz), sine
VR = 0 V
240
A
t = 10 ms; (50 Hz), sine
TVJ = 45°C
340
A²s
t = 8,3 ms; (60 Hz), sine
t = 10 ms; (50 Hz), sine
VR = 0 V
325
A²s
TVJ = 150 °C
240
A²s
240
A²s
t = 8,3 ms; (60 Hz), sine
VR = 0 V
VR = 400 V f = 1 MHz
TVJ = 25°C
PGM
max. gate power dissipation
t P = 30 µs
T C = 150 °C
13
t P = 300 µs
average gate power dissipation
critical rate of rise of current
K/W
0.50
junction capacitance
(di/dt) cr
mΩ
K/W
TC = 25°C
CJ
PGAV
17
0.5
TVJ = 125°C; f = 50 Hz
repetitive, IT =
90 A
non-repet., IT =
30 A
pF
10
W
5
W
0.5
W
150 A/µs
t P = 200 µs; di G /dt = 0.2 A/µs;
IG =
(dv/dt) cr
critical rate of rise of voltage
VGT
gate trigger voltage
I GT
gate trigger current
0.2 A; VD = ⅔ VDRM
500 A/µs
TVJ = 125°C
500 V/µs
VD = 6 V
TVJ = 25 °C
1.3
TVJ = -40 °C
1.6
V
VD = 6 V
TVJ = 25 °C
28
mA
TVJ = -40 °C
50
mA
TVJ = 150 °C
0.2
V
1
mA
TVJ = 25 °C
90
mA
VD = ⅔ VDRM
R GK = ∞; method 1 (linear voltage rise)
VGD
gate non-trigger voltage
I GD
gate non-trigger current
IL
latching current
VD = ⅔ VDRM
t p = 10 µs
IG =
0.2 A; di G /dt =
V
0.2 A/µs
IH
holding current
VD = 6 V R GK = ∞
TVJ = 25 °C
60
mA
t gd
gate controlled delay time
VD = ½ VDRM
TVJ = 25 °C
2
µs
tq
turn-off time
IG =
0.5 A; di G /dt =
0.5 A/µs
VR = 100 V; I T = 30 A; VD = ⅔ VDRM TVJ = 150 °C
di/dt = 10 A/µs; dv/dt =
IXYS reserves the right to change limits, conditions and dimensions.
© 2013 IXYS all rights reserved
150
µs
20 V/µs; t p = 200 µs
Data according to IEC 60747and per semiconductor unless otherwise specified
20130118a
CMA30E1600PB
Package
Ratings
TO-220
Symbol
I RMS
Definition
Conditions
RMS current
per terminal
Tstg
storage temperature
T VJ
virtual junction temperature
min.
typ.
max.
35
Unit
A
-55
150
°C
-40
150
°C
Weight
2
MD
mounting torque
FC
mounting force with clip
Product Marking
Logo
Date Code
Lot #
0.4
0.6
Nm
20
60
N
Part number
C
M
A
30
E
1600
PB
abcdef
Part Number
g
=
=
=
=
=
=
=
Thyristor (SCR)
Thyristor
(up to 1800V)
Current Rating [A]
Single Thyristor
Reverse Voltage [V]
TO-220AB (3)
YYWW Z
XXXXXX
Assembly Line
Ordering
Standard
Part Number
CMA30E1600PB
Similar Part
CMA30E1600PN
CLA30E1200PB
CS22-12io1M
CLA30E1200PC
CLA30E1200HB
CS22-08io1M
Equivalent Circuits for Simulation
I
V0
R0
Marking on Product
CMA30E1600PB
Package
TO-220ABFP (3)
TO-220AB (3)
TO-220ABFP (3)
TO-263AB (D2Pak) (2)
TO-247AD (3)
TO-220ABFP (3)
* on die level
Delivery Mode
Tube
Code No.
503348
Voltage class
1600
1200
1200
1200
1200
800
T VJ = 150°C
Thyristor
V 0 max
threshold voltage
0.9
V
R 0 max
slope resistance *
14
mΩ
IXYS reserves the right to change limits, conditions and dimensions.
© 2013 IXYS all rights reserved
Quantity
50
Data according to IEC 60747and per semiconductor unless otherwise specified
20130118a
CMA30E1600PB
Outlines TO-220
Dim.
Millimeter
Min.
Max.
Inches
Min.
Max.
A
A1
A2
4.32
1.14
2.29
4.82
1.39
2.79
0.170
0.045
0.090
0.190
0.055
0.110
b
b2
0.64
1.15
1.01
1.65
0.025
0.045
0.040
0.065
C
D
0.35
14.73
0.56
16.00
0.014
0.580
0.022
0.630
E
e
H1
9.91
2.54
5.85
10.66
BSC
6.85
0.390
0.100
0.230
0.420
BSC
0.270
L
L1
12.70
2.79
13.97
5.84
0.500
0.110
0.550
0.230
ØP
Q
3.54
2.54
4.08
3.18
0.139
0.100
0.161
0.125
A
A1
ØP
H1
Q
E
D
4
3
L
3x b2
2
L1
1
3x b
2x e
C
A2
2
1
3
IXYS reserves the right to change limits, conditions and dimensions.
© 2013 IXYS all rights reserved
Data according to IEC 60747and per semiconductor unless otherwise specified
20130118a
CMA30E1600PB
Thyristor
250
60
1000
VR = 0 V
50 Hz, 80% VRRM
50
TVJ = 45°C
200
40
IT
ITSM
2
It
30
[A]
TVJ = 45°C
[A]
20
2
[A s]
150
TVJ =
125°C
10
TVJ = 125°C
150°C
TVJ = 25°C
0
0.5
1.0
100
1.5
10
2.0
0.01
0.1
VT [V]
1
IGD: TVJ = -40°C
IGD: TVJ = 0°C
IGD: TVJ = 25°C
[V]
Fig. 3 I t versus time (1-10 s)
30
TVJ = 125°C
tgd
ITAVM
[μs]
[A]
dc =
1
0.5
0.4
0.33
0.17
0.08
20
lim.
100
10
typ.
10-1
50
4 5 6 7 8 910
t [ms]
IGD: TVJ = 25°C
25
3
40
101
0
0
2
2
102
3
2
1
Fig. 2 Surge overload current
ITSM: crest value, t: duration
IGD: TVJ = 125°C
VG
1
t [s]
Fig. 1 Forward characteristics
4
TVJ = 125°C
100
-2
75
10-1
100
0
101
0
40
IG [A]
IG [mA]
Fig. 4 Gate voltage & gate current
80
120
160
Tcase [°C]
Fig. 5 Gate controlled delay time tgd
Triggering: A = no; B = possible; C = safe
Fig. 6 Max. forward current at
case temperature
0.6
RthHA
0.6
0.8
1.0
2.0
4.0
8.0
60 dc =
1
0.5
0.4
0.33
P(AV)40 0.17
0.08
0.4
ZthJC
i Rthi (K/W)
1
0.08
2
0.06
3
0.2
4
0.05
5
0.11
[K/W]
[W]
0.2
20
0
ti (s)
0.01
0.0001
0.02
0.2
0.11
0.0
0
10
20
30
40 0
IF(AV) [A]
50
100
150
Fig. 7a Power dissipation versus direct output current
Fig. 7b and ambient temperature
IXYS reserves the right to change limits, conditions and dimensions.
© 2013 IXYS all rights reserved
1
10
100
1000
10000
t [ms]
Tamb [°C]
Fig. 7 Transient thermal impedance junction to case
Data according to IEC 60747and per semiconductor unless otherwise specified
20130118a