IXYS IXTH16N20D2

Preliminary Technical Information
IXTH16N20D2
IXTT16N20D2
Depletion Mode
MOSFET
VDSX
ID(on)
RDS(on)
=
>
≤
200V
16A
73mΩ
Ω
N-Channel
TO-247 (IXTH)
G
Symbol
Test Conditions
Maximum Ratings
VDSX
TJ = 25°C to 150°C
200
V
VDGX
TJ = 25°C to 150°C, RGS = 1MΩ
200
V
VGSX
Continuous
±20
V
VGSM
Transient
±30
V
PD
TC = 25°C
695
W
- 55 ... +150
150
- 55 ... +150
°C
°C
°C
300
260
°C
°C
1.13 / 10
Nm/lb.in.
6
4
g
g
TJ
TJM
Tstg
TL
TSOLD
1.6mm (0.062 in.) from Case for 10s
Plastic Body for 10s
Md
Mounting Torque (TO-247)
Weight
TO-247
TO-268
D
D (Tab)
S
TO-268 (IXTT)
G
S
D (Tab)
G = Gate
S = Source
D
= Drain
Tab = Drain
Features
• Normally ON Mode
• International Standard Packages
• Molding Epoxies Meet UL 94 V-0
Flammability Classification
Symbol
Test Conditions
(TJ = 25°C, Unless Otherwise Specified)
Characteristic Values
Min.
Typ.
Max.
BVDSX
VGS = - 5V, ID = 250μA
200
VGS(off)
VDS = 25V, ID = 4mA
IGSX
VGS = ±20V, VDS = 0V
IDSX(off)
VDS = VDSX, VGS = - 5V
RDS(on)
VGS = 0V, ID = 8A, Note 1
ID(on)
VGS = 0V, VDS = 25V, Note 1
- 2.0
Advantages
V
- 4.0
V
±100 nA
5 μA
100 μA
TJ = 125°C
© 2012 IXYS CORPORATION, All Rights Reserved
73 mΩ
16
A
• Easy to Mount
• Space Savings
• High Power Density
Applications
•
•
•
•
•
•
Audio Amplifiers
Start-up Circuits
Protection Circuits
Ramp Generators
Current Regulators
Active Loads
DS100260A(08/12)
IXTH16N20D2
IXTT16N20D2
Symbol
Test Conditions
(TJ = 25°C, Unless Otherwise Specified)
gfs
Characteristic Values
Min.
Typ.
Max.
VDS = 20V, ID = 8A, Note 1
7
Ciss
Coss
VGS = -10V, VDS = 25V, f = 1MHz
Crss
td(on)
tr
td(off)
tf
Resistive Switching Times
VGS = + 5V, VDS = 100V, ID = 8A
RG = 3.3Ω (External)
Qg(on)
Qgs
12
S
5500
pF
1360
pF
607
pF
46
ns
130
ns
270
ns
135
ns
208
nC
28
nC
110
nC
0.21
0.18 °C/W
°C/W
VGS = + 5V, VDS = 100V, ID = 8A
Qgd
RthJC
RthCS
TO-247 Outline
Safe-Operating-Area Specification
Characteristic Values
Min.
Typ.
Max.
Symbol
Test Conditions
SOA
VDS = 200V, ID = 2.1A, TC = 75°C, tp = 5s
420
W
Source-Drain Diode
Symbol
Test Conditions
(TJ = 25°C, Unless Otherwise Specified)
VSD
IF = 16A, VGS = -10V, Note 1
trr
IRM
QRM
IF = 8A, -di/dt = 100A/μs
VR = 100V, VGS = -10V
1.3
265
14.3
1.9
2
∅P
3
e
Terminals: 1 - Gate
3 - Source
Dim.
Millimeter
Min. Max.
A
4.7
5.3
2.2
2.54
A1
A2
2.2
2.6
b
1.0
1.4
b1
1.65
2.13
b2
2.87
3.12
C
.4
.8
D
20.80 21.46
E
15.75 16.26
e
5.20
5.72
L
19.81 20.32
L1
4.50
∅P 3.55
3.65
Q
5.89
6.40
R
4.32
5.49
S
6.15 BSC
2 - Drain
Inches
Min. Max.
.185 .209
.087 .102
.059 .098
.040 .055
.065 .084
.113 .123
.016 .031
.819 .845
.610 .640
0.205 0.225
.780 .800
.177
.140 .144
0.232 0.252
.170 .216
242 BSC
TO-268 Outline
Characteristic Values
Min.
Typ.
Max.
0.8
1
V
ns
A
μC
Note 1. Pulse test, t ≤ 300μs, duty cycle, d ≤ 2%.
Terminals: 1 - Gate
3 - Source
2 - Drain
Tab - Drain
PRELIMINARY TECHNICAL INFORMATION
The product presented herein is under development. The Technical Specifications offered are derived
from data gathered during objective characterizations of preliminary engineering lots; but also may yet
contain some information supplied during a pre-production design evaluation. IXYS reserves the right
to change limits, test conditions, and dimensions without notice.
IXYS Reserves the Right to Change Limits, Test Conditions, and Dimensions.
IXYS MOSFETs and IGBTs are covered
4,835,592
by one or more of the following U.S. patents: 4,860,072
4,881,106
4,931,844
5,017,508
5,034,796
5,049,961
5,063,307
5,187,117
5,237,481
5,381,025
5,486,715
6,162,665
6,259,123 B1
6,306,728 B1
6,404,065 B1
6,534,343
6,583,505
6,683,344
6,727,585
7,005,734 B2
6,710,405 B2 6,759,692
7,063,975 B2
6,710,463
6,771,478 B2 7,071,537
7,157,338B2
IXTH16N20D2
IXTT16N20D2
Fig. 1. Output Characteristics @ T J = 25ºC
Fig. 2. Extended Output Characteristics @ T J = 25ºC
16
200
VGS = 5V
4V
3V
2V
14
12
1.5V
160
140
1V
10
ID - Amperes
ID - Amperes
VGS = 5V
180
0V
8
6
1V
120
100
2V
80
1V
60
-1V
4
40
2
0
0
0.1
0.2
0.3
0.4
-2V
20
- 3V
0
0.5
0.6
0V
- 1V
-2V
0
0.7
5
10
25
30
35
36
VGS = 5V
4V
3V
2V
1V
14
12
32
VGS = 0V
28
- 0.4V
24
ID - Amperes
10
0V
8
6
-1V
20
- 0.8V
16
12
4
- 1.2V
8
-2V
2
- 1.6V
4
- 2.0V
- 2.4V
-3V
0
0
0
0.2
0.4
0.6
0.8
1
1.2
0
10
20
VDS - Volts
30
40
50
VDS - Volts
Fig. 6. Dynamic Resistance vs. Gate Voltage
Fig. 5. Drain Current @ T J = 100ºC
40
1.E+10
VGS = 0V
36
∆VDS = 50V - 25V
1.E+09
32
1.E+08
28
- 0.4V
1.E+07
24
R O - Ohms
ID - Amperes
20
Fig. 4. Drain Current @ T J = 25ºC
Fig. 3. Output Characteristics @ T J = 125ºC
16
ID - Amperes
15
VDS - Volts
VDS - Volts
- 0.8V
20
16
4
0
TJ = 25ºC
1.E+05
TJ = 100ºC
- 1.2V
1.E+04
- 1.6V
1.E+03
- 2.0V
- 2.4V
1.E+02
12
8
1.E+06
1.E+01
0
10
20
30
VDS - Volts
© 2012 IXYS CORPORATION, All Rights Reserved
40
50
-5
-4
-3
-2
VGS - Volts
-1
0
IXTH16N20D2
IXTT16N20D2
Fig. 8. RDS(on) Normalized to ID = 8A Value
vs. Drain Current
Fig. 7. Normalized RDS(on) vs. Junction Temperature
1.6
2.6
VGS = 0V
1.5
VGS = 0V
I D = 8A
5V - - - -
2.2
R DS(on) - Normalized
R DS(on) - Normalized
1.4
1.3
1.2
1.1
1.8
1.4
TJ = 125ºC
1.0
TJ = 25ºC
1.0
0.6
0.9
0.2
0.8
-50
-25
0
25
50
75
100
125
0
150
5
10
15
TJ - Degrees Centigrade
25
30
35
40
Fig. 10. Transconductance
Fig. 9. Input Admittance
30
50
VDS = 20V
VDS = 20V
TJ = - 40ºC, 25ºC, 125ºC
25
g f s - Siemens
40
ID - Amperes
20
ID - Amperes
30
20
TJ = 125ºC
25ºC
- 40ºC
10
20
15
10
5
0
-4.0
0
-3.5
-3.0
-2.5
-2.0
-1.5
-1.0
-0.5
0.0
0.5
0
1.0
5
10
15
20
VGS - Volts
25
30
35
40
45
50
ID - Amperes
Fig. 11. Normalized Breakdown and Threshold
Voltages vs. Junction Temperature
Fig. 12. Forward Voltage Drop of Intrinsic Diode
30
1.3
VGS = -10V
25
1.2
20
IS - Amperes
BV / VGS(off)
VGS(off) @ VDS = 25V
1.1
BVDSX @ VGS = - 5V
1.0
15
10
TJ = 125ºC
0.9
TJ = 25ºC
5
0
0.8
-50
-25
0
25
50
75
100
125
150
TJ - Degrees Centigrade
IXYS Reserves the Right to Change Limits, Test Conditions, and Dimensions.
0.3
0.4
0.5
0.6
VSD - Volts
0.7
0.8
0.9
IXTH16N20D2
IXTT16N20D2
Fig. 13. Capacitance
Fig. 14. Gate Charge
5
100,000
f = 1 MHz
VDS = 100V
4
I D = 8A
I G = 10mA
2
10,000
Ciss
VGS - Volts
Capacitance - PicoFarads
3
Coss
1,000
1
0
-1
-2
-3
-4
Crss
-5
100
0
5
10
15
20
25
30
35
0
40
20
40
60
80
100
120
140
160
180
VDS - Volts
QG - NanoCoulombs
Fig. 15. Forward-Bias Safe Operating Area
Fig. 16. Forward-Bias Safe Operating Area
@ T C = 25ºC
200
220
@ T C = 75ºC
1,000
1,000
TJ = 150ºC
TJ = 150ºC
TC = 25ºC
Single Pulse
TC = 75ºC
Single Pulse
ID - Amperes
RDS(on) Limit
100
25µs
ID - Amperes
100
100µs
1ms
10
RDS(on) Limit
25µs
100µs
10
DC
1ms
10ms
100ms
DC
1
10ms
100ms
1
1
1.000
100 Fig.
10
17. Maximum
Transient Thermal
Impedance10
1,000
1
VDS - Volts
100
1,000
VDS - Volts
Fig. 17. Maximum Transient Thermal Impedance
hvjv
0.300
Z (th)JC - ºC / W
0.100
0.010
0.001
0.00001
0.0001
0.001
0.01
0.1
1
10
Pulse Width - Seconds
© 2012 IXYS CORPORATION, All Rights Reserved
IXYS REF: T_16N20D2(8C)4-08-10
Mouser Electronics
Authorized Distributor
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IXTT16N20D2