SHENZHENFREESCALE AO8820

AO8820
20V Common-Drain Dual
N-Channel Mosfet
General Description
The AO8820 uses advanced trench technology to provide excellent RDS(ON) , low gate charge and operation with gate
voltages as low as 1.8V while retaining a 12V VGS(MAX) rating. It is ESD protected. This device is suitable for use
as a uni-directional or bi-directional load switch, facilitated by its common-drain configuration.
Features
VDS
20V
ID (at VGS=10V)
7A
RDS(ON) (at VGS=10V)
< 21mΩ
RDS(ON) (at VGS=4.5V)
< 24mΩ
RDS(ON) (at VGS=3.6V)
< 28mΩ
RDS(ON) (at VGS=2.5V)
< 32mΩ
RDS(ON) (at VGS=1.8V)
< 50mΩ
ESD protected!
D2
D1
Top View
D1/D2
S1
S1
G1
1
2
3
4
8
7
6
5
D1/D2
S2
S2
G2
G2
G1
S2
S1
Absolute Maximum Ratings TA=25°C unless otherwise noted
Parameter
Symbol
Drain-Source Voltage
VDS
Gate-Source Voltage
Continuous Drain
Current
VGS
TA=25°C
Pulsed Drain Current C
Junction and Storage Temperature Range
Thermal Characteristics
Parameter
Maximum Junction-to-Ambient A
Maximum Junction-to-Ambient A D
Maximum Junction-to-Lead
1/5
Steady-State
Steady-State
A
1.5
W
0.96
TJ, TSTG
Symbol
t ≤ 10s
V
30
PD
TA=70°C
±12
5.5
IDM
TA=25°C
Power Dissipation B
Units
V
7
ID
TA=70°C
Maximum
20
RθJA
RθJL
°C
-55 to 150
Typ
64
89
53
Max
83
120
70
Units
°C/W
°C/W
°C/W
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AO8820
20V Common-Drain Dual
N-Channel Mosfet
Electrical Characteristics (TJ=25°C unless otherwise noted)
Symbol
Parameter
STATIC PARAMETERS
Drain-Source Breakdown Voltage
BVDSS
Conditions
Min
ID=250µA, VGS=0V
IGSS
Gate-Body leakage current
VDS=0V, VGS= ±10V
VGS(th)
Gate Threshold Voltage
VDS=VGS ID=250µA
0.5
ID(ON)
On state drain current
VGS=10V, VDS=5V
30
VGS=10V, ID=7A
13
TJ=55°C
5
TJ=125°C
10
µA
1.1
V
17.2
21
24
29
A
15
19.4
24
VGS=3.6V, ID=6A
16
20.7
28
VGS=2.5V, ID=5.5A
18
25
32
35
50
gFS
Forward Transconductance
VDS=5V, ID=7A
25
VSD
Diode Forward Voltage
IS=1A,VGS=0V
0.65
IS
Maximum Body-Diode Continuous Current
DYNAMIC PARAMETERS
Input Capacitance
Ciss
Coss
Output Capacitance
Crss
Reverse Transfer Capacitance
VGS=0V, VDS=10V, f=1MHz
SWITCHING PARAMETERS
Qg
Total Gate Charge
Qgs
Gate Source Charge
mΩ
S
1
V
2.5
A
500
pF
100
pF
52
pF
6
VGS=4.5V, VDS=10V, ID=7A
µA
0.8
VGS=4.5V, ID=6.6A
VGS=1.8V, ID=2A
Units
V
1
Zero Gate Voltage Drain Current
Static Drain-Source On-Resistance
Max
20
VDS=16V, VGS=0V
IDSS
RDS(ON)
Typ
9
nC
2
nC
Qgd
Gate Drain Charge
1
nC
tD(on)
Turn-On DelayTime
0.2
us
tr
Turn-On Rise Time
1.5
us
tD(off)
Turn-Off DelayTime
7.4
us
tf
Turn-Off Fall Time
18
us
ns
nC
VGS=5V, VDS=10V, RL=1.4Ω,
RGEN=3Ω
trr
Body Diode Reverse Recovery Time
IF=7A, dI/dt=100A/µs
9
Qrr
Body Diode Reverse Recovery Charge IF=7A, dI/dt=100A/µs
10
A. The value of RθJA is measured with the device mounted on 1in2 FR-4 board with 2oz. Copper, in a still air environment with TA =25°C. The
value in any given application depends on the user's specific board design.
B. The power dissipation PD is based on TJ(MAX)=150°C, using ≤ 10s junction-to-ambient thermal resistance.
C. Repetitive rating, pulse width limited by junction temperature TJ(MAX)=150°C. Ratings are based on low frequency and duty cycles to keep
initialTJ=25°C.
D. The RθJA is the sum of the thermal impedence from junction to lead RθJL and lead to ambient.
E. The static characteristics in Figures 1 to 6 are obtained using <300µs pulses, duty cycle 0.5% max.
F. These curves are based on the junction-to-ambient thermal impedence which is measured with the device mounted on 1in2 FR-4 board with
2oz. Copper, assuming a maximum junction temperature of TJ(MAX)=150°C. The SOA curve provides a single pulse rating.
2/5
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AO8820
20V Common-Drain Dual
N-Channel Mosfet
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS
30
20
10V
VDS=5V
3V
25
15
4V
2V
ID(A)
ID (A)
20
15
10
10
125°C
5
5
25°C
VGS=1.5V
0
0
0
1
2
3
4
0
5
50
1
1.5
2
2.5
40
VGS=2.5V
VGS=3.6V
30
20
10
VGS=4.5V
VGS=10V
Normalized On-Resistance
1.8
VGS=1.8V
RDS(ON) (mΩ
Ω)
0.5
VGS(Volts)
Figure 2: Transfer Characteristics (Note E)
VDS (Volts)
Fig 1: On-Region Characteristics (Note E)
VGS=2.5V
ID=5.5A
1.6
VGS=4.5V
ID=6.6A
1.4
17
5
VGS=10V
ID=7A 2
10
1.2
VGS=1.8V
ID=2A
1
0.8
0
0
0
5
10
15
20
ID (A)
Figure 3: On-Resistance vs. Drain Current and Gate
Voltage (Note E)
25
50
75
100
125
150
175
0
Temperature (°C)
Figure 4: On-Resistance vs. Junction
18Temperature
(Note E)
80
1.0E+01
ID=7A
70
1.0E+00
40
1.0E-01
50
IS (A)
RDS(ON) (mΩ
Ω)
60
125°C
1.0E-02
40
125°C
1.0E-03
25°C
30
20
25°C
1.0E-05
10
0
4
6
8
10
VGS (Volts)
Figure 5: On-Resistance vs. Gate-Source Voltage
(Note E)
3/5
1.0E-04
2
0.0
0.2
0.4
0.6
0.8
1.0
1.2
VSD (Volts)
Figure 6: Body-Diode Characteristics (Note E)
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AO8820
20V Common-Drain Dual
N-Channel Mosfet
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS
800
5
VDS=10V
ID=7A
4
Ciss
Capacitance (pF)
VGS (Volts)
600
3
2
400
Coss
200
1
0
0
2
4
6
Qg (nC)
Figure 7: Gate-Charge Characteristics
8
0
20
RDS(ON)
limited
1ms
1.0
10ms
TJ(Max)=150°C
TA=25°C
0.1
TA=25°C
10µs
100µs
1000
Power (W)
10.0
5
10
15
VDS (Volts)
Figure 8: Capacitance Characteristics
10000
100.0
ID (Amps)
Crss
0
10s
DC
100
10
1
0.0
0.00001
0.01
0.1
1
VDS (Volts)
10
0.001
0.1
10
1000
100
Pulse Width (s)
Figure 10: Single Pulse Power Rating Junction-toAmbient (Note F)
Figure 9: Maximum Forward Biased Safe
Operating Area (Note F)
Zθ JA Normalized Transient
Thermal Resistance
10
In descending order
D=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse
D=Ton/T
TJ,PK=TA+PDM.ZθJA.RθJA
1
RθJA=83°C/W
0.1
PD
0.01
Single Pulse
Ton
T
0.001
0.00001
0.0001
0.001
0.01
0.1
1
10
100
1000
Pulse Width (s)
Figure 11: Normalized Maximum Transient Thermal Impedance (Note F)
4/5
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AO8820
20V Common-Drain Dual
N-Channel Mosfet
Gate Charge Test Circuit & Waveform
Vgs
Qg
10V
+
+ Vds
VDC
-
Qgs
Qgd
VDC
DUT
-
Vgs
Ig
Charge
R es istiv e S w itch ing T e st C ircu it & W a ve fo rm s
RL
V ds
Vds
DUT
Vgs
90 %
+
Vdd
VDC
-
Rg
1 0%
Vgs
V gs
t d (o n )
tr
t d (o ff)
to n
tf
t o ff
D iode R ecovery T est C ircuit & W aveform s
Q rr = -
V ds +
Idt
DUT
V gs
V ds -
Isd
V gs
Ig
5/5
L
Isd
+
VD C
-
IF
t rr
dI/dt
I RM
V dd
V dd
V ds
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