SHENZHENFREESCALE AO4828

AO4828
60V Dual N-channel MOSFET
General Description
The AO4828 uses advanced trench technology to provide excellent RDS(ON) and low gate charge. This
device is suitable for use as a load switch or in PWM applications.
Features
VDS (V) = 60V
ID = 4.5A (VGS = 10V)
RDS(ON) < 56mΩ (VGS = 10V)
RDS(ON) < 77mΩ (VGS = 4.5V)
SOIC-8
D
1
D
2
Top View
D2
D2
D1
D1
S2
G2
S1
G1
G1
G2
S1
Absolute Maximum Ratings TA=25°C unless otherwise noted
Parameter
Symbol
Drain-Source Voltage
VDS
Gate-Source Voltage
VGS
TA=25°C
Continuous Drain
AF
Current
B
TA=25°C
Avalanche Current
B
Repetitive avalanche energy 0.1mH
B
Junction and Storage Temperature Range
Thermal Characteristics
Parameter
A
Maximum Junction-to-Ambient
A
Maximum Junction-to-Ambient
Maximum Junction-to-Lead
1/4
C
Units
V
±20
V
ID
3.6
IDM
20
A
2
PD
TA=70°C
Power Dissipation
Maximum
60
4.5
TA=70°C
Pulsed Drain Current
S2
W
1.28
IAR, IAS
19
A
EAR, EAS
18
mJ
TJ, TSTG
-55 to 150
°C
Symbol
t ≤ 10s
Steady-State
Steady-State
RθJA
RθJL
Typ
48
74
35
Max
62.5
110
60
Units
°C/W
°C/W
°C/W
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AO4828
60V Dual N-channel MOSFET
Electrical Characteristics (TJ=25°C unless otherwise noted)
Symbol
Parameter
STATIC PARAMETERS
BVDSS
Drain-Source Breakdown Voltage
Conditions
Min
ID=250µA, VGS=0V
Units
V
1
Zero Gate Voltage Drain Current
IGSS
Gate-Body leakage current
VDS=0V, VGS= ±20V
VGS(th)
Gate Threshold Voltage
VDS=VGS ID=250µA
1
ID(ON)
On state drain current
VGS=10V, VDS=5V
20
TJ=55°C
µA
5
VGS=10V, ID=4.5A
Static Drain-Source On-Resistance
Max
60
VDS=60V, VGS=0V
IDSS
RDS(ON)
Typ
TJ=125°C
VGS=4.5V, ID=3A
100
nA
2.1
3
V
46
56
80
100
64
77
mΩ
1
V
A
mΩ
gFS
Forward Transconductance
VDS=5V, ID=4.5A
VSD
Diode Forward Voltage
IS=1A,VGS=0V
IS
Maximum Body-Diode Continuous Current
3
A
ISM
Pulsed Body Diode Current B
20
A
540
pF
11
DYNAMIC PARAMETERS
Ciss
Input Capacitance
Coss
Output Capacitance
Crss
Reverse Transfer Capacitance
Rg
Gate resistance
450
VGS=0V, VDS=30V, f=1MHz
Qgs
Gate Source Charge
Qgd
tD(on)
tr
Turn-On Rise Time
60
pF
25
VGS=0V, VDS=0V, f=1MHz
SWITCHING PARAMETERS
Qg(10V) Total Gate Charge
Qg(4.5V) Total Gate Charge
S
0.74
VGS=10V, VDS=30V, ID=4.5A
1.3
pF
1.65
2
Ω
8.5
10.5
nC
4.3
5.5
nC
1.6
nC
Gate Drain Charge
2.2
nC
Turn-On DelayTime
4.7
ns
2.3
ns
15.7
ns
1.9
ns
VGS=10V, VDS=30V, RL=6.7Ω,
RGEN=3Ω
tD(off)
Turn-Off DelayTime
tf
trr
Turn-Off Fall Time
Qrr
Body Diode Reverse Recovery Charge IF=4.5A, dI/dt=100A/µs
Body Diode Reverse Recovery Time
IF=4.5A, dI/dt=100A/µs
27.5
35
32
ns
nC
A: The value of R θJA is measured with the device mounted on 1in 2 FR-4 board with 2oz. Copper, in a still air environment with
T A=25°C. The value in any given application depends on the user's specific board design.
B: Repetitive rating, pulse width limited by junction temperature.
C. The R θJA is the sum of the thermal impedence from junction to lead R θJL and lead to ambient.
D. The static characteristics in Figures 1 to 6 are obtained using <300 µs pulses, duty cycle 0.5% max.
E. These tests are performed with the device mounted on 1 in 2 FR-4 board with 2oz. Copper, in a still air environment with T A=25°C. The
SOA curve provides a single pulse rating.
F. The current rating is based on the t≤ 10s junction to ambient thermal resistance rating.
Rev8: May 2010
2/4
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AO4828
60V Dual N-channel MOSFET
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS
20
15
10.0
V
5.0V
VDS=5V
15
125°C
ID(A)
ID (A)
10
4.5V
10
4.0V
5
5
25°C
VGS=3.5V
0
0
1
2
3
4
0
5
2
2.5
VDS (Volts)
Fig 1: On-Region Characteristics
Normalized On-Resistance
80
RDS(ON) (mΩ )
4
4.5
5
2
90
VGS=4.5V
70
60
50
VGS=10V
40
30
20
VGS=10V
1.8
ID=4.5A
1.6
VGS=4.5V
ID=3.0A
1.4
1.2
1
0.8
0
5
10
15
20
0
ID (A)
Figure 3: On-Resistance vs. Drain Current and
Gate Voltage
25
50
75
100
125
150
175
Temperature (°C)
Figure 4: On-Resistance vs. Junction
Temperature
160
1.0E+01
ID=4.5A
140
1.0E+00
125°C
1.0E-01
120
IS (A)
RDS(ON) (mΩ )
3.5
VGS(Volts)
Figure 2: Transfer Characteristics
100
125°C
100
1.0E-02
25°C
1.0E-03
80
25°C
60
1.0E-04
40
1.0E-05
2
4
6
8
10
VGS (Volts)
Figure 5: On-Resistance vs. Gate-Source Voltage
3/4
3
0.0
0.2
0.4
0.6
0.8
1.0
VSD (Volts)
Figure 6: Body-Diode Characteristics
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AO4828
60V Dual N-channel MOSFET
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS
800
10
VDS=30V
ID= 4.5A
Capacitance (pF)
VGS (Volts)
8
6
4
2
600
Ciss
400
Coss
200
Crss
0
0
0
1
2
3
4
5
6
7
8
9
10
0
10
Qg (nC)
Figure 7: Gate-Charge Characteristics
50
60
1ms
1s
1.0
10s
TJ(Max)=150°C
TA=25°C
30
Power (W)
ID (Amps)
10.0
10ms
TJ(Max)=150°C
TA=25°C
10µs
100µs
0.1s
20
10
DC
0
0.001
0.1
1
10
0.1
1
10
100
1000
Pulse Width (s)
Figure 10: Single Pulse Power Rating Junction-toAmbient (Note E)
100
VDS (Volts)
Figure 9: Maximum Forward Biased Safe
Operating Area (Note E)
Zθ JA Normalized Transient
Thermal Resistance
40
40
RDS(ON)
limited
10
30
VDS (Volts)
Figure 8: Capacitance Characteristics
100.0
0.1
20
D=Ton/T
TJ,PK=TA+PDM.ZθJA.RθJA
RθJA=62.5°C/W
0.01
In descending order
D=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse
1
PD
0.1
Ton
Single Pulse
0.01
0.00001
0.0001
0.001
0.01
0.1
1
T
10
100
1000
Pulse Width (s)
Figure 11: Normalized Maximum Transient Thermal Impedance
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