WILLAS MMBT4401LT1

WILLAS
FM120-M+
MMBT4401LT1
THRU
Purpose
Transistor
FM1200-M+
1.0AGeneral
SURFACE MOUNT
SCHOTTKY BARRIER
RECTIFIERS -20V- 200V
Pb Free Product
SOD-123+ PACKAGE
Package outline
Features
process
design,
excellent
power dissipation
••Batch
We declare
that
the material
of product
complianceoffers
with RoHS requirements.
better
reverse
leakage
and thermal resistance.
Pb-Free
package
iscurrent
available
• Low profile surface mounted application in order to
RoHS product for packing code suffix ”G”
optimize board space.
Halogen
for packing code suffix “H”
power free
loss,product
high efficiency.
• Low
• High current capability, low forward voltage drop.
High surge capability.
•ORDERING
INFORMATION
• Guardring for overvoltage protection.
high-speed switching.
• Ultra
Device
Marking
Shipping
• Silicon epitaxial planar chip, metal silicon junction.
MMBT4401LT1
2X
3000/Tape & Reel
parts meet environmental standards of
• Lead-free
SOD-123H
0.146(3.7)
0.130(3.3)
0.012(0.3) Typ.
0.071(1.8)
0.056(1.4)
MIL-STD-19500 /228
RATINGS
RoHS product
for packing code suffix "G"
•MAXIMUM
Halogen free product for packing code suffix "H"
Rating
Symbol
Mechanical data
Collector–Emitter Voltage
V CEO
Value
Unit
40
Vdc
• Epoxy : UL94-V0 rated flame retardant
60
Collector–Base Voltage
V
• Case : Molded plastic, SOD-123H CBO
,
6.0
Emitter–Base
Voltage
V EBO per MIL-STD-750
• Terminals
:Plated
terminals, solderable
Method—
2026
Collector Current
Continuous
IC
600
• Polarity : Indicated by cathode band
Mounting Position
: Any
•THERMAL
CHARACTERISTICS
• Weight : Approximated
0.011 gram
Characteristic
0.040(1.0)
0.024(0.6)
Vdc
0.031(0.8) Typ.
0.031(0.8) Typ.
Vdc
3
COLLECTOR
mAdc
Dimensions in inches1and (millimeters)
BASE
Symbol
Max
Unit
2
EMITTER
225
mW
Total Device Dissipation FR– 5 Board, (1)
PD
MAXIMUM RATINGS AND ELECTRICAL
CHARACTERISTICS
TA = 25°C
Ratings at 25℃ ambient temperature unless otherwise specified.
Derate above 25°C
1.8
mW/°C
Single phase half wave, 60Hz, resistive of inductive load.
Thermal Resistance, Junction to Ambient
RθJA
556
°C/W
For capacitive load, derate current by 20%
Total Device Dissipation
PD
300
mW
SYMBOL FM120-MH FM130-MH FM140-MH FM150-MH FM160-MH FM180-MH FM1100-MH FM1150-MH FM1200-MH UNIT
RATINGS(2) TA = 25°C
Alumina Substrate,
Marking CodeDerate above 25°C
12
13
14
15
18
10
115
120
2.4
mW/°C 16
20
30
40
50
80
100
150
200
Maximum Recurrent
Reverse Junction
Voltage to Ambient VRRM
Volts
ThermalPeak
Resistance,
RθJA
417
°C/W 60
VRMS
T14
J , Tstg
21 –55 to28
+150
35°C
42
56
70
105
140
Volts
Maximum DC Blocking Voltage
VDC
20
30
50
60
80
100
150
200
Volts
MaximumDEVICE
Average Forward
Rectified Current
MARKING
IO
IFSM
Maximum RMS
Voltageand Storage Temperature
Junction
SOT–23
Peak ForwardMMBT4401LT1
Surge Current 8.3 ms
single half sine-wave
= 2X
superimposed on rated load (JEDEC method)
40
1.0
30
ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise
noted.)
RΘJA
Typical Thermal Resistance (Note 2)
CJ
Typical Junction Capacitance
(Note 1)
Characteristic
TJ
Operating Temperature Range
OFF CHARACTERISTICS
Storage Temperature Range
CHARACTERISTICS
(I C = 1.0
mAdc, I B = 0)
Maximum Average
Reverse
(I C = 0.1
mAdc,Current
I E = 0)at @T A=25℃
A=125℃
Rated DC Blocking
Voltage Breakdown @T
Emitter–Base
Voltage
2012-06
2012-11
Min
40
120
Max
Amps
℃/W
PF
Unit
-55 to +150
℃
- 65 to +175
V (BR)CEO
℃
Vdc
SYMBOL FM120-MH FM130-MH FM140-MH
40 FM150-MH FM160-MH
— FM180-MH FM1100-MH FM1150-MH FM1200-MH UNIT
VF
IR
(I E = 0.1 mAdc, I C = 0)
Base Cutoff Current
1- Measured at 1 MHZ and applied reverse voltage of 4.0 VDC.
(V CE = 35 Vdc, V EB = 0.4 Vdc)
2- Thermal Resistance From Junction to Ambient
Collector Cutoff Current
(V CE = 35 Vdc, V EB = 0.4 Vdc)
1. FR–5 = 1.0 x 0.75 x 0.062 in.
2. Alumina = 0.4 x 0.3 x 0.024 in. 99.5% alumina.
3. Pulse Test: Pulse Width <300 µs; Duty Cycle <2.0%.
NOTES:
Symbol
-55 to +125
TSTG
Collector–Emitter Breakdown Voltage (3)
Maximum Forward
Voltage at Breakdown
1.0A DC
Collector–Base
Voltage
Amps
V (BR)CBO
0.50
0.70
60
V
(BR)EBO
0.85
Vdc
0.5
—
10
6.0
—
—
0.1
—
0.1
0.9
0.92
Volts
mAmps
Vdc
µAdc
I BEV
µAdc
I CEX
WILLAS
ELECTRONIC
CORP.
WILLAS
ELECTRONIC
CORP.
WILLAS
FM120-M+
THRU
MMBT4401LT1
FM1200-M+
1.0AGeneral
SURFACE MOUNT
SCHOTTKY BARRIER
RECTIFIERS -20V- 200V
Purpose
Transistor
Pb Free Product
SOD-123+ PACKAGE
Package
ELECTRICAL CHARACTERISTICS (T A = 25°C unless otherwise noted)
(Continued) outline
Features
Characteristic
power dissipation offers
• Batch process design, excellent
Symbol
Min
Max
better
reverse leakage current
ON
CHARACTERISTICS
( 3 and
) thermal resistance.
SOD-123H
surface
mounted application in order to
• Low profile
DC Current
Gain
hFE
optimize board space.
(I C = 0.1 mAdc, V CE = 1.0 Vdc)
• Low power loss, high efficiency.
(I C = 1.0 mAdc, V CE = 1.0 Vdc)
capability, low forward voltage drop.
• High current
(I C = 10 mAdc, V CE = 1.0 Vdc)
capability.
• High surge
(I C =for
150overvoltage
mAdc, V CE =protection.
1.0 Vdc)
• Guardring
(I
=
500
mAdc,
V
=
C
CE
• Ultra high-speed switching. 2.0 Vdc)
Voltage
epitaxial planar Saturation
chip, metal
silicon junction.
• SiliconCollector–Emitter
(I
=
150
mAdc,
I
=
15
mAdc)
C
B
• Lead-free parts meet environmental standards of
MIL-STD-19500
/228 I B = 50 mAdc)
(I C = 500 mAdc,
for packing
code suffix
"G"
• RoHS product
Base–Emitter
Saturation
Voltage
Halogen free product for packing code suffix "H"
(I C = 150 mAdc, I B = 15 mAdc)
Mechanical
data
(I C = 500 mAdc, I B = 50 mAdc)
• Epoxy : UL94-V0 rated flame retardant
––
––
0.4
0.75
0.75
––
0.95
1.2
0.012(0.3) Typ.
0.071(1.8)
0.056(1.4)
Vdc
V BE(sat)
Vdc
0.040(1.0)
0.024(0.6)
0.031(0.8) Typ.
0.031(0.8) Typ.
fT
14
21
28
35
42
56
70
105
140
Volts
20
VDC
DelayForward
Time Rectified (V
CC = 30 Vdc, V EB =
Maximum Average
Current
IO2.0 Vdc
30
40
50
60
80
15
100
150
200
Volts
CHARACTERISTICS
MaximumSWITCHING
DC Blocking Voltage
VRMS
I C = 150 mAdc, I B1 = 15 mAdc)
Peak Forward Surge Current 8.3 ms single half sine-wave
IFSM
Storage
Time
(V CC = 30 Vdc, I C = 150 mAdc
superimposed on
rated load
(JEDEC method)
Rise Time
Fall
Time
Typical Thermal
Resistance
(Note 2) I B1 = I B2 = 15 mAdc)
RΘJA
CJ
3. Pulse Test: Pulse Width <300 µs; Duty Cycle
Operating Temperature Range
TJ<2.0%.
Typical Junction Capacitance (Note 1)
Storage Temperature Range
CHARACTERISTICS
Maximum Forward Voltage at 1.0A DC
+ 16 V
—
—
ts
—
tf
—
1.0
30
40
120
-55 to +125
NOTES:
ns
225
ns
30
Amps
℃/W
PF
-55 to +150
℃
- 65 to +175
℃
SYMBOL FM120-MH FM130-MH FM140-MH FM150-MH FM160-MH FM180-MH FM1100-MH FM1150-MH FM1200-MH UNIT
+30 V
DUTY CYCLE = 2%
@T A=125℃
VF
0.50
200
IR Ω
+ 16 V
0.70
0.9
+30 0.85
V
1.0 to 100µs,
0.5
DUTY CYCLE = 2%
0.92
Volts
200Ω
mAmp
10
1.0 kΩ
1.0 kΩ
Amps
20
SWITCHING TIME EQUIVALENT TEST CIRCUITS
to 100µs,
Maximum Average Reverse1.0
Current
at @T A=25℃
Rated DC Blocking Voltage
td
tr
TSTG
––
0.146(3.7)
0.130(3.3)
––
––
300
––
MHz
(I C = Method
20 mAdc,
V CE= 10Vdc, f = 100 MHz)
250
––
2026
C cb
Dimensions in inches and (millimeters) pF
• PolarityCollector–Base
: Indicated byCapacitance
cathode band
(V CB= 5.0 Vdc, I E = 0, f = 1.0 MHz)
––
6.5
• Mounting Position : Any
Emitter–Base Capacitance
C eb
pF
• Weight(V: Approximated
0.011 gram
––
30
EB = 0.5 Vdc, I C = 0, f = 1.0 MHz)
Input Impedance
h ie
kΩ
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
(V CE= 10 Vdc, I C = 1.0 mAdc, f = 1.0 kHz)
1.0
15
–4
Ratings at 25℃ Voltage
ambientFeedback
temperature
unless otherwise specified.
Ratio
h re
X 10
Single phase half
wave,
60Hz,
resistive
of
inductive
load.
(V CE= 10 Vdc, I C = 1.0 mAdc, f = 1.0 kHz)
0.1
8.0
For capacitive load,
derate current by 20%
Small–Signal Current Gain
h fe
—
FM1100-MH FM1150-MH FM1200-MH UNIT
(V CE=RATINGS
10 Vdc, I C = 1.0 mAdc, f = 1.0SYMBOL
kHz) FM120-MH FM130-MH FM140-MH FM150-MH
40 FM160-MH FM180-MH
500
Marking Code
Output Admittance
12
13h oe
14
15
16
18
10 µmhos
115
120
20
30
40
501.0
60
80
100
150
200
Maximum Recurrent
Reverse
Volts
(V Peak
Vdc, I CVoltage
= 1.0 mAdc, f = 1.0VkHz)
30
RRM
CE= 10
Maximum RMS Voltage
––
20
40
80
100
40
VCE(sat)
Molded plastic, SOD-123H
• Case : SMALL–SIGNAL
CHARACTERISTICS
,
Current–Gain
— Bandwidth
Product per MIL-STD-750
• Terminals
:Plated terminals,
solderable
Unit
0
0
1- Measured at 1 MHZ and applied reverse voltage of 4.0 VDC.
– 2.0V
<2.0 ns
2- Thermal Resistance From Junction to Ambient
C S*< 10 pF
C S* < 10 pF
–14 V
< 20 ns
1N916
– 4.0 V
Scope rise time < 4.0ns
*Total shunt capacitance of test jig connectors, and oscilloscope
Figure 1. Turn–On Time
2012-06
2012-11
Figure 2. Turn–Off Time
WILLAS ELECTRONIC CORP.
WILLAS ELECTRONIC CORP.
WILLAS
FM120-M+
THRU
MMBT4401LT1
Purpose
Transistor
FM1200-M+
1.0AGeneral
SURFACE MOUNT
SCHOTTKY BARRIER
RECTIFIERS -20V- 200V
Pb Free Product
SOD-123+ PACKAGE
Package outline
TRANSIENT CHARACTERISTICS
Features
• Batch process design, excellent power dissipation offers
better reverse leakage current and thermal resistance.
SOD-123H
• Low profile surface mounted application in order to
T J = 25°C
T J = 100°C
MIL-STD-19500 /228
RoHS product for packing code suffix "G"
•5.0
Halogen free product for packing code suffix "H"
10
7.0
QT
2.0
• Epoxy : UL94-V0 rated flame retardant
Case
Molded
plastic,
•2.0
0.1 :0.2
0.3
0.5
1.0 SOD-123H
2.0 3.0 5.0
10
20 30
50
,
• Terminals :Plated terminals, solderable per MIL-STD-750
0.7
0.5
0.3
Q
0.2
0.040(1.0) A
0.024(0.6)
0.1
10 0.031(0.8)
20Typ. 30
Figure 4. Charge Data
I C /I B = 10
VRRM
12
20
13
30
Maximum7.0RMS Voltage
VRMS
14
VDC
20
Maximum5.0DC Blocking Voltage
20
30
50
Forward
Rectified
200IO 300
70 100
Current
14
15
50
16
60
18
80
10
100
115
150
120
200
Volts
21
7.0 28
35
42
56
70
105
140
Volts
30
5.0 40
50
60
80
100
150
200
Volts
10
CHARACTERISTICS
NOTES:
Amp
- 65 to +175
50
℃/W
70
VF
Reverse Current at @T A=25℃
PF
-55 to +150
V CC = 30 V
℃
℃
I B1 = I B2
I C /I B = 20
30
0.50
IR
@T A=125℃
Rated DC Blocking Voltage
Amp
500
SYMBOL FM120-MH FM130-MH FM140-MH FM150-MH FM160-MH FM180-MH FM1100-MH FM1150-MH FM1200-MH UNIT
Maximum Forward Voltage at 1.0A DC
Maximum100
Average
100
t f , FALL TIME (ns)
t f , STORAGE TIME (ns)
Storage Temperature
Range
200
300
40
120
-55 to +125
t s’ = tTs J– 1/8 t f
I B1 TSTG
= I B2
I C/I B = 10 to 20
Operating Temperature Range
30
Figure 6. Rise and Fall Time
CJ
300
50
70 100
200
1.0
I C , COLLECTOR CURRENT (mA)
30
20
RΘJA
Typical Junction Capacitance (Note 1)
70
50
1- Measured at 1 MHZ and applied reverse voltage of 4.0 VDC.
10 40
500
Time
Typical Thermal Resistance (Note 2)
tf
30
I C 8.3
, COLLECTOR
Peak Forward Surge Current
ms single half CURRENT
sine-wave (mA)
IFSM
Figure
5. Turn–On
superimposed on rated load (JEDEC
method)
t , RISE TIME (ns)
t , TIME (ns)
Maximum10Recurrent Peak Reverse Voltage
Maximum
V CC= 30V
I C/I B =10
tr
20
t d@V EB=0V
SYMBOL FM120-MH FM130-MH FM140-MH FM150-MH FM160-MH FM180-MH FM1100-MH FM1150-MH FM1200-MH UNIT
RATINGS
Marking Code
70
Ratings at 25℃ ambient temperature unless otherwise
specified.
t r @V CC=30V
Single phase
half wave, 60Hz, resistive of inductive
=10V
t r @Vload.
30
CC
For capacitive load, derate current by 20%
t d@V EB=2.0V
10
Average
200 0.031(0.8)
300 Typ.500
100
Dimensions in inches and (millimeters)
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
50
20
70
100
70
50
I C , COLLECTOR CURRENT (mA)
Figure 3. Capacitance
50
0.071(1.8)
0.056(1.4)
1.0
REVERSE VOLTAGE (VOLTS)
Method 2026
• Polarity : Indicated by cathode band
• Mounting Position : Any
100
• Weight : Approximated 0.011 gram
0.012(0.3) Typ.
3.0
C cb
Mechanical
data
3.0
0.146(3.7)
0.130(3.3)
V CC = 30 V
I C / I B = 10
5.0
Q, CHARGE (pC)
CAPACITANCE (pF)
optimize board space.
Low power loss, high efficiency.
• 30
• High current capability, low forward voltage drop.
20
• High surge capability.
• Guardring for overvoltage protection.
C obo
• Ultra high-speed switching.
Silicon epitaxial planar chip, metal silicon junction.
• 10
Lead-free parts meet environmental standards of
•7.0
0.70
I C /I B = 10
20
0.9
0.85
0.92
0.5
Volts
mAmp
10
10
7.0
2- Thermal Resistance From Junction to Ambient
30
5.0
10
2012-06
2012-11
20
30
50
70
100
200
300
500
10
20
30
50
70
100
200
300
I C , COLLECTOR CURRENT (mA)
I C , COLLECTOR CURRENT (mA)
Figure 7. Storage Time
Figure 8. Fall Time
500
WILLAS
ELECTRONIC
CORP.
WILLAS
ELECTRONIC
CORP.
WILLAS
FM120-M+
THRU
MMBT4401LT1
FM1200-M+
Purpose
Transistor
1.0AGeneral
SURFACE MOUNT
SCHOTTKY BARRIER
RECTIFIERS -20V- 200V
Pb Free Product
SOD-123+ PACKAGE
SMALL–SIGNAL CHARACTERISTICS
NOISE FIGURE
Package
V CE = 10 Vdc, T A = 25°C
Batch process design, excellent power dissipation offers
better reverse leakage current and thermal resistance. Bandwidth = 1.0 Hz
Features
•
profile surface mounted application in order to
• Low 10
SOD-123H
10
optimize board space.
I C = 1.0 mA, R S = 150 Ω
f = 1.0 kHz
efficiency.
• Low power loss, high
I C = 500
µA, R S = 200 Ω
R S = OPTIMUM
8.0
• High current capability,
µA, Rforward
= 2.0 kΩvoltage
I C = 100low
RSdrop.
= SOURCE
S
• High surge capability.
I C = 50 µA, R S = 4.0 kΩ
RS = RESISTANCE
6.0
for overvoltage protection.
• Guardring
• Ultra high-speed switching.
epitaxial planar chip, metal silicon junction.
• Silicon
4.0
• Lead-free parts meet environmental standards of
8.0
NF, NOISE FIGURE (dB)
NF, NOISE FIGURE (dB)
•
outline
MIL-STD-19500 /228
2.0product for packing code suffix "G"
RoHS
Halogen free product for packing code suffix "H"
Mechanical
data
0
0.146(3.7)
0.130(3.3)
0.012(0.3) Typ.
I C = 50 µA
I C = 100 µA
I C = 500 µA
I C = 1.0 mA
6.0
0.071(1.8)
0.056(1.4)
4.0
2.0
0
0.040(1.0)
0.05 0.1 0.2
1.0 2.0
5.0 10 20
50 100
500 100 200
500 1.0k 2.0k
5.0k 10k 0.024(0.6)
20k
50k 100k
UL94-V0
rated flame0.5
retardant
• Epoxy :0.010.02
f , FREQUENCY (kHz)
R S, SOURCE RESISTANCE (kΩ)
• Case : Molded plastic, SOD-123H
0.031(0.8) Typ.
0.031(0.8) Typ.
Figure 9. Frequency Effects
,
Figure 10. Source Resistance Effects
• Terminals :Plated terminals, solderable per MIL-STD-750
h PARAMETERS
Method 2026
Dimensions in inches and (millimeters)
(V CE = 10 Vdc, f = 1.0 kHz, T A = 25°C)
• Polarity : Indicated by cathode band
Position : Any
• MountingThis
group of graphs illustrates the relationship between h fe and other “h” parameters for this series of
• Weightransistors.
: Approximated
0.011
gramcurves, a high–gain and a low–gain unit were selected from the LMBT4401LT1
To obtain
these
lines, and the same units were used to develop the correspondingly numbered curves on each graph.
RATINGS
100
12 1
LMBT4401LT1 UNIT
20
VRRM
LMBT4401LT1
UNIT 2
14
VRMS
70
Maximum Recurrent Peak Reverse Voltage
Maximum RMS 50
Voltage
Maximum DC Blocking Voltage
13
30
21
20
VDC
30
30
IO
20
Peak Forward Surge Current 8.3 ms single half sine-wave
IFSM
0.1
0.2 0.3
0.5 0.7 1.0
2.0 3.0
Maximum Average Forward Rectified Current
superimposed on rated load (JEDEC method)
h re, VOLTAGE FEEDBACK RATIO (X 10 –4 )
Storage Temperature
Range
7.0
Maximum Forward Voltage at 1.0A DC
2.0
Maximum Average Reverse Current at @T A=25℃
NOTES:
IR
@T A=125℃
0.7
2- Thermal Resistance From Junction to Ambient
0.3
0.2
2012-06
2012-11
0.1
0.2
0.3
0.5 0.7
10
100
115
150
120
200
Volts
28
35
42
56
70
105
140
50
60
80
100
150
200
Volts
1.0
0.1
0.2
0.3
1.0
0.5300.7
Amps
1.0
2.0
3.0
7.0 5.0
Amps
10
I C , COLLECTOR CURRENT
(mA)
40
Figure 12.
120Input Impedance
-55 to +150
℃/W
-55 to +125
1- Measured at 10.5
MHZ and applied reverse voltage of 4.0 VDC.
18
80
100
PF
℃
- 65 to +175
℃
50
LMBT4401LT1 UNIT 1
LMBT4401LT1 UNIT 1
SYMBOL FM120-MH FM130-MH FM140-MH FM150-MH FM160-MH FM180-MH FM1100-MH FM1150-MH FM1200-MH UNIT
LMBT4401LT1 UNIT 2
LMBT4401LT1 UNIT 2
Volts
0.9
0.92
VF
0.50 20
0.70
0.85
CHARACTERISTICS
3.0
1.0
16
60
40
2.0
10
TSTG
5.0
15
50
Volts
TJ
Operating Temperature
Range
10
14
40
5.0
Figure
Typical Junction Capacitance (Note
1) 11. Current Gain
CJ
Rated DC Blocking Voltage
20
0.5
7.0 5.0
I C , COLLECTOR
CURRENT
(mA)
Typical Thermal Resistance (Note
2)
RΘJA
LMBT4401LT1 UNIT 1
LMBT4401LT1 UNIT 2
10
FM150-MH FM160-MH FM180-MH FM1100-MH FM1150-MH FM1200-MH UNIT
SYMBOL FM120-MH FM130-MH FM140-MH
Marking Code
h ie, INPUT IMPEDANCE (kΩ)
h fe, CURRENT GAIN
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
50
Ratings at 25℃ ambient temperature unless otherwise specified.
Single phase200
half wave, 60Hz, resistive of inductive load.
For capacitive load, derate current by 20%
h oe , OUTPUT ADMITTANCE ( µmhos)
300
1.0
2.0
3.0
7.0 5.0
10
0.5
mAmps
10
10
5.0
2.0
1.0
0.1
0.2
0.3
0.5 0.7
1.0
2.0
3.0
7.0 5.0
I C , COLLECTOR CURRENT (mA)
I C , COLLECTOR CURRENT (mA)
Figure 13. Voltage Feedback Ratio
Figure 14. Output Admittance
10
WILLAS ELECTRONIC CORP.
WILLAS
ELECTRONIC CORP.
WILLAS
FM120-M+
MMBT4401LT1
THRU
Purpose
Transistor
FM1200-M+
1.0AGeneral
SURFACE MOUNT
SCHOTTKY BARRIER
RECTIFIERS -20V- 200V
Pb Free Product
SOD-123+ PACKAGE
Package outline
Features
offers
• Batch process design, excellent power dissipation
STATIC
CHARACTERISTICS
better reverse leakage current and thermal resistance.
SOD-123H
• Low profile surface mounted application in order to
optimize
board space.
3.0
, NORMALIZED CURRENT GAIN
• Low power loss, high efficiency.
V CE= 1.0 V
current capability,Vlow=10
forward
voltage drop.
• High2.0
V
• High surge capability. CE
• Guardring for overvoltage protection.
• Ultra1.0high-speed switching.
• Silicon epitaxial planar chip, metal silicon junction.
parts meet environmental standards of
• Lead-free
0.7
0.146(3.7)
0.130(3.3)
0.012(0.3) Typ.
T J = 125°C
0.071(1.8)
0.056(1.4)
25°C
MIL-STD-19500 /228
• RoHS0.5product for packing code suffix "G"
–55°C
Halogen free product for packing code suffix "H"
0.3
Mechanical
data
FE
0.040(1.0)
0.024(0.6)
h
: UL94-V0 rated flame retardant
• Epoxy
0.2
plastic,
• Case : Molded
0.1
0.2
0.3SOD-123H
0.5
0.7
1.0
2.0
3.0
5.0 7.0
10 0.031(0.8)
20Typ.
,
• Terminals :Plated terminals, solderable per MIL-STD-750
I , COLLECTOR CURRENT (mA)
V CE, COLLECTOR EMITTER VOLTAGE (VOLTS)
70
100
20 0.031(0.8)
300 Typ. 500
Figure 15. DC Current Gain
• Polarity : Indicated by cathode band
1.0
Position : Any
• Mounting
• Weight : Approximated 0.011 gram
Dimensions in inches and (millimeters)
T J = 25°C
0.8
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25℃
0.6 ambient temperature unless otherwise specified.
mA
=1.0 mA
Single phase half wave,I 60Hz,
resistive of inductive 10
load.
C
For capacitive load, derate current by 20%
100mA
500mA
0.4
RATINGS
Marking Code
SYMBOL FM120-MH FM130-MH FM140-MH FM150-MH FM160-MH FM180-MH FM1100-MH FM1150-MH FM1200-MH UNIT
Maximum Recurrent Peak Reverse Voltage
VRRM
12
20
13
30
14
40
15
50
16
60
18
80
10
100
115
150
120
200
Volts
Maximum RMS Voltage
VRMS
14
21
28
35
42
56
70
105
140
Volts
40
50
2.0
200
Volts
0.2
0
Maximum DC Blocking Voltage
0.02
0.03
0.05 0.07
0.1
Maximum Average Forward Rectified Current
Peak Forward Surge Current 8.3 ms single half sine-wave
superimposed on rated load (JEDEC method)
Operating Temperature
Range
0.8
V, VOLTAGE ( VOLTS )
Storage Temperature Range
V @ V CE =1.0 V
-55 to +125
V CE(sat) @ I C /I B =10
1- Measured at 1 MHZ and applied reverse voltage of 4.0 VDC.
0
10
20
50
10
100 20
150
30
50
1.0
30
Amps
Amps
℃/W
PF
-55 to +150
θ VC for V CE(sat)
- 65 to +175
0
℃
℃
– 0.5
–1.0
0.70
0.9
0.85
0.92
0.5
–1.5
mAmp
10
θ VB for V
–2.0
Volts
BE
– 2.5
100 200
I C , COLLECTOR CURRENT (mA)
Figure 17. “On” Voltages
2012-06
2012-11
80
7.0
40
120
0.50
IR
@T A=125℃
2- Thermal Resistance
From Junction
Ambient
0.1 0.2
0.5 1.0 to2.0
5.0
60 5.0
3.0
+0.5
VF
0.4
0.2
1.0
IO
I B , BASE CURRENT (mA)
Figure 16. Collector Saturation Region
IFSM
Maximum Average Reverse Current at @T A=25℃
NOTES:
0.7
SYMBOL FM120-MH FM130-MH FM140-MH FM150-MH FM160-MH FM180-MH FM1100-MH FM1150-MH FM1200-MH UNIT
Maximum Forward Voltage at 1.0A DC
30
0.5
TSTG
BE
CHARACTERISTICS
Rated DC Blocking Voltage
200.3
CJ
V BE(sat) @ I C /I B =10
TJ
T J = 25°C (Note 1)
Typical Junction Capacitance
0.6
0.2
RΘJA
10 Resistance (Note 2)
Typical Thermal
VDC
COEFFICIENT (mV/ °C)
0.01
50
C
Method 2026
30
500
0.1
0.2
0.5
1.0 2.0
5.0
10
20
50
100 200
500
I C , COLLECTOR CURRENT (mA)
Figure 18. Temperature Coefficients
WILLAS
ELECTRONIC
CORP.
WILLAS
ELECTRONIC
CORP.
WILLAS
FM120-M+
THRU
MMBT4401LT1
Purpose
Transistor
FM1200-M+
1.0AGeneral
SURFACE MOUNT
SCHOTTKY BARRIER
RECTIFIERS -20V- 200V
Pb Free Product
SOD-123+ PACKAGE
Package outline
SOT-23
.006(0.15)MIN.
• Batch process design, excellent power dissipation offers
better reverse leakage current and thermal resistance.
• Low profile surface mounted application in order to
optimize board space.
.063(1.60)
.047(1.20)
• Low power loss, high efficiency.
.122(3.10)
• High current capability, low forward voltage drop.
.106(2.70)
• High surge capability.
• Guardring for overvoltage protection.
• Ultra high-speed switching.
• Silicon epitaxial planar chip, metal silicon junction.
• Lead-free parts meet environmental standards of
SOD-123H
0.146(3.7)
0.130(3.3)
0.071(1.8)
0.056(1.4)
.110(2.80)
MIL-STD-19500 /228
• RoHS product for packing code suffix "G"
Halogen free product for packing code suffix "H"
Mechanical data
0.040(1.0)
0.024(0.6)
• Epoxy : UL94-V0 rated flame retardant
• Case : Molded plastic, SOD-123H
,
.080(2.04)
• Terminals :Plated terminals,
solderable per MIL-STD-750
Method 2026
0.012(0.3) Typ.
.083(2.10)
Features
.008(0.20)
0.031(0.8) Typ.
0.031(0.8) Typ.
.003(0.08)
.070(1.78)
• Polarity : Indicated by cathode band
• Mounting Position : Any
• Weight : Approximated 0.011 gram
Dimensions in inches and (millimeters)
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
RATINGS
.055(1.40)
.035(0.89)
Ratings at 25℃ ambient .004(0.10)MAX.
temperature unless otherwise specified.
Single phase half wave, 60Hz, resistive of inductive load.
For capacitive load, derate current by 20%
SYMBOL FM120-MH FM130-MH FM140-MH FM150-MH FM160-MH FM180-MH FM1100-MH FM1150-MH FM1200-MH UNIT
Marking Code
12
.020(0.50)
20
.012(0.30)
13
30
Maximum Recurrent Peak Reverse Voltage
VRRM
Maximum RMS Voltage
VRMS
14
21
Maximum DC Blocking Voltage
VDC
20
30
Maximum Average Forward Rectified Current
14
40
15
50
16
60
18
80
10
100
115
150
120
200
Volts
28
35
42
56
70
105
140
Volts
40
50
60
80
100
150
200
Volts
IO
Dimensions
in inches and (millimeters)
Peak Forward Surge Current 8.3 ms single half sine-wave
superimposed on rated load (JEDEC method)
RΘJA
0.037
0.95CJ
TJ
Typical Thermal Resistance (Note 2)
Typical Junction Capacitance (Note 1)
Operating Temperature Range
Storage Temperature Range
1.0
30
IFSM
0.037
0.95
40
120
-55 to +125
Amps
Amps
℃/W
PF
-55 to +150
℃
- 65 to +175
TSTG
℃
CHARACTERISTICS
Maximum Average Reverse Current at @T A=25℃
Rated DC Blocking Voltage
0.079
FM150-MH FM160-MH FM180-MH FM1100-MH FM1150-MH FM1200-MH UNIT
SYMBOL FM120-MH FM130-MH FM140-MH
VF
Maximum Forward Voltage at 1.0A DC
@T A=125℃
1- Measured at 1 MHZ and applied reverse voltage of 4.0 VDC.
2012-11
0.70
0.85
0.5
0.035IR
0.9
NOTES:
2- Thermal Resistance From Junction to Ambient
2.0
0.50
0.9
0.92
10
0.031
0.8
Volts
inches
mm
WILLAS ELECTRONIC CORP.
mAmps