ETC EDI88257CA/LPA-C

EDI88257CA
HI-RELIABILITY PRODUCT
256Kx8 Monolithic SRAM
FEATURES
■ Access Times of 20, 25, 35, 45, 55ns
The EDI88257CA is a 2 Megabit 256Kx8 bit Monolithic CMOS
Static RAM.
■ Data Retention Function (LPA Versions)
The 32 pin DIP pinout adheres to the JEDEC evolutionary standard
for the two megabit device. The device is upgradeable to the
512Kx8 SRAM, the EDI88512CA. Pin 1 becomes the higher order
address.
■ TTL Compatible Inputs and Outputs
■ Fully Static, No Clocks
■ Organized as 256Kx8
■ Commercial, Industrial and Military Temperature Ranges
A Low Power version, EDI88257LPA, offers a data retention
function for battery back-up opperation. Military product is available compliant to Appendix A of MIL-PRF-38535.
■ JEDEC Approved Evolutionary Pinout
• 32 pin Ceramic DIP, 0.6 mils wide (Package 9)
■ Single +5V (±10%) Supply Operation
FIG. 1
PIN CONFIGURATION
PIN DESCRIPTION
32 DIP
TOP VIEW
NC
A16
A14
A12
A7
A6
A5
A4
A3
A2
A1
AØ
I/OØ
I/O1
I/O2
VSS
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
32 VCC
31 A15
30 A17
29 WE
28 A13
27 A8
26 A9
25 A11
24 OE
23 A10
22 CS
21 I/O7
20 I/O6
19 I/O5
18 I/O4
17 I/O3
BLOCK DIAGRAM
I/O0-7
Data Inputs/Outputs
A0-17
Address Inputs
WE
Write Enable
CS
Chip Selects
OE
Output Enable
VCC
Power (+5V ±10%)
VSS
Ground
NC
Not Connected
Memory Array
AØ-17
Address
Buffer
Address
Decoder
I/O
Circuits
I/OØ-7
WE
CS
OE
May 2000 Rev. 2
1
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EDI88257CA
TRUTH TABLE
ABSOLUTE MAXIMUM RATINGS
Parameter
Voltage on any pin relative to Vss
Unit
OE
CS
WE
Mode
Output
Power
V
X
H
L
X
H
L
L
L
X
H
H
L
Standby
Output Deselect
Read
Write
High Z
High Z
Data Out
Data In
Icc 2 , Icc 3
Icc 1
Icc 1
Icc 1
-0.5 to 7.0
Operating Temperature TA (Ambient)
Industrial
-40 to +85
°C
Military
-55 to +125
°C
Storage Temperature, Ceramic
-65 to +150
°C
Power Dissipation
1.5
W
Output Current
20
mA
Junction Temperature, TJ
175
°C
RECOMMENDED OPERATING CONDITIONS
Parameter
NOTE:
Stress greater than those listed under "Absolute Maximum Ratings" may cause
permanent damage to the device. This is a stress rating only and functional
operation of the device at these or any other conditions greater than those indicated in the operational sections of this specification is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect reliability.
Symbol
Min
Typ
Max
Supply Voltage
VCC
4.5
5.0
5.5
Unit
V
Supply Voltage
VSS
0
0
0
V
Input High Voltage
VIH
2.2
—
Vcc +0.5
V
Input Low Voltage
VIL
-0.3
—
+0.8
V
CAPACITANCE
(T A = +25°C)
Parameter
Symbol
Condition
Max
Unit
Address Lines
CI
VIN = Vcc or Vss, f = 1.0MHz
12
pF
Input/Output Lines
CO
VOUT = Vcc or Vss, f = 1.0MHz
14
pF
These parameters are sampled, not 100% tested.
DC CHARACTERISTICS
(VCC = 5V, TA = +25°C)
Parameter
Symbol
Conditions
Units
Min
Typ
Max
µA
Input Leakage Current
ILI
VIN = 0V to VCC
-10
—
+10
Output Leakage Current
ILO
VI/O = 0V to VCC
-10
—
+10
µA
—
225
mA
—
200
mA
—
60
mA
Operating Power Supply Current
I CC1
WE, CS = VIL, II/O = 0mA, Min Cycle
Standby (TTL) Power Supply Current
I CC2
CS ≥ VIH, VIN ≤ VIL, VIN ≥ VIH
Full Standby Power Supply Current
I CC3
CS ≥ VCC -0.2V
VIN ≥ Vcc -0.2V or VIN ≤ 0.2V
Output Low Voltage
VOL
Output High Voltage
VOH
(20-25ns)
(35-55ns)
CA
—
—
25
mA
LPA
—
—
20
mA
IOL = 8.0mA
—
—
0.4
V
IOH = -4.0mA
2.4
—
—
V
NOTE: DC test conditions: VIL = 0.3V, VIH = Vcc -0.3V
White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com
2
EDI88257CA
AC CHARACTERISTICS – READ CYCLE
(VCC = 5.0V, VSS = 0V, TA = -55°C to +125°C))
Parameter
Symbol
JEDEC
Alt.
20ns
Min
Max
Min
25ns
Read Cycle Time
tAVAV
tRC
20
25
Address Access Time
tAVQV
tAA
Chip Select Access Time
tELQV
tACS
Chip Select to Output in Low Z (1)
tELQX
tCLZ
3
Chip Disable to Output in High Z (1)
tEHQZ
tCHZ
0
Output Hold from Address Change
tAVQX
tOH
0
Output Enable to Output Valid
tGLQV
tOE
20
tGLQX
tOLZ
0
tGHQZ
tOHZ
0
45ns
Min
Max
55ns
Min
Max
35
45
55
35
25
8
0
3
10
0
0
0
0
0
10
0
20
0
ns
55
ns
20
ns
25
ns
20
ns
ns
0
0
ns
25
0
15
55
3
0
15
0
8
15
0
12
45
3
Units
ns
45
35
3
10
Output Enable to Output in Low Z (1)
35ns
Min
Max
25
20
Output Disable to Output in High Z (1)
Max
0
20
ns
0
1. This parameter is guaranteed by design but not tested.
AC CHARACTERISTICS – WRITE CYCLE
(VCC = 5.0V, VSS = 0V, TA = -55°C to +125°C)
Parameter
Symbol
JEDEC
Alt.
20ns
Min
Max
Min
Write Cycle Time
tAVAV
tWC
20
Chip Select to End of Write
tELWH
tELEH
tCW
tCW
Address Setup Time
tAVWL
tAVEL
Address Valid to End of Write
35ns
Min
Max
45ns
Min
Max
55ns
Min
Max
25
35
45
45
ns
15
15
17
17
25
25
30
30
30
30
ns
ns
tAS
tAS
0
0
0
0
0
0
0
0
0
0
ns
ns
tAVWH
tAVEH
tAW
tAW
15
15
17
17
25
25
30
30
30
30
ns
ns
Write Pulse Width
tWLWH
tWLEH
tWP
tWP
15
15
17
17
25
25
30
30
30
30
ns
ns
Write Recovery Time
tWHAX
tEHAX
tWR
tWR
0
0
0
0
0
0
0
0
0
0
ns
ns
Data Hold Time
tWHDX
tEHDX
tDH
tDH
0
0
0
0
0
0
0
0
0
0
ns
ns
Write to Output in High Z (1)
tWLQZ
tWHZ
0
Data to Write Time
tDVWH
tDVEH
tDW
tDW
10
10
12
12
20
20
25
25
25
25
ns
ns
Output Active from End of Write (1)
tWHQX
tWLZ
0
0
0
0
0
ns
8
0
25ns
Max
10
0
25
0
30
0
Units
30
ns
1. This parameter is guaranteed by design but not tested.
AC TEST CONDITIONS
Figure 1
Figure 2
Vcc
480Ω
Input Pulse Levels
Input Rise and Fall Times
Input and Output Timing Levels
Output Load
Vcc
480Ω
VSS to 3.0V
5ns
1.5V
Figure 1
NOTE: For tEHQZ, tGHQZ and tWLQZ, CL = 5pF Figure 2)
Q
Q
255Ω
30pF
255Ω
5pF
3
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EDI88257CA
FIG. 2
TIMING WAVEFORM - READ CYCLE
tAVAV
ADDRESS
tAVQV
CS
tAVAV
ADDRESS
ADDRESS 1
ADDRESS 2
tAVQV
tAVQX
tELQV
tELQX
tEHQZ
tGLQV
tGLQX
tGHQZ
OE
DATA I/O
DATA 1
DATA OUT
DATA 2
READ CYCLE 2 (WE HIGH)
READ CYCLE 1 (WE HIGH; OE, CS LOW)
FIG. 3
WRITE CYCLE - WE CONTROLLED
tAVAV
ADDRESS
tAVWH
tELWH
tWHAX
CS
tAVWL
tWLWH
WE
tDVWH
DATA IN
tWHDX
DATA VALID
tWLQZ
tWHQX
HIGH Z
DATA OUT
WRITE CYCLE 1, WE CONTROLLED
FIG. 4
WRITE CYCLE - CS CONTROLLED
tAVAV
WS32K32-XHX
ADDRESS
tAVEH
tELEH
tEHAX
CS
tAVEL
tWLEH
WE
tDVEH
DATA IN
DATA VALID
HIGH Z
DATA OUT
WRITE CYCLE 2, CS CONTROLLED
White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com
tEHDX
4
EDI88257CA
DATA RETENTION CHARACTERISTICS (EDI88257LPA ONLY)
(TA = -55°C to +125°C)
Characteristic
Low Power Version only
Sym
Conditions
Min
Typ
Max
Units
Data Retention Voltage
VDD
VDD = 2.0V
2
–
–
V
Data Retention Quiescent Current
ICCDR
CS ≥ VDD -0.2V
–
–
2
mA
Chip Disable to Data Retention Time
TCDR
VIN ≥ VDD -0.2V
Operation Recovery Time
TR
or VIN ≤ 0.2V
0
–
–
ns
TAVAV
–
–
ns
FIG. 5
DATA RETENTION - CS CONTROLLED
Data Retention Mode
4.5V
Vcc
WS32K32-XHX
VDD
4.5V
tCDR
CS
tR
CS = VDD -0.2V
DATA RETENTION, CS CONTROLLED
5
White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com
EDI88257CA
PACKAGE 9:
32 PIN SIDEBRAZED CERAMIC DIP (600mils wide)
1.616
1.584
0.175
0.125
0.061
0.017
0.620
0.600
0.060
0.040
Pin 1 Indicator
0.100
TYP
0.020
0.016
0.155
0.115
0.600
NOM
15 x 0.100 = 1.500
ALL DIMENSIONS ARE IN INCHES
ORDERING INFORMATION
EDI 8 8 257 CA X X X
WHITE ELECTRONIC DESIGNS
SRAM
ORGANIZATION, 256Kx8
TECHNOLOGY:
CA = CMOS Standard Power
LPA = Low Power
ACCESS TIME (ns)
PACKAGE TYPE:
C = 32 lead Sidebrazed DIP, 600 mil (Package 9)
DEVICE GRADE:
B = MIL-STD-883 Compliant
M = Military Screened
-55°C to +125°C
I = Industrial
-40°C to +85°C
C = Commercial
0°C to +70°C
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