SRDA05−4R2 Low Capacitance Surface Mount TVS for High−Speed Data Interfaces The SRDA05−4 transient voltage suppressor is designed to protect equipment attached to high speed communication lines from ESD, EFT, and lightning. Features: SO−8 LOW CAPACITANCE VOLTAGE SUPPRESSOR 500 WATTS PEAK POWER 6 VOLTS • SO−8 Package • Peak Power − 500 Watts 8 x 20 S • ESD Rating: • http://onsemi.com IEC 61000−4−2 (ESD) 15 kV (air) 8 kV (contact) IEC 61000−4−4 (EFT) 40 A (5/50 ns) IEC 61000−4−5 (lightning) 23 (8/20 s) UL Flammability Rating of 94V−0 PIN CONFIGURATION AND SCHEMATIC Typical Applications: • High Speed Communication Line Protection I/O 1 1 MAXIMUM RATINGS Rating Peak Power Dissipation 8 x 20 S @ TA = 25°C (Note 1) Junction and Storage Temperature Range Lead Solder Temperature − Maximum 10 Seconds Duration Symbol Value Unit Ppk 500 W TJ, Tstg −55 to +150 °C TL 260 °C 8 REF 2 REF 1 2 7 I/O 4 REF 1 3 6 I/O 3 I/O 2 4 5 REF 2 8 1 SO−8 CASE 751 PLASTIC 1. Non−repetitive current pulse 8 x 20 S exponential decay waveform MARKING DIAGRAM SRDA5 LYWW SRDA5= Device Code L = Location Code Y = Year WW = Work Week ORDERING INFORMATION Device Package Shipping† SRDA05−4R2 SO−8 2500/Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. Semiconductor Components Industries, LLC, 2004 March, 2004 − Rev. 3 1 Publication Order Number: SRDA05−4R2/D SRDA05−4R2 ELECTRICAL CHARACTERISTICS Characteristic Symbol Min Typ Max Unit VBR 6.0 − − V Reverse Leakage Current @ VRWN = 5.0 Volts IR N/A − 10 A Maximum Clamping Voltage @ IPP = 1.0 A, 8 x 20 S VC N/A − 9.8 V Maximum Clamping Voltage @ IPP = 10 A, 8 x 20 S VC N/A − 12 V Between I/O Pins and Ground @ VR = 0 Volts, 1.0 MHz Capacitance − 10 15 pF Between I/O Pins @ VR = 0 Volts, 1.0 MHz Capacitance − 5 8 pF Reverse Breakdown Voltage @ It = 1.0 mA ELECTRICAL CHARACTERISTICS I (TA = 25°C unless otherwise noted) UNIDIRECTIONAL (Circuit tied to Pins 1 and 3 or 2 and 3) Parameter Symbol IPP Maximum Reverse Peak Pulse Current VC Clamping Voltage @ IPP VRWM IR VBR IT VBR IF VC VBR VRWM IR VF IT Working Peak Reverse Voltage Maximum Reverse Leakage Current @ VRWM Breakdown Voltage @ IT Test Current IPP Maximum Temperature Coefficient of VBR IF Forward Current VF Forward Voltage @ IF ZZT Maximum Zener Impedance @ IZT IZK Reverse Current ZZK Maximum Zener Impedance @ IZK Uni−Directional TVS http://onsemi.com 2 V SRDA05−4R2 9 8 8 7 IR, REVERSE LEAKAGE (A) VZ, REVERSE BREAKDOWN (V) TYPICAL CHARACTERISTICS 7 6 5 4 3 2 1 0 −100 −50 0 50 100 T, TEMPERATURE (°C) 150 6 5 4 3 2 1 0 −100 200 VC, CLAMPING VOLTAGE (V) % OF PEAK PULSE CURRENT 70 60 HALF VALUE IRSM/2 @ 20 s 50 40 30 tP 20 10 0 0 20 40 200 35 PULSE WIDTH (tP) IS DEFINED AS THAT POINT WHERE THE PEAK CURRENT DECAY = 8 s 80 150 100 Figure 2. Reverse Leakage versus Temperature PEAK VALUE IRSM @ 8 s tr 90 50 T, TEMPERATURE (°C) Figure 1. Reverse Breakdown versus Temperature 100 0 −50 60 30 25 20 15 10 5 0 80 0 10 20 30 40 50 60 70 80 IPP, PEAK PULSE CURRENT (A) t, TIME (s) Figure 3. 8 × 20 s Pulse Waveform Figure 4. Clamping Voltage versus Peak Pulse Current http://onsemi.com 3 90 SRDA05−4R2 PACKAGE DIMENSIONS SO−8 CASE 751−07 ISSUE AB NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. 751−01 THRU 751−06 ARE OBSOLETE. NEW STANDAARD IS 751−07 −X− A 8 5 0.25 (0.010) S B 1 M Y M 4 K −Y− G C N DIM A B C D G H J K M N S X 45 SEATING PLANE −Z− 0.10 (0.004) H D 0.25 (0.010) M Z Y S X M J S MILLIMETERS MIN MAX 4.80 5.00 3.80 4.00 1.35 1.75 0.33 0.51 1.27 BSC 0.10 0.25 0.19 0.25 0.40 1.27 0 8 0.25 0.50 5.80 6.20 INCHES MIN MAX 0.189 0.197 0.150 0.157 0.053 0.069 0.013 0.020 0.050 BSC 0.004 0.010 0.007 0.010 0.016 0.050 0 8 0.010 0.020 0.228 0.244 SOLDERING FOOTPRINT* 1.52 0.060 7.0 0.275 4.0 0.155 0.6 0.024 1.270 0.050 SCALE 6:1 mm inches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. 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