ETC UPD444008G5-8-7JF

DATA SHEET
MOS INTEGRATED CIRCUIT
µPD444008
4M-BIT CMOS FAST SRAM
512K-WORD BY 8-BIT
Description
The µPD444008 is a high speed, low power, 4,194,304 bits (524,288 words by 8 bits) CMOS static RAM.
Operating supply voltage is 5.0 V ± 0.5 V.
The µPD444008 is packaged in 36-pin plastic SOJ and 44-pin plastic TSOP (II).
Features
• 524,288 words by 8 bits organization
• Fast access time : 8, 10, 12 ns (MAX.)
• Output Enable input for easy application
• Single +5.0 V power supply
Ordering Information
Part number
Package
Supply current mA (MAX.)
ns (MAX.)
At operating
At standby
10
µPD444008LE-8
36-pin plastic SOJ
8
200
µPD444008LE-10
(10.16 mm (400))
10
180
12
170
44-pin plastic TSOP (II)
8
200
(10.16 mm (400))
10
180
(Normal bent)
12
170
µPD444008LE-12
•
µPD444008G5-8-7JF Note
•
µPD444008G5-10-7JF
•
µPD444008G5-12-7JF Note
•
Access time
Note
Note Under development
The information in this document is subject to change without notice. Before using this document, please
confirm that this is the latest version.
Not all devices/types available in every country. Please check with local NEC representative for
availability and additional information.
Document No. M14428EJ4V0DS00 (4th edition)
Date Published January 2001 NS CP(K)
Printed in Japan
The mark • shows major revised points.
©
1999
µPD444008
Pin Configurations (Marking Side)
/××× indicates active low signal.
36-pin plastic SOJ (10.16 mm (400))
[ µPD444008LE ]
A0
1
36
NC
A1
2
35
A18
A2
3
34
A17
A3
4
33
A16
A4
5
32
A15
/CS
6
31
/OE
I/O1
7
30
I/O8
I/O2
8
29
I/O7
VCC
9
28
GND
GND
10
27
VCC
I/O3
11
26
I/O6
I/O4
12
25
I/O5
/WE
13
24
A14
A5
14
23
A13
A6
15
22
A12
A7
16
21
A11
A8
17
20
A10
A9
18
19
NC
A0 - A18
: Address Inputs
I/O1 - I/O8 : Data Inputs / Outputs
/CS
: Chip Select
/WE
: Write Enable
/OE
: Output Enable
VCC
: Power supply
GND
: Ground
NC
: No connection
Remark Refer to Package Drawings for the 1-pin index mark.
2
Data Sheet M14428EJ4V0DS
µPD444008
44-pin plastic TSOP (II) (10.16 mm (400)) (Normal bent)
[ µPD444008G5-××
]
××-7JF
××
NC
1
44
NC
NC
2
43
NC
A0
3
42
NC
A1
4
41
A18
A2
5
40
A17
A3
6
39
A16
A4
7
38
A15
/CS
8
37
/OE
I/O1
9
36
I/O8
I/O2
10
35
I/O7
VCC
11
34
GND
GND
12
33
VCC
I/O3
13
32
I/O6
I/O4
14
31
I/O5
/WE
15
30
A14
A5
16
29
A13
A6
17
28
A12
A7
18
27
A11
A8
19
26
A10
A9
20
25
NC
NC
21
24
NC
NC
22
23
NC
A0 - A18
: Address Inputs
I/O1 - I/O8 : Data Inputs / Outputs
/CS
: Chip Select
/WE
: Write Enable
/OE
: Output Enable
VCC
: Power supply
GND
: Ground
NC
: No connection
Remark Refer to Package Drawings for the 1-pin index mark.
Data Sheet M14428EJ4V0DS
3
µPD444008
A0
|
A18
I/O1
|
I/O8
Row decoder
Address buffer
Block Diagram
Memory cell array
4,194,304 bits
Input data
controller
Sense amplifier /
Switching circuit
Output data
controller
Column decoder
Address buffer
/CS
/OE
/WE
VCC
GND
Truth Table
/CS
/OE
/WE
Mode
I/O
Supply current
H
×
×
Not selected
High impedance
ISB
L
L
H
Read
DOUT
ICC
L
×
L
Write
DIN
L
H
H
Output disable
High impedance
Remark × : Don’t care
4
Data Sheet M14428EJ4V0DS
µPD444008
Electrical Specifications
Absolute Maximum Ratings
Parameter
Symbol
Condition
Rating
–0.5
Note
Unit
Supply voltage
VCC
to +7.0
V
Input / Output voltage
VT
–0.5 Note to VCC+0.5
V
Operating ambient temperature
TA
0 to 70
°C
Storage temperature
Tstg
–55 to +125
°C
Note –2.0 V (MIN.) (pulse width : 2 ns)
Caution Exposing the device to stress above those listed in Absolute Maximum Rating could cause
permanent damage. The device is not meant to be operated under conditions outside the limits
described in the operational section of this specification. Exposure to Absolute Maximum Rating
conditions for extended periods may affect device reliability.
Recommended Operating Conditions
Parameter
Symbol
Condition
MIN.
TYP.
MAX.
Unit
5.0
5.5
V
VCC+0.5
V
+0.8
V
70
°C
Supply voltage
VCC
4.5
High level input voltage
VIH
2.2
Low level input voltage
VIL
–0.5
Operating ambient temperature
TA
0
Note
Note –2.0 V (MIN.) (pulse width : 2 ns)
Data Sheet M14428EJ4V0DS
5
µPD444008
DC Characteristics (Recommended Operating Conditions Unless Otherwise Noted)
Parameter
Symbol
Test condition
MIN.
TYP.
MAX.
Unit
Input leakage current
ILI
VIN = 0 V to VCC
–2
+2
µA
Output leakage current
ILO
VI/O = 0 V to VCC,
–2
+2
µA
mA
/CS = VIH or /OE = VIH or /WE = VIL
Operating supply current
ICC
Standby supply current
/CS = VIL,
Cycle time : 8 ns
200
II/O = 0 mA,
Cycle time : 10 ns
180
Minimum cycle time
Cycle time : 12 ns
170
ISB
/CS = VIH, VIN = VIH or VIL
40
ISB1
/CS ≥ VCC – 0.2 V,
10
mA
VIN ≤ 0.2 V or VIN ≥ VCC – 0.2 V
High level output voltage
VOH
IOH = –4.0 mA
Low level output voltage
VOL
IOL = +8.0 mA
2.4
V
0.4
V
MAX.
Unit
Remarks 1. VIN : Input voltage
VI/O : Input / Output voltage
2. These DC characteristics are in common regardless of package types.
Capacitance (TA = 25 °C, f = 1 MHz)
Parameter
Symbol
Test condition
MIN.
TYP.
Input capacitance
CIN
VIN = 0 V
6
pF
Input / Output capacitance
CI/O
VI/O = 0 V
8
pF
Remarks 1. VIN : Input voltage
VI/O : Input / Output voltage
2. These parameters are periodically sampled and not 100% tested.
6
Data Sheet M14428EJ4V0DS
µPD444008
AC Characteristics (Recommended Operating Conditions Unless Otherwise Noted)
AC Test Conditions
Input Waveform (Rise and Fall Time ≤ 3 ns)
3.0 V
1.5 V
Test Points
1.5 V
1.5 V
Test Points
1.5 V
GND
Output Waveform
Output Load
AC characteristics directed with the note should be measured with the output load shown in Figure 1 or
Figure 2.
Figure 1
Figure 2
(tAA, tACS, tOE, tOH)
(tCLZ, tOLZ, tCHZ, tOHZ, tWHZ, tOW )
VTT = +1.5 V
+5.0 V
50 Ω
480 Ω
ZO = 50 Ω
I/O (Output)
I/O (Output)
30 pF
CL
Remark
255 Ω
5 pF
CL
CL includes capacitances of the probe and jig, and stray capacitances.
Data Sheet M14428EJ4V0DS
7
µPD444008
Read Cycle
Parameter
Symbol
µPD444008-8
µPD444008-10
µPD444008-12
MIN.
MIN.
MIN.
MAX.
8
MAX.
10
Unit
MAX.
Read cycle time
tRC
12
Address access time
tAA
8
10
12
ns
/CS access time
tACS
8
10
12
ns
/OE access time
tOE
4
5
6
ns
Output hold from address change
tOH
3
3
3
ns
/CS to output in low impedance
tCLZ
3
3
3
ns
/OE to output in low impedance
tOLZ
0
0
0
ns
/CS to output in high impedance
tCHZ
4
5
6
ns
/OE to output hold in high impedance
tOHZ
4
5
6
ns
ns
Notes 1. See the output load shown in Figure 1.
2. Transition is measured at ± 200 mV from steady-state voltage with the output load shown in Figure 2.
3. These parameters are periodically sampled and not 100% tested.
Remark These AC characteristics are in common regardless of package types.
Read Cycle Timing Chart 1 (Address Access)
tRC
Address (Input)
tAA
tOH
I/O (Output)
Previous data out
Data out
Remarks 1. In read cycle, /WE should be fixed to high level.
2. /CS = /OE = VIL
8
Data Sheet M14428EJ4V0DS
Notes
1
2, 3
µPD444008
Read Cycle Timing Chart 2 (/CS Access)
tRC
Address (Input)
tAA
tACS
/CS (Input)
tCLZ
tCHZ
/OE (Input)
tOHZ
tOE
tOLZ
I/O (Output)
High impedance
Data out
Caution
Address valid prior to or coincident with /CS low level input.
Remark
In read cycle, /WE should be fixed to high level.
Data Sheet M14428EJ4V0DS
High impedance
9
µPD444008
Write Cycle
Parameter
µPD444008-8
µPD444008-10
µPD444008-12
MIN.
MIN.
MIN.
Symbol
MAX.
MAX.
Unit
MAX.
Write cycle time
tWC
8
10
12
ns
/CS to end of write
tCW
6
7
8
ns
Address valid to end of write
tAW
6
7
8
ns
Write pulse width
tWP
6
7
8
ns
Data valid to end of write
tDW
4
5
6
ns
Data hold time
tDH
0
0
0
ns
Address setup time
tAS
0
0
0
ns
Write recovery time
tWR
0
0
0
ns
/WE to output in high impedance
tWHZ
Output active from end of write
tOW
4
5
3
6
3
Notes
3
ns
1, 2
ns
Notes 1. Transition is measured at ± 200 mV from steady-state voltage with the output load shown in Figure 2.
2. These parameters are periodically sampled and not 100% tested.
Remark These AC characteristics are in common regardless of package types.
Write Cycle Timing Chart 1 (/WE Controlled)
tWC
Address (Input)
tCW
/CS (Input)
tAW
tAS
tWR
tWP
/WE (Input)
tOW
tWHZ
I/O (Input / Output)
Indefinite data out
tDW
High
impedance
tDH
Data in
High
impedance
Indefinite data out
Cautions 1. /CS or /WE should be fixed to high level during address transition.
2. Do not input data to the I/O pins while they are in the output state.
Remarks 1. Write operation is done during the overlap time of a low level /CS and a low level /WE.
2. When /WE is at low level, the I/O pins are always high impedance. When /WE is at high level, read
operation is executed. Therefore /OE should be at high level to make the I/O pins high impedance.
10
Data Sheet M14428EJ4V0DS
µPD444008
Write Cycle Timing Chart 2 (/CS Controlled)
tWC
Address (Input)
tAS
tCW
/CS (Input)
tAW
tWP
tWR
/WE (Input)
tDW
High impedance
Data in
I/O (Input)
tDH
High impedance
Cautions 1. /CS or /WE should be fixed to high level during address transition.
2. Do not input data to the I/O pins while they are in the output state.
Remark
Write operation is done during the overlap time of a low level /CS and a low level /WE.
Data Sheet M14428EJ4V0DS
11
µPD444008
Package Drawings
36-PIN PLASTIC SOJ (10.16 mm (400))
B
36
19
C
1
D
18
G
H
J
E
F
U
Q
M
N
S
S
T
P
M
K
I
NOTE
Each lead centerline is located within 0.12 mm
of its true position (T.P.) at maximum material
condition.
ITEM
MILLIMETERS
B
23.6±0.20
C
10.16±0.1
D
11.18±0.2
E
1.005±0.1
F
0.74
G
H
3.5±0.2
2.545±0.2
I
0.8 MIN.
J
K
2.6
1.27 (T.P.)
M
0.42 +0.08
−0.07
N
0.12
P
9.4±0.20
Q
0.1
T
R 0.85
U
0.22 +0.08
−0.07
P36LE-400A-2
12
Data Sheet M14428EJ4V0DS
µPD444008
44-PIN PLASTIC TSOP (II) (10.16 mm (400))
44
23
detail of lead end
F
P
E
1
22
A
H
G
I
S
C
D
N
M
M
J
L
S
B
K
NOTE
Each lead centerline is located within 0.13 mm of
its true position (T.P.) at maximum material condition.
ITEM
MILLIMETERS
A
18.63 MAX.
B
0.93 MAX.
C
0.8 (T.P.)
D
0.32 +0.08
−0.07
E
0.1±0.05
F
1.2 MAX.
G
0.97
11.76±0.2
10.16±0.1
H
I
J
0.8±0.2
K
0.145+0.025
−0.015
L
M
0.5±0.1
0.13
N
0.10
P
+7°
3°−3°
S44G5-80-7JF5-1
Data Sheet M14428EJ4V0DS
13
µPD444008
Recommended Soldering Conditions
Please consult with our sales offices for soldering conditions of the µPD444008.
Types of Surface Mount Device
µPD444008LE
: 36-pin plastic SOJ (10.16 mm (400))
µPD444008G5-7JF
: 44-pin plastic TSOP (II) (10.16 mm (400)) (Normal bent)
14
Data Sheet M14428EJ4V0DS
µPD444008
NOTES FOR CMOS DEVICES
1
PRECAUTION AGAINST ESD FOR SEMICONDUCTORS
Note:
Strong electric field, when exposed to a MOS device, can cause destruction of the gate oxide and
ultimately degrade the device operation. Steps must be taken to stop generation of static electricity
as much as possible, and quickly dissipate it once, when it has occurred. Environmental control
must be adequate. When it is dry, humidifier should be used. It is recommended to avoid using
insulators that easily build static electricity. Semiconductor devices must be stored and transported
in an anti-static container, static shielding bag or conductive material. All test and measurement
tools including work bench and floor should be grounded. The operator should be grounded using
wrist strap. Semiconductor devices must not be touched with bare hands. Similar precautions need
to be taken for PW boards with semiconductor devices on it.
2
HANDLING OF UNUSED INPUT PINS FOR CMOS
Note:
No connection for CMOS device inputs can be cause of malfunction. If no connection is provided
to the input pins, it is possible that an internal input level may be generated due to noise, etc., hence
causing malfunction. CMOS devices behave differently than Bipolar or NMOS devices. Input levels
of CMOS devices must be fixed high or low by using a pull-up or pull-down circuitry. Each unused
pin should be connected to V DD or GND with a resistor, if it is considered to have a possibility of
being an output pin. All handling related to the unused pins must be judged device by device and
related specifications governing the devices.
3
STATUS BEFORE INITIALIZATION OF MOS DEVICES
Note:
Power-on does not necessarily define initial status of MOS device. Production process of MOS
does not define the initial operation status of the device. Immediately after the power source is
turned ON, the devices with reset function have not yet been initialized. Hence, power-on does
not guarantee out-pin levels, I/O settings or contents of registers. Device is not initialized until the
reset signal is received. Reset operation must be executed immediately after power-on for devices
having reset function.
Data Sheet M14428EJ4V0DS
15
µPD444008
• The information in this document is current as of January, 2001. The information is subject to
change without notice. For actual design-in, refer to the latest publications of NEC's data sheets or
data books, etc., for the most up-to-date specifications of NEC semiconductor products. Not all
products and/or types are available in every country. Please check with an NEC sales representative
for availability and additional information.
• No part of this document may be copied or reproduced in any form or by any means without prior
written consent of NEC. NEC assumes no responsibility for any errors that may appear in this document.
• NEC does not assume any liability for infringement of patents, copyrights or other intellectual property rights of
third parties by or arising from the use of NEC semiconductor products listed in this document or any other
liability arising from the use of such products. No license, express, implied or otherwise, is granted under any
patents, copyrights or other intellectual property rights of NEC or others.
• Descriptions of circuits, software and other related information in this document are provided for illustrative
purposes in semiconductor product operation and application examples. The incorporation of these
circuits, software and information in the design of customer's equipment shall be done under the full
responsibility of customer. NEC assumes no responsibility for any losses incurred by customers or third
parties arising from the use of these circuits, software and information.
• While NEC endeavours to enhance the quality, reliability and safety of NEC semiconductor products, customers
agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize
risks of damage to property or injury (including death) to persons arising from defects in NEC
semiconductor products, customers must incorporate sufficient safety measures in their design, such as
redundancy, fire-containment, and anti-failure features.
• NEC semiconductor products are classified into the following three quality grades:
"Standard", "Special" and "Specific". The "Specific" quality grade applies only to semiconductor products
developed based on a customer-designated "quality assurance program" for a specific application. The
recommended applications of a semiconductor product depend on its quality grade, as indicated below.
Customers must check the quality grade of each semiconductor product before using it in a particular
application.
"Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio
and visual equipment, home electronic appliances, machine tools, personal electronic equipment
and industrial robots
"Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster
systems, anti-crime systems, safety equipment and medical equipment (not specifically designed
for life support)
"Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life
support systems and medical equipment for life support, etc.
The quality grade of NEC semiconductor products is "Standard" unless otherwise expressly specified in NEC's
data sheets or data books, etc. If customers wish to use NEC semiconductor products in applications not
intended by NEC, they must contact an NEC sales representative in advance to determine NEC's willingness
to support a given application.
(Note)
(1) "NEC" as used in this statement means NEC Corporation and also includes its majority-owned subsidiaries.
(2) "NEC semiconductor products" means any semiconductor product developed or manufactured by or for
NEC (as defined above).
M8E 00. 4