MURA160T3 Preferred Device Surface Mount Ultrafast Power Rectifier Ideally suited for high voltage, high frequency rectification, or as free wheeling and protection diodes in surface mount applications where compact size and weight are critical to the system. • • • • Small Compact Surface Mountable Package with J–Bend Leads Rectangular Package for Automated Handling High Temperature Glass Passivated Junction Low Forward Voltage Drop (1.05 Volts Max @ 1.0 A, TJ = 150°C) Mechanical Characteristics: http://onsemi.com ULTRAFAST RECTIFIER 1 AMPERE 600 VOLTS • Case: Epoxy, Molded • Weight: 70 mg (approximately) • Finish: All External Surfaces Corrosion Resistant and Terminal • • • • • Leads are Readily Solderable Lead and Mounting Surface Temperature for Soldering Purposes: 260°C Max. for 10 Seconds Shipped in 12 mm Tape and Reel, 5000 units per reel Polarity: Polarity Band Indicates Cathode Lead ESD Protection: Human Body Model > 4000 V (Class 3) ESD Protection: Machine Model > 400 V (Class C) Marking: U4J MARKING DIAGRAM U4J SMA CASE 403D PLASTIC U4J = Device Code ORDERING INFORMATION MAXIMUM RATINGS Rating Symbol Value Unit Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage VRRM VRWM VR 600 V Average Rectified Forward Current @ TL = 145°C @ TL = 110°C IF(AV) Non-Repetitive Peak Surge Current (Surge Applied at Rated Load Conditions Halfwave, Single Phase, 60 Hz) IFSM 30 A TJ –65 to +175 °C Operating Junction Temperature Range Semiconductor Components Industries, LLC, 2001 January, 2001 – Rev. 1 A Device Package Shipping MURA160T3 SMA 5000/Tape & Reel Preferred devices are recommended choices for future use and best overall value. 1.0 2.0 1 Publication Order Number: MURA160T3/D MURA160T3 THERMAL CHARACTERISTICS Characteristic Thermal Resistance, Junction to Lead (TL = 25°C) (Note 1.) Thermal Resistance, Junction to Ambient (Note 1.) Symbol Max Unit PsiJL (Note 2.) RθJA 24 °C/W 216 ELECTRICAL CHARACTERISTICS Maximum Instantaneous Forward Voltage (Note 3.) (iF = 1.0 A, TJ = 25°C) (iF = 1.0 A, TJ = 150°C) vF Maximum Instantaneous Reverse Current (Note 3.) (Rated dc Voltage, TJ = 25°C) (Rated dc Voltage, TJ = 150°C) iR Maximum Reverse Recovery Time (iF = 1.0 A, di/dt = 50 A/µs) trr Volts 1.25 1.05 µA 5.0 150 75 ns 1. Rating applies when surface mounted on the minimum pad size recommended, PC Board FR–4. 2. In compliance with JEDEC 51, these values (historically represented by RθJL) are now referenced as PsiJL. 3. Pulse Test: Pulse Width = 300 µs, Duty Cycle 2.0%. 1000 TJ = 175°C IR, REVERSE CURRENT (A) IR, REVERSE CURRENT (A) 100 10 TJ = 100°C 1 0.1 TJ = 25°C TJ = 175°C 100 TJ = 100°C 10 TJ = 25°C 0.01 100 200 300 400 500 1 600 100 200 300 400 500 VR, REVERSE VOLTAGE (VOLTS) Figure 1. Typical Reverse Current Figure 2. Maximum Reverse Current 10 100°C TC = 175°C 25°C 1 0.1 0.01 0.3 0 VR, REVERSE VOLTAGE (VOLTS) IF, INSTANTANEOUS FORWARD CURRENT (A) IF, INSTANTANEOUS FORWARD CURRENT (A) 0 0.5 0.7 0.9 1.1 1.3 1.5 1.7 10 TC = 175°C 100°C 25°C 1 0.1 0.01 0.3 VF, INSTANTANEOUS VOLTAGE (VOLTS) 0.5 0.7 0.9 1.1 1.3 1.5 1.7 VF, INSTANTANEOUS VOLTAGE (VOLTS) Figure 4. Maximum Forward Voltage Figure 3. Typical Forward Voltage http://onsemi.com 2 600 1.9 MURA160T3 30 NOTE: TYPICAL CAPACITANCE AT 0 V = 24 pF 20 15 10 5 20 15 10 5 0 8 4 12 16 24 20 28 32 36 0 40 12 16 20 24 28 32 Figure 5. Typical Capacitance Figure 6. Maximum Capacitance 4 dc 3 SQUARE WAVE 2 1 0 80 8 VR, REVERSE VOLTAGE (VOLTS) 5 60 4 VR, REVERSE VOLTAGE (VOLTS) IF(AV), AVERAGE FORWARD CURRENT (A) 0 100 120 140 160 180 160 180 0.8 0.7 0.6 SQUARE WAVE 0.5 0.4 0.3 0.2 0.1 0 0 20 40 60 80 100 120 140 TA, AMBIENT TEMPERATURE (°C) Figure 8. Current Derating, Ambient (FR–4 Board with Minimum Pad) 4.5 4 dc 3.5 3 SQUARE WAVE 2.5 2 1.5 1 0.5 0 0.5 40 dc Figure 7. Current Derating, Lead 0 36 1 0.9 TL, LEAD TEMPERATURE (°C) PF, AVERAGE POWER DISSIPATION (W) IF(AV), AVERAGE FORWARD CURRENT (A) 0 NOTE: MAXIMUM CAPACITANCE AT 0 V = 27 pF 25 C, CAPACITANCE (pF) C, CAPACITANCE (pF) 25 1 1.5 2 2.5 3 IF(AV), AVERAGE FORWARD CURRENT (AMPS) Figure 9. Power Dissipation http://onsemi.com 3 3.5 MURA160T3 PACKAGE DIMENSIONS SMA CASE 403D–01 ISSUE O S A D NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. DIM A B C D H J K S B INCHES MIN MAX 0.160 0.180 0.090 0.115 0.075 0.105 0.050 0.064 0.004 0.008 0.006 0.016 0.030 0.060 0.190 0.220 MILLIMETERS MIN MAX 4.06 4.57 2.29 2.92 1.91 2.67 1.27 1.63 0.10 0.20 0.15 0.41 0.76 1.52 4.83 5.59 C K J H MINIMUM SOLDER PAD SIZE 0.157 4.0 0.0787 2.0 0.0787 2.0 inches mm ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC (SCILLC). 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