CET CEP703AL

CEP703AL/CEB703AL
March 1998
4
N-Channel Logic Level Enhancement Mode Field Effect Transistor
FEATURES
30V , 40A , RDS(ON)=17m Ω @VGS=10V.
RDS(ON)=30m Ω @VGS=4.5V.
Super high dense cell design for extremely low RDS(ON).
D
High power and current handling capability.
TO-220 & TO-263 package.
G
D
G
G
D
S
S
CEB SERIES
TO-263(DD-PAK)
S
CEP SERIES
TO-220
ABSOLUTE MAXIMUM RATINGS (Tc=25 C unless otherwise noted)
Symbol
Limit
Unit
Drain-Source Voltage
VDS
30
V
Gate-Source Voltage
VGS
Ć 20
V
ID
40
A
IDM
120
A
IS
40
A
PD
50
0.4
W
W/ C
TJ, TSTG
-65 to 175
C
Thermal Resistance, Junction-to-Case
RįJC
3
C/W
Thermal Resistance, Junction-to-Ambient
RįJA
62.5
C/W
Parameter
Drain Current-Continuous a @TJ=125 C
-Pulsed
Drain-Source Diode Forward Current
a
Maximum Power Dissipation a @Tc=25 C
Derate above 25 C
Operating and Storage Temperature Range
THERMAL CHARACTERISTICS
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CEP703AL/CEB703AL
ELECTRICAL CHARACTERISTICS (TC 25 C unless otherwise noted)
Parameter
Min Typ Max Unit
Symbol
Condition
Drain-Source Breakdown Voltage
BVDSS
VGS = 0V, ID = 250µA
Zero Gate Voltage Drain Current
IDSS
VDS = 24V, VGS = 0V
1
µA
Gate-Body Leakage
IGSS
VGS =Ć20V, VDS = 0V
Ć100
nA
Gate Threshold Voltage
VGS(th)
VDS = VGS, ID = 250µA
1.7
3
V
Drain-Source On-State Resistance
RDS(ON)
VGS = 10V, ID = 25A
14
17
mΩ
VGS = 4.5V, ID = 10A
22
30
mΩ
4
OFF CHARACTERISTICS
30
V
ON CHARACTERISTICS a
ID(ON)
gFS
On-State Drain Current
Forward Transconductance
VGS = 10V, VDS = 10V
VDS = 10V, ID = 25A
1
A
60
30
S
1005
PF
420
PF
100
PF
b
DYNAMIC CHARACTERISTICS
Input Capacitance
CISS
Output Capacitance
COSS
Reverse Transfer Capacitance
CRSS
VDS =15V, VGS = 0V
f =1.0MHZ
b
SWITCHING CHARACTERISTICS
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
tD(ON)
tr
tD(OFF)
VDD = 15V,
ID =25A,
VGS = 10V,
RGEN =24 Ω
23
ns
120 180
ns
80
120
ns
18
Fall Time
tf
60
165
ns
Total Gate Charge
Qg
15
20
nC
Gate-Source Charge
Qgs
Gate-Drain Charge
Qgd
VDS =10V, ID = 25A,
VGS =5V
3
nC
7
nC
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CEP703AL/CEB703AL
ELECTRICAL CHARACTERISTICS (TC=25 C unless otherwise noted)
Parameter
Condition
Min Typ Max Unit
VGS = 0V, Is =25A
0.93 1.3
Symbol
DRAIN-SOURCE DIODE CHARACTERISTICS b
Diode Forward Voltage
VSD
V
Notes
a.Pulse Test:Pulse Width ś300ijs, Duty Cycle ś 2%.
b.Guaranteed by design, not subject to production testing.
40
40
VGS=10,8,7,6,5V
25 C
VGS=4V
30
ID, Drain Current (A)
ID, Drain Current(A)
35
25
20
15
10
VGS=3V
30
TJ=125 C
20
10
-55 C
5
0
0
0
0.5
1.0
1.5
2.0
2.5
0
3.0
VDS, Drain-to-Source Voltage (V)
1
2
3
4
5
6
VGS, Gate-to-Source Voltage (V)
Figure 1. Output Characteristics
Figure 2. Transfer Characteristics
3000
RDS(ON), Normalized
Drain-Source On-Resistance
3.0
2500
C, Capacitance (pF)
4
2000
1500
Ciss
1000
Coss
500
Crss
0
VGS=10V
2.5
2.0
Tj=125 C
1.5
25 C
1.0
0.5
-55 C
0
0
5
10
15
20
25
30
0
10
20
30
40
ID, Drain Current(A)
VDS, Drain-to Source Voltage (V)
Figure 4. On-Resistance Variation with
Drain Current and Temperature
Figure 3. Capacitance
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25
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CEP703AL/CEB703AL
4
VDD
t on
RL
V IN
D
td(off)
tf
90%
90%
VOUT
VOUT
VGS
RGEN
toff
tr
td(on)
10%
INVERTED
10%
G
90%
S
VIN
50%
50%
10%
PULSE WIDTH
Figure 12. Switching Waveforms
Figure 11. Switching Test Circuit
r(t),Normalized Effective
Transient Thermal Impedance
2
1
D=0.5
0.2
0.1
0.1
PDM
0.05
t1
t2
0.02
0.01
1. RįJC (t)=r (t) * RįJC
2. RįJC=See Datasheet
3. TJM-TC = P* RįJC (t)
4. Duty Cycle, D=t1/t2
Single Pulse
0.01
0.01
0.1
1
10
100
1000
10000
Square Wave Pulse Duration (msec)
Figure 13. Normalized Thermal Transient Impedance Curve
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