ETC EUA2101

芯美电子
Preliminary
EUA2101
10-W Stereo Class-D
Audio Power Amplifier
DESCRIPTION
FEATURES
The EUA2101 is a high efficiency, 10W stereo Class-D
audio power amplifier for driving bridged-tied stereo
speakers. The EUA2101 utilizes fully differential
architecture, and comprehensive click and pop suppression.
The high efficiency of the EUA2101, 87% eliminates the
need for an external heat sink when playing music.
The gain of the amplifier is controlled by two gain select
pins. The gain selections are 20, 26, 32, 36dB.
The outputs are fully protected against shorts to GND, VCC,
and output-to-output shorts with an auto recovery feature
and monitor output.
z
z
z
z
z
z
z
z
z
z
z
Unique Modulation Scheme Reduces EMI Emission
10-W/ch into an 8-Ω Load From a 12-V Supply
17.4-W/ch into an 4-Ω Load From a 12-V Supply
Operates from 10V to 15V
87% Efficient Class-D Operation Eliminates
Need for Heat Sinks
Four Selectable, Gain Settings
Differential Inputs
Thermal and Short-Circuit Protection With Auto
Recovery Feature
Clock Output for Synchronization With Multiple
Class-D Devices
7mm × 7mm, 48-pin TQFN Package
RoHS compliant and 100% lead(Pb)-free
APPLICATIONS
Typical Application Circuit
z
Televisions
Figure1.
DS2101 Ver 0.1 June 2007
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Preliminary
EUA2101
Pin Configurations
Package Type
Pin Configurations
(TOP VIEW)
TQFN-48
Pin Description
PIN
TQFN-48
I/O
DESCRIPTION
SHUTDOWN
44
I
Shutdown signal for IC (LOW = disabled, HIGH = operational). TTL logic
levels with compliance to AVCC.
RINN
2
I
Negative audio input for right channel. Biased at VREG/2.
RINP
3
I
Positive audio input for right channel. Biased at VREG/2.
LINN
6
I
Negative audio input for left channel. Biased at VREG/2.
LINP
5
I
Positive audio input for left channel. Biased at VREG/2.
GAIN0
8
I
Gain select least significant bit. TTL logic levels with compliance to VREG.
GAIN1
9
I
Gain select most significant bit. TTL logic levels with compliance to VREG.
MUTE
45
I
FAULT
46
O
BSLP
18
I/O
Mute signal for quick disable/enable of outputs (HIGH = outputs high-Z,
LOW = outputs enabled). TTL logic levels with compliance to AVCC.
TTL compatible output. HIGH = short-circuit fault. LOW = no fault. Only
reports short-circuit faults. Thermal faults are not reported on this terminal.
Bootstrap I/O for left channel, positive high-side FET.
PVCCL
26,27
LOUTP
19,20
O
Power supply for left channel H-bridge, not internally connected to PVCCR
or AVCC.
Class-D 1/2-H-bridge positive output for left channel.
PGNDL
28,29
LOUTN
21,22
O
Class-D 1/2-H-bridge negative output for left channel.
BSLN
23
I/O
Bootstrap I/O for left channel, negative high-side FET.
VCLAMPL
30
Internally generated voltage supply for left channel bootstrap capacitor.
VCLAMPR
31
Internally generated voltage supply for right channel bootstrap capacitor.
DS2101 Ver 0.1 June 2007
Power ground for left channel H-bridge.
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EUA2101
Preliminary
Pin Description (Continued)
PIN
TQFN-48
I/O
DESCRIPTION
BSRN
38
I/O
Bootstrap I/O for right channel, negative high-side FET.
ROUTN
39,40
O
Class-D 1/2-H-bridge negative output for right channel.
PGNDR
32,33
ROUTP
41,42
PVCCR
34,35
BSRP
43
AGND
4,17
ROSC
14
I/O
MSTR/ SLV
10
I
SYNC
11
I/O
VBYP
16
O
VREG
15
O
AVCC
48
NC
1,7,12,
13,24,25,
36,37,47
Power ground for right channel H-bridge.
O
Class-D 1/2-H-bridge positive output for right channel.
Power supply for right channel H-bridge, not connected to PVCCL or AVCC.
I/O
Bootstrap I/O for right channel, positive high-side FET.
Analog ground for digital/analog cells in core.
I/O for current setting resistor of ramp generator.
Master/Slave select for determining direction of SYNC terminal.
HIGH=Master mode, SYNC terminal is an output; LOW = slave mode,
SYNC terminal accepts a clock input. TTL logic levels with compliance to VREG.
Clock input/output for synchronizing multiple class-D devices. Direction
determined by MSTR/ SLV terminal. Input signal not to exceed VREG.
Reference for preamplifier. Nominally equal to 1.25 V. Also controls start-up
time via external capacitor sizing.
4-V regulated output for use by internal cells, GAINx, MUTE, and MSTR/ SLV
pins only. Not specified for driving other external circuitry.
High-voltage analog power supply. Not internally connected to PVCCR or
PVCCL.
Not internally connected.
Ordering Information
Order Number
Package Type
EUA2101JIR1
TQFN-48
EUA2101
Marking
xxxxx
EUA2101
Operating Temperature range
-40 °C to 85°C
□ □ □ □
Lead Free Code
1: Lead Free 0: Lead
Packing
R: Tape & Reel
Operating temperature range
I: Industry Standard
Package Type
J: TQFN
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EUA2101
Preliminary
Absolute Maximum Ratings
▓
▓
▓
▓
▓
▓
▓
▓
▓
Supply Voltage, AVCC,PVCC -------------------------------------------------------------------------- -0.3 V to 15V
Input Voltage, SHUTDOWN ,MUTE--------------------------------------------------------- -0.3 V to VCC +0.3V
Input Voltage,GAIN0,GAIN1,RINN,RINP,LINN,LINP, MSTR/ SLV ,SYNC------- -0.3 V to VREG +0.5V
Continuous Total Power Dissipation-------------------------------------------------- See Dissipation Rating Table
Free-air Temperature Range, TA ---------------------------------------------------------------------- -40°C to 85°C
Junction Temperature Range, TJ --------------------------------------------------------------------- -40°C to 150°C
Storage Temperature Rang, Tstg ------------------------------------------------------------------- -65°C to 150°C
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds ----------------------------------------- 260°C
Load Resistance, RLOAD ---------------------------------------------------------------------------------- 3.2Ω Minimum
Typical Dissipation Ratings
Package
TA ≤ 25°C
Derating Factor
TA= 70°C
TA= 85°C
TQFN-48
4.39W
35.1 mW/ °C
2.81W
2.28W
Recommended Operating Conditions
Supply voltage, VCC
PVCC,AVCC
High-level input voltage, VIH
Low-level input voltage, VIL
SHUTDOWN ,MUTE,GAIN0,GAIN1,
MSTR/SLV ,SYNC
SHUTDOWN ,MUTE,GAIN0,GAIN1,
MSTR/SLV ,SYNC
Min
Max
Unit
10
15
V
2
V
0.8
SHUTDOWN ,VI=VCC,VCC=12V
125
MUTE,VI=VCC, VCC=12V
75
GAIN0,GAIN1, MSTR/SLV ,SYNC,VI=VREG,
VCC=12V
2
SHUTDOWN ,VI=0V,VCC=12V
2
1
High-level output voltage, VOH
SYNC,MUTE,GAIN0,GAIN1,MSTR/SLV
,VI=0V, VCC=12V
FAULT, IOH=1mA
Low-level output voltage, VOL
FAULT, IOL= -1mA
Oscillator frequency, fOSC
ROSC Resistor=100 kΩ
High-level input current, IIH
Low-level input current, IIL
Operating free-air temperature, TA
V
µA
µA
VREG-0.6
V
AGND+0.4
V
200
300
kHz
-40
85
°C
DC Characteristics TA = 25°C ,VCC=12V, RL=8Ω (Unless otherwise noted)
Symbol
VOS
PSRR
Parameter
Conditions
Min
EUA2101
Unit
Typ Max.
Class-D output offset voltage
(measured differentially)
VI= 0 V, Gain = 36 dB
Bypass reference for input amplifier
VBYP, no load
1.30
1.39
1.49
V
4-V internal supply voltage
VREG, no load, VCC= 10V to 15V
3.70
3.94
4.25
V
DC Power supply rejection ratio
VCC = 12 V to 15 V, inputs ac
coupled to AGND, Gain = 36 dB
DS2101 Ver 0.1 June 2007
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-60
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mV
dB
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EUA2101
Preliminary
DC Characteristics (Continued)
Symbol
ICC
Parameter
Conditions
Quiescent supply current
ICC(SD) Quiescent supply current in shutdown
mode
ICC(MUTE) Quiescent supply current in mute mode
rDS(on)
Drain-source on-state resistance
EUA2101
Unit
Typ Max.
SHUTDOWN =2V, MUTE=0V,
no load
25
30
mA
SHUTDOWN =0.8V, no load
300
490
µA
6
11
mA
MUTE=2V, no load
VCC=12V,
IO=500mA,
TJ=25°C
GAIN1=0.8V
G
Min
Gain
GAIN1=2V
High Side
370
Low Side
370
Total
780
950
mΩ
GAIN0=0.8V
19
20
21
GAIN0=2V
25
26
27
GAIN0=0.8V
31
32
33
GAIN0=2V
35
36
37
dB
dB
tON
Turn-on time
C(VBYP)=1µF, SHUTDOWN =2V
25
ms
tOFF
Turn-off time
C(VBYP)=1µF, SHUTDOWN =0.8
V
0.1
ms
AC Characteristics TA = 25°C ,VCC=12V, RL=8Ω (Unless otherwise noted)
Symbol
KSVR
PO
Parameter
Conditions
200mVPP ripple from 20 Hz-1 kHz,
Gain= 20dB, Inputs ac-coupled to AGND
Supply ripple rejection
Continuous output power
THD+N Total harmonic distortion +noise
Vn
SNR
Min
EUA2101
Unit
Typ Max.
-50
THD+N=7%, f=1kHz
9.32
THD+N=10%, f=1kHz
10
THD+N=7%, f=1kHz, RL=4Ω
16.42
THD+N=10%, f=1kHz,RL=4Ω
(thermally limited)
17.45
RL=8Ω, f=1 kHz, PO=5W (half-power)
0.258%
RL=4Ω, f=1 kHz, PO=8W (half-power)
0.287%
dB
W
Output integrated noise
20Hz to 22kHz, A-weighted filter,
Gain=20dB
512
µV
-65
dBV
Crosstalk
PO=1 W, Gain=20dB, f=1 kHz
Maximum output at THD+N< 1%,
f=1kHz,Gain=20dB, A-weighted
-85
dB
84
dB
Thermal trip point
160
℃
Thermal hysteresis
30
℃
Signal-to-noise ratio
DS2101 Ver 0.1 June 2007
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Preliminary
EUA2101
Block Diagram
Figure2.
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EUA2101
Preliminary
Typical Characteristics
Figure3.
DS2101 Ver 0.1 June 2007
Figure4.
Figure5.
Figure6
Figure7.
Figure8.
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Figure9.
DS2101 Ver 0.1 June 2007
EUA2101
Preliminary
Figure10.
Figure11.
Figure12.
Figure13.
Figure14.
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Preliminary
EUA2101
Figure15.
DS2101 Ver 0.1 June 2007
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Preliminary
EUA2101
Application Information
Figure 16.
DS2101 Ver 0.1 June 2007
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EUA2101
Preliminary
Application Information (continued)
Most applications require a ferrite bead filter. The ferrite
filter reduces EMI around 1 MHz and higher (FCC and CE
only test radiated emissions greater than 30 MHz). When
selecting a ferrite bead, choose one with high impedance at
high frequencies, but low impedance at low frequencies.
Use an LC output filter if there are low frequency (<1
MHz) EMI-sensitive circuits and/or there are long wires
from the amplifier to the speaker.
When both an LC filter and a ferrite bead filter are used,
the LC filter should be placed as close as possible to the IC
followed by the ferrite bead filter.
Gain setting via GAIN0 and GAIN1 inputs
The gain of the EUA2101 is set by two input terminals,
GAIN0 and GAIN1.
The gains listed in Table 1 are realized by changing the
taps on the input resistors and feedback resistors inside
the amplifier. This causes the input impedance (ZI) to be
dependent on the gain setting. The actual gain settings
are controlled by ratios of resistors, so the gain variation
from part-to-part is small. However, the input impedance
from part-to-part at the same gain may shift by ±30%
due to shifts in the actual resistance of the input
resistors.
For design purposes, the input network should be
designed assuming an input impedance of 12.8kΩ,
which is the absolute minimum input impedance of the
EUA2101. At the lower gain settings, the input
impedance could increase as high as 41.6 kΩ.
Table.1 Gain Setting
Figure.17
GAIN1 GAIN0
0
0
1
1
0
1
0
1
AMPLIFIER
GAIN (dB)
TYP
20
26
32
36
INPUT
IMPEDANCE (kΩ)
TYP
32
16
16
16
Input Resistance
Changing the gain setting can vary the input resistance
of the amplifier from its smallest value, 16 kΩ ±30%, to
the largest value, 32 kΩ ±30%. As a result, if a single
capacitor is used in the input high-pass filter, the -3 dB
or cutoff frequency may change when changing gain
steps.
Figure.18
Figure.19
Using the LC filter in Figure.17, the EUA2101 EMI EVM
passed the FCC Part 15 Class B radiated emissions with 21
inch speaker wires. Quasi-peak measurements were taken
for 4 configurations, and the EUA2101 EMI EVM passed
with at least a 5.6dB margin.
DS2101 Ver 0.1 June 2007
The -3dB frequency can be calculated using Equation 1.
Use the ZI values given in Table 1.
f =
1
2 πZ C
i i
---------------- (1)
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Preliminary
Input Capacitor, CI
In the typical application, an input capacitor (CI) is required
to allow the amplifier to bias the input signal to the proper
dc level for optimum operation. In this case, CI and the
input impedance of the amplifier (ZI) form a high-pass
filter with the corner frequency determined in Equation 2.
EUA2101
quivalent- series-resistance (ESR) ceramic capacitor,
typically 0.1µF to 1µF placed as close as possible to the
device VCC lead works best. For filtering lower
frequency noise signals, a larger aluminum electrolytic
capacitor of 220µF or greater placed near the audio
power amplifier is recommended. The 220µF capacitor
also serves as local storage capacitor for supplying
current during large signal transients on the amplifier
outputs. The PVCC terminals provide the power to the
output transistors, so a 220µF or larger capacitor should
be placed on each PVCC terminal. A 10µF capacitor on
the AVCC terminal is adequate.
BSN and BSP Capacitors
1
f =
c 2 πZ C
i i
-----------------(2)
The value of CI is important, as it directly affects the bass
(low-frequency) performance of the circuit. Consider the
example where ZI is 20 kΩ and the specification calls for a
flat bass response down to 20 Hz. Equation 2 is
reconfigured as Equation 3.
1
C =
i 2 πZ f
i c
-----------------(3)
In this example, CI is 0.4 µF; so, one would likely choose a
value of 0.47µF as this value is commonly used. If the gain
is known and is constant, use ZI from Table 1 to calculate
CI. A further consideration for this capacitor is the leakage
path from the input source through the input network (CI)
and the feedback network to the load. This leakage current
creates a dc offset voltage at the input to the amplifier that
reduces useful headroom, especially in high gain
applications. For this reason, a low-leakage tantalum or
ceramic capacitor is the best choice. When polarized
capacitors are used, the positive side of the capacitor should
face the amplifier input in most applications as the dc level
there is held at 2V, which is likely higher than the source dc
level. Note that it is important to confirm the capacitor
polarity in the application. Additionally, lead-free solder
can create dc offset voltages and it is important to ensure
that boards are cleaned properly.
Power Supply Decoupling, CS
The EUA2101 is a high-performance CMOS audio
amplifier that requires adequate power supply decoupling
to ensure that the output total harmonic distortion (THD) is
as low as possible. Power supply decoupling also prevents
oscillations for long lead lengths between the amplifier and
the speaker. The optimum decoupling is achieved by using
two capacitors of different types that target different types
of noise on the power supply leads. For higher frequency
transients, spikes, or digital hash on the line, a good low
DS2101 Ver 0.1 June 2007
The full H-bridge output stages use only NMOS
transistors. Therefore, they require bootstrap capacitors
for the high side of each output to turn on correctly. A
220nF ceramic capacitor, rated for at least 25V, must be
connected from each output to its corresponding
bootstrap input. Specifically, one 220nF capacitor must
be connected from xOUTP to BSxx, and one 220nF
capacitor must be connected from xOUTN to BSxx.( See
application circuit diagram in Figure 16.)
The bootstrap capacitors connected between the BSxx
pins and corresponding output function as a floating
power supply for the high-side N-channel power
MOSFET gate drive circuitry. During each high-side
switching cycle, the bootstrap capacitors hold the
gate-to-source voltage high enough to keep the high-side
MOSFETs turned on.
VCLAMP Capacitors
To ensure that the maximum gate-to-source voltage for
the NMOS output transistors is not exceeded, two
internal regulators clamp the gate voltage. Two 1µF
capacitors must be connected from VCLAMPL (pin 30)
and VCLAMPR (pin 31) to ground and must be rated for
at least 16V. The voltages at the VCLAMP terminals
may vary with VCC and may not be used for powering
any other circuitry.
Internal Regulated 4V Supply (VREG)
The VREG terminal (pin 15) is the output of an
internally generated 4V supply, used for the oscillator,
preamplifier, and gain control circuitry. It requires a
10nF capacitor, placed close to the pin, to keep the
regulator stable.
This regulated voltage can be used to control GAIN0,
GAIN1, MSTR/ SLV , and MUTE terminals, but should
not be used to drive external circuitry.
VBYP Capacitor Selection
The internal bias generator (VBYP) nominally provides a
1.25V internal bias for the preamplifier stages. The
external input capacitors and this internal reference allow
the inputs to be biased within the optimal common-mode
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EUA2101
Preliminary
range of the input preamplifiers.
The selection of the capacitor value on the VBYP terminal
is critical for achieving the best device performance.
During power up or recovery from the shutdown state, the
VBYP capacitor determines the rate at which the amplifier
starts up. When the voltage on the VBYP capacitor equals
VBYP, the device starts a 16.4ms timer. When this timer
completes, the outputs start switching. The charge rate of
the capacitor is calculated using the standard charging
formula for a capacitor, I = C x dV/dT. The charge current
is nominally equal to 250µA and dV is equal to VBYP. For
example, a 1µF capacitor on VBYP would take 5 ms to
reach the value of VBYP and begin a 16.4ms count before
the outputs turn on. This equates to a turn-on time of <30
ms for a 1µF capacitor on the VBYP terminal.
A secondary function of the VBYP capacitor is to filter
high-frequency noise on the internal 1.25V bias generator.
A value of at least 0.47µF is recommended for the VBYP
capacitor. For the best power-up and shutdown pop
performance, the VBYP capacitor should be greater than or
equal to the input capacitors.
The MUTE terminal should never be left floating. For
power conservation, the SHUTDOWN terminal
should be used to reduce the quiescent current to the
absolute minimum level.
The MUTE terminal can also be used with the FAULT
output to automatically recover from a short-circuit
event. When a short-circuit event occurs, the FAULT
terminal transitions high indicating a short-circuit has
been detected. When directly connected to MUTE, the
MUTE terminal transitions high, and clears the internal
fault flag. This causes the FAULT terminal to cycle low,
and normal device operation resumes if the short-circuit
is removed from the output. If a short remains at the
output, the cycle continues until the short is removed.
If external MUTE control is desired, and automatic
recovery from a short-circuit event is also desired, an
OR gate can be used to combine the functionality of the
FAULT output and external MUTE control, see Figure
20.
Differential Input
The differential input stage of the amplifier cancels any
noise that appears on both input lines of the channel. To use
the EUA2101 with a differential source, connect the
positive lead of the audio source to the INP input and the
negative lead from the audio source to the INN input. To
use the EUA2101 with a single-ended source, ac ground the
INP or INN input through a capacitor equal in value to the
input capacitor on INN or INP and apply the audio source
to either input. In a single-ended input application, the
unused input should be ac grounded at the audio source
instead of at the device input for best noise performance.
SHUTDOWN Operation
The EUA2101 employs a shutdown mode of operation
designed to reduce supply current (ICC) to the absolute
minimum level during periods of nonuse for power
conservation. The SHUTDOWN input terminal should
be held high during normal operation when the amplifier is
in use. Pulling SHUTDOWN low causes the outputs to
mute and the amplifier to enter a low-current state. Never
leave SHUTDOWN unconnected, because amplifier
operation would be unpredictable.
For the best power-off pop performance, place the amplifier
in the shutdown or mute mode prior to removing the power
supply voltage.
MUTE Operation
The MUTE pin is an input for controlling the output state
of the EUA2101. A logic high on this terminal disables the
outputs. A logic low on this pin enables the outputs. This
terminal may be used as a quick disable/enable of outputs
when changing channels on a television or transitioning
between different audio sources.
DS2101 Ver 0.1 June 2007
Figure.20
MSTR/SLV and SYNC Operation
The MSTR/ SLV and SYNC terminals can be used to
synchronize the frequency of the class-D output
switching. When the MSTR/ SLV terminal is high, the
output switching frequency is determined by the
selection of the resistor connected to the ROSC terminal.
The SYNC terminal becomes an output in this mode,
and the frequency of this output is also determined by
the selection of the ROSC resistor. This TTL compatible,
push-pull output can be connected to another EUA2101,
configured in the slave mode. The output switching is
synchronized to avoid any beat frequencies that could
occur in the audio band when two class-D amplifiers in
the same system are switching at slightly different
frequencies.
When the MSTR/ SLV terminal is low, the output
switching frequency is determined by the incoming
square wave on the SYNC input. The SYNC terminal
becomes an input in this mode and accepts a TTL
compatible square wave from another EUA2101
configured in the master mode or from an external GPIO.
If connecting to an external GPIO, recommended
frequencies are 200kHz to 300kHz for proper device
operation, and the maximum amplitude is 4V.
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Preliminary
Using Low-ESR Capacitors
Low-ESR capacitors are recommended throughout this
application section. A real (as opposed to ideal) capacitor
can be modeled simply as a resistor in series with an ideal
capacitor. The voltage drop across this resistor minimizes
the beneficial effects of the capacitor in the circuit. The
lower the equivalent value of this resistance, the more the
real capacitor behaves like an ideal capacitor.
Short-Circuit Protection and Automatic Recovery
Feature
The EUA2101 has short-circuit protection circuitry on the
outputs that prevents damage to the device during
output-to-output shorts, output-to-GND shorts, and
output-to-VCC shorts. When a short circuit is detected on
the outputs, the part immediately disables the output drive.
This is a latched fault and must be reset by cycling the
voltage on the SHUTDOWN pin or MUTE pin. This
clears the short-circuit flag and allows for normal operation
if the short was removed. If the short was not removed, the
protection circuitry again activates.
The FAULT terminal can be used for automatic recovery
from a short-circuit event, or used to monitor the status
with an external GPIO. For automatic recovery from a
short-circuit event, connect the FAULT terminal directly to
the MUTE terminal. When a short-circuit event occurs, the
FAULT terminal transitions high indicating a short-circuit
has been detected. When directly connected to MUTE,
the MUTE terminal transitions high, and clears the internal
fault flag. This causes the FAULT terminal to cycle low,
and normal device operation resumes if the short-circuit is
removed from the output. If a short remains at the output,
the cycle continues until the short is removed. If external
MUTE control is desired, and automatic recovery from a
short-circuit event is also desired, an OR gate can be used
to combine the functionality of the FAULT output and
external MUTE control, see Figure 20.
Thermal Protection
Thermal protection on the EUA2101 prevents damage to
the device when the internal die temperature exceeds 160oC.
There is a 10oC tolerance on this trip point from device to
device. Once the die temperature exceeds the thermal set
point, the device enters into the shutdown state and the
outputs are disabled. This is not a latched fault. The thermal
fault is cleared once the temperature of the die is reduced
by 30oC. The device begins normal operation at this point
with no external system interaction.
DS2101 Ver 0.1 June 2007
EUA2101
Printed-Circuit Board (PCB) Layout
Because the EUA2101 is a class-D amplifier that
switches at a high frequency, the layout of the printedcircuit board (PCB) should be optimized according to
the following guidelines for the best possible
performance.
z Decoupling capacitors— The high-frequency 1µF
decoupling capacitors should be placed as close to the
PVCC (pins 26, 27, 34, and 35) and AVCC (pin 48)
terminals as possible. The VBYP (pin 16) capacitor,
VREG (pin 15) capacitor, and VCLAMP (pins 30 and
31) capacitor should also be placed as close to the
device as possible. Large (220µF or greater) bulk
power supply decoupling capacitors should be placed
near theEUA2101 on the PVCCL, PVCCR, and
AVCC terminals.
z Grounding— The AVCC (pin 48) decoupling
capacitor, VREG (pin 15) capacitor, VBYP (pin 16)
capacitor, and ROSC (pin 14) resistor should each be
grounded to analog ground (AGND, pin 17). The
PVCC decoupling capacitors and VCLAMP
capacitors should each be grounded to power ground
(PGND, pins 28, 29, 32, and 33). Analog ground and
power ground should be connected at the thermal pad,
which should be used as a central ground connection
or star ground for the EUA2101.
z Output filter— The ferrite EMI filter (Figure 19)
should be placed as close to the output terminals as
possible for the best EMI performance. The LC filter
(Figure 17 and Figure 18) should be placed close to
the outputs. The capacitors used in both the ferrite
and LC filters should be grounded to power ground. If
both filters are used, the LC filter should be placed
first, following the outputs.
z Thermal Pad— The thermal pad must be soldered to
the PCB for proper thermal performance and optimal
reliability. The dimensions of the thermal pad and
thermal land should be 5,1 mm by 5,1 mm. Five rows
of solid vias (five vias per row, 0.3302mm or 13 mils
diameter) should be equally spaced underneath the
thermal land. The vias should connect to a solid
copper plane, either on an internal layer or on the
bottom layer of the PCB. The vias must be solid vias,
not thermal relief or webbed vias.
14
联系电话:15999644579 83151715
芯美电子
EUA2101
Preliminary
Package Information
TQFN-48
Detail A
SYMBOLS
A
A1
b
E1
D
D1
E
e
L
DS2101 Ver 0.1 June 2007
MILLIMETERS
MIN.
MAX.
0.70
0.80
0.00
0.05
0.15
0.35
5.00
6.90
7.10
5.00
6.90
7.10
0.50
0.30
0.50
INCHES
MIN.
0.028
0.000
0.006
MAX.
0.031
0.002
0.014
0.200
0.272
0.279
0.200
0272
0.279
0.020
0.012
0.020
15
联系电话:15999644579 83151715