FAN7530 Critical Conduction Mode PFC Controller Features Description Low Total Harmonic Distortion (THD) The FAN7530 is an active power factor correction (PFC) controller for boost PFC applications that operates in critical conduction mode (CRM). It uses the voltage mode PWM that compares an internal ramp signal with the error amplifier output to generate MOSFET turn-off signal. Since the voltage mode CRM PFC controller does not need rectified AC line voltage information, it saves the power loss of the input voltage sensing network necessary for the current mode CRM PFC controller. Precise Adjustable Output Over-Voltage Protection Open-Feedback Protection and Disable Function Zero Current Detector 150µs Internal Start-up Timer MOSFET Over-Current Protection Under-Voltage Lockout with 3.5V Hysteresis Low Start-up (40µA) and Operating Current (1.5mA) Totem Pole Output with High State Clamp FAN7530 provides many protection functions, such as over voltage protection, open-feedback protection, overcurrent protection, and under-voltage lockout protection. The FAN7530 can be disabled if the INV pin voltage is lower than 0.45V and the operating current decreases to 65µA. Using a new variable on-time control method, THD is lower than the conventional CRM boost PFC ICs. +500/-800mA Peak Gate Drive Current 8-Pin DIP or 8-Pin SOP Applications Adapter Ballast LCD TV, CRT TV SMPS Related Application Notes AN-6027 - Design of Power Factor Correction Circuit Using FAN7530 Ordering Information Part Number Operating Temp. Range Pb-Free Package Packing Method Marking Code FAN7530N -40°C to +125°C Yes 8-DIP Rail FAN7530 FAN7530M -40°C to +125°C Yes 8-SOP Rail FAN7530 FAN7530MX -40°C to +125°C Yes 8-SOP Tape & Reel FAN7530 © 2006 Fairchild Semiconductor Corporation FAN7530 Rev. 1.0.0 www.fairchildsemi.com FAN7530 Critical Conduction Mode PFC Controller October 2006 FAN7530 Critical Conduction Mode PFC Controller Typical Application Diagrams L D VO AC IN VAUX I2 NAUX RZCD R2 ZCD CO VCC FAN7530 INV MOT I1 CS COMP R1 GND FAN7530 Rev. 00 Figure 1. Typical Boost PFC Application Internal Block Diagram 2.5V Ref VCC 8 UVLO 12V 8.5V VCC Internal Bias Disable Drive Output 150ms Timer ZCD 5 Q 1.4V 1.5V R Zero Current Detector OVP 4 Disable 40k 8pF 0.8V MOT 2 7 OUT 13V S 6.5V CS Vref Ramp Signal Sawtooth Generator 2.675V 2.5V 0.45V 0.35V Current Protection Comparator 1V Offset Error Amplifier 1V~5V Range 6 GND Gm Vref 1 INV 3 COMP FAN7530 Rev. 00 Figure 2. Functional Block Diagram of FAN7530 © 2006 Fairchild Semiconductor Corporation FAN7530 Rev. 1.0.0 www.fairchildsemi.com 2 VCC OUT GND ZCD 8 7 6 5 YWW FAN7530 1 2 3 4 INV MOT COMP CS FAN7530 Rev. 00 Figure 3. Pin Configuration (Top View) Pin Definitions Pin # Name Description 1 INV This pin is the inverting input of the error amplifier. The output voltage of the boost PFC converter should resistively divided to 2.5V. 2 MOT This pin is used to set the slope of the internal ramp. The voltage of this pin is maintained at 2.9V. If a resistor is connected between this pin and GND, current flows out of the pin and the slope of the internal ramp is proportional to this current. 3 COMP This pin is the output of the transconductance error amplifier. Components for the output voltage compensation should be connected between this pin and GND. 4 CS This pin is the input of the over-current protection comparator. The MOSFET current is sensed using a sensing resistor and the resulting voltage is applied to this pin. An internal RC filter is included to filter switching noise. 5 ZCD This pin is the input of the zero current detection block. If the voltage of this pin goes higher than 1.5V, then goes lower than 1.4V, the MOSFET is turned on. 6 GND This pin is used for the ground potential of all the pins. For proper operation, the signal ground and the power ground should be separated. 7 OUT This pin is the gate drive output. The peak sourcing and sinking current levels are +500mA and -800mA respectively. For proper operation, the stray inductance in the gate driving path must be minimized. 8 Vcc This pin is the IC supply pin. IC current and MOSFET drive current are supplied using this pin. © 2006 Fairchild Semiconductor Corporation FAN7530 Rev. 1.0.0 www.fairchildsemi.com 3 FAN7530 Critical Conduction Mode PFC Controller Pin Assignments The “Absolute Maximum Ratings” are those values beyond which the safety of the device cannot be guaranteed. The device should not be operated at these limits. The parametric values defined in the Electrical Characteristics tables are not guaranteed at the absolute maximum ratings. TA=25°C, unless otherwise specified. Symbol VCC IOH, IOL Iclamp Parameter Supply Voltage Peak Drive Output Current Driver Output Clamping Diodes VO>VCC or VO<-0.3V Value Unit VZ V +500/-800 mA ±10 mA ±10 mA -0.3 to 6 V 150 °C Operating Temperature Range -40 to 125 °C Storage Temperature Range Idet Detector Clamping Diodes VIN Error Amplifier, MOT, CS Input Voltages TJ Operating Junction Temperature TA -65 to 150 °C VESD_HBM ESD Capability, Human Body Model 2.0 kV VESD_MM ESD Capability, Machine Model 300 V VESD_CDM ESD Capability, Charged Device Model 500 V TSTG Thermal Impedance(1) Symbol θJA Parameter Thermal Resistance, Junction-to-Ambient Value Unit 8-DIP 110 °C/W 8-SOP 150 °C/W Note: 1. Regarding the test environment and PCB type, please refer to JESD51-2 and JESD51-10. © 2006 Fairchild Semiconductor Corporation FAN7530 Rev. 1.0.0 www.fairchildsemi.com 4 FAN7530 Critical Conduction Mode PFC Controller Absolute Maximum Ratings VCC = 14V and TA = -40°C~125°C unless otherwise specified. Symbol Parameter Condition Min. Typ. Max. Unit 11 12 13 V UNDER-VOLTAGE LOCKOUT SECTION Vth(start) Start Threshold Voltage VCC increasing Vth(stop) Stop Threshold Voltage VCC decreasing HY(uvlo) UVLO Hysteresis VZ Zener Voltage 7.5 8.5 9.5 V 3.0 3.5 4.0 V ICC = 20mA 22 V SUPPLY CURRENT SECTION Ist Start-up Supply Current VCC = Vth(start) - 0.2V 40 70 µA ICC Operating Supply Current Output no switching 1.5 3.0 mA Idcc Dynamic Operating Supply Current 50kHz, CL=1nF 2.5 4.0 mA Operating Current at Disable Vinv = 0V 20 65 95 µA Voltage Feedback Input Threshold1 TA = 25°C 2.465 2.500 2.535 V Line Regulation VCC = 14V ~ 20V 0.1 10.0 mV ICC(dis) ERROR AMPLIFIER SECTION Vref1 ΔVref1 Vref1(2) ΔVref2 Temperature Stability of Ib(ea) Input Bias Current Vinv = 1V ~ 4V Isource Output Source Current Vinv = Vref1 - 0.1V -12 µA Output Sink Current Vinv = Vref1 + 0.1V 12 µA Veao(H) Output Upper Clamp Voltage Vinv = Vref1 - 0.1V Veao(Z) Zero Duty Cycle Output Voltage 0.9 1.0 1.1 V Transconductance(2) 90 115 140 µmho 2.784 2.900 3.016 V 19 24 29 µsec 0.7 0.8 0.9 V -1.0 -0.1 1.0 µA 350 500 nsec Isink gm 20 -0.5 5.4 mV 0.5 6.0 6.6 µA V MAXIMUM ON-TIME SECTION Vmot ton(max) Maximum On-Time Voltage Rmot = 40.5kΩ Maximum On-Time Programming Rmot = 40.5kΩ, TA = 25°C CURRENT SENSE SECTION VCS(limit) Ib(cs) td(cs) Current Sense Input Threshold Voltage Limit Input Bias Current Current Sense Delay to VCS = 0V ~ 1V Output(2) dV/dt = 1V/100ns, from 0V to 5V Note: 2. These parameters, although guaranteed by design, are not tested in production. © 2006 Fairchild Semiconductor Corporation FAN7530 Rev. 1.0.0 www.fairchildsemi.com 5 FAN7530 Critical Conduction Mode PFC Controller Electrical Characteristics VCC = 14V and TA = -40°C~125°C unless otherwise specified. Symbol Parameter Condition Min. Typ. Max. Unit 1.35 1.50 1.65 V ZERO CURRENT DETECT SECTION Vth(ZCD) Input Voltage Threshold(3) (3) HY(ZCD) Detect Hysteresis 0.05 0.10 0.15 V Vclamp(H) Input High Clamp Voltage Idet = 3mA 6.0 6.7 7.4 V Vclamp(L) Input Low Clamp Voltage Idet = -3mA 0 0.65 1.00 V -1.0 -0.1 1.0 µA Ib(ZCD) Input Bias Current VZCD = 1V ~ 5V (3) Isource(zcd) Source Current Capability TA = 25°C -10 mA Isink(zcd) Sink Current Capability(3) TA = 25°C 10 mA 200 nsec 11.0 12.8 V tdead Maximum Delay from ZCD to Output dV/dt = -1V/100ns, Turn-on(3) from 5V to 0V 100 OUTPUT SECTION VOH Output Voltage High IO = -100mA, TA = 25°C VOL Output Voltage Low IO = 200mA, TA = 25°C 1.0 2.5 V tr Rising Time(3) Cl = 1nF 50 100 nsec Falling Time(3) Cl = 1nF 50 100 nsec 13.0 14.5 V 1 V tf VO(max) VO(UVLO) Maximum Output Voltage VCC = 20V, IO = 100μA Output Voltage with UVLO Activated VCC = 5V, IO = 100μA 9.2 11.5 RESTART TIMER SECTION td(rst) Restart Timer Delay 50 150 300 µsec OVER-VOLTAGE PROTECTION SECTION Vovp HY(ovp) OVP Threshold Voltage TA = 25°C 2.620 2.675 2.730 V OVP Hysteresis TA = 25°C 0.120 0.175 0.230 V ENABLE SECTION Vth(en) Enable Threshold Voltage 0.40 0.45 0.50 V HY(en) Enable Hysteresis 0.05 0.10 0.15 V Note: 3. These parameters, although guaranteed by design, are not tested in production. © 2006 Fairchild Semiconductor Corporation FAN7530 Rev. 1.0.0 www.fairchildsemi.com 6 FAN7530 Critical Conduction Mode PFC Controller Electrical Characteristics (Continued) 9.5 12.5 9.0 Vth(stop) [V] Vth(start) [V] 13.0 12.0 8.5 8.0 11.5 7.5 11.0 -60 -40 -20 0 20 40 60 80 -60 -40 -20 100 120 140 0 40 60 80 100 120 140 Figure 5. Stop Threshold Voltage vs. Temp. 4.00 23.0 3.75 22.5 VZ [V] HY(UVLO) [V] Figure 4. Start Threshold Voltage vs. Temp. 3.50 22.0 21.5 3.25 21.0 3.00 -60 -40 -20 0 20 40 60 80 -60 -40 -20 100 120 140 0 20 40 60 80 100 120 140 Temperature [°C] Temperature [°C] Figure 6. UVLO Hysteresis vs. Temp. Figure 7. Zener Voltage vs. Temp. 60 2.4 ICC [mA] 45 Ist [μA] 20 Temperature [°C] Temperature [°C] 30 1.6 0.8 15 0.0 -60 -40 -20 0 20 40 60 80 -60 -40 -20 100 120 140 Figure 8. Start-up Supply Current vs. Temp. 20 40 60 80 100 120 140 Figure 9. Operating Supply Current vs. Temp. © 2006 Fairchild Semiconductor Corporation FAN7530 Rev. 1.0.0 0 Temperature [°C] Temperature [°C] www.fairchildsemi.com 7 FAN7530 Critical Conduction Mode PFC Controller Typical Characteristics 90 3 72 ICC(dis) [μA] Idcc [mA] 4 2 1 54 36 0 -60 -40 -20 0 20 40 60 80 100 120 140 -60 -40 -20 0 Temperature [°C] 20 40 60 80 100 120 140 Temperature [°C] Figure 10. Dynamic Operating Supply Current vs. Temp. Figure 11. Operating Current at Disable vs. Temp. 10.0 7.5 ΔVref1 [mV] Vref1 [V] 2.52 2.50 5.0 2.5 2.48 0.0 -60 -40 -20 0 20 40 60 80 -60 -40 -20 100 120 140 0 20 40 60 80 100 120 140 Temperature [°C] Temperature [°C] Figure 13. ΔVref1 vs. Temp. Figure 12. Vref1 vs. Temp. 0.50 -9 Isource [μA] Ib(ea) [μA] 0.25 0.00 -12 -15 -0.25 -0.50 -18 -60 -40 -20 0 20 40 60 80 100 120 140 -60 -40 -20 Temperature [°C] 20 40 60 80 100 120 140 Temperature [°C] Figure 14. Input Bias Current vs. Temp. Figure 15. Output Source Current vs. Temp. © 2006 Fairchild Semiconductor Corporation FAN7530 Rev. 1.0.0 0 www.fairchildsemi.com 8 FAN7530 Critical Conduction Mode PFC Controller Typical Characteristics (Continued) 6.6 15 6.3 Veao(H) [V] Isink [μA] 18 12 9 6.0 5.7 6 5.4 -60 -40 -20 0 20 40 60 80 100 120 140 -60 -40 -20 0 Temperature [°C] 20 40 60 80 100 120 140 Temperature [°C] Figure 16. Output Sink Current vs. Temp. Figure 17. Output Upper Clamp Voltage vs. Temp. 1.10 3.00 2.95 Vmot [V] Veao(Z) [V] 1.05 1.00 2.90 2.85 0.95 2.80 0.90 -60 -40 -20 0 20 40 60 80 100 120 140 -60 -40 -20 0 Temperature [°C] 20 40 60 80 100 120 140 Temperature [°C] Figure 18. Zero Duty Cycle Output Voltage vs. Temp. Figure 19. Maximum On-Time Voltage vs. Temp. 0.90 0.85 Vcs(limit) [V] Ton(max) [μs] 27 24 0.80 0.75 21 0.70 -60 -40 -20 0 20 40 60 80 100 120 140 -60 -40 -20 Temperature [°C] 20 40 60 80 100 120 140 Temperature [°C] Figure 20. Maximum On-Time vs. Temp. Figure 21. Current Sense Input Threshold Voltage vs. Temp. © 2006 Fairchild Semiconductor Corporation FAN7530 Rev. 1.0.0 0 www.fairchildsemi.com 9 FAN7530 Critical Conduction Mode PFC Controller Typical Characteristics (Continued) 1.0 7.2 6.8 Vclamp(H) [V] Ib(cs) [μA] 0.5 0.0 6.4 -0.5 6.0 -1.0 -60 -40 -20 0 20 40 60 80 100 120 140 -60 -40 -20 0 Temperature [°C] Figure 22. Input Bias Current vs. Temp. 40 60 80 100 120 140 Figure 23. Input High Clamp Voltage vs. Temp. 1.00 1.0 0.75 0.5 Ib(zcd) [μA] Vclamp(L) [V] 20 Temperature [°C] 0.50 0.25 0.0 -0.5 0.00 -1.0 -60 -40 -20 0 20 40 60 80 100 120 140 -60 -40 -20 0 Temperature [°C] 20 40 60 80 100 120 140 Temperature [°C] Figure 24. Input Low Clamp Voltage vs. Temp. Figure 25. Input Bias Current vs. Temp. 0.9 14 VO(uvlo) [V] VO(max) [V] 0.6 13 12 0.3 0.0 -0.3 -60 -40 -20 0 20 40 60 80 100 120 140 -60 -40 -20 Temperature [°C] 20 40 60 80 100 120 140 Temperature [°C] Figure 26. Maximum Output Voltage vs. Temp. Figure 27. Output Voltage with UVLO Activated vs. Temp. © 2006 Fairchild Semiconductor Corporation FAN7530 Rev. 1.0.0 0 www.fairchildsemi.com 10 FAN7530 Critical Conduction Mode PFC Controller Typical Characteristics (Continued) 2.73 300 2.70 200 Vovp [V] td(rst) [μs] 250 150 100 2.67 2.64 50 -60 -40 -20 0 20 40 60 80 -60 -40 -20 100 120 140 0 20 40 60 80 100 120 140 Temperature [°C] Temperature [°C] Figure 28. Restart Delay Time vs. Temp. Figure 29. OVP Threshold Voltage vs. Temp. 0.500 0.475 0.18 Vth(en) [V] HY(OVP) [V] 0.21 0.450 0.15 0.425 0.400 0.12 -60 -40 -20 0 20 40 60 80 -60 -40 -20 100 120 140 0 20 40 60 80 100 120 140 Temperature [°C] Temperature [°C] Figure 30. OVP Hysteresis vs. Temp. Figure 31. Enable Threshold Voltage vs. Temp. 0.150 HY(en) [V] 0.125 0.100 0.075 0.050 -60 -40 -20 0 20 40 60 80 100 120 140 Temperature [°C] Figure 32. Enable Hysteresis vs. Temp. © 2006 Fairchild Semiconductor Corporation FAN7530 Rev. 1.0.0 www.fairchildsemi.com 11 FAN7530 Critical Conduction Mode PFC Controller Typical Characteristics (Continued) 1. Error Amplifier Block rent detector turns on the MOSFET. The ZCD pin is protected internally by two clamps, 6.7V-high clamp and 0.65V-low clamp. The 150µs timer generates a MOSFET turn-on signal if the drive output has been low for more than 150µs from the falling edge of the drive output. The error amplifier block consists of a transconductance amplifier, output OVP comparator, and disable comparator. For the output voltage control, a transconductance amplifier is used instead of the conventional voltage amplifier. The transconductance amplifier (voltage controlled current source) aids the implementation of OVP and disable function. The output current of the amplifier changes according to the voltage difference of the inverting and non-inverting input of the amplifier. The output voltage of the amplifier is compared with the internal ramp signal to generate the switch turn-off signal. The OVP comparator shuts down the output drive block when the voltage of the INV pin is higher than 2.675V and there is 0.175V hysteresis. The disable comparator disables the operation of the FAN7530 when the voltage of the inverting input is lower than 0.45V and there is 100mV hysteresis. An external small signal MOSFET can be used to disable the IC, as shown in Figure 33. The IC operating current decreases below 65µA to reduce power consumption if the IC is disabled. 2.675V OVP Disable 0.45V RZCD S 6.7V Q 1.4V Zero Current Detector R FAN7530 Rev. 00 Figure 34. Zero Current Detector Block 3. Sawtooth Generator Block The output of the error amplifier and the output of the sawtooth generator are compared to determine the MOSFET turn-off instance. The slope of the sawtooth is determined by an external resistor connected to the MOT pin. The voltage of the MOT pin is 2.9V and the slope is proportional to the current flowing out of the MOT pin. The internal ramp signal has a 1V offset; therefore, the drive output is shut down if the voltage of the COMP pin is lower than 1V. The MOSFET on-time is maximum when the COMP pin voltage is 5V. According to the slope of the internal ramp, the maximum on-time can be programmed. The necessary maximum on-time depends on the boost inductor, lowest AC line voltage, and maximum output power. The resistor value should be designed properly. Vout Error Amp 3 5 1.5V 0.35V Gm Turn-on Signal ZCD 2.5V Vref1 (2.5V) 150μs Timer Vin INV 1 Disable Signal COMP Off Signal FAN7530 Rev. 00 1V Offset MOT Sawtooth Generator 3 Figure 33. Error Amplifier Block 2.9V 2. Zero Current Detection Block Error Amp Output The zero current detector (ZCD) generates the turn-on signal of the MOSFET when the boost inductor current reaches zero using an auxiliary winding coupled with the inductor. If the voltage of the ZCD pin goes higher than 1.5V, the ZCD comparator waits until the voltage goes below 1.4V. If the voltage goes below 1.4V, the zero cur- FAN7530 Rev. 00 Figure 35. Sawtooth Generator Block © 2006 Fairchild Semiconductor Corporation FAN7530 Rev. 1.0.0 www.fairchildsemi.com 12 FAN7530 Critical Conduction Mode PFC Controller Applications Information 5. Switch Drive Block The MOSFET current is sensed using an external sensing resistor for the over-current protection. If the CS pin voltage is higher than 0.8V, the over-current protection comparator generates a protection signal. An internal RC filter is included to filter switching noise. The FAN7530 contains a single totem-pole output stage designed for direct drive of the power MOSFET. The drive output is capable of up to +500/-800mA peak current with a typical rise and fall time of 50ns with 1nF load. The output voltage is clamped to 13V to protect the MOSFET gate if the VCC voltage is higher than 13V. OCP Signal 40k CS 4 6. Under-Voltage Lockout Block If the VCC voltage reaches 12V, the IC’s internal blocks are enabled and start operation. If the VCC voltage drops below 8.5V, most of the internal blocks are disabled to reduce the operating current. VCC voltage should be higher than 8.5V under normal conditions. 8pF 0.8V Over-Current Protection Comparator FAN7530 Rev. 00 Figure 36. Over-Current Protection Block © 2006 Fairchild Semiconductor Corporation FAN7530 Rev. 1.0.0 www.fairchildsemi.com 13 FAN7530 Critical Conduction Mode PFC Controller 4. Over-Current Protection Block Application Output Power Input Voltage Output Voltage Ballast 100W Universal input (85~265VAC) 400V Features High efficiency (>90% at 85VAC input) Low total harmonic distortion (THD) (<10% at 265VAC input, 25W load) Key Design Notes R1, R2, R5, C11 should be optimized for best THD characteristic. 1. Schematic T1 PFC OUTPUT VAUX BD D2 C5 R4 R3 R5 NTC Q1 ZD1 D1 C3 C4 8 7 VCC R6 C11 6 C9 5 OUT GND ZCD C2 LF1 R10 D3 C10 R9 FAN7530 R2 C1 V1 INV MOT COMP CS 1 2 R1 F1 3 R8 C7 C6 R11 4 R7 C8 FAN7530 Rev. 00 AC INPUT Figure 37. Schematic © 2006 Fairchild Semiconductor Corporation FAN7530 Rev. 1.0.0 www.fairchildsemi.com 14 FAN7530 Critical Conduction Mode PFC Controller Typical Application Circuit FAN7530 Critical Conduction Mode PFC Controller 2. Inductor Schematic Diagram 1 NVcc 2 3 Np 5 FAN7530 Rev. 00 Figure 38. Inductor Schematic Diagram 3. Winding Specification No Pin (s→f) 2→1 NVcc Wire 0.2φ ×1 Turns Winding Method 8 Solenoid Winding 58 Solenoid Winding Insulation: Polyester Tape t = 0.050mm, 4 Layers 5→3 Np 0.2φ × 10 Outer Insulation: Polyester Tape t = 0.050mm, 4 Layers Air Gap: 0.6mm for each leg 4. Electrical Characteristics Inductance Pin Specification Remarks 3-5 600µH ± 10% 100kHz, 1V 5. Core & Bobbin Core: EI 3026 Bobbin: EI3026 Ae(mm2): 111 © 2006 Fairchild Semiconductor Corporation FAN7530 Rev. 1.0.0 www.fairchildsemi.com 15 Part Value Note Part Value Fuse F1 3A/250V NTC 10D-9 Note Inductor T1 600µH EI3026 NTC MOSFET Resistor Q1 FQPF13N50C Fairchild R1 56kΩ 1/4W R2 820kΩ 1/4W R3 330kΩ 1/2W D1 1N4148 Fairchild R4 150Ω 1/2W D2 BYV26C 600V, 1A R5 20kΩ 1/4W D3 SB140 Fairchild R6 10Ω 1/4W ZD1 1N4746 18V R7 0.2Ω 1/2W R8 10kΩ 1/4W R9 10kΩ 1/4W R10 2MΩ 1/4W R11 12.9kΩ 1/4W Diode Bridge Diode BD KBL06 600V/4A Line Filter Capacitor LF1 C1 150nF/275VAC Box Capacitor C2 470nF/275VAC Box Capacitor C3 2.2nF/3kV Ceramic Capacitor C4 2.2nF/3kV Ceramic Capacitor C6 47µF/25V Electrolytic Capacitor C7 47nF/50V Ceramic Capacitor 220nF/50V Multilayer Ceramic Capacitor C9 100µF/450V Electrolytic Capacitor C10 12nF/100V Film Capacitor C11 56pF/50V Ceramic Capacitor 40mH IC IC1 FAN7530 V1 471 C5 C8 Fairchild TNR © 2006 Fairchild Semiconductor Corporation FAN7530 Rev. 1.0.0 Wire 0.4mm 470V www.fairchildsemi.com 16 FAN7530 Critical Conduction Mode PFC Controller 6. Demo Circuit Part List FAN7530 Critical Conduction Mode PFC Controller 7. Layout Power Ground Signal Ground Separate the power ground and the signal ground Place the output voltage sensing resistors close to IC Figure 39. PCB Layout Considerations for FAN7530 8. Performance Data POUT 100W 75W 50W 25W 85VAC 115VAC 230VAC 265VAC PF 0.998 0.998 0.991 0.984 THD 5.1% 3.6% 5.2% 6.2% Efficiency 90.9% 93.7% 95.6% 96% PF 0.999 0.998 0.986 0.975 THD 4.1% 3.6% 5.0% 5.7% Efficiency 91.6% 93.3% 94.6% 95.3% PF 0.998 0.997 0.974 0.956 THD 4.4% 5.0% 5.7% 6.2% Efficiency 91.3% 91.9% 92.7% 93.4% PF 0.995 0.991 0.923 0.876 THD 7.9% 8.6% 8.3% 8.7% Efficiency 86.4% 87.1% 87.3% 88.1% © 2006 Fairchild Semiconductor Corporation FAN7530 Rev. 1.0.0 www.fairchildsemi.com 17 8-DIP 0.060 ±0.004 #5 1.524 ±0.10 #4 0.018 ±0.004 #8 2.54 0.100 9.60 MAX 0.378 #1 9.20 ±0.20 0.362 ±0.008 ( 6.40 ±0.20 0.252 ±0.008 0.46 ±0.10 0.79 ) 0.031 Dimensions are in millimeters (inches) unless otherwise noted.. 5.08 MAX 0.200 7.62 0.300 3.40 ±0.20 0.134 ±0.008 3.30 ±0.30 0.130 ±0.012 0.33 0.013 MIN +0.10 0.25 –0.05 +0.004 0~15° 0.010 –0.002 September 1999, Rev B 8dip_dim.pdf © 2006 Fairchild Semiconductor Corporation FAN7530 Rev. 1.0.0 www.fairchildsemi.com 18 FAN7530 Critical Conduction Mode PFC Controller Mechanical Dimensions 8-SOP Dimensions are in millimeters (inches) unless otherwise noted. MIN #5 6.00 ±0.30 0.236 ±0.012 0.41 ±0.10 0.016 ±0.004 #4 1.27 0.050 #8 5.13 MAX 0.202 #1 4.92 ±0.20 0.194 ±0.008 ( 0.56 ) 0.022 1.55 ±0.20 0.061 ±0.008 0.1~0.25 0.004~0.001 3.95 ±0.20 0.156 ±0.008 ° +0.10 0.15 -0.05 +0.004 0.006 -0.002 MAX0.10 MAX0.004 1.80 MAX 0.071 0~ 8 5.72 0.225 0.50 ±0.20 0.020 ±0.008 September 2001, Rev B1 sop8_dim.pdf © 2006 Fairchild Semiconductor Corporation FAN7530 Rev. 1.0.0 www.fairchildsemi.com 19 FAN7530 Critical Conduction Mode PFC Controller Mechanical Dimensions (Continued) ACEx¥ ActiveArray¥ Bottomless¥ Build it Now¥ CoolFET¥ CROSSVOLT¥ DOME¥ EcoSPARK¥ 2 E CMOS¥ EnSigna¥ FACT¥ FACT Quiet Series¥ ® FAST FASTr¥ FPS¥ FRFET¥ GlobalOptoisolator¥ GTO¥ HiSeC¥ 2 I C¥ i-Lo¥ ImpliedDisconnect¥ IntelliMAX¥ ISOPLANAR¥ LittleFET¥ MICROCOUPLER¥ MicroFET¥ MicroPak¥ MICROWIRE¥ MSX¥ MSXPro¥ OCX¥ OCXPro¥ ® OPTOLOGIC OPTOPLANAR¥ PACMAN¥ POP¥ Power247¥ PowerEdge¥ PowerSaver¥ ® PowerTrench ® QFET QS¥ QT Optoelectronics¥ Quiet Series¥ RapidConfigure¥ RapidConnect¥ ScalarPump¥ PSerDes¥ ® SILENT SWITCHER SMART START¥ SPM¥ Stealth¥ SuperFET¥ SuperSOT¥-3 SuperSOT¥-6 SuperSOT¥-8 SyncFET¥ TCM¥ TinyBoost¥ TinyBuck¥ ® TinyLogic TINYOPTO¥ TinyPower¥ TinyPWM¥ TruTranslation¥ UHC¥ ® UltraFET UniFET¥ VCX¥ Wire¥ Across the board. Around the world.¥ Programmable Active Droop¥ ® The Power Franchise DISCLAIMER FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. THESE SPECIFICATIONS DO NOT EXPAND THE TERMS OF FAIRCHILD’S WORLDWIDE TERMS AND CONDITIONS, SPECIFICALLY THE WARRANTY THEREIN, WHICH COVERS THESE PRODUCTS. LIFE SUPPORT POLICY FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury of the user. 2. A critical component in any component of a life support, device, or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. PRODUCT STATUS DEFINITIONS Definition of Terms Datasheet Identification Product Status Advance Information Formative or In Design This datasheet contains the design specifications for product development. Specifications may change in any manner without notice. Definition Preliminary First Production This datasheet contains preliminary data; supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice to improve design. No Identification Needed Full Production This datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice to improve design. Obsolete Not In Production This datasheet contains specifications on a product that has been discontinued by Fairchild Semiconductor. The datasheet is printed for reference information only. Rev. I20 © 2006 Fairchild Semiconductor Corporation FAN7530 Rev. 1.0.0 www.fairchildsemi.com 20 FAN7530 Critical Conduction Mode PFC Controller TRADEMARKS The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks. www.fairchildsemi.com Application Note AN-6027 Design of Power Factor Correction Circuit Using FAN7530 1. Introduction The FAN7530 is an active power factor correction (PFC) controller for the boost PFC application that operates in the critical conduction mode (CRM). The critical conduction mode boost power factor converter operates at the boundary of continuous conduction mode and discontinuous conduction mode. The CRM PFC controllers are of two kinds: the current-mode CRM PFC controller and the voltage-mode CRM PFC controller. For the current mode, a boost switch is turned on when the inductor current reaches zero and turned off when the inductor current meets the desired current reference. In this case, the rectified AC line voltage should be sensed to generate the current reference, as in the FAN7527B; however, the sensing network can cause addi- tional power loss. In the voltage mode, the switch turn-on is the same as that of the current mode, but the switch turn-off is determined by an internal ramp signal. The ramp signal is compared with an error amplifier output and the switch turnon time is controlled to be constant, as shown in Figure 1. If the turn-on time is constant, the peak inductor current is proportional to the rectified AC line voltage, as shown in Figure 2. In this way, the input current waveform follows the waveform of the input voltage, thereby obtaining a good power factor. The FAN7530 is a voltage-mode CRM PFC controller. Because the voltage-mode CRM PFC controller does not need the rectified AC line voltage information, it can save the power loss of the sensing network. L D VOUT VOUT AC AC IN Turn-On Turn-On S R Turn-Off Turn-Off Q OCP RSENSE SENSE Feedback Feedback OVP Disable Ramp Error Amp Figure 1. Voltage Mode CRM Boost PFC Circuit Inductor Current MOSFET Conduction Diode Conduction Peak Inductor Current Average Input Current Gating Signal Constant On-time & Variable Off-time Figure 2. CRM Boost PFC Inductor Current Waveform © 2006 Fairchild Semiconductor Corporation Rev. 1.0.3 • 1/11/07 www.fairchildsemi.com AN6027 APPLICATION NOTE Figure 3 shows the block diagram of the FAN7530. The only difference between the FAN7529 and the FAN7530 is the pin configuration of pin 2 and pin 3. For the FAN7529, the INV pin and the COMP pin are adjacent, but because the voltage of pin 1 is 2.5V and the operating range of pin 2 is from 1V to 5V, the PFC output voltage can increase at light load if pins 1 and 2 are shorted. For the FAN7530, however, the INV pin and the MOT pin are adjacent. Because the voltage of the MOT pin is 2.9V, the over-voltage protection works if pin 1 and pin 2 are shorted. Block Diagram 2.5V Ref VCC 8 UVLO Vref VCC Internal Bias 12V 8.5V Drive Output Disable 150μs Timer ZCD 5 S 6.5V Q 1.4V 1.5V R Zero Current Detector CS OVP 4 Disable 40k 8pF 0.8V Ramp Signal MOT 2 7 OUT 13V 2.675V 2.5V 0.45V 0.35V Current Protection Comparator Vref 1V Offset Error Amplifier Sawtooth Generator Gm 1V~5V Range 6 3 GND COMP 1 INV Figure 3. Block Diagram of the FAN7530 Showing Error Amplifier Block, Zero Current Detector Block, Sawtooth Generator Block, Over-Current Protection Block, and Switch Drive Block © 2006 Fairchild Semiconductor Corporation Rev. 1.0.3 • 1/11/07 www.fairchildsemi.com 2 AN6027 APPLICATION NOTE 2. Device Block Description the junction capacitor of the MOSFET resonates with the boost inductor and the auxiliary winding voltage decreases resonantly. If it reaches 1.4V, the zero current detector turns on the MOSFET. The ZCD pin is protected internally by two clamps: the 6.5V HIGH clamp and the 0.65V LOW clamp, as shown in Figure 5. 2.1 Error Amplifier Block The error amplifier block consists of a transconductance amplifier, output OVP comparator, and disable comparator. For the output voltage control, a transconductance amplifier is used instead of the conventional voltage amplifier. The transconductance amplifier (voltage controlled current source) aids the implementation of OVP and disable function. The output current of the amplifier changes according to the voltage difference of the inverting input and the noninverting input of the amplifier. The output voltage of the amplifier is compared with the internal ramp signal to generate the switch turn-off signal. The OVP comparator shuts down the output drive block when the voltage of the INV pin is higher than 2.675V and there is 0.175V hysteresis. The disable comparator disables the operation of the FAN7530 when the voltage of the inverting input is lower than 0.45V and there is 100mV hysteresis. An external, small-signal MOSFET can be used to disable the IC, as shown in Figure 4. The IC operating current decreases to under 65µA to reduce power consumption if the IC is disabled. Turn-on Signal Timer S Q R VIN ZCD 5 6.5V 1.4V 1.5V Zero Current Detector Figure 5. Zero Current Detector Block 2.675V OVP Disable 0.45V 2.5V Gm 2 IPEAK 0.35V tzero Inductor Current V OUT V ref (2.5V) Error Amp Figure 6 shows typical ZCD-related waveforms. Because the ZCD pin has some capacitance, there can be some delay caused by Rzcd and the turn-on time can be delayed. 0A ton tdis INV toff 1 COMP INEG Disable Signal n·(V OUT-V IN) V AUX 0V -n·V IN Delay Time V clamp Figure 4. Error Amplifier Block ZCD Voltage V th R ZCD Delay 2.2 Zero Current Detection Block OUT The zero current detector (ZCD) generates the turn-on signal of the MOSFET when the boost inductor current reaches zero using an auxiliary winding coupled with the inductor. Because the polarity of the auxiliary winding is opposite the inductor winding, the auxiliary winding voltage is negative and proportional to the rectified AC line voltage when the MOSFET is turned on. If the MOSFET is turned off, the voltage becomes positive and proportional to the difference between VOUT and VIN. If the inductor current reaches zero, © 2006 Fairchild Semiconductor Corporation Rev. 1.0.3 • 1/11/07 0V V OUT V DS Minimum Voltage Turn-on 0V Figure 6. Zero Current Detector Waveform www.fairchildsemi.com 3 AN6027 APPLICATION NOTE Ideally, the switch must be turned on when the inductor current reaches zero; but because of the structure of the ZCD block and Rzcd delay, it is turned on after some delay time. During this delay time, the stored charge of the COSS (MOSFET output capacitor) is discharged through the path indicated in Figure 7. This charge is transferred into a small filter capacitor, Cin1, which is connected to the bridge diode. Therefore, there is no current flow from the input side, meaning the input current Iin is zero during this period. For better total harmonic distortion (THD), it is important to make tzero / TS as small as possible. As shown in Figure 6, tzero is proportional to L ⋅ C oss but ton and tdis are proportional to L. Therefore tzero / TS is approximately inversely proportional to L . Therefore THD increases as the inductance decreases. Reducing the inductance can decrease the inductor size and cost but the switching loss increases because of the increased switching frequency. In real case, boost diode’s junction capacitance and boost inductor’s parasitic capacitance should be added to COSS when calculating tzero. That means it is important to minimize the parasitic capacitance of the boost inductor and diode junction capacitance for better THD. iin L AC IN D Off Signal 1V Offset MOT Sawtooth Generator 3 2.9V Error Amp Output Figure 8. Sawtooth Generator Block 2.4 Over-Current Protection Block The MOSFET current is sensed using an external sense resistor for over-current protection. If the CS pin voltage is higher than 0.8V, the over-current protection comparator generates a protection signal to turn off the MOSFET. An internal R/C filter has been included to filter switching noise. CS 4 OCP S ig n a l 40k 8pF 0 .8 V V OUT O v e r-C u rre n t P ro te c tio n C o m p a ra to r iL C IN1 CO Q Figure 9. Over-Current Protection Block C OSS 2.5 Switch Drive Block The FAN7530 contains a single totem-pole output stage designed specifically for a direct drive of a power MOSFET. The drive output is capable of up to 500mA peak sourcing current and 800mA peak sinking current with a typical rise and fall time of 50ns with a 1.0nF load. Additional circuitry has been added to keep the drive output in a sinking mode whenever the UVLO is active. The output voltage is clamped at 13V to protect the MOSFET gate even when the VCC voltage is higher than 13V. Figure 7. Current Flow During tzero In the ZCD block, there is an internal timer to provide a means to start or restart the switching if the drive output has been low for more than 150µs from the falling edge of the drive output. Without this timer, the PFC converter does not work because the inductor current is always zero when the IC initially starts operation and the ZCD winding voltage does not become positive without any switching. 2.3 Sawtooth Generator Block The output of the error amplifier and the output of the sawtooth generator are compared to determine the MOSFET turn-off instant. The slope of the sawtooth is determined by an external resistor connected at the maximum on time (MOT) pin. The voltage of the MOT pin is 2.9V and the slope is proportional to the current flowing output of the MOT pin. The maximum on time is determined when the output of the error amplifier is 5V. When a 40.5kΩ resistor is connected, the maximum on time is 24µs. As the resistance increases, the maximum on time increases, because the slope decreases. The MOSFET on time is zero when the output of the error amplifier is lower than 1V. © 2006 Fairchild Semiconductor Corporation Rev. 1.0.3 • 1/11/07 www.fairchildsemi.com 4 AN6027 APPLICATION NOTE 3.Circuit Components Design 3.1 Power Stage Design 4 ⋅ fsw (min) 1) Boost Inductor Design The boost inductor value is determined by the output power and the minimum switching frequency. The minimum switching frequency must be above the audio frequency (20kHz) to prevent audible noise. The maximum switching period, TS(max), is a function of Vin(peak) and Vo, the output voltage. It can have a maximum value at the highest input voltage or at the lowest input voltage according to Vo. Compare TS(max) at Vin(peak_min) and Vin(peak_max), then select the higher value for the maximum switching period. The boost inductor value can be obtained by Equation 6. ton = L ⋅ IL( peak ) (t ) Vin( peak ) sin(ωt ) = L⋅ = L⋅ toff = L ⋅ = L⋅ 2 ⋅ Iin( peak ) sin(ωt ) Vin( peak ) sin(ωt ) ⎞ ⎟ ⎟ ⎠ (6) The auxiliary winding voltage is lowest at the highest line. So the turn number of the auxiliary winding can be obtained by Equation 7. The voltage should be higher than the ZCD threshold voltage of 1.5V. 1.5V ⋅ NP Naux > (1) (7) (Vo − 2Vin( peak _ max) ) 3) Input Capacitor Design The voltage ripple of the input capacitor is maximum when the line is lowest and the load is heaviest. If fsw(min) >> fac, the input current can be assumed to be constant during a switching period. Vin( peak ) Inductor Current 2 ⋅ I in (2) Vo − Vin( peak ) sin(ωt ) 2 ⋅ Iin( peak ) sin(ωt ) Input Current Vo − Vin( peak ) sin(ωt ) 2 ⋅ Vo ⋅ Io η ⋅ Vin( peak ) I in t on / 2 (3) t on t off Figure 10. Input Current and Inductor Current Waveform During a Switch Cycle TS = ton + toff ⎛ ⎞ 1 sin(ωt ) = 2 ⋅ L ⋅ Iin( peak ) ⎜ + ⎟ (4) ⎜ Vin( peak ) Vo − Vin( peak ) sin(ωt ) ⎟ ⎝ ⎠ Vin( peak ) ⋅ sin(ωt ) ⎞ 4 ⋅ L ⋅ Vo ⋅ Io ⎛ = ⎜1+ ⎟ 2 ⎜ η ⋅ Vin( peak ) ⎝ Vo − Vin( peak ) sin(ωt ) ⎟⎠ 4 ⋅ L ⋅ Vo ⋅ Io (max) ⎛ Vin ( peak ) = ⎜1 + 2 ⎜ Vo − Vin ( peak ) η ⋅ Vin ( peak ) ⎝ ⎛ Vin ( peak ) ⋅ Vo ⋅ Io (max) ⎜ 1 + ⎜ V o − Vin ( peak ) ⎝ 2) Auxiliary Winding Design 2 ⋅ Iin( peak ) IL( peak ) (t ) Iin( peak ) = TS (max) η ⋅ Vin ( peak )2 L= ⎞ ⎟ ⎟ ⎠ Cin ≥ ≥ ≥ (5) 2 ton 2 0 ΔVin(max) ∫ Iin ( peak _ max) ⎛ ⎜⎜ Iin( peak _ max) − 2 ton ⎝ ton ⋅ Iin( peak _ max) 2 ⋅ ΔVin(max) ⎞ t ⎟⎟ dt ⎠ (8) L ⋅ Io2(max) ⋅ Vo2 ΔVin(max) ⋅ Vin3( peak _ min) The input capacitor must be larger than the value calculated by Equation 8 and the maximum input capacitance is limited by the input displacement factor (IDF), defined as IDF≡cosθ. As shown in Figure 11, the input capacitor generates 90° © 2006 Fairchild Semiconductor Corporation Rev. 1.0.3 • 1/11/07 www.fairchildsemi.com 5 AN6027 APPLICATION NOTE 4) Output Capacitor Design leading current, which causes phase difference between the line current and the line voltage. The phase difference increases as the capacitance of the input capacitor increases. Therefore, the input capacitor must be smaller than Cin(max) calculated by Equation 12. Cin(max) is the sum of all the capacitors connected at the input side. Va = VA = Vin( peak ) cos(ωt ) The output capacitor is selected by the relationship between the input and output power. As shown in Figure 13, the minimum output capacitance is determined by Equation 14. IIN (9) ID + + i A = i a + ic = Ia cos(ωt ) − ω ⋅ Cin ⋅ Vin( peak ) sin(ωt ) LOAD CO VIN i a = Ia cos(ωt ) IO PFC − (10) VO − Figure 12. PFC Configuration ⎛ ω ⋅ Cin ⋅ Vin( peak ) ⎞ ⎟⎟ Ia ⎝ ⎠ Ia = tan cos−1(IDF ) ω ⋅ Vin( peak ) θ = tan−1 ⎜⎜ Cin(max) ( = 2 ⋅ Vo ⋅ Io ω ⋅ Vin2( peak _ max) (11) Pin = Iin( rms ) ⋅ Vin( rms ) ⋅ (1 − cos(2ωt ) ) = IDVo ) ID = ( tan cos−1(IDF ) ) Iin ( rms ) ⋅ Vin( rms ) Vo (1 − cos(2ωt )) = Io ⋅ (1 − cos(2ωt ) ) (12) (13) ID(avg) = IO (1- cos(2ωt)) Lin iA ia iC + Cin VA − IO + PFC Circuit Va ΔVO = − IO ωCO VO Input Filter Figure 13. Diode Current and Output Voltage Waveform Im iA Co(min) ≥ iC θ ia 2π ⋅ fac ⋅ ΔVo(max) (14) 5) MOSFET and Diode Selection Re The maximum MOSFET RMS current is obtained by Equation 15 and the conduction loss of the MOSFET is calculated by Equation 16. When MOSFET turns on, the MOSFET current rises from zero, so the turn-on loss is negligible. The MOSFET turn-off loss and the MOSFET discharge loss are obtained by Equations 17 and 18, respectively. The switching frequency of the critical conduction mode boost PFC converter varies according to the line and load conditions. VA Figure 11. Input Voltage and Current Displacement Due to Input Filter Capacitance © 2006 Fairchild Semiconductor Corporation Rev. 1.0.3 • 1/11/07 Io(max) www.fairchildsemi.com 6 AN6027 APPLICATION NOTE The switching frequency is the average value during a line period. The total MOSFET loss can be calculated by Equation 19 and a MOSFET can be selected considering the MOSFET thermal characteristic. IQrms = IL( peak _ max) = η ⋅ Vin(LL ) 1 4 2 ⋅ Vin( LL ) − 6 9π ⋅ Vo 2 Pon = IQrms ⋅ RDSon = R o1 1 4 2 ⋅ Vin( LL ) − 6 9π ⋅ Vo 2 2 ⋅ Vo ⋅ Io(max) Pturn −off = PFC OUT 1 Cp (15) 4 Coss.Vo ⋅ Vo2 ⋅ fsw 3 + Pturn −off + Pdisch arg e Pdisch arg e = PMOSFET = Pon Figure 14. Output Voltage Sensing Circuit (17) The feedback loop bandwidth must be lower than 20Hz for the PFC application. If the bandwidth is higher than 20Hz, the control loop may try to reduce the 120Hz ripple of the output voltage and the line current may be distorted, decreasing the power factor. A capacitor is connected between COMP and GND to eliminate the 120Hz ripple voltage by 40dB. If a capacitor is connected between the output of the error amplifier and the GND, the error amplifier works as an integrator and the error amplifier compensation capacitor can be calculated by Equation 23. To improve the power factor, Ccomp must be higher than the calculated value. If the value is too high, the output voltage control loop may become slow. (18) (19) The diode average current can be calculated by Equation 20. The total diode loss can be calculated by Equation 21. Select a diode considering diode thermal characteristic. IDavg = Io(max) (20) PDiode = Vf ⋅ IDavg (21) Ccomp = gm ⋅ 3.2 Control Circuit Design 1) Output Voltage Sensing Resistor and Feedback Loop Design © 2006 Fairchild Semiconductor Corporation Rev. 1.0.3 • 1/11/07 Ro 2 0.01⋅ 2π ⋅ 120Hz ⋅ (Ro1 + Ro 2 ) (23) To improve the output voltage regulation, a resistor and a capacitor can be added to a simple integrator, as shown in Figure 15. The resistor, Rcomp, increases mid-band gain and the capacitor, Cfilter, which is 1/10~1/5 of the Ccomp, is used to filter high-frequency noise. The gain of the error amplifier with the circuit in Figure 15 is shown in Figure 16. The output voltage sensing resistors, Ro1 and Ro2, are determined by the output voltage at the high line by Equation 22. The output voltage sensing resistors cause power loss, therefore Ro1 should be higher than 1MΩ. Too high resistance can cause some delay of the OVP circuit due to internal capacitance (Cp), which may slightly increase the OVP level. Ro1 Vo _ high − 2.5 = Ro 2 2.5 R o2 (16) 1 Vo ⋅ IL( peak _ max) ⋅ tf ⋅ fsw 6 2 2 Vo ⋅ Io(max) ⋅ tf ⋅ fsw 3 η ⋅ Vin( LL ) INV (22) www.fairchildsemi.com 7 AN6027 APPLICATION NOTE crossing point of the AC line, as shown in Figure 18. To minimize the zero crossing distortion, COSS must be minimized and a larger inductor should be used. There is a limitation in minimizing COSS and using a large inductor because a small MOSFET increases MOSFET conduction loss and a larger inductor is more expensive. VOUT Error Amp Ro1 INV 1 Gm Ro2 Vref 3 INEG = (25) COMP IPEAK Rcomp tzero Inductor Current Cfilter Ccomp Coss ⋅ (Vo − Vin ) L 0A ton tdis INEG toff Figure 15. Error Amplifier Circuit n·(VOUT-VIN) VAUX Integrator C comp 0V -n·VIN Proportional gain R comp Delay Time Freq Vclamp ZCD Voltage C filter High frequency Noise filter Vth RZCD Delay 0V OUT Figure 16. Gain of the Error Amplifier Figure 17. ZCD Waveforms 2) Zero Current Detection Resistor Design If the RZCD is selected appropriately, the MOSFET can be turned on when the Vds voltage is minimum to reduce switching loss. It is recommended to design the RZCD to turn on the MOSFET when the Vds voltage is minimum. The ZCD current should be less than 10mA; therefore the zero current detection resistor, RZCD is determined by Equation 24. ⎛ N ⋅V ⎞ RZCD = ⎜ aux o − 5.8V ⎟ /10mA ⎜ Np ⎟ ⎝ ⎠ To improve the zero crossing distortion, the MOSFET turnon time should be increased near the AC line zero crossing point. If a resistor is connected between the MOT and the auxiliary winding, as shown in Figure 19, the function can be implemented easily. Because the auxiliary winding voltage is negatively proportional to the input voltage during the MOSFET turn-on time, the current I2 is proportional to the input voltage (as shown in Figure 19). Therefore, the slope of the internal ramp changes according to input voltage as the current flowing out of the MOT pin changes, as shown in Figure 20. I2 current is maximum at the highest line voltage and the zero crossing improvement is best when I2 is 100% ~ 200% of I1. R2 value should be chosen by experiment. (24) Because the ZCD pin has some capacitance, the ZCD resistor and the capacitor cause some delay for ZCD detection, as shown in Figure 17. Because of this delay, the MOSFET is not turned on when the inductor current reaches zero and the MOSFET junction capacitor and the inductor resonate. The inductor current changes its direction and flows negatively. The peak value of this negative current is determined by Equation 25. As shown in Equation 25, the negative current increases as the input voltage is close to zero and COSS increases. This negative current decreases average inductor current and causes zero crossing distortion near the zero © 2006 Fairchild Semiconductor Corporation Rev. 1.0.3 • 1/11/07 www.fairchildsemi.com 8 AN6027 APPLICATION NOTE 3) Start-up Circuit Design To start up the FAN7530, the start-up current must be supplied through a start-up resistor. The resistor value is calculated by Equations 26 and 27. The start-up capacitor must supply IC operating current before the auxiliary winding supplies IC operating current, maintaining VCC voltage higher than the UVLO voltage. The start-up capacitor is determined by Equation 28. Output Voltage 1st Input Current 3rd RST ≤ 5th Vin( peak _ min) − Vth(st )max PRST = CST ≥ Figure 18. Zero Crossing Distortion (26) IST max Vin2( rms _ max) ≤ 1W (27) Idcc 2π ⋅ fac ⋅ HY(ST )min (28) RST 4) Current Sense Resistor Design L AC IN VAUX I2 D The CS pin voltage is highest when the AC line voltage is lowest and the output power is maximum. The current sense resistor is determined by Equations 29 and 31, limiting the power loss of the resistor to under 1W. VO NAUX RZCD R2 ZCD Rsense < CO VCC FAN7529 INV PRsense MOT CS I1 COMP R1 0.8V IL( peak _ max) η ⋅ Vin( peak _ min) ⎛ Vo ⋅ Io(max) = 2⋅⎜ ⎜ ⎝ η ⋅ Vin( peak _ min) Rsense < GND = 0.8V 4 ⋅ Vo ⋅ Io(max) (29) 2 ⎞ ⎟ ⋅ Rsense < 1W ⎟ ⎠ 1 ⎛ η ⋅ Vin ( peak _ min) ⋅⎜ 2 ⎜⎝ Vo ⋅ Io(max) ⎞ ⎟ ⎟ ⎠ (30) 2 (31) Figure 19. Zero Crossing Improvement Circuit Ramp Slope Change Slope Decrease VAC Slope Increase VEAO On-time Increase Ramp Variable On-time On-time Decrease Figure 20. On-Time Variation According to VAC © 2006 Fairchild Semiconductor Corporation Rev. 1.0.3 • 1/11/07 www.fairchildsemi.com 9 AN6027 APPLICATION NOTE 4. Design Example A 100W converter is used here to illustrate the design procedure using a design spreadsheet. Enter the system parameters in the file to get the designed parameters. The system parameters are as follows: • • • • • • • • • Maximum output power Input voltage range Output voltage AC line frequency PFC efficiency Minimum switching frequency Input displacement factor (IDF) Input capacitor ripple voltage Output voltage ripple 100W 90Vrms~264Vrms 392V 60Hz 90% 37kHz 0.98 24V 8V 4.1 Inductor Design The boost inductor is determined by Equation 6. Calculate it at both the lowest voltage and the highest voltage of the AC line and choose the lower value. The calculated value in this example is 403µH. To get the calculated inductor value, EI30 core is used and the primary winding is 44 turns. The air gap is 0.6mm at both legs of the EI core. The auxiliary winding number, determined by Equation 7, is five; but if more windings are used, the number is six. ZCD pin and the ground to increase the delay time for the MOSFET minimum voltage turn-on. 4.7 Start-up Circuit Design The maximum start-up resistor is 1.63MΩ and the minimum is 140kΩ, as determined by Equations 26-27. The selection is 330kΩ. The VCC capacitance must be larger than 7µF, calculated by Equation 28, so the selected value is 47µF. 4.8 Current Sense Resistor Design The maximum current sense resistance is 0.23Ω as a result of Equation 31 and the selected value is 0.2Ω. 4.9 MOT Resistor Design The MOT resistor is determined to get the maximum on-time when the AC line voltage is lowest and the output power is maximum. The calculated value is 20.44kΩ and the maximum on-time is 12.26µs. To improve THD performance, a 33kΩ resistor is used for the MOT resistor and a 370kΩ resistor is connected between the MOT pin and the auxiliary winding. The maximum on-time is determined by Equation 32 and the MOT resistor is determined by Equation 33. MOT = 4.2 Input Capacitor Design The minimum input capacitance is determined by the input voltage ripple specification. The calculated minimum input capacitor value is 0.33µF. The maximum input capacitance is restricted by the IDF. The calculated value is 0.77µF. The selected value is 0.63µF (sum of all the capacitors connected to the input side, C1, C2, C3, C4, and C5). 4.3 Output Capacitor Design The minimum output capacitor is determined by Equation 14 and the calculated value is 85µF. The selected value for the capacitor is 100µF. 4.4 MOSFET and Diode Selection RMOT > (33) Error Amp. Output Switching Nosie The upper output voltage sense resistor is chosen to be 2MΩ and the bottom output voltage sense resistor is 12.6kΩ. The error amplifier compensation capacitance must be larger than 0.1µF, as calculated by Equation 23. Therefore, 0.22µF capacitor is used. © 2006 Fairchild Semiconductor Corporation Rev. 1.0.3 • 1/11/07 MOT × 1012 600 (32) As shown in Figure 21, noise voltage can be added to the internal ramp signal during MOSFET turn-on. Because of this noise, the AC line current waveform can be distorted if the error amplifier output voltage is close to 1V. It is recommended to use higher resistor for MOSFET turn-on if there is waveform distortion and use a turn-off diode to speed up the turn-off process. 4.5 Output Voltage Sense Resistor and Feedback Loop Design The calculated value is 3.1kΩ and the selected value is 20kΩ. A 47pF ceramic capacitor is connected between the ⋅ 10−6 4.10 MOSFET Gate Drive Resistor Design By calculating Equations 15-19, a 500V/13A MOSFET FQPF13N50C is selected, and a 600V/1A diode BYV26C is selected by the result of Equations 20-21. 4.6 Zero Current Detection Resistor Design 2 ⋅ L ⋅ Po η ⋅ Vin2( rms _ min) Internal Ramp Signal IC OUT Signal Figure 21. Turn-on Noise on Internal Ramp Signal Figure 22 shows the designed application circuit diagram and Table 2 shows the 100W demo board components list. www.fairchildsemi.com 10 AN6027 APPLICATION NOTE T1 PFC OUTPUT VAUX D2 C5 R4 R3 R5 V1 5 6 C6 CS COMP R1 R8 F1 ZCD 7 R11 4 2 1 INV C1 C9 FAN7530 R2 3 C2 R6 C11 OUT Vcc 8 D1 GND ZD1 C3 C4 LF1 Q1 MOT NTC R10 D3 C10 R9 BD C7 R7 C8 AC INPUT Figure 22. Application Circuit Schematic © 2006 Fairchild Semiconductor Corporation Rev. 1.0.3 • 1/11/07 www.fairchildsemi.com 11 AN6027 APPLICATION NOTE Table 2. 100W Demo Board Part List PART# VALUE NOTE PART# Fuse F1 V1 RT1 VALUE NOTE Capacitor 250V/3A C1 150nF/275VAC Box Capacitor TNR C2 470nF/275VAC Box Capacitor C3,C4 2.2nF/3kV Ceramic Capacitor NTC C6 22µF/25V Electrolytic Capacitor 10D-9 C7 47nF/50V Ceramic Capacitor Resistor C8 220nF MLCC 471 470V R1 42kΩ 1/4W C9 100µF/450V Electrolytic Capacitor R2 370kΩ 1/4W C10 12nF/100V Film Capacitor R3 330kΩ 1/2W C11 47pF/50V Ceramic Capacitor R4 150Ω 1/2W R5 20kΩ 1/4W BD KBL06 Fairchild R6 100Ω 1/4W D1 1N4148 Fairchild R7 0.2Ω 1/2W D2 BYV26C 600V/1A R8 10kΩ 1/4W D3 SB140 Fairchild R9 10kΩ 1/4W ZD1 1N4746 Fairchild R10 2MΩ 1/4W R11 12.6kΩ 1/4W IC1 LF1 Diode Inductor T1 400µH(44T:6T) EI3026 IC Primary: 0.2φ*10, from Pin 5 to Pin 3 FAN7530 Secondary: 0.2φ, from Pin 2 to Pin 4 Line Filter MOSFET 38mH Wire 0.45mm Q1 FQPF13N50C 500V/13A Table 3. Performance Data 100W 50W 90VAC 110VAC 220VAC 264VAC PF 0.999 0.998 0.991 0.985 THD 3.97% 4.43% 5.25% 5.47% Efficiency 90.3% 92.7% 94.7% 95.2% PF 0.998 0.997 0.974 0.956 THD 4.81% 5.28% 6.74% 7.67% Efficiency 90.1% 90.8% 91.7% 92.5% © 2006 Fairchild Semiconductor Corporation Rev. 1.0.3 • 1/11/07 www.fairchildsemi.com 12 AN6027 APPLICATION NOTE Table 4. 200W Demo Board Part List (600µH, Wide Input Range Application) PART# VALUE NOTE PART# VALUE Fuse F1 V1 RT1 NOTE Capacitor 250V/5A C1 470nF/275VAC Box Capacitor TNR C2 470nF/275VAC Box Capacitor C3,C4 2.2nF/3kV Ceramic Capacitor NTC C6 47µF/25V Electrolytic Capacitor 10D-9 C7 47nF/50V Ceramic Capacitor Resistor C8 220nF MLCC 471 470V R1 37kΩ 1/4W C9 220µF/450V Electrolytic Capacitor R2 250kΩ 1/4W C10 12nF/100V Film Capacitor R3 330kΩ 1/2W C11 47pF/50V Ceramic Capacitor R4 150Ω 1/2W R5 20kΩ 1/4W BD KBU8K Fairchild R6 100Ω 1/4W D1 1N4148 Fairchild R7 0.1Ω 1W D2 SUF30J 600V/3A R8 10kΩ 1/4W D3 SB140 Fairchild R9 10kΩ 1/4W ZD1 1N4746 Fairchild R10 2MΩ 1/4W R11 12.6kΩ 1/4W IC1 LF1 Diode Inductor T1 200µH(30T:3T) PQ3230 IC Primary: 0.1φ*100, from Pin 5 to Pin 3 FAN7530 Secondary: 0.2φ, from Pin 2 to Pin 4 Line Filter MOSFET 22mH Wire 0.7mm Q1 FDPF20N50 Fairchild Table 5. Performance Data 200W 150W 100W 85VAC 115VAC 230VAC 265VAC PF 0.999 0.998 0.993 0.990 THD 3.8% 4.3% 6.5% 6.5% Efficiency 91.8% 94.8% 96.9% 97.3% PF 0.999 0.998 0.990 0.985 THD 4.7% 5.2% 7.0% 6.9% Efficiency 93.3% 95.5% 96.9% 97.0% PF 0.997 0.996 0.981 0.971 THD 6.5% 7.4% 9.0% 8.5% Efficiency 94.3% 95.3% 96.2% 96.0% © 2006 Fairchild Semiconductor Corporation Rev. 1.0.3 • 1/11/07 www.fairchildsemi.com 13 AN6027 APPLICATION NOTE Table 6. 300W Wide Input Range Application Part List PART# VALUE NOTE PART# Fuse F1 V1 RT1 VALUE NOTE Capacitor 250V/5A C1 680nF/275VAC Box Capacitor TNR C2 680nF/275VAC Box Capacitor C3,C4 2.2nF/3kV Ceramic Capacitor NTC C6 47µF/25V Electrolytic Capacitor 6D-22 C7 33nF/50V Ceramic Capacitor Resistor C8 220nF MLCC 471 470V R1 60kΩ 1/4W C9 33µF/450V Electrolytic Capacitor R2 330kΩ 1/4W C10 12nF/100V Film Capacitor R3 330kΩ 1/2W C11 9pF/50V Ceramic Capacitor R4 100Ω 1/2W R5 20kΩ 1/4W BD KBU8J Fairchild R6 100Ω 1/4W D1 1N4148 Fairchild R7 0.06Ω 1W D2 SUF30J 600V/3A R8 10kΩ 1/4W D3 SB140 Fairchild R9 10kΩ 1/4W ZD1 1N4746 Fairchild R10 2MΩ 1/4W R11 12.6kΩ 1/4W IC1 LF1 Diode Inductor T1 200µH(36T:3T) PQ3535 IC Primary: 0.1φ, *100, from Pin 5 to Pin 3 FAN7530 Secondary: 0.2φ, from Pin 2 to Pin 4 Line Filter MOSFET 40mH Wire 1mm Q1 FQA28N50 Fairchild Table 7. Performance Data 300W 225W 150W 75W 85VAC 115VAC 230VAC 265VAC PF 0.999 0.998 0.993 0.988 THD 4.5% 4.7% 6.4% 6.5% Efficiency 91.4% 94.5% 97.4% 97.7% PF 0.999 0.998 0.989 0.982 THD 3.9% 4.7% 6.1% 6.2% Efficiency 92.8% 95.1% 97.4% 97.7% PF 0.998 0.997 0.978 0.963 THD 4.8% 5.8% 7.4% 7.4% Efficiency 94.0% 95.7% 97.0% 97.3% PF 0.994 0.989 0.929 0.885 THD 9.3% 10.8% 11.2% 12.0% Efficiency 94.8% 95.9% 95.3% 95.2% © 2006 Fairchild Semiconductor Corporation Rev. 1.0.3 • 1/11/07 www.fairchildsemi.com 14 AN6027 APPLICATION NOTE Nomenclature RST: start-up resistance Ccomp: compensation capacitance Rzcd: zero current detection resistance CIN: input capacitance tf: MOSFET current falling time COUT: output capacitance toff: switch off time CST: start-up capacitance ton: switch on time fac: AC line frequency TS: switching period fsw(max): maximum switching frequency Vin (peak): input voltage peak value fsw(min): minimum switching frequency Vin (peak_low): input voltage peak value at low line fsw: switching frequency Vin (peak_max): maximum input voltage peak value HY(ST) min: minimum UVLO hysteresis Vin (peak_min): minimum input voltage peak value ID: boost diode current Vin (rms): input voltage RMS value IDavg: diode average current Vin (rms_max): maximum input voltage RMS value IDrms: diode RMS current Vin (rms_min): minimum input voltage RMS value Iin (peak): input current peak value Vin (t): input voltage Iin (peak_max): maximum of the input current peak value VO or VOUT: output voltage Iin (rms): input current RMS value ΔVin (max): maximum input voltage ripple Iin (t): input current ΔVO (max): maximum output voltage ripple IL (t): inductor current η: converter efficiency IL(peak) (t): inductor current peak value during one switching ω: AC line angular frequency cycle IL(peak): inductor current peak value during one AC line cycle IL(peak_max): maximum inductor current peak value IO (max): maximum output current IO: output current IQrms: MOSFET RMS current ISTmax: maximum start-up supply current L: boost inductance Naux: auxiliary winding turn number NP: boost inductor turn number Pin: input power PO(max): maximum output power PO: output power Rsense: current sense resistance © 2006 Fairchild Semiconductor Corporation Rev. 1.0.3 • 1/11/07 www.fairchildsemi.com 15 AN6027 APPLICATION NOTE DISCLAIMER FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION, OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. LIFE SUPPORT POLICY FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, or (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reason ably expected to result in significant injury to the user. © 2006 Fairchild Semiconductor Corporation Rev. 1.0.3 • 1/11/07 2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. www.fairchildsemi.com 16 www.fairchildsemi.com AN-8025 Design Guideline of Single-Stage Flyback AC-DC Converter Using FAN7530 for LED Lighting output should be controlled by CC mode in the normal state while CV mode only works as over voltage protection. Summary This application note describes the single-stage power factor correction (PFC) and presents the design guidelines of a 75W universal-input, single-stage PFC for LED lighting applications. Flyback converter topology controlled by the critical conduction mode control IC, FAN7530 is applied and several functions; such as CV/CC mode feedback circuits, cycle-by-cycle current limit, soft-starting function, and so on, are considered for LED lighting applications. Introduction Figure 2. Despite large output voltage ripple, single-stage AC-DC conversion is a more attractive solution than two-stage conversion from the standpoint of the cost and power density. Especially in applications like battery chargers, Plasma Display Panel (PDP)-sustaining power supplies, and LED lighting; low frequency, 100Hz or 120Hz, large output voltage ripple is inconsequential. Circuit Diagram of a Flyback AC-DC Converter Single-stage AC-DC converter directly converts AC input voltage to the DC output voltage without a pre-regulator, as shown in Figure 1. This application note presents a 75W single-stage AC-DC converter for LED lighting. As a power-conversion topology, flyback converter is normally chosen because it doesn’t need an inductive output filter; the main transformer works as an inductive filter itself. Figure 3. Block Diagram of FAN7530 Figure 3 shows the block diagram of FAN7530. Its major features are: Figure 1. Single-Stage AC-DC Converter Figure 2 shows the circuit diagram of a flyback AC-DC converter. FAN7530 is used as a controller and both CV (constant voltage) and CC (constant current) mode feedback circuits are applied to prevent overload and over-voltage conditions. In LED lighting, the output is always full-load condition and the forward voltage drop of LED decreases if the junction temperature of LED increases. Therefore the © 2009 Fairchild Semiconductor Corporation Rev. 1.0.1 • 12/29/09 Fixed On Time CRM PFC Controller Zero Current Detector (ZCS) & Valley Switching MOSFET Over-Current Protection Low Startup (40μA) and Operating Current (1.5mA) Totem Pole Output with High State Clamp +500/-800mA Peak Gate Drive Current FAN7530 is a voltage-mode CRM PFC controller; the turnon time of switch is fixed while the turn-off time is varied during the steady state. Therefore, the switching frequency varies in accordance with the input voltage variation shown in Figure 4. www.fairchildsemi.com AN-8025 APPLICATION NOTE A proper turn ratio, N1/N2, should also be considered in a flyback single-stage AC-DC converter because the maximum voltage rating of the MOSFET and Fast Recover Diode (FRD) strongly relates to the turn ratio of transformer. There is a trade-off relationship between the drain-to-source voltage rating, Vdss, of MOSFET and the reverse voltage rating, VR, of the FRD in accordance with the turn ratio of the transformer. A larger turn ratio (N1/N2) requires a higher VR of FRD while Vdss, of MOSFET is decreased. In contrast, a lower turn ratio causes a higher voltage stress on the MOSFET, while VR of the FRD is decreased. Figure 6 shows the trade-off relationship between Vdss of the MOSFET and VR of the FRD. Vin / Iin Vin Average input current fs Figure 4. Switching Frequency Variation Figure 5. Theoretical Waveforms Figure 5 illustrates the theoretical waveforms of the primary-side switch current, the secondary-side diode current, and gating signal. MOSFET Q turns on and Fast Recovery Diode (FRD) Do turns off under zero-current condition, while Q turns off and Do turns on under the hardswitching condition. Figure 6. From Po=ηVinIin, the maximum line current Iin(max) = Po/ηVin(min). If switching frequency fs is much higher than the AC line frequency, fac, the input current can be assumed to be constant during one switching period. To define the magnetizing inductance of transformer, the largest period must be defined. The largest switching period occurs at the peak of input current, Iin(max)_pk, when the minimum input voltage is applied. It can be defined as: Design Example A design guideline of 75W single-stage flyback AC-DC converter using FAN7530 is presented. The applied system parameters are shown in Table 1. Table 1. Iin (max) _ pk = System Parameters Parameter Value Output Power 75W Input Voltage Range 85~265VAC Output Voltage 45V Output Limit Voltage 50V Duty Ratio at Iin(max)_pk, D@ Iin(max)_pk 0.6 Minimum Switching Frequency, fs_min@ Vin_min 50kHz Efficiency, η 85% DIQ (max) _ pk 1 DT IQ (max) _ pk t dt = ∫ T 0 DT 2 (1) 2 I in (max) _ pk D (2) I Q (max) _ pk = where D = D@ Iin( max ) _ pk , Iin (max) _ pk = respectively. 2 I in (max) , and Vin (min) _ pk = 2Vin (min) , The transformer primary-side voltage, VT, is defined as: VT = Lm I f ΔI = Lm Q (max) _ pk s (min) ΔT D@ Iin(max)_pk (3 ) Therefore, the magnetizing inductance is calculated by: 1. Flyback Transformer Design In flyback converter, the transformer is easily saturated because the transformer is only utilized in the first quadrant of B-H loop. Moreover, if it works under the critical conduction mode, the peak current is much higher than that of the continuous conduction mode. Therefore, air-gap should be inserted to prevent saturation of the transformer. © 2009 Fairchild Semiconductor Corporation Rev. 1.0.1 • 12/29/09 Trade-Off Between VDS and VR Lm ≥ D@ Iin(max)_pk 2Vin (min) 2 I in (max) _ pk f s (min) = 0.62 × 85 2 ×1.04 × 50 × 103 (4 ) −6 = 294 × 10 From Equation (4) and Table 1, the calculated magnetizing inductance is 294μH. www.fairchildsemi.com 2 AN-8025 APPLICATION NOTE There are several methods defining the turn number for the desirable inductance, but using the AL-value is the most common and the easiest. The turn number can be obtained with AL-value as: The maximum reverse voltage and the forward peak current of the FRD are: L AL − value 17 = 50 + × 2 × 265 = 195V 44 2 2 75 = Io = × = 7.5 A 1 − D@ Iin (max) _ pk (1 − 0.6 ) 45 N= VR (max) = Vo _ Limit + (5 ) However, if air-gap is inserted into the magnetic core, a designer should find the AL-value. To obtain AL-value, wind several turns into a bobbin and measure the inductance, then calculate AL-value with the equation: AL − value = L N2 I R _ pk ( N2 Vin (max) _ pk N1 ) (12) (13) respectively. Therefore, the Ultra-Fast Rectifier Diode (UFRD), F06UP20S (200V, 6A, VF=1.15V), is finally chosen in consideration of the margins. (6 ) 3. Snubber Circuit Design Once the AL-value is obtained, calculate the turn number using Equation (6). In flyback converter, the resonant between Lleak and Coss causes an excessively high voltage surge that causes damage to the MOSFET during turn-off. This voltage surge must be suppressed and a snubber circuit is therefore necessary to prevent MOSFET failures. Applying coil dummy EER3435 with 0.33mm of air gap for the transformer and 14.9μH is measured when 10 turns are winded into the core and 0.149×10-6 of AL-value is obtained. Therefore, the calculated primary-side turn number is 44.4 from Equation (6) and finally determines 44 as the primary-side turn number. (The actual inductance is measured as 330μH.) The secondary-side turn number is obtained as 17 turns by following equation: N2 = π N1Vo (1 − Dmax ) 2 2 DmaxVin (min) = π × 44 × 45(1 − 0.6) 2 2 × 0.6 × 85 = 17 (7 ) 2. MOSFET and FRD The voltage stress of MOSFET is calculated as: Vds (max) = Vin (max) _ pk + Vsn (max) = Vin (max) _ pk + V f + VLk (8 ) where Vsn is the maximum capacitor voltage of the snubber circuit, Vf is the flyback voltage, and VLr is the ringing voltage at the leakage inductance of the transformer. Vf is derived by N1Vo/N2 and VLr is normally estimated as 1.5 times of the flyback voltage, Vf. Therefore, the maximum voltage of MOSFET is obtained as: 44 ⎛ 44 ⎞ Vds (max) = 2 × 265 + × 45 + 1.5 ⎜ × 45 ⎟ = 665.94V (9) 17 ⎝ 17 ⎠ The maximum rms current and the peak current are: Po 75 I in (max) = = = 1.04 A (10) ηVin (min) 0.85 × 85 Figure 7. The clamping voltage by snubber is: Vsn = V f + Lleak I Q (max) _ pk = η D@ Iin(max)_pkVin (min) 2 2 × 75 = = 4.89 A 0.85 × 0.6 × 85 ts = (11) (14) Lleak × I Dsn _ pk Vsn − V f = Lleak × I Dsn _ pk 1.5V f (15) The maximum power dissipation of the snubber circuit is determined by: respectively. Therefore, an N-Channel enhancement-mode MOSFET, FQPF8N80C (800V, 8A, RDS_ON = 1.55Ω), is chosen in consideration of the margins. © 2009 Fairchild Semiconductor Corporation Rev. 1.0.1 • 12/29/09 I Dsn _ pk Δi = V f + Lleak Δt ts Therefore: and 2 2 Po Snubber Circuit Psn = 1 ts 1 VsniDsn (t )dt = Lleak I Dsn _ pk 2 f s ∫ 0 2 T (16) www.fairchildsemi.com 3 AN-8025 APPLICATION NOTE The maximum power dissipation is: Psn (max) = 4. Sensing Resistor 2 v 1 Lleak I Dsn _ pk 2 f s @ vin max = c Rsn 2 The CS pin of FAN7530 limits the peak current and protects the MOSFET during transient state or over load condition. Normally, it is reasonable to limit to 1.5 times the switching peak current. The limiting level of switching peak current and the sensing resistor are obtained as: (17) where vc=Vsn=Vf +VLr. Therefore, the resistance, Rsn, is determined by: Rsn = 2vc 2 Lleak I Dsn _ pk 2 f s @ vin max (18) The maximum ripple voltage of the snubber circuit is obtained by: Δvc = vc Csn Rsn f s @ vin max (19) The larger snubber capacitor results, the lower voltage ripple, but the power dissipation increases. Consequently, selecting the proper value is important. In general, it is reasonable to determine that the surge voltage of snubber circuit, Vsur is 1.5 times of the flyback voltage, Vf and the ripple voltage, Δvc is 50V. Thus, the snubber resistor and capacitor are determined by the following equations: I Dsn _ pk @Vin = 265V = 2 2 Po η DminVin = 1.5 × N1 Vo _ Limit N2 44 50 = 194.1V 17 15 ×10−6 × 2.85 = 220.3n s 194.1 DminVsur f s @ vin( max ) = Lm I Dsn _ pk @Vin= 265V ts = 0.33 × 194 = 75.63kHz 297 ×10−6 × 2.85 2 ×1942 Rsn = = 23.3k Ω 15 × 10−6 × 2.85 × 75.63kHz Csn = = Switching Current Limit I Q _ Limit = 1.5I Q (max) _ pk = 1.5 × 2 2 × 75 = = 2.85 A 0.85 × 0.33 × 265 Vsur = 1.5V f = 1.5 × Figure 8. Vsn Δvc × Rsn × f s @ vin( max ) 194 + 129 = 3.67nF 50 × 23.3 × 2.85 × 75.63 × 103 (20) 2 Dmax ⎛ Po ⎞ ⎜⎜ 2 ⎟⎟ ⎝ ηVin (min) ⎠ 2 ⎛ 75 ⎞ ⎜ 2 ⎟ = 7.4 A 0.6 ⎝ 0.85 × 85 ⎠ 0.8 0.8 Rs ≤ = = 0.11Ω I Q _ Limit 7.4 (27) = 1.5 × (21) (28) 5. Soft-starting Circuit (22) (23) (24) (25) where the minimum duty ratio is obtained as: Dmin = = Vo N2 Viavg (max) + Vo N1 45 ⎞ 17 ⎛ 2 2 ×⎜ × 265 ⎟ + 45 44 ⎝ π ⎠ = 0.33 (26) Figure 9. © 2009 Fairchild Semiconductor Corporation Rev. 1.0.1 • 12/29/09 Soft-Starting Circuit www.fairchildsemi.com 4 AN-8025 APPLICATION NOTE Since the FAN7530 is designed for a non-isolated boost PFC circuit, some circuits are added externally. The internal disable amplifier can be used as soft-start function when FAN7530 is applied to non-isolated PFC circuit. However, the disable amplifier can not participate in the operation if it is applied to isolated single stage PFC circuit because the initial voltage at Pin 1 is zero and FAN7530 can not start. To exclude the disable amplifier from operation, over 0.5V of voltage must be applied through a blocking diode, as shown in Figure 9(a). Experimental Results To verify the validity of the design guideline in this application note, a prototype test set-up was built and tested. The design parameter and component values are shown in the appendix. Figure 11shows the input voltage and current at 110VAC input and 220VAC input conditions. The power factors at 110VAC and 220VAC condition are measured as 0.997 and 0.955, respectively. The initial VFB is approximately defined as: VFB _ initial R1 RFB = ⋅VCC RFB ( R1 + R2 ) + R1R2 Figure 12 shows the waveforms of the switching voltage and current, which shows the switching current waveforms following the shape of the input voltage well. The switch is turned on at zero current condition. (29) To prevent MOSFET failure due to the initial excessive switching current, an external soft-start function is necessary. The circuit shown in Figure 9(b) makes the output voltage of E/A increase slowly and, consequently, the converter can be smoothly started in accordance with the gradual increase of the on time. Line Voltage @ 110Vac Line Current 6. Voltage and Current Feedback Power supplies for LED lighting must be controlled by constant current (CC) mode as well as a constant voltage (CV) mode. Because the forward voltage drop of LED varies with the junction temperature and the current also increases greatly consequently, devices can be damaged. PF=0.997 @ 220Vac Figure 10 shows an example of a CC and CV mode feedback circuit. During normal operation, CC mode is dominant and CV mode only acts as OVP for abnormal modes. VCC VCC_2 PF=0.955 Vo C7 R6 R5 C8 Figure 11. R1 R8 VCC_2 ISO1 D4 R12 VFB 8 1 U1A 4 C12 D8 R21 7 U1B + 2 3 R17 + 6 R10 R11 Vref2 R18 R13 R19 R20 Vref2 5 R22 R24 Figure 10. Input Voltage and Current Io_sen R25 Example of CC & CV Feedback Circuit (a) at 110 Vac Input Figure 12. © 2009 Fairchild Semiconductor Corporation Rev. 1.0.1 • 12/29/09 (b) at 220 Vac Input Switching Voltage and Current www.fairchildsemi.com 5 AN-8025 APPLICATION NOTE Figure 13. Drain-Source Voltage and Switching Current at 265VAC Input Condition Figure 13 shows the waveforms of the drain-source voltage and current of 265V of input line voltage, the maximum input voltage, is applied. The voltage ripple of snubber circuit is measured at 54V and the maximum voltage stress is 688V, which shows the actual results are approximately in accord with the calculation. Since the maximum voltage is 688V, 800V rating MOSFET is needed for wide input voltage range. Figure 15. In the case of 220Vac input, the maximum efficiency is measured as 85.95% at full-load condition 75W. In LED lighting, LED strings are driven by the rating current and the power supply should be operated under the full-load condition. Therefore, the power supply is controlled by constant current during normal condition. Figure 15 shows the V-I characteristics of the prototype experimental set-up. The result verifies that the output is driven well by the constant current control for whole input voltage condition. The efficiency characteristics according to the load variation for 110 Vac and 220 Vac of the input conditions are plotted in Figure 14. In the case of 110V ac input, the maximum efficiency is measured as 85.17% at 45W load condition. Figure 14. Output V-I Characteristic Efficiency Comparison © 2009 Fairchild Semiconductor Corporation Rev. 1.0.1 • 12/29/09 www.fairchildsemi.com 6 © 2009 Fairchild Semiconductor Corporation Rev. 1.0.1 • 12/29/09 Figure 16. 7 ZC VFB VCC J1 R23 FUSE1 L1 LF1 R26 C5 C15 D6 R15 R14 C11 C3 R27 R28 C17 R16 C18 D7 C4 D5 BD1 GND ZCD COMP CS FAN7530 OUT VCC D2 I_sense MOT INV U3 C9 VCC R4 GATE C5 C16 R29 C14 DZ1 R2 VCC D3 R3 Q1 D1 R7 RS2 ZC GATE C1 RZ1 RZ2 RZ3 VFB N3_2 N3_3 N1 5 4 3 7 1 R6 DO2 DO1 D8 D4 R5 VCC_2 N3_1 N2 VCC ZC 8 9 11 14 ISO1 T1 R21 R12 C6 8 U1B 7 C12 3 2 + 5 6 R17 + VCC_2 R8 CO1 CO2 C2 C7 U1A 4 1 C8 VCC_2 R24 R22 R20 R18 Vref2 R11 RS1 Vref2 R25 R19 R13 R10 RO1 R1 Io_sen Vref2 U2 R9 VCC_2 C10 Io_sen J2 Vo AN-8025 APPLICATION NOTE Schematic Schematic www.fairchildsemi.com AN-8025 APPLICATION NOTE Part List Component Symbol Value/Part Number Rectifier BD1 Symbol Value/Part Number GBU8J R1 49.9kΩ C1 472/1kV R2 15Ω C2 104 R3 1.5kΩ C3 220nF R4 56kΩ/2Watt C4 440nF R5 3.3kΩ C5 474/NP/630V R6 11kΩ C6 33µ/35V R7 1.5/1W C7 473 R8 100kΩ C8 224 R9 1.2kΩ C9 33µ/35V R10 47kΩ C10 105 R11 50kΩ C11 224 R12 11kΩ C12 155 R13 5.1kΩ C13 33µ/35V R14 1.2kΩ C14 105 R15 10kΩ C15 683 R16 33Ω C16 56p R17 10kΩ C17 473 R18 2kΩ C18 224 R19 10Ω CO1 2200µ/63V R20 2kΩ CO2 2200µ/63V R21 8.2kΩ D1 UF4005 R22 2kΩ D2 RGF1J R23 330kΩ D3 UF4005 R24 2.1kΩ D4 1N4148 R25 33Ω D5 1N4148 R26 30kΩ D6 1N4148 R27 5.1kΩ D7 1N4148 R28 100kΩ D8 1N4148 R29 47kΩ DO1 F06UP20S RO1 56kΩ/2Watt DO2 UF4005 RS1 0.05Ω/5Watt Zener diode DZ1 1N4746(18V) RS2 0.1Ω/5Watt Fuse FUSE1 FUSE RZ1 56kΩ/2Watt Opto-coupler ISO1 PC817 RZ2 56kΩ/2Watt J1 CON4 RZ3 56kΩ/2Watt Capacitor Diode Connector Component Resistor J2 CON4 Transformer T1 EER3435 Inductor L1 330µH Op-Amp. U1A,B KA358 Chock-coil LF1 EMI_CHOCK Regulator U2 KA431E MOSFET Q1 FQPF8N80C PFC IC U3 FAN7530 © 2009 Fairchild Semiconductor Corporation Rev. 1.0.1 • 12/29/09 www.fairchildsemi.com 8 AN-8025 APPLICATION NOTE Related Datasheets FAN7527 — Boundary Mode PFC Control IC FAN7528 — Dual-Output Critical Conduction Mode PFC Controller FAN7529 — Critical Conduction Mode PFC Controller FAN7530 — Critical Conduction Mode PFC Controller Author by Jae-Eul Yeon/Ph. D. HV-PCIA/Fairchild Korea Semiconductor +82-32-680-1935 E-mail : [email protected] DISCLAIMER FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION, OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. LIFE SUPPORT POLICY FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, or (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. © 2009 Fairchild Semiconductor Corporation Rev. 1.0.1 • 12/29/09 2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. www.fairchildsemi.com 9