TI TLC0834INE4

TLC0834C, TLC0834I, TLC0838C, TLC0838I
8-BIT ANALOG-TO-DIGITAL CONVERTERS WITH SERIAL CONTROL
SLAS094E – MARCH 1995 – REVISED OCTOBER 2000
D
D
D
D
D
D
D
8-Bit Resolution
Easy Microprocessor Interface or
Stand-Alone Operation
Operates Ratiometrically or With 5-V
Reference
4- or 8-Channel Multiplexer Options With
Address Logic
Input Range 0 to 5 V With Single 5-V Supply
Remote Operation With Serial Data Link
D
D
D
Inputs and Outputs Are Compatible With
TTL and MOS
Conversion Time of 32 µs at
fclock = 250 kHz
Functionally Equivalent to the ADC0834
and ADC0838 Without the Internal Zener
Regulator Network
Total Unadjusted Error . . . ±1 LSB
description
These devices are 8-bit successive- approximation analog-to-digital converters, each with an
input-configurable multichannel multiplexer and serial input/output. The serial input/ output is configured to
interface with standard shift registers or microprocessors. Detailed information on interfacing with most popular
microprocessors is readily available from the factory.
The TLC0834 (4-channel) and TLC0838 (8-channel) multiplexer is software-configured for single-ended or
differential inputs as well as pseudodifferential input assignments. The differential analog voltage input allows
for common-mode rejection or offset of the analog zero input voltage value. In addition, the voltage reference
input can be adjusted to allow encoding of any smaller analog voltage span to the full 8 bits of resolution.
The TLC0834C and TLC0838C are characterized for operation from 0°C to 70°C. The TLC0834I and TLC0838I
are characterized for operation from – 40°C to 85°C. The TLC0834Q is characterized for operation from – 40°C
to 125°C.
TLC0834 . . . PW PACKAGE
(TOP VIEW)
TLC0834 . . . D OR N PACKAGE
(TOP VIEW)
NC
CS
CH0
CH1
CH2
CH3
DGTL GND
1
14
2
13
3
12
4
11
5
10
6
9
7
8
VCC
DI
CLK
SARS
DO
REF
ANLG GND
NC
CS
CH0
CH1
CH2
CH3
DGTL GND
NC
1
16
2
15
3
14
4
13
5
12
6
11
7
10
8
9
VCC
NC
CS
SARS
DO
REF
ANLG GND
NC
NC – No internal connection
TLC0838 . . . PW, DW, OR N PACKAGE
(TOP VIEW)
CH0
CH1
CH2
CH3
CH4
CH5
CH6
CH7
COM
DGTL GND
1
20
2
19
3
18
4
17
5
16
6
15
7
14
8
13
9
12
10
11
VCC
NC
CS
DI
CLK
SARS
DO
SE
REF
ANLG GND
AVAILABLE OPTIONS
PACKAGE
TA
SMALL
OUTLINE
(D)
SMALL
OUTLINE
(DW)
PLASTIC DIP
(N)
TSSOP
(PW)
0°C to 70°C
TLC0834CD
TLC0838CDW
TLC0834CN
TLC0838CN
TLC0834CPW TLC0838CPW
– 40°C to 85°C
TLC0834ID
TLC0838IDW
TLC0834IN
TLC0838IN
TLC0834IPW TLC0838IPW
– 40°C to 125°C
—
—
TLC0834QN
—
—
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright  2000, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
1
CS
DI
(see Note A)
Start
Flip-Flop
16
18
CS
18
CLK
17
15
R
D
SARS
S
5-Bit Shift Register
R
CLK
SELECT0 SELECT1
TLC0838
Only
SE
POST OFFICE BOX 655303
TLC0834
TLC0838
• DALLAS, TEXAS 75265
CH0
CH1
CH2
CH3
CH4
CH5
CH6
CH7
COM
1
2
3
4
5
6
7
8
9
ODD\ EVEN SGL\ DIF START
To Internal
Circuits
CLK
Analog
MUX
S
Time
Delay
18
EN
CS
Comparator
REF
R
Ladder
and
Decoder
SAR
Logic
and
Latch
12
Bits 0–7
One
Shot
CS
18
CS
18
EN
R
CLK
Bits 0–7
Bit 1
MSB
First
NOTES A: For the TLC0834, DI is input directly to the D input of SELECT1; SELECT0 is forced to a high.
B: Terminal numbers shown are for the DW or N package.
R
LSB
First
9-Bit
Shift
Register
EOC
CS
18
R
CLK
CS
18
14
DO
D
TLC0834C, TLC0834I, TLC0838C, TLC0838I
8-BIT ANALOG-TO-DIGITAL CONVERTERS WITH SERIAL CONTROL
CLK
SLAS094E – MARCH 1995 – REVISED OCTOBER 2000
2
functional block diagram
TLC0834C, TLC0834I, TLC0838C, TLC0838I
8-BIT ANALOG-TO-DIGITAL CONVERTERS WITH SERIAL CONTROL
SLAS094E – MARCH 1995 – REVISED OCTOBER 2000
functional description
The TLC0834 and TLC0838 use a sample-data-comparator structure that converts differential analog inputs
by a successive-approximation routine. Operation of both devices is similar with the exception of SE, an analog
common input, and multiplexer addressing. The input voltage to be converted is applied to a channel terminal
and is compared to ground (single ended), to an adjacent input (differential), or to a common terminal (pseudo
differential) that can be an arbitrary voltage. The input terminals are assigned a positive (+) or negative (–)
polarity. When the signal input applied to the assigned positive terminal is less than the signal on the negative
terminal, the converter output is all zeros.
Channel selection and input configuration are under software control using a serial-data link from the controlling
processor. A serial-communication format allows more functions to be included in a converter package with no
increase in size. In addition, it eliminates the transmission of low-level analog signals by locating the converter
at the analog sensor and communicating serially with the controlling processor. This process returns noise-free
digital data to the processor.
A particular input configuration is assigned during the multiplexer-addressing sequence. The multiplexer
address shifts into the converter through the data input (DI) line. The multiplexer address selects the analog
inputs to be enabled and determines whether the input is single ended or differential. When the input is
differential, the polarity of the channel input is assigned. Differential inputs are assigned to adjacent channel
pairs. For example, channel 0 and channel 1 may be selected as a differential pair. These channels cannot act
differentially with any other channel. In addition to selecting the differential mode, the polarity may also be
selected. Either channel of the channel pair may be designated as the negative or positive input.
The common input on the TLC0838 can be used for a pseudodifferential input. In this mode, the voltage on the
common input is considered to be the negative differential input for all channel inputs. This voltage can be any
reference potential common to all channel inputs. Each channel input can then be selected as the positive
differential input. This feature is useful when all analog circuits are biased to a potential other than ground.
A conversion is initiated by setting CS low, which enables all logic circuits. CS must be held low for the complete
conversion process. A clock input is then received from the processor. On each low-to-high transition of the
clock input, the data on DI is clocked into the multiplexer-address shift register. The first logic high on the input
is the start bit. A 3- to 4-bit assignment word follows the start bit. On each successive low-to-high transition of
the clock input, the start bit and assignment word are shifted through the shift register. When the start bit is
shifted into the start location of the multiplexer register, the input channel is selected and conversion starts. The
SAR status output (SARS) goes high to indicate that a conversion is in progress, and DI to the multiplexer shift
register is disabled for the duration of the conversion.
An interval of one clock period is automatically inserted to allow the selected multiplexed channel to settle. DO
comes out of the high-impedance state and provides a leading low for one clock period of multiplexer settling
time. The SAR comparator compares successive outputs from the resistive ladder with the incoming analog
signal. The comparator output indicates whether the analog input is greater than or less than the resistive-ladder
output. As the conversion proceeds, conversion data is simultaneously output from DO, with the most significant
bit (MSB) first. After eight clock periods, the conversion is complete and SARS goes low.
The TLC0834 outputs the least-significant-bit (LSB) first data after the MSB-first data stream. When SE is held
high on the TLC0838, the value of the LSB remains on the data line. When SE is forced low, the data is then
clocked out as LSB-first data. (To output LSB first, SE must first go low, then the data stored in the 9-bit shift
register outputs LSB first.) When CS goes high, all internal registers are cleared. At this time, the output circuits
go to the high-impedance state. If another conversion is desired, CS must make a high-to-low transition followed
by address information.
DI and DO can be tied together and controlled by a bidirectional processor I/O bit received on a single wire. This
is possible because DI is only examined during the multiplexer-addressing interval and DO is still in the
high-impedance state.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
3
TLC0834C, TLC0834I, TLC0838C, TLC0838I
8-BIT ANALOG-TO-DIGITAL CONVERTERS WITH SERIAL CONTROL
SLAS094E – MARCH 1995 – REVISED OCTOBER 2000
sequence of operation
TLC0834
1
2
3
4
5
6
10
7
11
12
13
14
15
18
19
20
21
CLK
tc
CS
tsu
Start
Bit
+Sign
SELECT
Bit
Bit 1
SGL ODD
Don’t Care
DI
DIF
EVEN
1
Hi-Z
SARS
Mux Settling Time
MSB-First Data
DO
Hi-Z
LSB-First Data
Hi-Z
MSB
7
LSB
6
2
1
0
MSB
1
2
6
TLC0834 MUX-ADDRESS CONTROL LOGIC TABLE
MUX ADDRESS
CHANNEL NUMBER
CH0 CH1 CH2 CH3
ODD/EVEN
SELECT BIT 1
SGL/DIF
+
–
L
L
L
+
–
H
L
L
–
+
L
L
H
–
+
H
L
H
+
H
L
L
+
H
L
H
+
H
H
L
+
H
H
H
H = high level, L = low level, – or + = terminal polarity for the selected input channel
4
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
7
TLC0834C, TLC0834I, TLC0838C, TLC0838I
8-BIT ANALOG-TO-DIGITAL CONVERTERS WITH SERIAL CONTROL
SLAS094E – MARCH 1995 – REVISED OCTOBER 2000
sequence of operation
TLC0838
1
2
3
4
5
6
7
11
8
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
CLK
tc
tsu
CS
Mux
Addressing
tsu
+
Sign SEL
Start
Bit
Bit
Bit SGL ODD
1
SEL
Bit
0
Don’t Care
DI
DIF
EVEN
1
0
Hi-Z
Hi-Z
SARS
SE
LSB-First Data
MSB-First Data
Hi-Z
Hi-Z
7
MSB
LSB
MSB
DO
6
2
1
0
1
2
3
4
5
6
7
SE Used to Control LSB-First Data
SE
Mux Settling Time
MSB-First Data
DO
LSB Held
MSB
7
LSB-First Data
MSB
LSB
6
2
1
POST OFFICE BOX 655303
0
• DALLAS, TEXAS 75265
1
2
3
4
5
6
7
5
TLC0834C, TLC0834I, TLC0838C, TLC0838I
8-BIT ANALOG-TO-DIGITAL CONVERTERS WITH SERIAL CONTROL
SLAS094E – MARCH 1995 – REVISED OCTOBER 2000
TLC0838 MUX-ADDRESS CONTROL LOGIC TABLE
SELECTED CHANNEL NUMBER
MUX ADDRESS
SELECT
0
SGL/DIF
ODD/EVEN
1
0
CH0
CH1
L
L
L
L
+
–
L
L
L
H
L
L
H
L
L
L
H
H
L
H
L
L
L
H
L
H
L
H
H
L
L
H
H
H
H
L
L
L
H
L
L
H
H
L
H
L
H
L
H
H
H
H
L
L
H
H
L
H
H
H
H
L
H
H
H
H
–
1
CH2
CH3
+
–
2
CH4
CH5
+
–
3
CH6
CH7
+
–
–
+
COM
+
–
+
–
+
+
–
+
–
+
–
+
–
+
–
+
–
+
–
+
–
H = high level, L = low level, – or + = polarity of external input
absolute maximum ratings over recommended operating free-air temperature range (unless
otherwise noted)†
Supply voltage, VCC (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6.5 V
Input voltage range: Logic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 0.3 V to VCC + 0.3 V
Analog . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 0.3 V to VCC+ 0.3 V
Input current, II . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ± 5 mA
Total input current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ± 20 mA
Operating free-air temperature range, TA: C suffix . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0°C to 70°C
I suffix . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 40°C to 85°C
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 65°C to 150°C
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds: N package . . . . . . . . . . . . . . . . . . . . . 260°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTE 1: All voltage values, except differential voltages, are with respect to the network ground terminal.
6
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
TLC0834C, TLC0834I, TLC0838C, TLC0838I
8-BIT ANALOG-TO-DIGITAL CONVERTERS WITH SERIAL CONTROL
SLAS094E – MARCH 1995 – REVISED OCTOBER 2000
recommended operating conditions
Supply voltage, VCC
High-level input voltage, VIH
MIN
NOM
MAX
4.5
5
5.5
2
Clock duty cycle (see Note 2)
V
V
Low-level input voltage, VIL
Clock frequency, f(clock)
UNIT
0.8
V
10
600
kHz
40%
60%
Pulse duration, CS high, tw
220
ns
Setup time, CS low, SE low, or data valid before CLK↑, tsu (see Figures 1 and 2)
350
ns
90
ns
Hold time, data valid after CLK↑, th (see Figure 1)
free air temperature,
temperature TA
Operating free-air
C suffix
I suffix
0
70
– 40
85
°C
NOTE 2: The clock-duty-cycle range ensures proper operation at all clock frequencies. When a clock frequency is used outside the
recommended duty-cycle range, the minimum pulse duration (high or low) is 1 µs.
electrical characteristics over recommended range of operating free-air temperature, VCC = 5 V,
f(clock) = 250 kHz (unless otherwise noted)
digital section
PARAMETER
VOH
High level output voltage
High-level
VOL
IIH
Low-level output voltage
IIL
IOH
Low-level input current
IOL
Low-level output (sink) current
High-level input current
High-level output (source) current
IOZ
High-impedance-state
g
output
current (DO or SARS)
Ci
Input capacitance
TEST CONDITIONS†
VCC = 4.75 V,
VCC = 4.75 V,
IOH = – 360 µA
IOH = – 10 µA
VCC = 5.25 V,
VIH = 5 V,
IOL = 1.6 mA
VIH = 5 V
VIL = 0,
VOH = 0,
VIL = 0
TA = 25°C
VOL = VCC,
VO = 5 V,
TA = 25°C
TA = 25°C
VO = 0,
TA = 25°C
C SUFFIX
MIN
TYP‡
I SUFFIX
MAX
MIN
2.8
2.4
4.6
4.5
TYP‡
MAX
V
0.34
– 6.5
V
µA
0.005
1
0.005
1
–1
– 0.005
–1
8
– 6.5
26
8
– 24
26
mA
3
0.01
3
– 0.01
–3
– 0.01
–3
5
• DALLAS, TEXAS 75265
µA
mA
0.01
Co
Output capacitance
5
† All parameters are measured under open-loop conditions with zero common-mode input voltage (unless otherwise specified).
‡ All typical values are at VCC = 5 V, TA = 25°C.
POST OFFICE BOX 655303
0.4
– 0.005
– 24
UNIT
µA
pF
pF
7
TLC0834C, TLC0834I, TLC0838C, TLC0838I
8-BIT ANALOG-TO-DIGITAL CONVERTERS WITH SERIAL CONTROL
SLAS094E – MARCH 1995 – REVISED OCTOBER 2000
electrical characteristics over recommended range of operating free-air temperature, VCC = 5 V,
f(clock) = 250 kHz (unless otherwise noted) (continued)
analog and converter section
PARAMETER
VIC
Common-mode input voltage
g
On channel
II(stdby)
I( tdb )
Off channel
Standby input current (see Note 4)
On channel
Off channel
TEST CONDITIONS†
MIN
See Note 3
– 0.05
to
VCC+ 0.05
TYP‡
MAX
UNIT
V
VI = 5 V
VI = 0
1
–1
VI = 0
VI = 5 V
–1
µA
1
ri(REF)
Input resistance to REF
1.3
2.4
5.9
kΩ
† All parameters are measured under open-loop conditions with zero common-mode input voltage.
‡ All typical values are at VCC = 5 V, TA = 25°C.
NOTES: 3. When channel IN – is more positive than channel IN+, the digital output code is 0000 0000. Connected to each analog input are
two on-chip diodes that conduct forward current for analog input voltages one diode drop above VCC.Care must be taken during
testing at low VCC levels (4.5 V) because high-level analog input voltage (5 V) can, especially at high temperatures, cause the input
diode to conduct and cause errors for analog inputs that are near full scale. As long as the analog voltage does not exceed the supply
voltage by more than 50 mV, the output code is correct. To achieve an absolute 0- to 5-V input range requires a minimum VCC of
4.950 V for all variations of temperature and load.
4. Standby input currents go in or out of the on or off channels when the A/D converter is not performing conversion and the clock is
in a high or low steady-state condition.
total device
PARAMETER
MIN
ICC
Supply current
‡ All typical values are at VCC = 5 V, TA = 25°C.
TYP‡
MAX
UNIT
0.6
1.25
mA
operating characteristics, VCC = 5 V, f(clock) = 250 kHz, tr = tf = 20 ns, TA = 25°C (unless otherwise
noted)
TEST CONDITIONS§
PARAMETER
Supply-voltage variation error
Total unadjusted error (see Note 5)
Common-mode error
MSB-first data
tpd
d
Propagation
g
delay
y time,, output
data after CLK↓ (see Note 6 and Figure 2)
tdis
di
Output disable time,
time DO or SARS after CS↑ (see Figure 3)
tc
Conversion time (multiplexer-addressing time not included)
LSB-first data
MIN
TYP
MAX
UNIT
VCC = 4.75 V to 5.25 V
Vref = 5 V,
TA = MIN to MAX
± 1/16
± 1/4
LSB
±1
LSB
Differential mode
± 1/16
± 1/4
LSB
1500
CL = 100 pF
600
CL = 10 pF,
RL = 10 kΩ
250
CL = 100 pF,
RL = 2 kΩ
500
8
ns
ns
clock
periods
§ All parameters are measured under open-loop conditions with zero common-mode input voltage. For conditions shown as MIN or MAX, use the
appropriate value specified under recommended operating conditions.
NOTES: 5. Total unadjusted error includes offset, full-scale, linearity, and multiplexer errors.
6. The MSB-first data is output directly from the comparator and, therefore, requires additional delay to allow for comparator response
time.
8
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
TLC0834C, TLC0834I, TLC0838C, TLC0838I
8-BIT ANALOG-TO-DIGITAL CONVERTERS WITH SERIAL CONTROL
SLAS094E – MARCH 1995 – REVISED OCTOBER 2000
PARAMETER MEASUREMENT INFORMATION
VCC
CLK
50%
50%
GND
tsu
tsu
VCC
CS
0.4 V
GND
th
th
VCC
2V
2V
DI
0.4 V
0.4 V
GND
Figure 1. Data-Input Timing
VCC
CLK
50%
50%
GND
tpd
tpd
VCC
DO
50%
50%
GND
tsu
VCC
50%
SE
GND
Figure 2. Data-Output Timing
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
9
TLC0834C, TLC0834I, TLC0838C, TLC0838I
8-BIT ANALOG-TO-DIGITAL CONVERTERS WITH SERIAL CONTROL
SLAS094E – MARCH 1995 – REVISED OCTOBER 2000
PARAMETER MEASUREMENT INFORMATION
VCC
Test
Point
S1
RL
From Output
Under Test
CL
(see Note A)
S2
LOAD CIRCUIT
tr
tr
VCC
CS
50%
90%
10%
CS
10%
GND
S1 Open
S2 Closed
VCC
90%
DO and SARS
S1 Closed
S2 Open
GND
VOLTAGE WAVEFORMS
–VCC
10%
VOLTAGE WAVEFORMS
NOTE A: CL includes probe and jig capacitance.
Figure 3. Output Disable Time Test Circuit and Voltage Waveforms
10
GND
tdis
tdis
DO and SARS
VCC
90%
50%
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
GND
TLC0834C, TLC0834I, TLC0838C, TLC0838I
8-BIT ANALOG-TO-DIGITAL CONVERTERS WITH SERIAL CONTROL
SLAS094E – MARCH 1995 – REVISED OCTOBER 2000
TYPICAL CHARACTERISTICS
LINEARITY ERROR
vs
REFERENCE VOLTAGE
UNADJUSTED OFFSET ERROR
vs
REFERENCE VOLTAGE
1.5
VCC = 5 V
f(CLK) = 250 kHz
TA = 25°C
VI(+) = VI(–) = 0 V
14
1.25
12
E L – Linearity Error – LSB
EO(unadj) – Unadjusted Offset Error – LSB
16
10
8
6
4
1
0.75
0.5
0.25
2
0
0
0.01
0.1
1
10
0
1
LINEARITY ERROR
vs
FREE-AIR TEMPERATURE
3
Vref = 5 V
f(CLK) = 250 kHz
Vref = 5 V
VCC = 5 V
2.5
E L – Linearity Error – LSB
0.45
E L – Linearity Error – LSB
5
LINEARITY ERROR
vs
CLOCK FREQUENCY
0.5
0.4
0.35
0.3
2
1.5
85°C
1
25°C
– 40°C
0.5
0
4
Figure 5
Figure 4
– 25
3
Vref – Reference Voltage – V
Vref – Reference Voltage – V
0.25
– 50
2
25
50
75
100
0
0
TA – Free-Air Temperature – °C
100
200
300
400
500
600
f(CLK) – Clock Frequency – kHz
Figure 6
Figure 7
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
11
TLC0834C, TLC0834I, TLC0838C, TLC0838I
8-BIT ANALOG-TO-DIGITAL CONVERTERS WITH SERIAL CONTROL
SLAS094E – MARCH 1995 – REVISED OCTOBER 2000
TYPICAL CHARACTERISTICS
SUPPLY CURRENT
vs
CLOCK FREQUENCY
SUPPLY CURRENT
vs
FREE-AIR TEMPERATURE
1.5
1.5
VCC = 5 V
TA = 25°C
I CC – Supply Current – mA
I CC – Supply Current – mA
f(CLK) = 250 kHz
CS = High
VCC = 5.5 V
VCC = 5 V
1
VCC = 4.5 V
0.5
– 50
1
0.5
0
– 25
0
25
50
75
100
0
100
TA – Free-Air Temperature – °C
200
Figure 9
OUTPUT CURRENT
vs
FREE-AIR TEMPERATURE
25
VCC = 5 V
I O – Output Current – mA
20
IOL (VOL = 5 V)
15
– IOH (VOH = 0 V)
10
– IOH (VOH = 2.4 V)
5
IOL (VOL = 0.4 V)
– 25
0
25
50
TA – Free-Air Temperature – °C
Figure 10
12
400
f(CLK) – Clock Frequency – kHz
Figure 8
0
– 50
300
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
75
100
500
TLC0834C, TLC0834I, TLC0838C, TLC0838I
8-BIT ANALOG-TO-DIGITAL CONVERTERS WITH SERIAL CONTROL
SLAS094E – MARCH 1995 – REVISED OCTOBER 2000
Differential Nonlinearity – LSB
TYPICAL CHARACTERISTICS
1
0.5
0
Vref = 5 V
TA = 25°C
f(CLK) = 250 kHz
VDD = 5 V
–0.5
–1
0
32
64
96
128
160
192
224
256
224
256
Output Code
Figure 11. Differential Nonlinearity With Output Code
Integral Nonlinearity – LSB
1
Vref = 5 V
TA = 25°C
f(CLK) = 250 kHz
VDD = 5 V
0.5
0
–0.5
–1
0
32
64
96
128
160
192
Output Code
Figure 12. Integral Nonlinearity With Output Code
Total Unadjusted Error – LSB
1
Vref = 5 V
TA = 25°C
f(CLK) = 250 kHz
VDD = 5 V
0.5
0
–0.5
–1
0
32
64
96
128
160
192
224
256
Output Code
Figure 13. Total Unadjusted Error With Output Code
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
13
PACKAGE OPTION ADDENDUM
www.ti.com
24-Jan-2013
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package Qty
Drawing
Eco Plan
Lead/Ball Finish
(2)
MSL Peak Temp
Op Temp (°C)
Top-Side Markings
(3)
(4)
TLC0834CD
ACTIVE
SOIC
D
14
50
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TLC0834C
TLC0834CDG4
ACTIVE
SOIC
D
14
50
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TLC0834C
TLC0834CDR
ACTIVE
SOIC
D
14
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TLC0834C
TLC0834CDRG4
ACTIVE
SOIC
D
14
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TLC0834C
TLC0834CN
ACTIVE
PDIP
N
14
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
TLC0834CN
TLC0834CNE4
ACTIVE
PDIP
N
14
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
TLC0834CN
TLC0834ID
ACTIVE
SOIC
D
14
50
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TLC0834I
TLC0834IDG4
ACTIVE
SOIC
D
14
50
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TLC0834I
TLC0834IDR
ACTIVE
SOIC
D
14
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TLC0834I
TLC0834IDRG4
ACTIVE
SOIC
D
14
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TLC0834I
TLC0834IN
ACTIVE
PDIP
N
14
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
TLC0834IN
TLC0834INE4
ACTIVE
PDIP
N
14
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
TLC0834IN
TLC0834QN
OBSOLETE
PDIP
N
14
TBD
Call TI
Call TI
TLC0838CDW
ACTIVE
SOIC
DW
20
25
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TLC0838C
TLC0838CDWG4
ACTIVE
SOIC
DW
20
25
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TLC0838C
TLC0838CDWR
ACTIVE
SOIC
DW
20
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TLC0838C
TLC0838CDWRG4
ACTIVE
SOIC
DW
20
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TLC0838C
Addendum-Page 1
-40 to 125
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
24-Jan-2013
Orderable Device
Status
(1)
Package Type Package Pins Package Qty
Drawing
Eco Plan
Lead/Ball Finish
(2)
MSL Peak Temp
Op Temp (°C)
Top-Side Markings
(3)
(4)
TLC0838CN
ACTIVE
PDIP
N
20
20
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
TLC0838CN
TLC0838CNE4
ACTIVE
PDIP
N
20
20
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
TLC0838CN
TLC0838CPW
ACTIVE
TSSOP
PW
20
70
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
TLC0838C
TLC0838CPWG4
ACTIVE
TSSOP
PW
20
70
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
TLC0838C
TLC0838CPWR
ACTIVE
TSSOP
PW
20
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
TLC0838C
TLC0838CPWRG4
ACTIVE
TSSOP
PW
20
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
TLC0838C
TLC0838IDW
ACTIVE
SOIC
DW
20
25
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TLC0838I
TLC0838IDWG4
ACTIVE
SOIC
DW
20
25
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TLC0838I
TLC0838IDWR
ACTIVE
SOIC
DW
20
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TLC0838I
TLC0838IDWRG4
ACTIVE
SOIC
DW
20
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TLC0838I
TLC0838IN
ACTIVE
PDIP
N
20
20
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
-40 to 85
TLC0838IN
TLC0838INE4
ACTIVE
PDIP
N
20
20
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
-40 to 85
TLC0838IN
TLC0838IPW
ACTIVE
TSSOP
PW
20
70
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
TLC0838I
TLC0838IPWG4
ACTIVE
TSSOP
PW
20
70
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
TLC0838I
TLC0838IPWR
ACTIVE
TSSOP
PW
20
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
TLC0838I
TLC0838IPWRG4
ACTIVE
TSSOP
PW
20
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
TLC0838I
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
Addendum-Page 2
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
24-Jan-2013
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
Only one of markings shown within the brackets will appear on the physical device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 3
PACKAGE MATERIALS INFORMATION
www.ti.com
26-Mar-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
TLC0834CDR
Package Package Pins
Type Drawing
SOIC
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
D
14
2500
330.0
16.4
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
6.5
9.0
2.1
8.0
16.0
Q1
TLC0834IDR
SOIC
D
14
2500
330.0
16.4
6.5
9.0
2.1
8.0
16.0
Q1
TLC0838CPWR
TSSOP
PW
20
2000
330.0
16.4
6.95
7.1
1.6
8.0
16.0
Q1
TLC0838IDWR
SOIC
DW
20
2000
330.0
24.4
10.8
13.3
2.7
12.0
24.0
Q1
TLC0838IDWR
SOIC
DW
20
2000
330.0
24.4
10.8
13.3
2.7
12.0
24.0
Q1
TLC0838IPWR
TSSOP
PW
20
2000
330.0
16.4
6.95
7.1
1.6
8.0
16.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
26-Mar-2013
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
TLC0834CDR
SOIC
D
14
2500
367.0
367.0
38.0
TLC0834IDR
SOIC
D
14
2500
367.0
367.0
38.0
TLC0838CPWR
TSSOP
PW
20
2000
367.0
367.0
38.0
TLC0838IDWR
SOIC
DW
20
2000
367.0
367.0
45.0
TLC0838IDWR
SOIC
DW
20
2000
367.0
367.0
45.0
TLC0838IPWR
TSSOP
PW
20
2000
367.0
367.0
38.0
Pack Materials-Page 2
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products
Applications
Audio
www.ti.com/audio
Automotive and Transportation
www.ti.com/automotive
Amplifiers
amplifier.ti.com
Communications and Telecom
www.ti.com/communications
Data Converters
dataconverter.ti.com
Computers and Peripherals
www.ti.com/computers
DLP® Products
www.dlp.com
Consumer Electronics
www.ti.com/consumer-apps
DSP
dsp.ti.com
Energy and Lighting
www.ti.com/energy
Clocks and Timers
www.ti.com/clocks
Industrial
www.ti.com/industrial
Interface
interface.ti.com
Medical
www.ti.com/medical
Logic
logic.ti.com
Security
www.ti.com/security
Power Mgmt
power.ti.com
Space, Avionics and Defense
www.ti.com/space-avionics-defense
Microcontrollers
microcontroller.ti.com
Video and Imaging
www.ti.com/video
RFID
www.ti-rfid.com
OMAP Applications Processors
www.ti.com/omap
TI E2E Community
e2e.ti.com
Wireless Connectivity
www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2013, Texas Instruments Incorporated