TI TLV0834IN

TLV0834C, TLV0834I, TLV0838C, TLV0838I
3-VOLT 8-BIT ANALOG-TO-DIGITAL CONVERTERS
WITH SERIAL CONTROL
SLAS147B – SEPTEMBER 1996 – REVISED OCTOBER 2000
D
D
D
D
D
D
D
D
8-Bit Resolution
2.7-V to 3.6-V VCC
Easy Microprocessor Interface or
Stand-Alone Operation
Operates Ratiometrically or With VCC
Reference
4- or 8-Channel Multiplexer Options With
Address Logic
Input Range 0 V to VCC With VCC Reference
Remote Operation With Serial Data Link
Inputs and Outputs Are Compatible With
TTL and MOS
Conversion Time of 32 µs at
f(CLK) = 250 kHz
Functionally Equivalent to the ADC0834
and ADC0838 at 3-V Supply Without the
Internal Zener Regulator Network
Total Unadjusted Error . . . ±1 LSB
D
D
D
description
These devices are 8-bit successive-approximation analog-to-digital converters, each with an input-configurable
multichannel multiplexer and serial input/output. The serial input/output is configured to interface with standard
shift registers or microprocessors. Detailed information on interfacing with most popular microprocessors is
readily available from the factory.
The TLV0834 (4-channel) and TLV0838 (8-channel) multiplexer is software-configured for single-ended or
differential inputs as well as pseudodifferential input assignments. The differential analog voltage input allows
for common-mode rejection or offset of the analog zero input voltage value. In addition, the voltage reference
input can be adjusted to allow encoding of any smaller analog voltage span to the full 8 bits of resolution.
The TLV0834C and TLV0838C are characterized for operation from 0°C to 70°C. The TLV0834I and TLV0838I
are characterized for operation from – 40°C to 85°C.
TLV0834 . . . D OR N PACKAGE
(TOP VIEW)
NC
CS
CH0
CH1
CH2
CH3
DGTL GND
1
14
2
13
3
12
4
11
5
10
6
9
7
8
VCC
DI
CLK
SARS
DO
REF
ANLG GND
TLV0834 . . . PW PACKAGE
(TOP VIEW)
NC
CS
CH0
CH1
CH2
CH3
DGTL GND
NC
1
16
2
15
3
14
4
13
5
12
6
11
7
10
8
9
VCC
DI
CLK
SARS
DO
REF
ANLG GND
NC
NC – No internal connection
TLV0838 . . . PW, DW, OR N PACKAGE
(TOP VIEW)
CH0
CH1
CH2
CH3
CH4
CH5
CH6
CH7
COM
DGTL GND
1
20
2
19
3
18
4
17
5
16
6
15
7
14
8
13
9
12
10
11
VCC
NC
CS
DI
CLK
SARS
DO
SE
REF
ANLG GND
AVAILABLE OPTIONS
PACKAGE
TA
SMALL
OUTLINE
(D)
SMALL
OUTLINE
(DW)
0°C to 70°C
TLV0834CD
TLV0838CDW
TLV0834CN
TLV0838CN
TLV0834CPW
TLV0838CPW
– 40°C to 85°C
TLV0834ID
TLV0838IDW
TLV0834IN
TLV0838IN
TLV0834IPW
TLV0838IPW
PLASTIC DIP
(N)
TSSOP
(PW)
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright  2000, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
1
CS
CLK
CS
DI
(see Note A)
SARS
R
D
S
5-Bit Shift Register
R
CLK
SELECT0 SELECT1
TLC0838
Only
SE
POST OFFICE BOX 655303
TLC0834
TLC0838
ODD\ EVEN SGL\ DIF START
To Internal
Circuits
CLK
• DALLAS, TEXAS 75265
CH0
CH1
CH2
CH3
CH4
CH5
CH6
CH7
COM
Analog
MUX
S
Time
Delay
EN
R
CS
Comparator
CS
CS
R
R
CS
EN
REF
Ladder
and
Decoder
SAR
Logic
and
Latch
Bits 0–7
One
Shot
CS
CLK
Bits 0–7
Bit 1
MSB
First
NOTE A: For the TLC0834, DI is input directly to the D input of SELECT1; SELECT0 is forced to a high.
LSB
First
9-Bit
Shift
Register
EOC
R
CLK
DO
D
TLV0834C, TLV0834I, TLV0838C, TLV0838I
3-VOLT 8-BIT ANALOG-TO-DIGITAL CONVERTERS
WITH SERIAL CONTROL
Start
Flip-Flop
CLK
SLAS147B – SEPTEMBER 1996 – REVISED OCTOBER 2000
2
functional block diagram
TLV0834C, TLV0834I, TLV0838C, TLV0838I
3-VOLT 8-BIT ANALOG-TO-DIGITAL CONVERTERS
WITH SERIAL CONTROL
SLAS147B – SEPTEMBER 1996 – REVISED OCTOBER 2000
functional description
The TLV0834 and TLV0838 use a sample-data-comparator structure that converts differential analog inputs by
a successive-approximation routine. Operation of both devices is similar with the exception of SE, an analog
common input, and multiplexer addressing. The input voltage to be converted is applied to a channel terminal
and is compared to ground (single ended), to an adjacent input (differential), or to a common terminal (pseudo
differential) that can be an arbitrary voltage. The input terminals are assigned a positive (+) or negative (–)
polarity. When the signal input applied to the assigned positive terminal is less than the signal on the negative
terminal, the converter output is all zeros.
Channel selection and input configuration are under software control using a serial-data link from the controlling
processor. A serial-communication format allows more functions to be included in a converter package with no
increase in size. In addition, it eliminates the transmission of low-level analog signals by locating the converter
at the analog sensor and communicating serially with the controlling processor. This process returns noise-free
digital data to the processor.
A particular input configuration is assigned during the multiplexer-addressing sequence. The multiplexer
address shifts into the converter through the data input (DI) line. The multiplexer address selects the analog
inputs to be enabled and determines whether the input is single ended or differential. When the input is
differential, the polarity of the channel input is assigned. Differential inputs are assigned to adjacent channel
pairs . For example, channel 0 and channel 1 may be selected as a differential pair. These channels cannot act
differentially with any other channel. In addition to selecting the differential mode, the polarity may also be
selected. Either channel of the channel pair may be designated as the negative or positive input.
The common input on the TLV0838 can be used for a pseudodifferential input. In this mode, the voltage on the
common input is considered to be the negative differential input for all channel inputs. This voltage can be any
reference potential common to all channel inputs. Each channel input can then be selected as the positive
differential input. This feature is useful when all analog circuits are biased to a potential other than ground.
A conversion is initiated by setting CS low, which enables all logic circuits. CS must be held low for the complete
conversion process. A clock input is then received from the processor. On each low-to-high transition of the
clock input, the data on DI is clocked into the multiplexer-address shift register. The first logic high on the input
is the start bit. A 3- to 4-bit assignment word follows the start bit. On each successive low-to-high transition of
the clock input, the start bit and assignment word are shifted through the shift register. When the start bit is
shifted into the start location of the multiplexer register, the input channel is selected and conversion starts. The
SAR status output (SARS) goes high to indicate that a conversion is in progress, and DI to the multiplexer shift
register is disabled for the duration of the conversion.
An interval of one clock period is automatically inserted to allow the selected multiplexed channel to settle. DO
comes out of the high-impedance state and provides a leading low for one clock period of multiplexer settling
time. The SAR comparator compares successive outputs from the resistive ladder with the incoming analog
signal. The comparator output indicates whether the analog input is greater than or less than the resistive-ladder
output. As the conversion proceeds, conversion data is simultaneously output from DO, with the most significant
bit (MSB) first. After eight clock periods, the conversion is complete and SARS goes low.
The TLV0834 outputs the least-significant-bit (LSB) first data after the MSB-first data stream. When SE is held
high on the TLV0838, the value of the LSB remains on the data line. When SE is forced low, the data is then
clocked out as LSB-first data. (To output LSB first, SE must first go low, then the data stored in the 9-bit shift
register outputs LSB first.) When CS goes high, all internal registers are cleared. At this time, the output circuits
go to the high-impedance state. If another conversion is desired, CS must make a high-to-low transition followed
by address information.
DI and DO can be tied together and controlled by a bidirectional processor I/O bit received on a single wire. This
is possible because DI is only examined during the multiplexer-addressing interval and DO is still in the
high-impedance state.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
3
TLV0834C, TLV0834I, TLV0838C, TLV0838I
3-VOLT 8-BIT ANALOG-TO-DIGITAL CONVERTERS
WITH SERIAL CONTROL
SLAS147B – SEPTEMBER 1996 – REVISED OCTOBER 2000
sequence of operation
TLV0834
1
2
3
4
5
6
10
7
11
12
13
14
15
18
19
20
21
CLK
tc
CS
tsu
Start
Bit
+Sign
SELECT
Bit
Bit 1
SGL ODD
Don’t Care
DI
DIF
1
EVEN
Hi-Z
SARS
MUX Settling Time
MSB-First Data
DO
LSB-First Data
Hi-Z
Hi-Z
MSB
7
LSB
6
2
1
0
MSB
1
2
6
TLV0834 MUX-ADDRESS CONTROL LOGIC TABLE
MUX ADDRESS
SGL/DIF
ODD/EVEN
CHANNEL NUMBER
SELECT BIT 1
CH0
CH1 CH2 CH3
+
–
L
L
L
+
–
H
L
L
–
+
L
L
H
–
+
H
L
H
+
H
L
L
+
H
L
H
+
H
H
L
+
H
H
H
H = high level, L = low level, – or + = terminal polarity for the selected input channel
4
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
7
TLV0834C, TLV0834I, TLV0838C, TLV0838I
3-VOLT 8-BIT ANALOG-TO-DIGITAL CONVERTERS
WITH SERIAL CONTROL
SLAS147B – SEPTEMBER 1996 – REVISED OCTOBER 2000
sequence of operation (continued)
TLV0838
1
2
3
4
5
6
7
8
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
CLK
tc
tsu
CS
MUX
Addressing
tsu
+
Sign SEL SEL
Start
Bit
Bit
Bit
Bit SGL ODD
1
0
Don’t Care
DI
DIF
EVEN
1
0
Hi-Z
Hi-Z
SARS
SE
LSB-First Data
MSB-First Data
Hi-Z
DO
Hi-Z
7
MSB
LSB
MSB
6
2
1
0
1
2
3
4
5
6
7
SE Used to Control LSB-First Data
SE
MUX Settling Time
MSB-First Data
DO
LSB Held
MSB
7
LSB-First Data
MSB
LSB
6
2
1
POST OFFICE BOX 655303
0
1
• DALLAS, TEXAS 75265
2
3
4
5
6
7
5
TLV0834C, TLV0834I, TLV0838C, TLV0838I
3-VOLT 8-BIT ANALOG-TO-DIGITAL CONVERTERS
WITH SERIAL CONTROL
SLAS147B – SEPTEMBER 1996 – REVISED OCTOBER 2000
TLV0838 MUX-ADDRESS CONTROL LOGIC TABLE
SELECTED CHANNEL NUMBER
MUX ADDRESS
SELECT
0
SGL/DIF
ODD/EVEN
1
0
CH0
CH1
L
L
L
L
+
–
L
L
L
H
L
L
H
L
L
L
H
H
L
H
L
L
L
H
L
H
L
H
H
L
L
H
H
H
H
L
L
L
H
L
L
H
H
L
H
L
H
L
H
H
H
H
L
L
H
H
L
H
H
H
H
L
H
H
H
H
–
1
CH2
CH3
+
–
2
CH4
CH5
+
–
3
CH6
CH7
+
–
–
+
COM
+
–
+
–
+
+
–
+
–
+
–
+
–
+
–
+
–
+
–
+
–
H = high level, L = low level, – or + = polarity of external input
absolute maximum ratings over recommended operating free-air temperature range (unless
otherwise noted)†
Supply voltage, VCC (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6.5 V
Input voltage range: Logic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 0.3 V to VCC + 0.3 V
Analog . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 0.3 V to VCC+ 0.3 V
Input current, II . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ± 5 mA
Total input current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ± 20 mA
Operating free-air temperature range, TA: C suffix . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0°C to 70°C
I suffix . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 40°C to 85°C
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 65°C to 150°C
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds: N package . . . . . . . . . . . . . . . . . . . . . 260°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTE 1: All voltage values, except differential voltages, are with respect to the network ground terminal.
6
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
TLV0834C, TLV0834I, TLV0838C, TLV0838I
3-VOLT 8-BIT ANALOG-TO-DIGITAL CONVERTERS
WITH SERIAL CONTROL
SLAS147B – SEPTEMBER 1996 – REVISED OCTOBER 2000
recommended operating conditions
Supply voltage, VCC (see clock frequency operating conditions)
High-level input voltage, VIH
MIN
NOM
MAX
2.7
3.3
3.6
2
Clock frequency, f(CLK)
VCC = 2.7 V
VCC = 3.3 V
Clock duty cycle (see Note 2)
V
V
Low-level input voltage, VIL
Clock frequency, f(CLK)
UNIT
0.8
V
10
250
kHz
10
600
kHz
40%
60%
Pulse duration, CS high, tw
220
ns
Setup time, CS low, SE low, or data valid before CLK↑, tsu
350
ns
Hold time, data valid after CLK↑, th
free air temperature,
temperature TA
Operating free-air
90
C suffix
I suffix
ns
0
70
– 40
85
°C
NOTE 2: The clock-duty-cycle range ensures proper operation at all clock frequencies. When a clock frequency is used outside the
recommended duty-cycle range, the minimum pulse duration (high or low) is 1 µs.
electrical characteristics over recommended range of operating free-air temperature, VCC = 3.3 V,
f(CLK) = 250 kHz (unless otherwise noted)
digital section
PARAMETER
TEST CONDITIONS†
VCC = 3 V,
VCC = 3 V,
IOH = – 360 µA
IOH = – 10 µA
VCC = 3 V,
VIH = 3.6 V
IOL = 1.6 mA
VOH
High level output voltage
High-level
VOL
IIH
Low-level output voltage
IIL
IOH
Low-level input current
High-level output (source) current
VIL = 0
At VOH, DO = 0 V, TA = 25°C
IOL
Low-level output (sink) current
A t VOL, DO = VCC, TA = 25°C
IOZ
High-impedance-state
output
g
current (DO or SARS)
VO = 3.3 V,
VO = 0,
Ci
Input capacitance
High-level input current
TA = 25°C
TA = 25°C
MIN
C SUFFIX
TYP‡
MAX
MIN
2.8
2.4
2.9
2.8
I SUFFIX
TYP‡
MAX
V
0.4
V
0.005
0.34
1
0.005
1
µA
– 0.005
–1
– 0.005
–1
µA
– 6.5
– 15
– 6.5
– 15
8
16
8
16
mA
mA
0.01
3
0.01
3
– 0.01
–3
– 0.01
–3
5
Co
Output capacitance
5
† All parameters are measured under open-loop conditions with zero common-mode input voltage (unless otherwise specified).
‡ All typical values are at VCC = 3.3 V, TA = 25°C.
POST OFFICE BOX 655303
UNIT
• DALLAS, TEXAS 75265
µA
pF
pF
7
TLV0834C, TLV0834I, TLV0838C, TLV0838I
3-VOLT 8-BIT ANALOG-TO-DIGITAL CONVERTERS
WITH SERIAL CONTROL
SLAS147B – SEPTEMBER 1996 – REVISED OCTOBER 2000
electrical characteristics over recommended range of operating free-air temperature, VCC = 3.3 V,
f(CLK) = 250 kHz (unless otherwise noted) (continued)
analog and converter section
TEST CONDITIONS†
PARAMETER
VIC
Common-mode input voltage
g
See Note 3
On channel
II(stdby)
I( tdb )
Off channel
Standby input current (see Note 4)
On channel
Off channel
ri(REF)
MIN
TYP‡
MAX
– 0.05
to
VCC + 0.05
V
VI = 3.3 V
VI = 0
1
–1
VI = 0
VI = 3.3 V
Input resistance to REF
UNIT
–1
µA
1
1.3
2.4
5.9
TYP‡
MAX
kΩ
total device
PARAMETER
MIN
UNIT
ICC
Supply current
0.2
0.75
mA
† All parameters are measured under open-loop conditions with zero common-mode input voltage.
‡ All typical values are at VCC = 3.3 V, TA = 25°C.
NOTES: 3. When channel IN – is more positive than channel IN+, the digital output code is 0000 0000. Connected to each analog input are
two on-chip diodes that conduct forward current for analog input voltages one diode drop above VCC. Care must be taken during
testing at low VCC levels (3 V) because high-level analog input voltage (3.6 V) can, especially at high temperatures, cause the input
diode to conduct and cause errors for analog inputs that are near full scale. As long as the analog voltage does not exceed the supply
voltage by more than 50 mV, the output code is correct. To achieve an absolute 0- to 3.3-V input range requires a minimum VCC of
3.25 V for all variations of temperature and load.
4. Standby input currents go in or out of the on or off channels when the A/D converter is not performing conversion and the clock is
in a high or low steady-state condition.
operating characteristics, VCC = 3.3 V, f(CLK) = 250 kHz, tr = tf = 20 ns, TA = 25°C
(unless otherwise noted)
TEST CONDITIONS§
PARAMETER
Supply-voltage variation error
Total unadjusted error (see Note 5)
Common-mode error
MSB-first data
tpd
d
Propagation
g
delay
y time,, output data after
CLK↓ (see Note 6)
tdis
di
Output disable time,
time DO or SARS after CS↑
tc
Conversion time (multiplexer-addressing time not included)
LSB-first data
MIN
TYP
MAX
UNIT
VCC = 3 V to 3.6 V
Vref = 3.3 V, TA = MIN to MAX
± 1/16
± 1/4
LSB
±1
LSB
Differential mode
± 1/16
± 1/4
LSB
500
CL = 100pF
200
CL = 10 pF,
RL = 10 kΩ
80
CL = 100 pF,
RL = 2 kΩ
250
8
ns
ns
clock
periods
§ All parameters are measured under open-loop conditions with zero common-mode input voltage. For conditions shown as MIN or MAX, use the
appropriate value specified under recommended operating conditions.
NOTES: 5. Total unadjusted error includes offset, full-scale, linearity, and multiplexer errors.
6. The MSB-first data is output directly from the comparator and, therefore, requires additional delay to allow for comparator response
time.
8
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
TLV0834C, TLV0834I, TLV0838C, TLV0838I
3-VOLT 8-BIT ANALOG-TO-DIGITAL CONVERTERS
WITH SERIAL CONTROL
SLAS147B – SEPTEMBER 1996 – REVISED OCTOBER 2000
PARAMETER MEASUREMENT INFORMATION
VCC
CLK
50%
50%
GND
tsu
tsu
VCC
CS
0.4 V
GND
th
th
VCC
2V
2V
DI
0.4 V
0.4 V
GND
Figure 1. Data-Input Timing
VCC
CLK
50%
50%
GND
tpd
tpd
VCC
DO
50%
50%
GND
tsu
VCC
50%
SE
GND
Figure 2. Data-Output Timing
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
9
TLV0834C, TLV0834I, TLV0838C, TLV0838I
3-VOLT 8-BIT ANALOG-TO-DIGITAL CONVERTERS
WITH SERIAL CONTROL
SLAS147B – SEPTEMBER 1996 – REVISED OCTOBER 2000
PARAMETER MEASUREMENT INFORMATION
VCC
Test
Point
S1
RL
From Output
Under Test
CL
(see Note A)
S2
LOAD CIRCUIT
tr
tr
VCC
CS
50%
90%
10%
CS
10%
GND
S1 open
S2 closed
VCC
90%
DO and SARS
S1 closed
S2 open
GND
VOLTAGE WAVEFORMS
VCC
10%
VOLTAGE WAVEFORMS
NOTE A: CL includes probe and jig capacitance.
Figure 3. Output Disable Time Test Circuit and Voltage Waveforms
10
GND
tdis
tdis
DO and SARS
VCC
90%
50%
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
GND
TLV0834C, TLV0834I, TLV0838C, TLV0838I
3-VOLT 8-BIT ANALOG-TO-DIGITAL CONVERTERS
WITH SERIAL CONTROL
SLAS147B – SEPTEMBER 1996 – REVISED OCTOBER 2000
TYPICAL CHARACTERISTICS
LINEARITY ERROR
vs
REFERENCE VOLTAGE
UNADJUSTED OFFSET ERROR
vs
REFERENCE VOLTAGE
1.5
VCC = 3.3 V
f(CLK) = 250 kHz
TA = 25°C
VI(+) = VI(–) = 0 V
14
1.25
12
E L – Linearity Error – LSB
EO(unadj) – Unadjusted Offset Error – LSB
16
10
8
6
4
1.0
0.75
0.5
0.25
2
0
0.01
0.1
1
0
10
0
1
Figure 4
4
Figure 5
LINEARITY ERROR
vs
CLOCK FREQUENCY
LINEARITY ERROR
vs
FREE-AIR TEMPERATURE
2.0
0.5
Vref = 3.3 V
VCC = 3.3 V
1.8
Vref = 3.3 V
f(CLK) = 250 kHz
1.6
E L – Linearity Error – LSB
E L – Linearity Error – LSB
3
Vref – Reference Voltage – V
Vref – Reference Voltage – V
0.45
2
0.4
0.35
0.3
1.4
85°C
1.2
1
0.8
25°C
0.6
0.4
– 40°C
0.2
0.25
– 50
– 25
0
25
50
75
100
TA – Free-Air Temperature – °C
0
0
100
200
300
400
500
600
700
800
f(CLK) – Clock Frequency – kHz
Figure 6
Figure 7
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
11
TLV0834C, TLV0834I, TLV0838C, TLV0838I
3-VOLT 8-BIT ANALOG-TO-DIGITAL CONVERTERS
WITH SERIAL CONTROL
SLAS147B – SEPTEMBER 1996 – REVISED OCTOBER 2000
TYPICAL CHARACTERISTICS
TLV0831
TLV0831
SUPPLY CURRENT
vs
FREE-AIR TEMPERATURE
SUPPLY CURRENT
vs
CLOCK FREQUENCY
0.3
0.5
f(CLK) = 250 kHz
CS = High
VCC = 3.3 V
TA = 25°C
0.4
I CC – Supply Current – mA
I CC – Supply Current – mA
VCC = 3.6 V
VCC = 3.3 V
0.2
VCC = 3 V
0.3
0.2
0.1
0.1
– 50
– 25
0
25
50
75
0
100
0
TA – Free-Air Temperature – °C
100
200
Figure 9
OUTPUT CURRENT
vs
FREE-AIR TEMPERATURE
16.5
VCC = 3.3 V
I O – Output Current – mA
16
IOL (DO = 3.3 V)
15.5
– IOH (DO = 0 V)
15
– IOH (DO = 2.4 V)
14.5
IOL (DO = 0.4 V)
– 25
0
25
50
TA – Free-Air Temperature – °C
Figure 10
12
400
f(CLK) – Clock Frequency – kHz
Figure 8
14
– 50
300
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
75
100
500
TLV0834C, TLV0834I, TLV0838C, TLV0838I
3-VOLT 8-BIT ANALOG-TO-DIGITAL CONVERTERS
WITH SERIAL CONTROL
SLAS147B – SEPTEMBER 1996 – REVISED OCTOBER 2000
Differential Nonlinearity – LSB
TYPICAL CHARACTERISTICS
1
0.5
0
Vref = 3.3 V
TA = 25°C
f(CLK) = 250 kHz
VDD = 3.3 V
– 0.5
–1
0
32
64
96
128
160
192
224
256
224
256
Output Code
Figure 11. Differential Nonlinearity With Output Code
Integral Nonlinearity – LSB
1
Vref = 3.3 V
TA = 25°C
f(CLK) = 250 kHz
VDD = 3.3 V
0.5
0
– 0.5
–1
0
32
64
96
128
160
192
Output Code
Figure 12. Integral Nonlinearity With Output Code
Total Unadjusted Error – LSB
1
Vref = 3.3 V
TA = 25°C
f(CLK) = 250 kHz
VDD = 3.3 V
0.5
0
– 0.5
–1
0
32
64
96
128
160
192
224
256
Output Code
Figure 13. Total Unadjusted Error With Output Code
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
13
PACKAGE OPTION ADDENDUM
www.ti.com
20-Aug-2011
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package
Drawing
Pins
Package Qty
Eco Plan
(2)
Lead/
Ball Finish
MSL Peak Temp
TLV0834CD
ACTIVE
SOIC
D
14
50
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
TLV0834CDG4
ACTIVE
SOIC
D
14
50
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
TLV0834CDR
ACTIVE
SOIC
D
14
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
TLV0834CDRG4
ACTIVE
SOIC
D
14
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
TLV0834CPW
ACTIVE
TSSOP
PW
16
90
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
TLV0834CPWG4
ACTIVE
TSSOP
PW
16
90
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
TLV0834CPWR
ACTIVE
TSSOP
PW
16
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
TLV0834CPWRG4
ACTIVE
TSSOP
PW
16
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
TLV0834ID
ACTIVE
SOIC
D
14
50
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
TLV0834IDG4
ACTIVE
SOIC
D
14
50
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
TLV0834IDR
ACTIVE
SOIC
D
14
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
TLV0834IDRG4
ACTIVE
SOIC
D
14
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
TLV0834IN
ACTIVE
PDIP
N
14
25
Pb-Free (RoHS)
CU NIPDAU N / A for Pkg Type
TLV0834INE4
ACTIVE
PDIP
N
14
25
Pb-Free (RoHS)
CU NIPDAU N / A for Pkg Type
TLV0834IPW
ACTIVE
TSSOP
PW
16
90
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
TLV0834IPWG4
ACTIVE
TSSOP
PW
16
90
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
TLV0834IPWR
ACTIVE
TSSOP
PW
16
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
TLV0834IPWRG4
ACTIVE
TSSOP
PW
16
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Addendum-Page 1
(3)
Samples
(Requires Login)
PACKAGE OPTION ADDENDUM
www.ti.com
Orderable Device
(1)
20-Aug-2011
Status
(1)
Package Type Package
Drawing
Pins
Package Qty
Eco Plan
(2)
Lead/
Ball Finish
MSL Peak Temp
TLV0838CDW
ACTIVE
SOIC
DW
20
25
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
TLV0838CDWG4
ACTIVE
SOIC
DW
20
25
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
TLV0838CDWR
ACTIVE
SOIC
DW
20
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
TLV0838CDWRG4
ACTIVE
SOIC
DW
20
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
TLV0838CN
ACTIVE
PDIP
N
20
20
Pb-Free (RoHS)
CU NIPDAU N / A for Pkg Type
TLV0838CNE4
ACTIVE
PDIP
N
20
20
Pb-Free (RoHS)
CU NIPDAU N / A for Pkg Type
TLV0838CPW
ACTIVE
TSSOP
PW
20
70
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
TLV0838CPWG4
ACTIVE
TSSOP
PW
20
70
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
TLV0838CPWR
ACTIVE
TSSOP
PW
20
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
TLV0838CPWRG4
ACTIVE
TSSOP
PW
20
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
TLV0838IDW
ACTIVE
SOIC
DW
20
25
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
TLV0838IDWG4
ACTIVE
SOIC
DW
20
25
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
TLV0838IDWR
ACTIVE
SOIC
DW
20
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
TLV0838IDWRG4
ACTIVE
SOIC
DW
20
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
TLV0838IPW
ACTIVE
TSSOP
PW
20
70
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
TLV0838IPWG4
ACTIVE
TSSOP
PW
20
70
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
TLV0838IPWR
ACTIVE
TSSOP
PW
20
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
TLV0838IPWRG4
ACTIVE
TSSOP
PW
20
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
The marketing status values are defined as follows:
Addendum-Page 2
(3)
Samples
(Requires Login)
PACKAGE OPTION ADDENDUM
www.ti.com
20-Aug-2011
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 3
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Jul-2012
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
TLV0834CDR
SOIC
D
14
2500
330.0
16.4
6.5
9.0
2.1
8.0
16.0
Q1
TLV0834CPWR
TSSOP
PW
16
2000
330.0
12.4
6.9
5.6
1.6
8.0
12.0
Q1
TLV0834IDR
SOIC
D
14
2500
330.0
16.4
6.5
9.0
2.1
8.0
16.0
Q1
TLV0834IPWR
TSSOP
PW
16
2000
330.0
12.4
6.9
5.6
1.6
8.0
12.0
Q1
TLV0838CDWR
SOIC
DW
20
2000
330.0
24.4
10.8
13.1
2.65
12.0
24.0
Q1
TLV0838CPWR
TSSOP
PW
20
2000
330.0
16.4
6.95
7.1
1.6
8.0
16.0
Q1
TLV0838IDWR
SOIC
DW
20
2000
330.0
24.4
10.8
13.1
2.65
12.0
24.0
Q1
TLV0838IPWR
TSSOP
PW
20
2000
330.0
16.4
6.95
7.1
1.6
8.0
16.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Jul-2012
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
TLV0834CDR
SOIC
D
14
2500
367.0
367.0
38.0
TLV0834CPWR
TSSOP
PW
16
2000
367.0
367.0
35.0
TLV0834IDR
SOIC
D
14
2500
367.0
367.0
38.0
TLV0834IPWR
TSSOP
PW
16
2000
367.0
367.0
35.0
TLV0838CDWR
SOIC
DW
20
2000
367.0
367.0
45.0
TLV0838CPWR
TSSOP
PW
20
2000
367.0
367.0
38.0
TLV0838IDWR
SOIC
DW
20
2000
367.0
367.0
45.0
TLV0838IPWR
TSSOP
PW
20
2000
367.0
367.0
38.0
Pack Materials-Page 2
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