TI SN74SSTL16857

SN74SSTL16857
14-BIT SSTL_2 REGISTERED BUFFER
SCAS625C – FEBRUARY 1999 – REVISED OCTOBER 1999
D
D
D
D
D
D
D
D
D
DGG PACKAGE
(TOP VIEW)
Member of the Texas Instruments
Widebus Family
Supports SSTL_2 Signal Data Inputs and
Outputs
Supports LVTTL Switching Levels on the
RESET Pin
Differential CLK Signal
Flow-Through Architecture Optimizes PCB
Layout
Meets SSTL_2 Class II Specifications
Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model (A114-A)
– 200-V Machine Model (A115-A)
– 1000-V Charged-Device Model (C101)
Packaged in Plastic Thin Shrink
Small-Outline Package
Q1
Q2
GND
VDDQ
Q3
Q4
Q5
GND
VDDQ
Q6
Q7
VDDQ
GND
Q8
Q9
VDDQ
GND
Q10
Q11
Q12
VDDQ
GND
Q13
Q14
description
This 14-bit registered buffer is designed for 2.3-V
to 3.6-V VCC operation and SSTL_2 data input
and output levels.
All inputs are compatible with the JEDEC
Standard for SSTL_2, except the LVCMOS reset
(RESET) input. All outputs are SSTL_2, Class II
compatible.
1
48
2
47
3
46
4
45
5
44
6
43
7
42
8
41
9
40
10
39
11
38
12
37
13
36
14
35
15
34
16
33
17
32
18
31
19
30
20
29
21
28
22
27
23
26
24
25
D1
D2
GND
VCC
D3
D4
D5
D6
D7
CLK
CLK
VCC
GND
VREF
RESET
D8
D9
D10
D11
D12
VCC
GND
D13
D14
When RESET is low, the differential input receivers are disabled, and undriven (floating) data and clock inputs
are allowed. In addition, when RESET is low, all registers are reset, and all outputs are forced low. The LVCMOS
RESET input must always be held at a valid logic high or low level.
To ensure defined outputs from the register before a stable clock has been supplied, RESET must be held in
the low state during power up.
The SN74SSTL16857 is characterized for operation from 0°C to 70°C.
FUNCTION TABLE
(each flip-flop)
INPUTS
RESET
CLK
CLK
D
OUTPUT
Q
L
X
X
X
L
H
↓
↑
H
H
H
↓
↑
L
L
H
L or H
L or H
X
Q0
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Widebus is a trademark of Texas Instruments Incorporated.
Copyright  1999, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
1
SN74SSTL16857
14-BIT SSTL_2 REGISTERED BUFFER
SCAS625C – FEBRUARY 1999 – REVISED OCTOBER 1999
logic diagram (positive logic)
RESET
CLK
CLK
VREF
D1
34
38
39
35
48
1D
C1
1
Q1
R
To 13 Other Channels
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage range, VCC or VDDQ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 4.6 V
Input voltage range, VI (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to VDDQ + 0.5 V
Output voltage range, VO (see Notes 1 and 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to VDDQ + 0.5 V
Input clamp current, IIK (VI < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –50 mA
Output clamp current, IOK (VO < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –50 mA
Continuous output current, IO (VO = 0 to VDDQ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±50 mA
Continuous current through each VCC, VDDQ, or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±100 mA
Package thermal impedance, θJA (see Note 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70°C/W
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 150°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
2. Current flows only when the output is in the high state and VO > VDDQ.
3. The package thermal impedance is calculated in accordance with JESD 51.
2
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
SN74SSTL16857
14-BIT SSTL_2 REGISTERED BUFFER
SCAS625C – FEBRUARY 1999 – REVISED OCTOBER 1999
recommended operating conditions (see Note 4)
MIN
NOM
VDDQ
2.3
MAX
UNIT
VCC
VDDQ
Supply voltage
VREF
VTT
Reference voltage (VREF = VDDQ/2)
VI
VIH
Input voltage
AC high-level input voltage
Data inputs
VIL
VIH
AC low-level input voltage
Data inputs
DC high-level input voltage
Data inputs
VIL
VIH
DC low-level input voltage
Data inputs
High-level input voltage
RESET
VIL
VICR
Low-level input voltage
RESET
Common-mode input voltage range
CLK, CLK
0.97
VI(PP)
IOH
Peak-to-peak input voltage
CLK, CLK
360
High-level output current
–20
mA
IOL
TA
Low-level output current
20
mA
70
_C
Output supply voltage
1.15
Termination voltage
VREF–40 mV
0
1.25
VREF
3.6
V
2.7
V
1.35
V
VREF+40 mV
VCC
V
VREF+350 mV
V
VREF–350 mV
VREF+180 mV
Operating free-air temperature
V
V
VREF–180 mV
2
V
V
0.8
0
V
1.53
V
V
mV
NOTE 4: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
3
SN74SSTL16857
14-BIT SSTL_2 REGISTERED BUFFER
SCAS625C – FEBRUARY 1999 – REVISED OCTOBER 1999
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
PARAMETER
TEST CONDITIONS
VIK
II = –18 mA
IOH = –100 µA
VOH
IOH = –8 mA
IOH = –16 mA
23V
2.3
VI = 2.7 V or 0
VI = 1.7 V or 0.8V
VI = 2.7 V or 0
VI = 1.7 V or 0.8V
CLK CLK
CLK,
VI = 2.7 V or 0
VI = 1.7 V or 0.8V
VI = 2.7 V or 0
RESET
VREF
ICC
RESET
Ci
Data inputs
RESET
TYP
27V
2.7
VREF = 1
1.15
15 V or 1
1.35
35 V
36V
3.6
VREF = 1
1.15
15 V or 1
1.35
35 V
27V
2.7
15 V or 1
35 V
VREF = 1
1.15
1.35
VI = VCC or GND
VREF = 1
1.15
15 V or 1
1.35
35 V
V
V
0.2
0.35
±5
±5
±5
±1
±1
±1
±5
±5
2.7 V
±5
IO = 0
36V
3.6
1 7 V or 0.8
08V
VI = 1.7
2
5 V†
2.5
VI = 1.7
1 7 V or 0.8
08V
3 3 V‡
3.3
µA
±5
3.6 V
VI = 1.7 V or 0.8 V
VI = 2.7 V or 0
mA
±1
3.6 V
27V
2.7
µA
±5
2.7 V
IO = 0
V
0.35
36V
3.6
VI = 1.7 V or 0.8 V
VI = 2.7 V or 0
Data inputs
† All typical values are at VCC = 2.5 V, TA = 25°C.
‡ All typical values are at VCC = 3.3 V, TA = 25°C.
UNIT
–1.2
1.95
23V
2.3
VREF = 1
1.15
15 V or 1
1.35
35 V
MAX
VCC–0.2
1.95
2.3 V to 2.7 V
IOL = 16 mA
VI = 1.7 V or 0.8V
Data inputs
MIN
2.3 V to 2.7 V
IOL = 100 µA
IOL = 8 mA
VOL
II
VCC
2.3 V
90
90
90
mA
90
3
2.5
pF
3
2.5
timing requirements over recommended operating free-air temperature range (unless otherwise
noted) (see Figure 1)
VCC = 2.5 V
± 0.2 V
MIN
4
fclock
tw
Clock frequency
tsu
Setup time
th
Hold time, data after CLK↑, CLK↓
MAX
VCC = 3.3 V
± 0.3 V
MIN
150
Pulse duration, CLK, CLK high or low
150
3.3
3.3
Data before CLK↑, CLK↓
1.1
1.75
RESET high before CLK↑, CLK↓
0.6
1.1
0.7
0.7
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
UNIT
MAX
MHz
ns
ns
ns
SN74SSTL16857
14-BIT SSTL_2 REGISTERED BUFFER
SCAS625C – FEBRUARY 1999 – REVISED OCTOBER 1999
switching characteristics over recommended operating free-air temperature range (unless
otherwise noted) (see Figure 1)
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
VCC = 2.5 V
± 0.2 V
MIN
MAX
150
VCC = 3.3 V
± 0.3 V
MIN
UNIT
MAX
fmax
tpd
CLK and CLK
Q
1.5
3.8
1.4
3.7
ns
tPHL
RESET
Q
1.5
4.3
1.4
3.5
ns
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
150
MHz
5
SN74SSTL16857
14-BIT SSTL_2 REGISTERED BUFFER
SCAS625C – FEBRUARY 1999 – REVISED OCTOBER 1999
PARAMETER MEASUREMENT INFORMATION
VCC = 2.5 V ± 0.2 V AND VCC = 3.3 V ± 0.3 V
VTT
Test
Point
25 Ω
25 Ω
CL= 30 pF
(see Note A)
LOAD CIRCUIT
Timing
Input
VREF†
tsu
Data
Input
VIL§
VIH‡
VREF†
Output
Control
VIH‡
VREF†
tPLH
VOLTAGE WAVEFORMS
PULSE DURATION
VIL§
VIL§
Output
Input
VIL§
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
VREF†
VIH‡
VREF†
VREF†
th
VREF†
Input
tw
VIH‡
VREF†
VIL§
VOH
VREF†
VOL
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
INVERTING AND NONINVERTING OUTPUTS
tPLZ
tPZL
Output
Waveform 1
(see Note B)
VIL§
VIL§
VTT
VOL
tPHZ
tPZH
tPHL
VREF†
VIH‡
VREF†
VOH
Output
Waveform 2
(see Note B)
VIH‡
VIH‡
VTT
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
LOW- AND HIGH-LEVEL ENABLING
† VREF = VDDQ/2
‡ VIH = VREF + 350 mV (AC voltage levels)
§ VIL = VREF – 350 mV (AC voltage levels)
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr ≤ 1.25 ns/V,
tf ≤ 1.25 ns/V.
D. The outputs are measured one at a time with one transition per measurement.
E. VTT = VREF = VDDQ/2
F. tPLZ and tPHZ are the same as tdis.
G. tPZL and tPZH are the same as ten.
H. tPLH and tPHL are the same as tpd.
Figure 1. Load Circuit and Voltage Waveforms
6
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
IMPORTANT NOTICE
Texas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue
any product or service without notice, and advise customers to obtain the latest version of relevant information
to verify, before placing orders, that information being relied on is current and complete. All products are sold
subject to the terms and conditions of sale supplied at the time of order acknowledgement, including those
pertaining to warranty, patent infringement, and limitation of liability.
TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in
accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent
TI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarily
performed, except those mandated by government requirements.
CERTAIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OF
DEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICAL
APPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, OR
WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHER
CRITICAL APPLICATIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD TO
BE FULLY AT THE CUSTOMER’S RISK.
In order to minimize risks associated with the customer’s applications, adequate design and operating
safeguards must be provided by the customer to minimize inherent or procedural hazards.
TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent
that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other
intellectual property right of TI covering or relating to any combination, machine, or process in which such
semiconductor products or services might be or are used. TI’s publication of information regarding any third
party’s products or services does not constitute TI’s approval, warranty or endorsement thereof.
Copyright  1999, Texas Instruments Incorporated