DISCRETE SEMICONDUCTORS DATA SHEET BLW898 UHF linear power transistor Product specification Supersedes data of 1995 Oct 04 1996 Jul 16 Philips Semiconductors Product specification UHF linear power transistor BLW898 PINNING SOT171A FEATURES • Internal input matching for wideband operation and high power gain PIN • Polysilicon emitter ballasting resistors for an optimum temperature profile • Gold metallization ensures excellent reliability. APPLICATION • Common emitter class-A operation in linear transposers/transmitters (television) in the 470 to 860 MHz frequency band. DESCRIPTION 1 emitter 2 emitter 3 base 4 collector 5 emitter 6 emitter handbook, halfpage c 2 4 6 DESCRIPTION NPN silicon planar transistor in a SOT171A 6-lead rectangular flange package, with a ceramic cap. The transistor delivers a Po sync = 3 W in class-A operation at 860 MHz and a supply voltage of 25 V. b e 1 3 5 Top view MAM141 Fig.1 Simplified outline and symbol. QUICK REFERENCE DATA RF performance at Th = 25 °C in a common emitter test circuit. MODE OF OPERATION f (MHz) VCE (V) ICQ (A) Po sync (W) Gp (dB) CW class-A 860 25 1.1 ≥3(1) ≥9(1) Note 1. Three-tone test signal (−8, −16, and −10 dB); dim = −63 dB. WARNING Product and environmental safety - toxic materials This product contains beryllium oxide. The product is entirely safe provided that the BeO disc is not damaged. All persons who handle, use or dispose of this product should be aware of its nature and of the necessary safety precautions. After use, dispose of as chemical or special waste according to the regulations applying at the location of the user. It must never be thrown out with the general or domestic waste. 1996 Jul 16 2 Philips Semiconductors Product specification UHF linear power transistor BLW898 LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT VCBO collector-base voltage open emitter − 60 V VCEO collector-emitter voltage open base − 28 V VEBO emitter-base voltage open collector − 2.5 V IC collector current (DC) − 3.7 A IC(AV) average collector current − 3.7 A Ptot total power dissipation − 44 W Tstg storage temperature −65 +150 °C Tj operating junction temperature − 200 °C up to Tmb = 70 °C THERMAL CHARACTERISTICS SYMBOL PARAMETER CONDITIONS Rth j-mb thermal resistance from junction to mounting-base Rth mb-h thermal resistance from mounting-base to heatsink Ptot = 44 W; Tmb = 70 °C MGD531 120 handbook, halfpage Ptot (W) 80 (2) (1) 40 0 40 0 80 120 Tmb °C 160 (1) Continuous operation (2) Short-time operation during mismatch. Fig.2 1996 Jul 16 Power derating curve. 3 VALUE UNIT 3 K/W 0.3 K/W Philips Semiconductors Product specification UHF linear power transistor BLW898 CHARACTERISTICS Tj = 25 °C unless otherwise specified. SYMBOL PARAMETER CONDITIONS MIN. TYP. − MAX. − UNIT V(BR)CBO collector-base breakdown voltage IC = 15 mA; IE = 0 60 V V(BR)CEO collector-emitter breakdown voltage IC = 30 mA; IB = 0 28 − − V V(BR)EBO emitter-base breakdown voltage IE = 0.6 mA; IC = 0 2.5 − − V ICBO collector-base leakage current VBE = 0; VCB = 28 V − − 1.5 mA mA ICEO collector-emitter leakage current VCE = 20 V − − 3 hFE DC current gain VCE = 25 V; IC = 1.1 A 30 − 140 Cc collector capacitance VCB = 25 V; IE = ie = 0; f = 1 MHz − 18 − pF Cre feedback capacitance VCB = 25 V; IC = 0; f = 1 MHz − 11 − pF MGD532 MGD533 60 handbook, halfpage 160 handbook, halfpage hFE Cc (pF) 120 40 80 20 40 0 0 0 1 2 IC (A) 0 3 10 40 30 VCB (V) VCE = 25 V; tp = 500 µs; δ = <1 %. IE = ie = 0; f = 1 MHz. Fig.3 Fig.4 DC current gain as a function of collector current; typical values. 1996 Jul 16 20 4 Collector capacitance as a function of collector-base voltage; typical values. Philips Semiconductors Product specification UHF linear power transistor BLW898 APPLICATION INFORMATION RF performance at Th = 25 °C in a common emitter class-A test circuit. MODE OF OPERATION f (MHz) VCE (V) ICQ (A) Po sync (W) Gp (dB) dim (dB) CW class-A 860 25 1.1 ≥3(1) ≥9(1) <−63(1) CW class-A 860 25 1.1 ≥3(2) ≥9(2) <−60(2) Notes 1. Three-tone test method (vision carrier −8 dB, sound carrier −10 dB, sideband signal −16 dB), 0 dB corresponds to peak sync level. 2. Three-tone test method (vision carrier −8 dB, sound carrier −7 dB, sideband signal −16 dB), 0 dB corresponds to peak sync level. Ruggedness in class-A operation The BLW898 is capable of withstanding a load mismatch corresponding to VSWR = 50 : 1 through all phases, under the conditions: VCE = 25 V; ICQ = 1.1 A; Th = 25 °C; f = 860 MHz; Po sync = 3 W. MGD534 MGD535 12 30 handbook, halfpage handbook, halfpage Po sync (W) (1) (1) Gp (dB) (2) (2) 20 8 10 4 0 0 0 1 2 3 0 4 Pi sync (W) 10 20 30 Po sync (W) VCE = 25 V; ICQ = 1.1 A; f = 860 MHz; (3-tone; −8/−16/−10 dB). (1) Th = 25 °C. (2) Th = 70 °C. VCE = 25 V; ICQ = 1.1 A; f = 860 MHz; (3-tone; −8/−16/−10 dB). (1) Th = 25 °C. (2) Th = 70 °C. Fig.5 Fig.6 Output power as a function of input power; typical values. 1996 Jul 16 5 Power gain as a function of output power; typical values. Philips Semiconductors Product specification UHF linear power transistor BLW898 MGD536 −10 MGD537 -40 handbook, halfpage handbook, halfpage dim (dB) dim (dB) −30 -50 (1) (2) −50 -60 (1) (2) −70 -70 0 10 20 30 0 0.4 0.8 1.2 1.6 IC (A) Po sync (W) VCE = 25 V; ICQ = 1.1 A; f = 860 MHz; (3-tone; −8/−16/−10 dB). (1) Th = 25 °C. (2) Th = 70 °C. VCE = 25 V; ICQ = 1.1 A; f = 860 MHz; Po sync = 3 W; (3-tone; −8/−16/−10 dB). (1) Th = 70 °C. (2) Th = 25 °C. Fig.7 Fig.8 Intermodulation distortion as a function of output power; typical values. Intermodulation distortion as a function of collector current; typical values. ,,,,,, , ,,,,,, ,,,,,, ,,,,,, ,,,,,, L12 R2 handbook, full pagewidth +VBB C5 C4 C9 L6 input 50 Ω ,,,,,, ,,,,,, C1 L2 L3 L4 L5 L1 C2 C10 C11 C12 L11 C6 C7 L9 DUT L7 C3 L8 L10 C13 output 50 Ω C8 Fig.9 Class-A test circuit at 860 MHz. 1996 Jul 16 +VCC R1 6 MGD538 Philips Semiconductors Product specification UHF linear power transistor BLW898 160 handbook, full pagewidth 77 77 69 +VBB +VCC R2 C10 C5 L12 C4 L11 R1 C9 C12 C11 L6 C1 L1 L2 & L3 C2 L4 & L5 C3 L9 C7 C6 C8 L10 C13 L7 & L8 MGD539 Dimensions in mm. Fig.10 Printed-circuit board and component lay-out for 860 MHz class-A test circuit. 1996 Jul 16 7 Philips Semiconductors Product specification UHF linear power transistor BLW898 List of components COMPONENT DESCRIPTION VALUE DIMENSIONS CATALOGUE No. C1 multilayer ceramic chip capacitor; note 1 8.2 pF C2, C8 Tekelec Giga trim 37271 0.6 to 4.5 pF C3 multilayer ceramic chip capacitor; note 1 15 pF C4, C12 multilayer ceramic chip capacitor 10 nF; 63 V 2222 592 16627 C5 solid aluminium capacitor 10 µF; 63 V 2222 030 38109 C6 multilayer ceramic chip capacitor; note 2 10 pF C7 multilayer ceramic chip capacitor; note 2 2.4 pF C9 multilayer ceramic chip capacitor; note 2 500 pF C10 solid aluminium capacitor 47 µF; 63 V C11 multilayer ceramic chip capacitor; note 2 330 pF C13 multilayer ceramic chip capacitor; note 1 5.1 pF L1 stripline; note 3 50 Ω 50 × 2.3 mm L2 stripline; note 3 50 Ω 10 × 2.3 mm L3 stripline; note 3 40 Ω 2 × 3.25 mm L4, L5 stripline; note 3 40 Ω 4 × 3.25 mm L6 RF choke 220 nH L7 stripline; note 3 40 Ω 2222 031 38479 9 × 3.25 mm L8 stripline; note 3 40 Ω 3.5 × 3.25 mm L9 stripline; note 3 50 Ω 9 × 2.3 mm L10 stripline; note 3 50 Ω 48.5 × 2.3 mm L11 stripline; note 3 40 Ω 41.5 × 3.25 mm L12 grade 4S2 ferroxcube wideband RF choke R1 metal film resistor 50 Ω; 0.6 W 2322 156 14999 R2 metal film resistor 10 Ω; 0.6 W 2322 156 11009 4330 030 36301 Notes 1. American Technical Ceramics type 100A or capacitor of same quality. 2. American Technical Ceramics type 100B or capacitor of same quality. 3. The striplines are on a double copper-clad PCB with PTFE fibre-glass dielectric (εr = 2.2); thickness 0.79 mm. 1996 Jul 16 8 Philips Semiconductors Product specification UHF linear power transistor Table 1 BLW898 Common emitter scattering parameter, ICQ = 1.1 A; VCE = 25 V. f (MHZ) S11 MAG. (RAT) S21 ANG. (DEG) MAG. (RAT) S12 ANG. (DEG) MAG. (RAT) S22 ANG. (DEG) MAG. (ANG) ANG. (DEG) GUM (dB) 470 0.962 176.1 1.002 68.3 0.017 32.6 0.802 −178.2 15.7 495 0.961 175.9 0.961 66.9 0.017 32.8 0.803 −178.2 15.2 520 0.959 175.7 0.923 65.7 0.017 33.6 0.804 −178.2 14.7 545 0.958 175.5 0.891 64.4 0.018 34.9 0.803 −178.3 14.3 570 0.957 175.3 0.861 63.2 0.018 35.8 0.804 −178.2 14.0 595 0.955 175.0 0.835 62.0 0.018 36.1 0.805 −178.2 13.5 620 0.953 174.8 0.815 61.0 0.019 36.8 0.804 −178.2 13.0 645 0.951 174.5 0.795 59.7 0.019 37.3 0.805 −178.1 12.7 670 0.950 174.2 0.775 58.6 0.019 37.4 0.807 −178.0 12.5 695 0.947 173.9 0.757 57.7 0.020 37.8 0.806 −178.0 12.0 720 0.943 173.7 0.744 56.6 0.021 38.5 0.805 −178.1 11.5 745 0.942 173.4 0.732 55.4 0.021 38.6 0.807 −177.9 11.3 770 0.941 173.1 0.724 54.4 0.021 39.8 0.808 −177.8 11.1 795 0.938 172.8 0.716 53.3 0.021 40.1 0.807 −177.8 10.8 820 0.935 172.5 0.707 51.8 0.022 39.1 0.808 −177.8 10.6 845 0.933 172.1 0.701 50.9 0.021 39.3 0.810 −177.6 10.4 860 0.932 171.9 0.700 50.2 0.022 39.4 0.809 −177.5 10.3 1996 Jul 16 9 Philips Semiconductors Product specification UHF linear power transistor BLW898 PACKAGE OUTLINE 11.5 10.5 handbook, full pagewidth 5.85 2.25 min 1 (2x) 3.25 9.15 2.85 1 2 3 4 5 6 25.2 max 18.42 2.25 1.85 (2x) 3.45 (2x) 3.15 2.8 4.50 4.05 7.0 max 6 max 0.14 MBC828 - 1 Dimensions in mm. Fig.11 SOT171A. 1996 Jul 16 10 9.3 max Philips Semiconductors Product specification UHF linear power transistor BLW898 DEFINITIONS Data Sheet Status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. 1996 Jul 16 11 Philips Semiconductors – a worldwide company Argentina: see South America Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113, Tel. +61 2 9805 4455, Fax. +61 2 9805 4466 Austria: Computerstr. 6, A-1101 WIEN, P.O. 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Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in The Netherlands 127041/1200/02/pp12 Date of release: 1996 Jul 16 Document order number: 9397 750 00966