CHR3663-QEG RoHS COMPLIANT 17-24GHz Integrated Down Converter GaAs Monolithic Microwave IC in SMD package Description The CHR3663-QEG is a multifunction part, which integrates a balanced cold FET mixer, a multiplier by two, and a RF LNA including gain control. It is designed for a wide range of applications, typically commercial communication systems and ISM. The circuit is manufactured with a robust high volume pHEMT process, 0.25µm gate length. It is available in lead-free SMD package. UMS R3663 YYWW 16 14 12 10 8 Conversion Gain (dB) Main Features ■ Broadband RF performance 17-24GHz ■ 11dB conversion gain ■ 15dBc Image Rejection ■ 3dBm Input IP3 ■ 15dB Gain control ■ 24LQFN4x5 ■ MSL1 6 4 2 0 -2 -4 -6 -8 -10 -12 Gcmax_SUP@2GHz Gcmax_INF@2GHz -14 Gcmin_SUP@2GHz Gcmin_INF@2GHz -16 17 18 19 20 21 22 23 24 25 RF Frequency (GHz) Main Characteristics Tamb = +25°C, Vd = 4.5V Symbol Parameter Min Typ Max Unit FRF RF frequency range 17.0 24.0 GHz FLO LO frequency range 7.0 14.0 GHz FIF IF frequency range DC 3.5 GHz Gc Conversion gain 11 dB ESD Protections: Electrostatic discharge sensitive device observe handling precautions! Ref. :DSCHR3663-QEG1192 - 11 Jul 11 1/18 Specifications subject to change without notice United Monolithic Semiconductors S.A.S. Route Départementale 128 - BP46 - 91401 Orsay Cedex France Tel.: +33 (0) 1 69 33 03 08 - Fax: +33 (0) 1 69 33 03 09 26 17–24GHz Down Converter CHR3663-QEG Electrical Characteristics Tamb = +25°C, VD = VDL = 4.5V Symbol Parameter Min Typ Max Unit FRF RF frequency range 17.0 24.0 GHz FLO LO frequency range 7.0 14.0 GHz FIF IF frequency range DC 3.5 GHz Gc Conversion gain@ min. attenuation (1) 8.5 G NF 11.0 dB Gain control range 15 dB Noise Figure@ min. attenuation, for IF>0.1GHz 3.5 Image rejection (1) 15 dBc PLO LO Input power 0 dBm IIP3 Input IP3@ min. att. 3 dBm Im_rej 0 4.5 dB 2LO/RF 2LO leakage at RF port @ max. gain -40 dBm VD, VDL DC drain voltage 4.5 V Drain current 380 mA LNA DC gate voltage -0.4 V Id VGL GC2, GC3 VGM Gain control DC voltage -2.0 Mixer DC gate voltage +0,6 -0.7 V V These values are representative of onboard measurements as defined on the drawing at paragraph “Evaluation mother board”. (1) An external combiner 90° is required on I / Q. Note: Id not affected by GC2, GC3. Ref. : DSCHR3663-QEG1192 - 11 Jul 11 2/18 Route Départementale 128, BP46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0) 1 69 33 03 08 - Fax: +33 (0) 1 69 33 03 09 Specifications subject to change without notice 17–24GHz Down Converter CHR3663-QEG Absolute Maximum Ratings (1) Tamb = +25°C Symbol Parameter Values Unit Vd Maximum drain bias voltage 5 V Id Maximum drain bias current 450 mA VGL,VGM LNA, mixer DC gate voltage -2.0 to +0.4 V Gain control voltage -2.5 to + 0.8 V GC1, 2 P_RF Maximum peak input power overdrive 10 dBm P_LO Maximum LO input power 10 dBm Tch Maximum channel temperature 175 °C Ta Operating temperature range -40 to +85 °C Tstg Storage temperature range -55 to +125 °C (1) Operation of this device above anyone of these paramaters may cause permanent damage. Ref. : DSCHR3663-QEG1192 - 11 Jul 11 3/18 Route Départementale 128, BP46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0) 1 69 33 03 08 - Fax: +33 (0) 1 69 33 03 09 Specifications subject to change without notice 17–24GHz Down Converter CHR3663-QEG Device thermal performances All the figures given in this section are obtained assuming that the QFN device is cooled down only by conduction through the package thermal pad (no convection mode considered). The temperature is monitored at the package back-side interface (Tcase) as shown below. The system maximum temperature must be adjusted in order to guarantee that Tcase remains below than the maximum value specified in the next table. So, the system PCB must be designed to comply with this requirement. A derating must be applied on the dissipated power if the Tcase temperature can not be maintained below than the maximum temperature specified in order to guarantee the nominal device life time (MTTF) (see the curve Pdiss. Max). DEVICE THERMAL SPECIFICATION : CHR3663-QEG Recommanded max. junction temperature (Tj max) : 143 Junction temperature absolute maximum rating : 175 Max. continuous dissipated power @ Tcase= 85 °C : 1,71 (1) => Pdiss derating above Tcase = 85 °C : 29 Junction-Case thermal resistance (Rth J-C)(2) : <34 Min. package back side operating temperature(3) : -40 Max. package back side operating temperature(3) : 85 Min. storage temperature : -55 Max. storage temperature : 125 °C °C W mW/°C °C/W °C °C °C °C (1) Derating at junction temperature constant = Tj max (2) Rth J-C is calculated for a worst case where the hotter junction of the MMIC is considered. (3) Tcase=Package back side temperature measured under the die-attach-pad (see the drawing below). Tcase 1,8 1,6 1,4 1 0,8 0,6 0,4 Pdiss. Max. (W) 0,2 Pdiss. Max. (W) 1,2 Example of QFN 16L 3x3 back-side view, temperature reference point (Tcase) location. 0 -50 -25 0 25 50 75 100 125 Tcase (°C) 5.6 Ref. : DSCHR3663-QEG1192 - 11 Jul 11 4/18 Route Départementale 128, BP46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0) 1 69 33 03 08 - Fax: +33 (0) 1 69 33 03 09 Specifications subject to change without notice 17–24GHz Down Converter CHR3663-QEG Typical Measured Performances Tamb = +25°C, VD = VDL = 4.5V, VGL = -0.4V, VGM = -0.7V, P_LO = 0dBm These values are representative of onboard measurements (on connector access planes) as defined on the drawing 97625 page 16. The board losses are estimated from 1.5 to 2.0dB in the frequency range. 16 14 12 10 Conversion Gain (dB) 8 6 4 2 0 -2 -4 -6 -8 -10 -12 Gcmax_SUP@2GHz Gcmax_SUP@3,5GHz -14 Gcmin_SUP@2GHz Gcmin_SUP@3,5GHZ -16 17 18 19 20 21 22 23 24 25 26 RF Frequency (GHz) Figure 1: Conversion Gain in Supradyne Mode versus Frequency F_RF = 2xF_LO+F_IF, F_IF = 2.0 & 3.5GHz, GC2 = GC3 = -1.5 & 0.5V 16 14 12 10 Conversion Gain (dB) 8 6 4 2 0 -2 -4 -6 -8 -10 -12 Gcmax_INF@2GHz Gcmax_INF@3,5GHz -14 Gcmin_INF@2GHz Gcmin_INF@3,5GHz -16 17 18 19 20 21 22 23 24 25 26 RF Frequency (GHz) Figure 2: Conversion Gain in Infradyne Mode versus Frequency F_RF = 2xF_LO-F_IF, F_IF = 2.0 & 3.5GHz, GC2 = GC3 = -1.5 & 0.5V Ref. : DSCHR3663-QEG1192 - 11 Jul 11 5/18 Route Départementale 128, BP46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0) 1 69 33 03 08 - Fax: +33 (0) 1 69 33 03 09 Specifications subject to change without notice 17–24GHz Down Converter CHR3663-QEG 30 28 26 24 Dynamic Range (dB) 22 20 18 16 14 12 10 8 6 DynamicRange_SUP@2GHz 4 DynamicRange_INF@2GHz 2 0 17 18 19 20 21 22 23 24 25 26 RF Frequency (GHz) Figure 3: Dynamic Range (Gcmax – Gcmin) versus Frequency F_RF = 2xF_LO-F_IF & F_RF = 2xF_LO+F_IF, F_IF = 2.0GHz 300 280 260 Drain Current (dB) 240 220 200 IDL@P_RF=-20dBm ID@P_LO=0dBm 180 160 140 120 100 16 17 18 19 20 21 22 23 24 25 26 Frequency (GHz) Figure 4: Drain Currents versus Frequency F_RF = 2xF_LO-F_IF, Freq_IF = 2.0GHz, GC2 = GC3 = -1.5V Ref. : DSCHR3663-QEG1192 - 11 Jul 11 6/18 Route Départementale 128, BP46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0) 1 69 33 03 08 - Fax: +33 (0) 1 69 33 03 09 Specifications subject to change without notice 17–24GHz Down Converter CHR3663-QEG 15 F_RF=16GHz F_RF=22GHz 14 F_RF=18GHz F_RF=24GHz F_RF=20GHz F_RF=26GHz Conversion Gain (dB) 13 12 11 10 9 8 7 6 5 -26 -24 -22 -20 -18 -16 -14 -12 -10 -8 -6 -4 -2 0 2 4 6 4 6 Input Power (dBm) Figure 5 : Conversion Gain versus RF Power & Frequency F_RF = 2xF_LO+F_IF, F_IF = 2.0GHz, GC2 = GC3 = -1.5V 16 14 12 10 Conversion Gain (dB) 8 6 4 2 0 -2 -4 -6 -8 -10 -12 GCx=-1,5V Gcx=-0,1V -14 Gcx=-0,5V GCx=+0,5V" Gcx=-0,3V -16 -26 -24 -22 -20 -18 -16 -14 -12 -10 -8 -6 -4 -2 0 2 Input Power (dBm) Figure 6: Conversion Gain versus RF Power & Gain control F_RF = 2xF_LO+F_IF, F_RF = 20GHz, F_IF = 2.0GHz Ref. : DSCHR3663-QEG1192 - 11 Jul 11 7/18 Route Départementale 128, BP46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0) 1 69 33 03 08 - Fax: +33 (0) 1 69 33 03 09 Specifications subject to change without notice 17–24GHz Down Converter Input IP3 (dBm) CHR3663-QEG 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 F_RF=17,5GHz F_RF=20,5GHz -20 F_RF=23,5GHz -15 -10 Input Power (dBm) Input IP3 (dBm) Figure 7: Input IP3 versus RF Frequency & RF Power (Double Carrier) F_RF = 2xF_LO-F_IF, F_IF = 3.5GHz, GC2 = GC3 = -1.5V 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 GCx=-1,5V GCx=-0,5V -20 GCx=-0,3V -15 -10 Input Power (dBm) Figure 8: Input IP3 versus Gain Control & RF Power (Double Carrier) F_RF = 2xF_LO-F_IF, F_RF = 20.5GHz, F_IF = 3.5GHz Ref. : DSCHR3663-QEG1192 - 11 Jul 11 8/18 Route Départementale 128, BP46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0) 1 69 33 03 08 - Fax: +33 (0) 1 69 33 03 09 Specifications subject to change without notice 17–24GHz Down Converter CHR3663-QEG Temperature Measurements T = [-40, +25, 85] °C, VD = VDL = 4.5V, VGL = -0.4V, VGM = -0.7V, P_LO = 0dBm 16 14 12 10 Conversion Gain (dB) 8 6 4 2 0 -2 -4 -6 -8 -10 -12 Gcmax_SUP@-40°C Gcmax_SUP@25°C Gcmax_SUP@85°C -14 Gcmin_SUP@-40°C Gcmin_SUP@25°C Gcmin_SUP@85°C -16 17 18 19 20 21 22 23 24 25 26 RF Frequency (GHz) Figure 9: Conversion Gain in Supradyne Mode versus Temperature & Frequency F_RF = 2xF_LO+F_IF, F_IF = 2.0GHz, GC2 = GC3 = -1.5 & 0.5V 16 14 12 10 Conversion Gain (dB) 8 6 4 2 0 -2 -4 -6 -8 -10 -12 Gcmax_INF@-40°C Gcmax_INF@25°C Gcmax_INF@85°C -14 -16 17 18 19 20 21 Gcmin_INF@-40°C Gcmin_INF@25°C Gcmin_INF@85°C 22 23 24 25 26 RF Frequency (GHz) Figure 10: Conversion Gain in Infradyne Mode versus Temperature & Frequency F_RF = 2xF_LO-F_IF, F_IF = 2.0GHz, GC2 = GC3 = -1.5 & 0.5V Ref. : DSCHR3663-QEG1192 - 11 Jul 11 9/18 Route Départementale 128, BP46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0) 1 69 33 03 08 - Fax: +33 (0) 1 69 33 03 09 Specifications subject to change without notice 17–24GHz Down Converter CHR3663-QEG 40 35 Image Rejection (dBc) 30 25 20 15 10 5 IM_REJ_I@-40°C IM_REJ_I@25°C IM_REJ_I@85°C 0 7 8 9 10 11 12 13 14 LO Frequency (GHz) Figure 11: Image Rejection on Output I F_IF = 2.0GHz, GC2 = GC3 = -1.5V 40 35 Image Rejection (dBc) 30 25 20 15 10 5 IM_REJ_Q@-40°C IM_REJ_Q@25°C IM_REJ_Q@85°C 0 7 8 9 10 11 12 13 14 LO Frequency (GHz) Figure 12: Image Rejection on Output Q F_IF = 2.0GHz, GC2 = GC3 = -1.5V Ref. : DSCHR3663-QEG1192 - 11 Jul 11 10/18 Route Départementale 128, BP46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0) 1 69 33 03 08 - Fax: +33 (0) 1 69 33 03 09 Specifications subject to change without notice Input IP3 (dBm) 17–24GHz Down Converter 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 CHR3663-QEG T=-40°C T=25°C -20 T=75°C -15 -10 Input Power (dBm) Figure 13: Input IP3 versus Temperature & RF Power (Double Carrier) F_RF = 2xF_LO-F_IF, F_RF = 20.5GHz, F_IF = 3.5GHz, GC2 = GC3 = -1.5V Noise Figure (dB) The following values are representative of onboard measurements of the Noise Figure where board losses have been deembedded (result given on package access planes). 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 NF_SUP@-40°C 16 17 18 19 NF_SUP@25°C 20 21 22 NF_SUP@85°C 23 24 25 26 RF Frequency (GHz) Figure 14: Noise Figure in Supradyne Mode vs Temperature & Frequency F_RF = 2xF_LO+F_IF, F_IF = 2.0GHz, GC2 = GC3 = -1.5V Ref. : DSCHR3663-QEG1192 - 11 Jul 11 11/18 Route Départementale 128, BP46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0) 1 69 33 03 08 - Fax: +33 (0) 1 69 33 03 09 Specifications subject to change without notice 17–24GHz Down Converter Noise Figure (dB) CHR3663-QEG 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 NF_INF@-40°C 16 17 18 19 NF_INF@25°C 20 21 22 NF_INF@85°C 23 24 25 26 RF Frequency (GHz) Figure 15: Noise Figure in Infradyne Mode vs Temperature & Frequency F_RF = 2xF_LO-F_IF, F_IF = 2.0GHz, GC2 = GC3 = -1.5V Ref. : DSCHR3663-QEG1192 - 11 Jul 11 12/18 Route Départementale 128, BP46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0) 1 69 33 03 08 - Fax: +33 (0) 1 69 33 03 09 Specifications subject to change without notice 17–24GHz Down Converter CHR3663-QEG Package outline (1) 1- Nc 2- Nc 3- Nc 4- GND(2) 5- RF in 6- GND(2) 7- GC3 8- GC2 9- VGL 10- VDL 11- VGM 12- VD 13- Nc 14- GND(2) 15- LO in 16- GND(2) 17- Nc 18- Nc 19- Nc 20- IF_I out 21- GND(2) 22- IF_Q out 23- Nc 24- Nc 25- GND Exposed pad (1) The package outline drawing included to this data-sheet is given for indication. Refere to the application note AN0017 available at http://www.ums-gaas.com for exact package dimensions. (2) It is strongly recommended to ground on the PCB board all the pins referenced as GND. Ref. : DSCHR3663-QEG1192 - 11 Jul 11 13/18 Route Départementale 128, BP46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0) 1 69 33 03 08 - Fax: +33 (0) 1 69 33 03 09 Specifications subject to change without notice 17–24GHz Down Converter CHR3663-QEG Evaluation mother board Compatible with the proposed footprint. Based on typically Ro4003 / 8mils or equivalent. Using a microstrip to coplanar transition to access the package. Recommended for the implementation of this product on a module board. Decoupling capacitors of 10nF 10% are recommended for all DC accesses. (See application note AN0017 for details). Decoupling Capacitors = 10nF Hybrid coupler Anaren 90° 2-4GHz Ref. : DSCHR3663-QEG1192 - 11 Jul 11 GC3 GC2 VGL VDL VGM VD 14/18 Route Départementale 128, BP46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0) 1 69 33 03 08 - Fax: +33 (0) 1 69 33 03 09 Specifications subject to change without notice 17–24GHz Down Converter CHR3663-QEG Notes 16 15 NC GND 17 LO IN NC 19 18 GND NC NC Due to ESD protection circuits on RF and LO inputs, an external capacitance might be requested to isolate the product from external voltage that could be present on these accesses in the application. 14 13 IF_I 20 12 VD GND 21 11 VGM IF_Q 22 10 VDL NC 23 9 VGL NC 24 8 GC2 6 7 GC3 5 GND 4 RF IN NC 3 GND 2 NC 1 NC X2 ESD protections are also implemented on gate accesses. The DC connections do not include any decoupling capacitor in package, therefore it is mandatory to provide a good external DC decoupling on the PC board, as close as possible to the package. Ref. : DSCHR3663-QEG1192 - 11 Jul 11 15/18 Route Départementale 128, BP46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0) 1 69 33 03 08 - Fax: +33 (0) 1 69 33 03 09 Specifications subject to change without notice 17–24GHz Down Converter CHR3663-QEG DC Schematic LNA: 4.5V, 110mA Vd=4.5V, 110mA 2k 45 17 22 17mA 41mA 1x100µm 1x100µm 64 310 52mA 1x100µm 1x100µm 1x100µm 1x100µm 3.4k 3.4k 1.3k 1.8k GC2 GC3 1.5k Vg~ -0.35V LO Buffer: 4.5V, 270mA Vd= 4.5V, 270mA Differential Amplifier Differential Multiplier 90mA Buffer 1 65mA Buffer 2 30mA 85mA 1k 25 960 8 1k 40 15 4x75µm 40 510 960 185 1.6k 2x75µm 510 725 25 16 100 220 40 100 190 100 50 50 Mixer 200 Ref. : DSCHR3663-QEG1192 - 11 Jul 11 16/18 Route Départementale 128, BP46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0) 1 69 33 03 08 - Fax: +33 (0) 1 69 33 03 09 Specifications subject to change without notice 17–24GHz Down Converter CHR3663-QEG Notes: Ref. : DSCHR3663-QEG1192 - 11 Jul 11 17/18 Route Départementale 128, BP46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0) 1 69 33 03 08 - Fax: +33 (0) 1 69 33 03 09 Specifications subject to change without notice 17–24GHz Down Converter CHR3663-QEG Recommended package footprint Refer to the application note AN0017 available at http://www.ums-gaas.com for package foot print recommendations and exact package dimensions. SMD mounting procedure For the mounting process standard techniques involving solder paste and a suitable reflow process can be used. For further details, see application note AN0017. Recommended environmental management Refer to the application note AN0019 available at http://www.ums-gaas.com for environmental data on UMS package products. Recommended ESD management Refer to the application note AN0020 available at http://www.ums-gaas.com for ESD sensitivity and handling recommendations for the UMS package products. Ordering Information QFN 4x5 RoHS compliant package: CHR3663-QEG/XY Stick: XY = 20 Tape & reel: XY = 21 Information furnished is believed to be accurate and reliable. However United Monolithic Semiconductors S.A.S. assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of United Monolithic Semiconductors S.A.S.. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. United Monolithic Semiconductors S.A.S. products are not authorised for use as critical components in life support devices or systems without express written approval from United Monolithic Semiconductors S.A.S. Ref. : DSCHR3663-QEG1192 - 11 Jul 11 18/18 Route Départementale 128, BP46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0) 1 69 33 03 08 - Fax: +33 (0) 1 69 33 03 09 Specifications subject to change without notice