ELANTEC EL7562CU

Monolithic 2 Amp DC:DC Step-down Regulator
Features
General Description
• Integrated synchronous MOSFETs
and current mode controller
• 2A continuous output current
• Up to 95% efficiency
• 4.5V to 5.5V input voltage
• Adjustable output from 1V to 3.8V
• Cycle-by-cycle current limit
• Precision reference
• ±0.5% load and line regulation
• Adjustable switching frequency to
1MHz
• Oscillator synchronization
possible
• Internal soft start
• Over temperature protection
• Under voltage lockout
• 16-pin QSOP package
The EL7562C is an integrated, synchronous step-down regulator with
output voltage adjustable from 1.0V to 3.8V. It is capable of delivering
2A continuous current at up to 95% efficiency. The EL7562C operates
at a constant frequency pulse width modulation (PWM) mode, making
external synchronization possible. Patented on-chip resistorless current sensing enables current mode control, which provides cycle-bycycle current limiting, over-current protection, and excellent step load
response. The EL7562C is available in a fused-lead 16-pin QSOP
package. With proper external components, the whole converter fits
into a less than 0.5 in2 area. The minimal external components and
small size make this EL7562C ideal for desktop and portable
applications.
Applications
•
•
•
•
•
DSP, CPU Core and IO Supplies
Logic/Bus Supplies
Portable Equipment
DC:DC Converter Modules
GTL + Bus Power Supply
The EL7562C is specified for operation over the -40°C to +85°C temperature range.
Typical Application Diagram
C3
EL7562CU
C4
0.1µF 270pF
Ordering Information
Part No
Tape & Reel
Outline #
16-Pin QSOP
-
MDP0040
1 SGND
PGND 16
2 COSC
VREF 15
C5
0.1µF
R3
Package
EL7562C - Preliminary
EL7562C - Preliminary
3 VDD
39Ω
FB 14
4 PGND
VDRV 13
5 PGND
LX 12
6 VIN
LX 11
7 VIN
VHI 10
R2
R1
2.37k
1kΩ
L1
C1
C2
100µF 0.1µF
8 EN
0.1µF
4.7µF
VO
(3.3V,
2A)
100µF
C7
PGND 9
Manufactured under U.S. Patent No. 57,323,974
Note: All information contained in this data sheet has been carefully checked and is believed to be accurate as of the date of publication; however, this data sheet cannot be a “controlled document”. Current revisions, if any, to these
specifications are maintained at the factory and are available upon your request. We recommend checking the revision level before finalization of your design documentation.
© 2001 Elantec Semiconductor, Inc.
October 25, 2001
VIN
(4.5V5.5V)
C6
EL7562C - Preliminary
EL7562C - Preliminary
Monolithic 2 Amp DC:DC Step-down Regulator
Absolute Maximum Ratings (T
Supply Voltage between VIN or VDD and GND
VLX Voltage
Input Voltage
VHI Voltage
A
= 25°C)
+6.5V
VIN +0.3V
GND -0.3V, VDD +0.3V
GND -0.3V, VLX +6V
Storage Temperature
Operating Ambient Temperature
Operating Junction Temperature
-65°C to +150°C
-40°C to +85°C
+135°C
Important Note:
All parameters having Min/Max specifications are guaranteed. Typ values are for information purposes only. Unless otherwise noted, all tests are at the
specified temperature and are pulsed tests, therefore: TJ = TC = TA.
DC Characteristics
VDD = VIN = 5V, TA = TJ = 25°C, COSC = 1.2nF, unless otherwise specified.
Parameter
Description
Conditions
Min
Typ
Max
1.24
1.26
1.28
VREF
Reference Accuracy
VREFTC
Reference Temperature Coefficient
VREFLOAD
Reference Load Regulation
VRAMP
Oscillator Ramp Amplitude
IOSC_CHG
Oscillator Charge Current
0.1V < V OSC < 1.25V
IOSC_DIS
Oscillator Discharge Current
0.1V < V OSC < 1.25V
IVDD+VDRV
VDD+VDRV Supply Current
VEN = 4V, FOSC = 120kHz
IVDD_OFF
VDD Standby Current
EN = 0
VDD_OFF
VDD for Shutdown
3.5
VDD_ON
VDD for Startup
3.95
4.35
TOT
Over Temperature Threshold
50
0 < IREF < 50µA
%
1.15
V
200
µA
8
mA
3.5
5
mA
1
1.5
mA
3.9
V
135
THYS
Over Temperature Hysteresis
ILEAK
Internal FET Leakage Current
ILMAX
Peak Current Limit
RDSON
FET On Resistance
RDSONTC
RDSON Tempco
VFB
Output Initial Accuracy
ILOAD = 0A
VFB_LINE
Output Line Regulation
VIN = 5V, ∆VIN = 10%, ILOAD = 0A
0.5
°C
10
µA
120
mΩ
3
A
60
0.2
0.960
V
°C
20
EN = 0, LX = 5V (low FET), LX = 0V (high FET)
Wafer level test only
V
ppm/°C
-1
2
Unit
0.975
mΩ/°C
0.99
V
%
VFB_LOAD
Output Load Regulation
0.1A < I LOAD < 1A
0.5
%
VFB_TC
Output Temperature Stability
-40°C < TA < 85°C, ILOAD = 0.5A
±1
%
IFB
Feedback Input Pull Up Current
VFB = 0V
100
200
nA
VEN_HI
EN Input High Level
3.2
4
V
VEN_LO
EN Input Low Level
IEN
Enable Pull Up Current
1
VEN = 0
V
-4
-2.5
µA
Min
Typ
Max
Unit
105
117
130
kHz
Closed Loop AC Electrical Characteristics
VS = VIN = 5V, TA = TJ = 25°C, COSC = 1.2nF, unless otherwise specified.
Parameter
Description
Conditions
FOSC
Oscillator Initial Accuracy
tSYNC
Minimum Oscillator Sync Width
25
ns
MSS
Soft Start Slope
0.5
V/ms
tBRM
FET Break Before Make Delay
15
ns
tLEB
High Side FET Minimum On Time
150
ns
DMAX
Maximum Duty Cycle
95
%
2
Pin Descriptions
Pin Number
Pin Name
1
SGND
Control circuit negative supply.
Pin Function
2
COSC
Oscillator timing capacitor. FOSC can be approximated by: FOSC (kHz) = 0.1843/COSC, COSC in µF.
3
VDD
Control circuit positive supply.
4
PGND
Ground return of the regulator. Connected to the source of the low-side synchronous NMOS power FET.
5
PGND
Ground return of the regulator. Connected to the source of the low-side synchronous NMOS power FET.
6
VIN
Power supply input of the regulator. Connected to the drain of the high-side NMOS power FET.
7
VIN
Power supply input of the regulator. Connected to the drain of the high-side NMOS power FET.
8
EN
Chip Enable, active high. A 2µA internal pull-up current enables the device if the pin is left open.
9
PGND
10
VHI
Positive supply of the high-side driver.
11
LX
Inductor drive pin. High current digital output whose average voltage equals the regulator output voltage.
12
LX
Inductor drive pin. High current digital output whose average voltage equals the regulator output voltage.
13
VDRV
14
FB
Ground return of the regulator.
Positive supply of the low-side driver and input voltage for the high-side boot strap.
Voltage feedback input. Connected to an external resistor divider between VOUT and GND. A 125nA pull-up current
forces VOUT to VS in the event that FB is floating.
15
VREF
Bandgap reference bypass capacitor. Typically 0.1µF to GND.
16
PGND
Ground return of the regulator.
3
EL7562C - Preliminary
EL7562C - Preliminary
Monolithic 2 Amp DC:DC Step-down Regulator
Monolithic 2 Amp DC:DC Step-down Regulator
Typical Performance Curves
100
Efficiency vs I O
VIN=5V
0.7
VO=2.5V
95
VO=3.3V
0.5
85
VO=1.8V
80
VO=1.5V
Power Loss (W)
Efficiency (%)
Power Loss vs IO
VIN=5V
0.6
90
VO=1.2V
75
70
FS=500kHz
L=Coilcraft DO3316P-472
65
60
0.1
1
VO=3.3V
0.4
VO=2.5V
0.3
VO=1.8V
VO=1.2V
0.2
VO=1.5V
0.1
0
2
0
0.5
1
1.5
2
1.5
2
110
160
Load Current IO (A)
Load Current IO (A)
Efficiency vs I O
VO=3.3V
85
VIN=5.5V
80
75
70
VIN=5.5V
0.4
0.2
VIN=5V
0
VIN=4.5V
-0.2
-0.4
65
60
Load Regulation
VO=3.3V
0.6
VIN=5V
90
Efficiency (%)
0.8
VIN=4.5V
95
Output Voltage (%)
100
0
0.5
1
1.5
-0.6
2
0
0.5
Load Current IO (A)
0.6
1
Load Current IO (A)
Line Regulation
VO=3.3V
VREF vs Temperature
1.258
1.256
0.4
IO=0.1A
1.254
0.2
1.252
VREF (V)
VO (%)
EL7562C - Preliminary
EL7562C - Preliminary
IO=1A
0
-0.2
IO=2A
1.25
1.248
1.246
-0.4
-0.6
4.5
1.244
4.7
4.9
5.1
5.3
1.242
-40
5.5
VIN (V)
10
60
Temperature (°C)
4
Typical Performance Curves
Oscillator Frequency vs Temperature
390
0.96
0.92
380
Input Current (A)
Oscillator Frequency (kHz)
VIN=5.5V
0.94
385
375
370
VIN=5V
0.9
VIN=4.5V
0.88
0.86
0.84
365
0.82
360
-40
10
60
110
0.8
-40
160
Temperature (°C)
1400
1200
1000
800
600
400
200
0
0
200
400
600
10
60
Temperature (°C)
Switching Frequency vs COSC
FS (kHz)
Input Current vs Temperature
(Enable connected to GND)
800
1000
COSC (pF)
5
110
160
EL7562C - Preliminary
EL7562C - Preliminary
Monolithic 2 Amp DC:DC Step-down Regulator
EL7562C - Preliminary
EL7562C - Preliminary
Monolithic 2 Amp DC:DC Step-down Regulator
Block Diagram
0.1µF
VREF
Junction
Temperature
Voltage
Reference
270pF
COSC
VDRV
Oscillator
Controlle
r Supply
39Ω
VHI
VDD
VIN
Power
FET
0.1µF
PWM
Controller
0.1µF
4.7µH
Drivers
Power
FET
PGND
EN
Current
Sense
SGND
FB
6
VOUT
100µF
2370Ω
1kΩ
Applications Information
Circuit Description
ited by the output LC filter and can react more quickly to
changes in line and load conditions. This feed-forward
characteristic also simplifies AC loop compensation
since it adds a zero to the overall loop response. Through
proper selection of the current-feedback to voltage-feedback ratio the overall loop response will approach a onepole system. The resulting system offers several advantages over traditional voltage control systems, including
simpler loop compensation, pulse by pulse current limiting, rapid response to line variation and good load step
response.
General
The EL7562C is a fixed frequency, current mode controlled DC:DC converter with integrated N-channel
power MOSFETs and a high precision reference. The
device incorporates all the active circuitry required to
implement a cost effective, user-programmable 2A synchronous step-down regulator suitable for use in DSP
core power supplies.
Theory of Operation
The heart of the controller is an input direct summing
comparator which sum voltage feedback, current feedback, slope compensation ramp and power tracking
signals together. Slope compensation is required to prevent system instability that occurs in current-mode
topologies operating at duty-cycles greater than 50%
and is also used to define the open-loop gain of the overall system. The slope compensation is fixed internally
and optimized for 500mA inductor ripple current. The
power tracking will not contribute any input to the comparator steady-state operation. Current feedback is
measured by the patented sensing scheme that senses the
inductor current flowing through the high-side switch
whenever it is conducting. At the beginning of each
oscillator period the high-side NMOS switch is turned
on. The comparator inputs are gated off for a minimum
period of time of about 150ns (LEB) after the high-side
switch is turned on to allow the system to settle. The
Leading Edge Blanking (LEB) period prevents the
detection of erroneous voltages at the comparator inputs
due to switching noise. If the inductor current exceeds
the maximum current limit (ILMAX) a secondary overcurrent comparator will terminate the high-side switch
on time. If ILMAX has not been reached, the feedback
voltage FB derived from the regulator output voltage
VOUT is then compared to the internal feedback reference voltage. The resultant error voltage is summed with
the current feedback and slope compensation ramp. The
high-side switch remains on until all four comparator
inputs have summed to zero, at which time the high-side
switch is turned off and the low-side switch is turned on.
However, the maximum on-duty ratio of the high-side
switch is limited to 95%. In order to eliminate cross-con-
The EL7562C is composed of 5 major blocks:
1. PWM Controller
2. NMOS Power FETs and Drive Circuitry
3. Bandgap Reference
4. Oscillator
5. Thermal Shut-down
PWM Controller
The EL7562C regulates output voltage through the use
of current-mode controlled pulse width modulation. The
three main elements in a PWM controller are the feedback loop and reference, a pulse width modulator whose
duty cycle is controlled by the feedback error signal, and
a filter which averages the logic level modulator output.
In a step-down (buck) converter, the feedback loop
forces the time-averaged output of the modulator to
equal the desired output voltage. Unlike pure voltagemode control systems, current-mode control utilizes
dual feedback loops to provide both output voltage and
inductor current information to the controller. The voltage loop minimizes DC and transient errors in the output
voltage by adjusting the PWM duty-cycle in response to
changes in line or load conditions. Since the output voltage is equal to the time-averaged of the modulator
output, the relatively large LC time constant found in
power supply applications generally results in low bandwidth and poor transient response. By directly
monitoring changes in inductor current via a series sense
resistor the controller's response time is not entirely lim7
EL7562C - Preliminary
EL7562C - Preliminary
Monolithic 2 Amp DC:DC Step-down Regulator
EL7562C - Preliminary
EL7562C - Preliminary
Monolithic 2 Amp DC:DC Step-down Regulator
Oscillator
duction of the high-side and low-side switches a 15ns
break-before-make delay is incorporated in the switch
drive circuitry. The output enable (EN) input allows the
regulator output to be disabled by an external logic control signal.
The system clock is generated by an internal relaxation
oscillator with a maximum duty-cycle of approximately
95%. Operating frequency can be adjusted through the
COSC pin or can be driven by an external source. If the
oscillator is driven by an external source care must be
taken in selecting the ramp amplitude. Since CSLOPE
value is derived from the COSC ramp, changes to COSC
ramp will change the CSLOPE compensation ramp
which determine the open-loop gain of the system.
Output Voltage Setting
In general:
R 2

V OUT = 0.975V ×  1 + ------ 
R 1

When external synchronization is required, always
choose COSC such that the free-running frequency is at
least 20% lower than that of sync source to accommodate component and temperature variations. Figure 1
shows a typical connection.
However, due to the relatively low open loop gain of the
system, gain errors will occur as the output voltage and
loop-gain is changed. This is shown in the performance
curves. A 100nA pull-up current from FB to VDD forces
VOUT to GND in the event that FB is floating.
NMOS Power FETs and Drive Circuitry
The EL7562C integrates low on-resistance (60mΩ)
NMOS FETs to achieve high efficiency at 2A. In order
to use an NMOS switch for the high-side drive it is necessary to drive the gate voltage above the source voltage
(LX). This is accomplished by bootstrapping the VHI
pin above the LX voltage with an external capacitor
CVHI and internal switch and diode. When the low-side
switch is turned on and the LX voltage is close to GND
potential, capacitor CVHI is charged through internal
switch to VDRV, typically 5V. At the beginning of the
next cycle the high-side switch turns on and the LX pins
begin to rise from GND to VIN potential. As the LX pin
rises the positive plate of capacitor CVHI follows and
eventually reaches a value of VDRV+VIN, typically
10V, for VDRV=VIN=5V. This voltage is then level
shifted and used to drive the gate of the high-side FET,
via the VHI pin. A value of 0.1µF for CVHI is
recommended.
100pF
External
Oscillator
BAT54S
1
16
2
15
3
14
6
11
7
10
8
9
EL7562C
Figure 1. Oscillator Synchronization
Thermal Shut-down
An internal temperature sensor continuously monitors
die temperature. In the event that die temperature
exceeds the thermal trip-point, the system is in fault state
and will be shut down. The upper and low trip-points are
set to 135°C and 115°C respectively.
Reference
A 1.5% temperature compensated bandgap reference is
integrated in the EL7562C. The external VREF capacitor acts as the dominant pole of the amplifier and can be
increased in size to maximize transient noise rejection.
A value of 0.1µF is recommended.
8
Start-up Delay
A capacitor can be added to the EN pin to delay the converter start-up (Figure 2) by utilizing the pull-up current.
The delay time is approximately:
t d ( ms ) = 1200 × C ( µF )
1
16
2
15
3
14
6
11
7
10
8
9
VOUT
VIN
C
VO
td
TIME
EL7562C
Figure 2. Start-up Delay
Layout Considerations
In addition, the bypass capacitor connected to the VDD
pin needs to be as close to the pin as possible.
The layout is very important for the converter to function properly. Power Ground ( ) and Signal Ground (---)
should be separated to ensure that the high pulse current
in the Power Ground never interferes with the sensitive
signals connected to Signal Ground. They should only
be connected at one point (normally at the negative side
of either the input or output capacitor.)
The heat of the chip is mainly dissipated through the
PGND pins. Maximizing the copper area around these
pins is preferable. In addition, a solid ground plane is
always helpful for the EMI performance.
The demo board is a good example of layout based on
these principles. Please refer to the EL7562C Application Brief for the layout.
The trace connected to pin 14 (FB) is the most sensitive
trace. It needs to be as short as possible and in a “quiet”
place, preferably between PGND or SGND traces.
9
EL7562C - Preliminary
EL7562C - Preliminary
Monolithic 2 Amp DC:DC Step-down Regulator
EL7562C - Preliminary
EL7562C - Preliminary
Monolithic 2 Amp DC:DC Step-down Regulator
General Disclaimer
Specifications contained in this data sheet are in effect as of the publication date shown. Elantec, Inc. reserves the right to make changes in the circuitry or specifications contained herein at any time without notice. Elantec, Inc. assumes no responsibility for the use of any circuits described
herein and makes no representations that they are free from patent infringement.
October 25, 2001
WARNING - Life Support Policy
Elantec, Inc. products are not authorized for and should not be used
within Life Support Systems without the specific written consent of
Elantec, Inc. Life Support systems are equipment intended to support or sustain life and whose failure to perform when properly used
in accordance with instructions provided can be reasonably
expected to result in significant personal injury or death. Users contemplating application of Elantec, Inc. Products in Life Support
Systems are requested to contact Elantec, Inc. factory headquarters
to establish suitable terms & conditions for these applications. Elantec, Inc.’s warranty is limited to replacement of defective
components and does not cover injury to persons or property or
other consequential damages.
Elantec Semiconductor, Inc.
675 Trade Zone Blvd.
Milpitas, CA 95035
Telephone: (408) 945-1323
(888) ELANTEC
Fax:
(408) 945-9305
European Office: +44-118-977-6020
Japan Technical Center: +81-45-682-5820
10
Printed in U.S.A.