FUJITSU FTR-B2

4 Pole (2 FORM C+ 2 FORM A)
Signal Relay for Central Switching/
Data Transmission
FTR-B2 SERIES
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Features
IS
RoHS compliant
4 POLE MINIATURE RELAY
Mounting space of 175mm2 with 4 pole relay, suitable for high
density mounting.
l SAFETY STANDARD
- UL/CSA recognized
- Conforms to Bellcore specification & FCC part 68
- Conforms to IEC 60950 / UL1950 / EN60950 spacing and high breakdown voltage
Clearance: 1.0mm
Creepage: 1.6mm
l HIGH RELIABILITY
Bifurcated gold overlay silver alloy
l HIGH HEAT RESISTANCE, FLAMMABILITY
Flammability grade of 94V-0 materials employed
l AIR TIGHT CONSTRUCTION
Air tight construction allows high resistance to various environments
and to clean the relay
l SMT VERSION
Surface mount type available on request
l RoHS compliant since date code: 0430B8
Please see page 7 for more information
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nORDERING INFORMATION
[Example]
FTR-B2 M A 012 Z – **
(a)
( b)(c) (d) (e) (f )
Remarks: Actual marking on relay would not carry code FTR and be as below:
Ordering code
Actual marking
FTR-B2MA012Z →
B2MA012Z
FTR-B2 Series
nSAFETY STANDARD AND FILE NUMBERS
UL508, 1950 (File No. E63615)
C22.2 No. 14, No. 950 (File No. LR40304)
Please request when the approval markings are required on the cover.
Nominal voltage 4.5 to 12 VDC
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Clearance
0.2 A
125 VAC
1 A 30 VDC
0.3 A 110 VDC
IS
resistive
Creepage
C
1.0mm
coil a- contacts
Contact rating
Remarks
- working voltage: 150V
- relay inside and outside
- pollution degree "2"
1.6mm
coil - contacts
n COIL DATA CHART
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MODEL
FTR-F2 Ser i es
FTR-H2 Ser i es
FTR-F2AK005T
FTR-F2AK006T
FTR-F2AK009T
FTR-F2AK012T
FTR-F2AK024T
FTR-F2AK048T
FTR-H2AK005T
FTR-H2AK006T
FTR-H2AK009T
FTR-H2AK012T
FTR-H2AK024T
FTR-H2AK048T
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No m i n al
V o l t ag e
5VDC
6VDC
9VDC
12VDC
24VDC
48VDC
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Co i l Res i s t an c e
(± 10%)
Mu s t Op er at e
Vo l t ag e
Mu s t Rel eas e
V o l t ag e
47 Ω
68 Ω
155 Ω
3.5VDC
4.2VDC
6.3VDC
8.4VDC
16.8VDC
33.6VDC
0.25VDC
0.3VDC
0.45VDC
0.6VDC
1.2VDC
2.4VDC
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27 0 Ω
1,200 Ω
4,400 Ω
FTR-B2 Series
n
specifications
It em
FTR-B 2 Ser i es
Contact
D
Arrangement
2 Form C + 2 Form A
Material
Gold overlay Silver alloy
Resistance (initial)
Maximum 75mΩ (at 1A 6VDC)
IS
Time Value
Rating (resistive)
30VDC 1A / 125VAC 0.2A
Maximum Switching Power
30W / 25VA
Maximum Switching Voltage
110VDC / 125VAC
Maximum Switching Current
1A
Maximum Carrying Current
1.25A
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Operate Time (at nominal voltage) Maximum 10ms
Release Time (at nominal voltage) Maximum 5ms
Coil
Operating Temperature
Insulation
Resistance (at 500VDC)
Dielectric Strength
Life
Vibration
Shock
Weight
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-40° C to +85° C (no frost)
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Minimum 1,000 MΩ
ED
750 VAC 1 Min. (open contacts)
500 VAC 1 Min. (adjacent contacts)
1,500 VAC 1 Min. (coil-contacts)
Mechanical
10 x 106 operations minimum
Electrical
50 x 103 operations minimum at 30VDC 1A
100 x 103 operations minimum at 125VDC 0.2A
Misoperation
10-55 Hz (double amplitude of 1.5mm)
Endurance
10-55 Hz (double amplitude of 1.5mm)
Misoperation
100m/s2 (11±1ms)
Endurance
500m/s2 (6±1ms)
Approximately 3.9g
FTR-B2 Series
nCHARACTERISTIC DATA
Time (ms)
8
D
6
4
2
0
Operation time
IS
Release
0
0.2
0.4
C
tac
n
Co
20
DC Resistive
arr
tc
Co
0
nta
N
AC Resistive
ct
10
30 50
in
rry
0A
nt:
rre
u
gc
0.4
0.6
0.8
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50
30
20
10
2.4
2.2
Co
2.0
nta
1.8
Co
nta
ct
ct c
1.6
1.4
1.2
ca
rry
in
gc
arr
y
ing
cur
r
urr
en
t: 0
ent
:
A
1A
Operating Voltage
(hot coil)
1.0
0.8
Operating Voltage
(cool coil)
0.6
0
20
40
60
80
100
Ambient Temperature (°C)
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0.2
0.4
ED
30 VDC Resistive
125 VAC Resistive
0
100 200
(maximum applied voltage,
operating voltage characteristics)
Life Curve
5
5
gc
ca
0.2
100
0.2
1
yin
e
urr
nt:
1A
Coil Power (W)
1
0.1
40
Operation (x104)
Contact Current (A)
3
0.5
0.4
0.3
60
0.8
Maximum Switching Power
2
80
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0.6
Coil Power (W)
Ambient Temperature
Coil Temperature Rise
Nominal Voltage Multiplying Factor (%)
10
Coil Temperature Rise (°C)
Operation
(return time characteristics)
0.6
0.8
1.0
1.2
Contact Current (A)
Contact Voltage (V)
nREFERENCE DATA
Distribution of Operate
and Release Voltage
80
60
40
20
100
Maximum Switching Power
3
FTR-B2MA4.5Z
n=100
Operate
Release
80
Contact Current (A)
FTR-B2MA4.5Z
n=100
Operate
Release
Distribution (%)
Distribution (%)
100
Distribution of Operate
and Release Time
60
40
20
0
10 20 30 40 50 60 70 80 90 100
Nominal Voltage Multiplying Factor (%)
1
0.5
0.4
0.3
1
2
3
4
Time (ms)
5
6
AC Resistive
0.2
0.1
0
DC Resistive
2
1
5
10
30 50
100 200
Contact Voltage (V)
FTR-B2 Series
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1.0
Initial1
Release Voltage
FBR-B2MA4.5Z
n=10
1200 operations/min.
IS
5 10
C
Make
Break
50 100
Operation (x104)
nDIMENSIONS
l Dimensions
Through hole type
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500 1000
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4.0
Operating Voltage
3.0
2.0
Release Voltage
1.0
FBR-B2MA4.5Z
n=10
30 operations/min.
125 VAC 0.2A
(resistive load)
0
500
200
100
50
20
10
5
2
Make
Break
Initial
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10
Operation (x104)
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l Schematics
(BOTTOM VIEW)
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Nominal Voltage
Multiplying Factor (%)
2.0
Electrical Life Test
Contact
Resistance (m‰)
Operating Voltage
3.0
0
500
200
100
50
20
10
5
2
Nominal Voltage
Multiplying Factor (%)
Mechanical Life Test
4.0
Contact
Resistance (m‰)
Contact
Nominal Voltage
Resistance (m‰) Multiplying Factor (%)
nREFERENCE DATA
ED
Electrical Life Test
4.0
Operating Voltage
3.0
2.0
Release Voltage
1.0
FBR-B2MA4.5Z
n=10
30 operations/min.
30 VDC 1A (resistive load)
0
500
200
100
50
20
10
5
2
Make
Break
Initial
5
Operation
(x104)
l PC board mounting
hole layout
(BOTTOM VIEW)
Orientation mark
l Dimensions
Surface mount type
l Schematics
(TOP VIEW)
l PC board mounting
hole layout
(TOP VIEW)
Orientation mark
FTR-B2 Series
nRECOMMENDED CONDITION (Temperature Profile)
VPS(Vapor Phase Soldering)
soldering
T3
T2
T3 = 245C max.
T 2 =200Cmax.
cooling T =165Cmax.
D
preheating
T
IS
0
C
120secmaximum
Temperature (C)
Temperature (C)
IRS (Infrared Reflow Soldering)
25C maximum soldering
T3
cooling
T2
preheating
T
30sec
Max.
0
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T3 =200Cmaximum
T 2 =165Cmaximum
T =100Cmaximum
60secMax.
60secMax.
90secMax.
Note: 1.Temperature profiles show the temperature of PC board surface.
2.Please perform soldering test with your actual PC board before
mass production, since the temperatures of PC board surfaces vary according to the size of PC board, status of parts mounting and heating method.
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Tape dimensions
ø 1.55
ø 2.2
2
4
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0.4
17.9
32
28.4
14.2
16
TI
1.75
nPACKAGING
10.7
11.7
Tape feeding
ø 380
Reel Dimensions
Top cover tape
Embossed carrying tape
Perforation
Parts box
ø 13
Dimensions: mm
General tolerance: ±0.2
Quantity of one reel: 250 pieces
FTR-B2 Series
RoHS Compliance and Lead Free Relay Information
1. General Information
Relays produced after the specific date code that is indicated on each data sheet are lead-free
now. Most of our signal and power relays are lead-free. Please refer to Lead-Free Status Info.
(http://www.fcai.fujitsu.com/pdf/LeadFreeLetter.pdf)
l Lead free solder paste currently used in relays is Sn-3.0Ag-0.5Cu. From February 2005 forward
Sn-3.0Cu-Ni will be used for FTRB3 and FTR-B4 series relays.
lMost signal and some power relays also comply with RoHS. Please refer to individual data
sheets. Relays that are RoHS compliant do not contain the 6 hazardous materials that
are restricted by RoHS directive (lead, mercury, cadmium, chromium IV, PBB, PBDE).
l It has been verified that using lead-free relays in leaded assembly process will not cause any
problems (compatible).
l“LF” is marked on each outer and inner carton. (No marking on individual relays).
lTo avoid leaded relays (for lead-free sample, etc.) please consult with area sales office. We will ship leaded relays as long as the leaded relay inventory exists.
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2. Recommended Lead Free Solder Profile
Recommended solder paste Sn-3.0Ag-0.5Cu and Sn-3.0 Cu-Ni (only FTR-B3 and FTR-B4 from February
2005)
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Reflow Solder condtion
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Peak Temp.:max.250C
Temperature ( C)
250
220
Pre-heating
170
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Soldering
ED
Cooling
Flow Solder condtion:
Pre-heating:
Soldering:
maximum 120˚C
dip within 5 sec. at 260˚C solder bath
Solder by Soldering Iron:
Soldering Iron
Temperature: maximum 360˚C
Duration:
maximum 3 sec.
130
30
90~120sec.
max.120sec.
20~30sec.
(duration)
We highly recommend that you confirm your actual solder conditions
3. Moisture Sensitivity
Moisture Sensitivity Level standard is not applicable to electromechanical realys.
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4. Tin Whisker
SnAgCu solder is known as low riskof tin whisker. No considerable length whisker was found by our in-house
test.
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FTR-B2 Series
Fujitsu Components International Headquarter Offices
Japan
Fujitsu Component Limited
Gotanda-Chuo Building
3-5, Higashigotanda 2-chome, Shinagawa-ku
Tokyo 141, Japan
Tel: (81-3) 5449-7010
Fax: (81-3) 5449-2626
Email: [email protected]
Web: www.fcl.fujitsu.com
Europe
Fujitsu Components Europe B.V.
Diamantlaan 25
2132 WV Hoofddorp
Netherlands
Tel: (31-23) 5560910
Fax: (31-23) 5560950
Email: [email protected]
Web: http://www.fujitsu.com/emea/services/components/
North and South America
Fujitsu Components America, Inc.
250 E. Caribbean Drive
Sunnyvale, CA 94089 U.S.A.
Tel: (1-408) 745-4900
Fax: (1-408) 745-4970
Email: [email protected]
Web: http://www.fujitsu.com/us/services/edevices/components/
Asia Pacific
Fujitsu Components Asia Ltd.
102E Pasir Panjang Road
#04-01 Citilink Warehouse Complex
Singapore 118529
Tel: (65) 6375-8560
Fax: (65) 6273-3021
Email: [email protected]
Web: http://www.fujitsu.com/sg/services/micro/components/
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©2006 Fujitsu Components America, Inc. All rights reserved. All trademarks or registered trademarks are the property off their respective
owners.
Fujitsu Components America does not warrant that the content of datasheet is error free. In a continuing effort to improve our products Fujitsu
Components America, Inc. reserves the right to change specifications/datasheets without prior notice. Rev. 03/21/2006.
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