GILWAY GHB-SOT23-DR

55 Commerce Way
Woburn, MA 01801
(781) 935 - 4442
(781) 938 - 5867
www.gilway.com
GHB-SOT23-DR
Features
Description
!SOT-23
The Super Bright Red source color devices are made
PACKAGE SURFACE MOUNT LED LAMP.
!LOW POWER CONSUMPTION.
with Gallium Aluminum Arsenide Red Light Emitting
!LONG
Diode.
LIFE - SOLID STATE RELIABILITY.
!PACKAGE: 2000PCS
/ REEL.
SOT-23 SURFACE MOUNT LED LAMP
Package Dimensions
Notes:
1. All dimensions are in millimeters (inches).
2. Tolerance is 0.25(0.01") unless otherwise noted.
3. Lead spacing is measured where the lead emerge package.
4. Specifications are subject to change without notice.
REV NO: V.2
DATE:DEC/16/2002
PAGE: 1 OF 4
Selection Guide
P
Pa
a
art
rt N
No.
No
o..
D iic
ce
SUPER BRIGHT RED (GaAlAs)
GHB-SOT23-DR
m c dd)
v ((mcd
IIv
(mcd)
@ 20 mA
L
Lens
e
ens
nss T
Typ
Tyy p e
WATER CLEAR
ew i n g
V
Viewin
Viiiewing
Angle
in.
n.
Miin
T
Typ
Tyyyp
pp..
36
70
140°
Note:
1 1/2 is the angle from optical centerline where the luminous intensity is 1/2 the optical centerline value.
Electrical Maximum Ratings at TA=25 C
S
Sy
yymbo
ymbol
mb o l
P
Pa
a
aramete
r a m e t er
De
evic
ev ic e
peak
Peak Wavelength
Super Bright Red
D
Dominate Wavelength
1/2
TTyyyp
pp..
Ma
ax
xx..
Un
nit
its
T
Test
e
est
ss t C
Cond
o n d iition
t io nss
660
nm
IF =20mA
Super Bright Red
640
nm
IF =20mA
Spectral Line Half-width
Super Bright Red
20
nm
IF =20mA
C
Capacitance
Super Bright Red
45
pF
V F =0V;f=1MHz
VF
Forward Voltage
Super Bright Red
1.85
2.5
V
IF =20mA
IR
Reverse Current
Super Bright Red
10
uA
VR = 5V
Absolute Maximum Ratings at TA=25 C
P
Paramet
Pa
a
arameter
r a m e t er
S
Su
up
u
uper
p er
er Bri
Bright
Re
B
Br
Br igh
g h t Red
R
ed
U
Unit
nit
n
its
Power dissipation
1 00
mW
DC Forward Current
30
mA
Peak Forward Current [1]
1 55
mA
Reverse Voltage
5
V
Operating / Storage Temperature
-40 C To +85 C
Note:
1. 1/10 Duty Cycle, 0.1ms Pulse Width.
REV NO: V.2
DATE:DEC/16/2002
PAGE: 2 OF 4
REV NO: V.2
DATE:DEC/16/2002
PAGE: 3 OF 4
SMT Reflow Soldering Instructions
Number of reflow process shall be less than 2 times and cooling
process to normal temperature is required between first and
second soldering process.
Recommended Soldering Pattern
(Units : mm)
Tape Specifications
(Units : mm)
REV NO: V.2
DATE:DEC/16/2002
PAGE: 4 OF 4