HFA25PB60 Vishay High Power Products HEXFRED® Ultrafast Soft Recovery Diode, 25 A FEATURES • • • • • • BENEFITS Cathode to base • • • • • 4 2 1 Cathode Ultrafast recovery Ultrasoft recovery Very low IRRM Very low Qrr Specified at operating conditions Designed and qualified for industrial level 3 Anode 2 Reduced RFI and EMI Reduced power loss in diode and switching transistor Higher frequency operation Reduced snubbing Reduced parts count DESCRIPTION HFA25PB60 is a state of the art ultrafast recovery diode. Employing the latest in epitaxial construction and advanced processing techniques it features a superb combination of characteristics which result in performance which is unsurpassed by any rectifier previously available. With basic ratings of 600 V and 25 A continuous current, the HFA25PB60 is especially well suited for use as the companion diode for IGBTs and MOSFETs. In addition to ultrafast recovery time, the HEXFRED® product line features extremely low values of peak recovery current (IRRM) and does not exhibit any tendency to “snap-off” during the tb portion of recovery. The HEXFRED features combine to offer designers a rectifier with lower noise and significantly lower switching losses in both the diode and the switching transistor. These HEXFRED advantages can help to significantly reduce snubbing, component count and heatsink sizes. The HEXFRED HFA25PB60 is ideally suited for applications in power supplies and power conversion systems (such as inverters), motor drives, and many other similar applications where high speed, high efficiency is needed. TO-247AC modified PRODUCT SUMMARY VR 600 V VF at 25 A at 25 °C 1.7 V IF(AV) 25 A trr (typical) 23 ns TJ (maximum) 150 °C Qrr (typical) 112 nC dI(rec)M/dt (typical) 250 A/µs IRRM 10 A ABSOLUTE MAXIMUM RATINGS PARAMETER SYMBOL Cathode to anode voltage TEST CONDITIONS VR Maximum continuous forward current IF TC = 100 °C VALUES UNITS 600 V 25 Single pulse forward current IFSM 225 Maximum repetitive forward current IFRM 100 Maximum power dissipation PD Operating junction and storage temperature range Document Number: 93084 Revision: 30-Jul-08 TC = 25 °C 151 TC = 100 °C 60 TJ, TStg For technical questions, contact: [email protected] - 55 to + 150 A W °C www.vishay.com 1 HFA25PB60 Vishay High Power Products HEXFRED® Ultrafast Soft Recovery Diode, 25 A ELECTRICAL SPECIFICATIONS (TJ = 25 °C unless otherwise specified) PARAMETER SYMBOL TEST CONDITIONS Cathode to anode breakdown voltage VBR IR = 100 µA Maximum forward voltage VFM IF = 50 A IF = 25 A See fig. 1 MIN. TYP. MAX. 600 - - - 1.3 1.7 - 1.5 2.0 UNITS V IF = 25 A, TJ = 125 °C - 1.3 1.7 VR = VR rated - 1.5 20 - 600 2000 - 55 100 pF - 12 - nH UNITS Maximum reverse leakage current IRM Junction capacitance CT VR = 200 V Series inductance LS Measured lead to lead 5 mm from package body TJ = 125 °C, VR = 0.8 x VR rated See fig. 2 See fig. 3 µA DYNAMIC RECOVERY CHARACTERISTICS (TJ = 25 °C unless otherwise specified) PARAMETER Reverse recovery time See fig. 5, 10 Peak recovery current See fig. 6, 10 Reverse recovery charge See fig. 7, 10 Peak rate of fall of recovery current during tb See fig. 8, 10 SYMBOL TEST CONDITIONS MIN. TYP. MAX. - 23 - trr IF = 1.0 A, dIF/dt = 200 A/µs, VR = 30 V trr1 TJ = 25 °C - 50 75 trr2 TJ = 125 °C - 105 160 IRRM1 TJ = 25 °C - 4.5 10 IRRM2 TJ = 125 °C - 8.0 15 - 112 375 - 420 1200 IF = 25 A dIF/dt = 200 A/µs VR = 200 V ns A Qrr1 TJ = 25 °C Qrr2 TJ = 125 °C dI(rec)M/dt1 TJ = 25 °C - 250 - dI(rec)M/dt2 TJ = 125 °C - 160 - MIN. TYP. MAX. UNITS - - 300 °C - - 0.83 nC A/µs THERMAL - MECHANICAL SPECIFICATIONS PARAMETER SYMBOL TEST CONDITIONS Lead temperature Tlead Thermal resistance, junction to case RthJC Thermal resistance, junction to ambient RthJA Typical socket mount - - 40 Thermal resistance, case to heatsink RthCS Mounting surface, flat, smooth and greased - 0.25 - - 6.0 - g - 0.21 - oz. 6.0 (5.0) - 12 (10) kgf · cm (lbf · in) 0.063" from case (1.6 mm) for 10 s Weight Mounting torque Marking device www.vishay.com 2 Case style TO-247AC modified (JEDEC) For technical questions, contact: [email protected] K/W HFA25PB60 Document Number: 93084 Revision: 30-Jul-08 HFA25PB60 HEXFRED® Vishay High Power Products Ultrafast Soft Recovery Diode, 25 A 10000 T = 150°C J 1000 100 TJ = 125°C 100 10 1 0.1 TJ = 150°C TJ = 25°C 0.01 0 100 T = 125°C 200 300 400 Reverse Voltage - V J 500 600 R (V) T = 25°C J Fig. 2 - Typical Reverse Current vs. Reverse Voltage 10 1000 A TJ = 25°C 100 1 0.6 1.0 1.4 1.8 2.2 2.6 Forward Voltage Drop - V FM (V) 10 1 10 100 1000 Reverse Voltage - V R (V) Fig. 1 - Maximum Forward Voltage Drop vs. Instantaneous Forward Current Fig. 3 - Typical Junction Capacitance vs. Reverse Voltage Thermal Response (Z thJC ) 1 D = 0.50 0.20 0.1 0.01 0.00001 0.10 PDM 0.05 t1 0.02 0.01 t2 SINGLE PULSE (THERMAL RESPONSE) 0.0001 Notes: 1. Duty factor D = t 1 / t 2 2. Peak TJ = P DM x Z thJC + TC 0.001 0.01 0.1 1 t1 , Rectangular Pulse Duration (sec) Fig. 4 - Maximum Thermal Impedance ZthJC Characteristics Document Number: 93084 Revision: 30-Jul-08 For technical questions, contact: [email protected] www.vishay.com 3 HFA25PB60 Vishay High Power Products HEXFRED® Ultrafast Soft Recovery Diode, 25 A 1400 140 VR = 200V TJ = 125°C TJ = 25°C I F = 50A I F = 25A 120 1200 I F = 10A I F = 50A 1000 100 I F = 25A 80 800 60 600 40 400 20 200 VR = 200V TJ = 125°C TJ = 25°C 0 100 I F = 10A di f /dt - (A/µs) 1000 0 100 Fig. 5 - Typical Reverse Recovery Time vs. dIF/dt 30 di f /dt - (A/µs) 1000 Fig. 7 - Typical Stored Charge vs. dIF/dt 10000 VR = 200V TJ = 125°C TJ = 25°C VR = 200V TJ = 125°C TJ = 25°C 25 I F = 50A I F = 50A IF = 25A I F = 25A 20 I F = 10A 15 1000 IF = 10A 10 5 0 100 di f /dt - (A/µs) 1000 Fig. 6 - Typical Recovery Current vs. dIF/dt www.vishay.com 4 100 100 di f /dt - (A/µs) 1000 Fig. 8 - Typical dI(rec)M/dt vs. dIF/dt For technical questions, contact: [email protected] Document Number: 93084 Revision: 30-Jul-08 HFA25PB60 HEXFRED® Vishay High Power Products Ultrafast Soft Recovery Diode, 25 A VR = 200 V 0.01 Ω L = 70 µH D.U.T. dIF/dt adjust D IRFP250 G S Fig. 9 - Reverse Recovery Parameter Test Circuit (3) trr IF ta tb 0 Qrr (2) IRRM (4) 0.5 IRRM dI(rec)M/dt (5) 0.75 IRRM (1) dIF/dt (1) dIF/dt - rate of change of current through zero crossing (2) IRRM - peak reverse recovery current (3) trr - reverse recovery time measured from zero crossing point of negative going IF to point where a line passing through 0.75 IRRM and 0.50 IRRM extrapolated to zero current. (4) Qrr - area under curve defined by trr and IRRM Qrr = trr x IRRM 2 (5) dI(rec)M/dt - peak rate of change of current during tb portion of trr Fig. 10 - Reverse Recovery Waveform and Definitions Document Number: 93084 Revision: 30-Jul-08 For technical questions, contact: [email protected] www.vishay.com 5 HFA25PB60 Vishay High Power Products HEXFRED® Ultrafast Soft Recovery Diode, 25 A ORDERING INFORMATION TABLE Device code HF A 25 PB 60 - 1 2 3 4 5 6 1 - HEXFRED® family 2 - Process designator: A = Electron irradiated B = Platinum diffused 3 - Current rating (25 = 25 A) 4 - Package outline (PB = TO-247, 2 pins) 5 - Voltage rating (60 = 600 V) 6 - None = Standard production PbF = Lead (Pb)-free LINKS TO RELATED DOCUMENTS Dimensions http://www.vishay.com/doc?95253 Part marking information http://www.vishay.com/doc?95255 www.vishay.com 6 For technical questions, contact: [email protected] Document Number: 93084 Revision: 30-Jul-08 Legal Disclaimer Notice Vishay Disclaimer All product specifications and data are subject to change without notice. Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained herein or in any other disclosure relating to any product. Vishay disclaims any and all liability arising out of the use or application of any product described herein or of any information provided herein to the maximum extent permitted by law. The product specifications do not expand or otherwise modify Vishay’s terms and conditions of purchase, including but not limited to the warranty expressed therein, which apply to these products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by any conduct of Vishay. The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications unless otherwise expressly indicated. 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