Surface Mount Chip LEDs Technical Data HSMx-C260 Features Description • Reverse Mountable SMT LED • Diffused Optics • Small 3.4 x 1.25 mm Footprint • Operating Temperature Range of -25°C to +80°C • Compatible with IR Solder • Four Colors Available: Red, Orange, Yellow, and Green • Available in 8 mm tape on 7 in. (178 mm) Diameter Reels The HSMx-C260 is a reverse mountable chip-type LED for lighting the non-component side of a PC board. In this reverse mounting configuration, this LED is designed to emit light through a small cut-out hole in the PC board. Applications • • • • The HSMx-C260 is available in four colors. The small size, narrow footprint, and low profile make this series of LEDs excellent for backlighting, status indication, and front panel illumination applications. Keypad Backlighting Symbol Backlighting Status Indication Front Panel Indicator Device Selection Guide Part Number HSMS-C260 HSMD-C260 HSMY-C260 HSMG-C260 Color High Efficiency Red Orange Yellow Green Parts Per Reel 3000 3000 3000 3000 2 Package Dimensions LED DIE CATHODE MARK 1.25 (0.049) 3.4 (0.134) DIFFUSED EPOXY POLARITY 1.2 (0.047) 1.1 (0.043) 1.1 (0.043) PC BOARD 0.3 (0.012) 0.50 ± 0.15 (0.020 ± 0.006) 0.50 ± 0.15 (0.020 ± 0.006) SOLDERING TERMINAL HSMx-C260 Notes: 1. All dimensions in millimeters (inches). 2. Tolerance is ± 0.1 mm (± 0.004 in.) unless otherwise specified. Absolute Maximum Ratings at TA=25°C Parameter DC Forward Current[1] Peak Pulsing Current[2] Power Dissipation Reverse Voltage (IR = 100 µA) LED Junction Temperature Operating Temperature Range Storage Temperature Range Soldering Temperature HSMx-C260 Units 25 mA 100 mA 65 mW 5 V 95 °C -25 to +80 °C -30 to +85 °C See IR soldering profile (Figure 6) Notes: 1. Derate linearly as shown in Figure 4 for temperature above 25°C. 2. Pulse condition of 1/10 duty and 0.1 msec. width. 3 Optical Characteristics at TA=25°C Color HER Orange Yellow Green Luminous Intensity[1] Iv(mcd) @ 20 mA Min. Typ. 2.50 8.0 2.50 8.0 2.50 8.0 4.00 15.0 Peak Wavelength lpeak(nm) Typ. 639 606 584 570 Dominant Wavelength ld(nm) Typ. 626 604 586 572 Viewing Angle 2u1/2 Degrees[2] Typ. 170 170 170 170 Notes: 1. The luminous intensity, Iv, is measured at the peak of the spatial radiation pattern, which may not be aligned with the mechanical axis of the lamp package. 2. u1/2 is the off-axis angle where the luminous intensity is 1/2 the peak intensity. Electrical Characteristics at TA=25 °C Color HER Orange Yellow Green Forward Voltage Reverse Capacitance VF(V) Breakdown C(pF) @ IF=20 mA VR(V) @ IR=100 µA @ VF=0 V, f =1 MHz Typ. Max. Min. Typ. 1.9 2.6 5 8 2.1 2.6 5 6 2.1 2.6 5 7 2.2 2.6 5 6 Thermal Resistance RθJ-P ( °C/W) Typ. 250 250 250 250 Color Bin Limits[1] Green Color Bins[1] Dom. Wavelength [nm] Bin ID MIN. MAX. A 561.5 564.5 B 564.5 567.5 C 567.5 570.5 D 570.5 573.5 E 573.5 576.5 Tolerance: ± 0.5 nm Orange Color Bins[1] Dom. Wavelength [nm] Bin ID MIN. MAX. A 597.0 600.0 B 600.0 603.0 C 603.0 606.0 D 606.0 609.0 E 609.0 612.0 F 612.0 615.0 Tolerance: ± 1 nm Yellow/Amber Color Bins[1] Dom. Wavelength [nm] Bin ID MIN. MAX. A 582.0 584.5 B 584.5 587.0 C 587.0 589.5 D 589.5 592.5 E 592.0 594.5 F 594.5 597.0 Tolerance: ± 0.5 nm Note: 1. Bin categories are established for classification of products. Products may not be available in all categories. Please contact your Agilent representative for information on currently available bins. 4 Light Intensity (Iv) Bin Limits[1] Bin ID A B C D E F G H J K L M N P Q R S T U V W X Y Intensity (mcd) Min. Max. 0.11 0.18 0.18 0.29 0.29 0.45 0.45 0.72 0.72 1.10 1.10 1.80 1.80 2.80 2.80 4.50 4.50 7.20 7.20 11.20 11.20 18.00 18.00 28.50 28.50 45.00 45.00 71.50 71.50 112.50 112.50 180.00 180.00 285.00 285.00 450.00 450.00 715.00 715.00 1125.00 1125.00 1800.00 1800.00 2850.00 2850.00 4500.00 Tolerance: ± 15% Note: 1. Bin categories are established for classification of products. Products may not be available in all categories. Please contact your Agilent representative for information on currently available bins. 5 1.0 RELATIVE INTENSITY GREEN YELLOW 0.5 ORANGE 0 500 HER 550 600 650 700 750 WAVELENGTH – nm Figure 1. Relative Intensity vs. Wavelength. 1.6 HER LUMINOUS INTENSITY (NORMALIZED AT 20 mA) IF – FORWARD CURRENT – mA 100 GREEN 10 1 YELLOW 0.1 ORANGE 1.5 1.7 1.9 2.1 0.4 0 10 20 30 40 IF – FORWARD CURRENT – mA Figure 3. Luminous Intensity vs. Forward Current. Figure 2. Forward Current vs. Forward Voltage. 1.00 35 0.90 30 RELATIVE INTENSITY – % IF MAX. – MAXIMUM FORWARD CURRENT – mA 0.8 0 2.3 VF – FORWARD VOLTAGE – V 25 20 RθJ-A = 600°C/W 15 RθJ-A = 800°C/W 10 5 0 1.2 0.80 0.70 0.60 0.50 0.40 0.30 0.20 0.10 0 20 40 60 80 100 TA – AMBIENT TEMPERATURE – °C Figure 4. Maximum Forward Current vs. Ambient Temperature. 0 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 ANGLE Figure 5. Relative Intensity vs. Angle. 6 2.2 (0.087) DIA. PCB HOLE TEMPERATURE 10 SEC. MAX. 230°C MAX. 4°C/SEC. MAX. 140-160°C 1.25 (0.049) 3°C/SEC. MAX. 4°C/SEC. MAX. OVER 2 MIN. 1.4 (0.055) TIME Figure 6. Recommended Reflow Soldering Profile. USER FEED DIRECTION CATHODE SIDE Figure 8. Reeling Orientation. 1.4 (0.055) Figure 7. Recommended Solder Pad Pattern. Note: 1. All dimensions in millimeters (inches). PRINTED LABEL 2.3 (0.091) 7 8.0 ± 1.0 (0.315 ± 0.039) 10.50 ± 1.0 (0.413 ± 0.039) Ø 20.20 MIN. (Ø 0.795 MIN.) Ø 13.1 ± 0.5 (Ø 0.516 ± 0.020) 3.0 ± 0.5 (0.118 ± 0.020) 59.60 ± 1.00 (2.346 ± 0.039) 178.40 ± 1.00 (7.024 ± 0.039) 4.0 ± 0.5 (0.157 ± 0.020) 6 PS 5.0 ± 0.5 (0.197 ± 0.020) Note: 1. All dimensions in millimeters (inches). Figure 9. Reel Dimensions. 4.00 (0.157) CATHODE 1.50 (0.059) DIM. C (SEE TABLE 1) 0.20 ± 0.05 (0.008 ± 0.002) 1.75 (0.069) 3.50 ± 0.05 (0.138 ± 0.002) DIM. A (SEE TABLE 1) 8.00 ± 0.30 (0.315 ± 0.012) DIM. B (SEE TABLE 1) 2.00 ± 0.05 (0.079 ± 0.002) CARRIER TAPE USER FEED DIRECTION 4.00 (0.157) PART NUMBER DIM. A DIM. B DIM. C ± 0.10 (0.004) ± 0.10 (0.004) ± 0.10 (0.004) HSMx-C260 SERIES 3.70 (0.146) 1.45 (0.057) Figure 10. Tape Dimensions. COVER TAPE TABLE 1 DIMENSIONS IN MILLIMETERS (INCHES) 1.30 (0.051) END START Convective IR Reflow Soldering For more information on IR reflow soldering, refer to Application Note 1060, Surface Mounting SMT LED Indicator Components. THERE SHALL BE A MINIMUM OF 160 mm (6.3 INCH) OF EMPTY COMPONENT POCKETS SEALED WITH COVER TAPE. MOUNTED WITH COMPONENTS THERE SHALL BE A MINIMUM OF 160 mm (6.3 INCH) OF EMPTY COMPONENT POCKETS SEALED WITH COVER TAPE. Figure 11. Tape Leader and Trailer Dimensions. Notes: 1. All dimensions in millimeters (inches). 2. Tolerance is ± 0.1 mm (± 0.004 in.) unless otherwise specified. MINIMUM OF 230 mm (9.05 INCH) MAY CONSIST OF CARRIER AND/OR COVER TAPE. Storage Condition: 5 to 30˚ C @ 60% RH max. Baking is required under the condition: a) the blue silica gel indicator becoming white/transparent color b) the pack has been opened for more than 1 week Baking recommended condition: 60 +/– 5˚C for 20 hours. www.agilent.com/semiconductors For product information and a complete list of distributors, please go to our web site. For technical assistance call: Americas/Canada: +1 (800) 235-0312 or (408) 654-8675 Europe: +49 (0) 6441 92460 China: 10800 650 0017 Hong Kong: (+65) 6271 2451 India, Australia, New Zealand: (+65) 6271 2394 Japan: (+81 3) 3335-8152(Domestic/International), or 0120-61-1280(Domestic Only) Korea: (+65) 6271 2194 Malaysia, Singapore: (+65) 6271 2054 Taiwan: (+65) 6271 2654 Data subject to change. Copyright © 2002 Agilent Technologies, Inc. Obsoletes 5988-0366EN April 15, 2002 5988-6269EN