The documentation process conversion measures necessary to comply with this revision shall be completed by 20 March 1998 INCH-POUND MIL-PRF-19500/535B 20 December 1997 SUPERSEDING MIL-S-19500/535A(USAF) 28 January 1994 PERFORMANCE SPECIFICATION SHEET SEMICONDUCTOR DEVICE, TRANSISTOR, PNP, SILICON, POWER TYPES 2N5003, 2N5005, JAN, JANTX, JANTXV, JANS, JANHC, AND JANKC This specification is approved for use by all Departments and Agencies of the Department of Defense. 1. SCOPE 1.1 Scope. This specification covers the performance requirements for PNP, silicon, power transistors for use in high-speed power-switching applications. Four levels of product assurance are provided for each device type as specified in MIL-PRF19500. Two levels of product assurance are provided for unencapsulated die. 1.2 Physical dimensions. See figure 1 (T6-C, similar to T0-59) and figure 2 (JANHC and JANKC). 1.3 Maximum ratings. PT 1/ PT 2/ VCBO VCEO VEBO IC IC 3/ Reverse pulse 4/ energy Tstg and TJ TA = +25°C TC = +25°C W W V dc V dc V dc A dc A dc mJ °C 2 58 100 80 5.5 5 10 15 -65 to +200 1/ Derate linearly 11.4 mW/°C for TA > +25°C 2/ Derate linearly 331 mW/°C for TC > +25°C 3/ This value applies for PW ≤ 8.3 ms, duty cycle ≤ 1 percent. 4/ This rating is based on the capability of the transistors to operate safely in the unclamped inductive load energy test circuit of figure 4. 1.4. Primary electrical characteristics at TC = +25°C. Limits hFE2 1/ VCE = 5 V IC= 2.5A 2N5003 Min Max 2N5005 30 90 70 200 |hfe| VCE = 5 V IC = 500 mA dc f = 10 MHz 2N5003 6 VBE(sat)2 1/ IC = 5 A dc IB = 500 mA dc VCE(Sat)2 1/ IC = 5 A dc IB = 500 mA dc Cobo VCB = 10 V dc IE = 0 f = 1 MHz RθJA RθJC V dc V dc pF °C/W °C/W 2.2 1.5 250 88 3 2N5005 7 1/ Pulsed (see 4.5.1) Beneficial comments (recommendations, additions, deletions) and any pertinent data which may be of use in improving this document should be addressed to: Commander, Defense Supply Center Columbus, ATTN: DSCC-VAT, 3990 East Broad Street, Columbus, OH 43216-5000, by using the Standardization Document Improvement Proposal (DD Form 1426) appearing at the end of this document or by letter. AMSC N/A DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited. FSC 5961 MIL-PRF-19500/535B 2. APPLICABLE DOCUMENTS 2.1. General. The documents listed in this section are specified in sections 3 and 4 of this specification. This section does not include documents cited in other sections of this specification or recommended for additional information or as examples. While every effort has been made to ensure the completeness of this list, document users are cautioned that they must meet all specified requirements documents cited in sections 3 and 4 of this specification, whether or not they are listed. 2.2. Government documents. 2.2.1. Specifications, standards, and handbooks. The following specifications, standards, and handbooks form a part of this document to the extent specified herein. Unless otherwise specified, the issues of these documents are those listed in the issue of the Department of Defense Index of Specifications and Standards (DODISS) and supplement thereto, cited in the solicitation (see 6.2). SPECIFICATION DEPARTMENT OF DEFENSE MIL-PRF-19500 - Semiconductor Devices, General Specification for. STANDARD MILITARY MIL-STD-750 - Test Methods for Semiconductor Devices. (Unless otherwise indicated, copies of the above specifications, standards, and handbooks are available from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.3. Order of precedence. In the event of a conflict between the text of this document and the references cited herein (except for related associated specifications or specification sheets), the text of this document takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1. Qualification. Devices furnished under this specification shall be products that are authorized by the qualifying activity for listing on the applicable qualified products list before contract award (see 4.2 and 6.3). 3.2. Associated detail specification. The individual item requirements shall be in accordance with MIL-PRF-19500, and as specified herein. 3.3. Abbreviations, symbols, and definitions. The abbreviations, symbols, and definitions used herein shall be as specified in MIL-PRF-19500. 3.4. Interface requirements and physical dimensions. The Interface requirements and physical dimensions shall be as specified on figure 1 (T6-C) (T0-59) and figure 2 (JANHC and JANKC) herein. 3.4.1. Lead finish. Unless otherwise specified, lead finish shall be solderable in accordance with MIL-PRF-19500, MILSTD-750, and herein. 3.4.2. Current density. Current density of internal conductors shall be as specified in MIL-PRF-19500. 3.4.3. Construction. These devices shall be constructed in a manner and using materials which enable tha transistors to meet the applicable requirements of MIL-PRF-19500 and this document. 2 MIL-PRF-19500/535B Ltr Dimensions Inches Millimeters Min Max Min Max A --- .250 --- 6.35 CD .330 .360 8.38 9.14 CD .370 .437 9.40 11.10 CH .320 .468 8.13 11.80 HF .424 .437 10.77 11.10 HT .090 .150 2.67 3.81 OAH .575 .763 14.61 19.40 5 PS .185 .215 4.70 5.46 4, 8 PS .090 .110 2.29 2.79 4, 8 SL .400 .455 10.16 11.56 SU --- .078 --- 1.98 T .040 .065 1.02 1.65 UD .155 .189 3.94 4.80 Notes 7 NOTES: 1. Dimensions are in inches. 2. Metric equivalents are given for general information only. 3. See FED-STD-H28, “Screw-Thread Standards for Federal Services”. 4. The orientation of the terminals in relation to the hex flats is not controlled. 5. All three terminals. 6. The case temperature may be measured anywhere on the seating plane within .125 (3.18 mm) of the stud. 7. Terminal spacing measured at the base seat only. 8. This dimension applies to the location of the center line of the terminals. 9. Terminal - 1, emitter; terminal - 2, base; terminal - 3, collector. Collector lead is isolated from the case. FIGURE 1. Physical dimensions of transistor types (JAN, JANTX, and JANTXV) 2N5003and 2N5005 (T0-59). 3 MIL-PRF-19500/535B Ltr Dimensions Inches A Millimeters Min Max Min Max .117 .127 2.97 3.23 NOTES: 1. Dimensions are in inches. 2. Metric equivalents (millimeters) are in parenthesis. 3. Metric equivalents are given for general information only. 4. Unless otherwise specified, tolerance is ± .005 (0.13 mm). 5. The physical characteristics of the die are; Thickness: .008 (0.20 mm) to .012 (0.30 mm), tolerance is ± .005 (0.13 mm). Top metal: Aluminum, 40,000 Å minimum, 50,000 Å nominal. Back metal: Gold 2,500 Å minimum, 3,000 Å nominal. Back side: Collector. Bonding pad: B = .015 (0.38 mm) x .0072 (.183). E = .015 (0.38 mm) x .0060 (.152). FIGURE 2. Physical dimensions JANHCA and JANKCA die dimensions. 4 Inches mm .005 0.13 .006 0.15 .0072 0.183 .008 0.20 .012 0.30 .015 0.38 .117 2.97 .127 3.23 MIL-PRF-19500/535B 3.5. Marking. Devices shall be in accordance with MIL-PRF-19500. 3.6. Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as specified in 1.3, 1.4 and table I herein. 3.7. Electrical test requirements. The electrical test requirements shall be the subgroups specified in 4.4.2 and 4.4.3 herein. 4. VERIFICATION 4.1. Classification of inspections. The inspection requirements specified herein are classified as follows: a. Qualification inspection (see 4.2). b. Screening (see 4.3) c. Conformance inspection (see 4.4). 4.2. Qualification inspection. Qualification inspection shall be in accordance with MIL-PRF-19500. 4.2.1. JANHC and JANKC devices. Qualification for JANHC and JANKC devices shall be in accordance with appendix G of MIL-PRF-19500. 4.3. Screening (JANS, JANTX, and JANTXV levels only). Screening shall be in accordance with MIL-PRF-19500 (Appendix E, table IV), and as specified herein. The following measurements shall be made in accordance with table I herein. Devices that exceed the limits of table I herein shall not be acceptable. Screen (see appendix E, table IV of MIL-PRF-19500) Measurement JANS level JANTX and JANTXV levels 1/ Thermal impedance (see 4.3.2) Thermal impedance (see 4.3.2) 9 ICES1 and hFE2 Not applicable 11 ∆ICES1 = 100 percent or 100 nA, whichever is greater; ∆hFE2 = ± 20 percent. ICES1 and hFE2 12 See 4.3.1 See 4.3.1 13 Subgroups 2 and 3 of table I herein: ∆ ICES1 = +100 percent of initial value or 100 nA, whichever is greater ∆hFE2 = ± 20 percent. Subgroup 2 of table I herein: ∆ ICES1 = +100 percent of initial value or 100 nA, whichever is greater ∆hFE2 = ± 20 percent. 1/ May be performed anytime before screen 9. 4.3.1. Power burn-in conditions. Power burn-in conditions are as follows: TA = Room ambient as defined in the general requirements of MIL-STD-750, (see 4.5); VCE = 40 V ± 1 V, PT = 2.0 W (min) NOTE: No heat sink or forced air cooling on the device shall be permitted 5 MIL-PRF-19500/535B 4.3.2. Thermal impedance (ZθJX measurements). The ZθJX measurements shall be performed in accordance with MIL-STD-750, method 3131. The maximum limit (not to exceed the group A, subgroup 2 limit) for ZθJX in screening (appendix E, table IV of MIL-PRF-19500) shall be derived by each vendor by means of statistical process control. When the process has exhibited control and capability, the capability data shall be used to establish the fixed screening limit. In addition to screening, once a fixed limit has been established, monitor all future sealing lots using a random five piece sample from each lot to be plotted on the applicable X, R chart. If a lot exhibits an out of control condition, the entire lot shall be removed from the line and held for Engineering evaluation and disposition. 4.3.2.1. Thermal impedance (ZθJX measurements) for initial qualification or requalification. The ZθJX measurements shall be performed in accordance with MIL-STD-750, method 3131 (read and record date ZθJX ). ZθJX shall be supplied on one lot (500 devices minimum and a thermal response curve shall be submitted). Twenty-two of these samples shall be serialized and provided to the qualifying activity for correlation prior to shipment of parts. Measurements conditions shall be in accordance with 4.4.1 herein. 4.3.3. Screening (JANHC or JANKC). Screening of die shall be in accordance with MIL-PRF-19500, appendix G. As a minimum, die shall be 100-percent probed to ensure compliance with group A, subgroup 2. 4.4. Conformance inspection. Conformance inspection shall be in accordance with MIL-PRF-19500. 4.4.1. Group A inspection. Group A inspection shall be conducted in accordance with appendix E, table V of MIL-PRF19500 and table I herein. End-point electrical measurements shall be in accordance with the applicable steps of table II herein. The following test conditions shall be used for ZθJX , end-point measurements: ZθJX = 3.1°C/W. a. IM ................................................... 10 mA. b. VCE measurement voltage ............. 20 V (same as VH). c. IH collector heating current ............. 1 A (minimum). d. VH collector-emitter heating voltage. 20 V (minimum). e. tH heating time ............................... 100 ms. f. tMD measurement delay time ......... 50 µs to 80 µs. g. tSW sample window time ............... 10 µs (maximum). 4.4.2. Group B inspection. Group B inspection shall be conducted in accordance with conditions specified for the subgroup testing in appendix E, table VIa (JANS) and table VIb (JAN, JANTX, and JANTXV) of MIL-PRF-19500, and as follows. Electrical measurements (end points) and delta requirements shall be in accordance with the applicable steps of table II herein. 4.4.2.1. Group B inspection, appendix E, table VIa (JANS) of MIL-PRF-19500. Subgroup Method Condition B4 1037 VCB = 10 V dc minimum, PT = 2.5 W minimum, TA = +25°C ± 3°C. B5 1027 VCB = 20 V dc, TJ = +275°C ± 5°C for 96 hours; Adjust the chosen TA and PT to give an average lot TJ = +275°C. Marking legibility requirements shall not apply. B6 3131 See 4.5.2. 6 MIL-PRF-19500/535B 4.4.2.2. Group B inspection, appendix E, table VIb (JANTX and JANTXV) of MIL-PRF-19500. Subgroup B3 B5 Method 1037 Condition VCB = 10 V dc minimum, PT = 2.5 W minimum, TA = +25°C ± 3°C. 3131 See 4.5.2. 4.4.3. Group C inspection. Group C inspection shall be conducted in accordance with the conditions specified for subgroup testing in appendix E, table VII of MIL-PRF-19500 and as follows. Electrical measurements (end-points) and delta requirements shall be in accordance with the applicable steps of table II herein. Subgroup Method Conditions C2 2036 Test condition A, weight = 7 pounds, ± 5 ounces, application time = 15 seconds; Test condition D1, torque = 6 inch - ounce, application time = 15 seconds; test condition D2, torque = 15 in - lbs, application time = 15 seconds. C6 1037 VCB = 10 V dc minimum, PT = 2.5 W minimum, TA = +25°C ± 3°C. 4.5. Methods of examination and test. Methods of examination and test shall be as specified in the appropriate tables and as follows. 4.5.1. Pulse measurements. Conditions for pulse measurements shall be as specified in section 4 of MIL-STD-750. 4.5.2. Thermal resistance. Thermal resistance measurements shall be conducted in accordance with method 3131 of MILSTD-750. The following details shall apply: a. Collector current magnitude during power application shall be 2.0 A dc. b. Collector to emitter voltage magnitude shall be 10 V dc. c. Reference temperature measuring point shall be the case. d. Reference point temperature shall be +25°C ≤ TR ≤ +75°C and recorded before the test is started. e. Mounting arrangement shall be with heat sink to case. f. Maximum limit of RθJC shall be 3.0°C/W. 4.5.3. Inspection conditions. Unless otherwise specified herein all inspections shall be conducted at a case temperature (TC) of +25°C. 7 MIL-PRF-19500/535B TABLE I. Group A inspection. Inspection 1/ MIL-STD-750 Method Symbol Conditions Limits Min Unit Max Subgroup 1 Visual and mechanical inspection 2071 Subgroup 2 Thermal impedance 3131 See 4.4.1 Breakdown voltage, collector to emitter 3011 Bias condition D, IC = 100 mA dc, IB = 0, pulsed (see4.5.1) 3.1 VBR(CEO) 80 °C/W V dc ICES1 Collector to emitter cutoff current 3041 Bias condition C, VCE = 60 V dc, VBE = 0 ICES2 1.0 µA dc ICEO 1.0 Ma dc Bias condition D, VEB = 4 V dc, IC = 0 IEBO1 50 µA dc Bias condition C, VCE = 100 V dc, VBE = 0 Collector to emitter cutoff current 3041 Collector to emitter cutoff current 3041 Emitter to base cutoff current 3061 Bias condition D, VEB = 5.5 V dc, IC = 0 IEBO2 1.0 µA dc Emitter to base cutoff current 3061 VCE = 5 V dc, IC = 50 mA dc hFE1 1.0 mA dc Forward - current transfer ratio 3076 VCE = 5 V dc, IC = 2.5 A dc, pulsed (see 4.5.1) Bias condition D, VCE = 40 V dc, IB = 0 hFE2 2N5003 2N5005 Forward - current transfer ratio 20 50 3076 VCE = 5 V dc, IC = 5 A dc, pulsed (see 4.5.1) hFE3 2N5003 2N5005 Forward - current transfer ratio 30 70 3076 2N5003 2N5005 20 40 See footnote at end of table. 8 90 200 MIL-PRF-19500/535B TABLE I. Group A inspection - Continued. Inspection 1/ MIL-STD-750 Method Symbol Conditions Limits Min Unit Max Subgroup 2 - Continued Base-emitter voltage (nonsaturated) 3066 Test condition B, VCE = 5 V dc, IC = 2.5 A dc, pulsed (see 4.5.1) Base-emitter saturation voltage 3066 Base-emitter saturation voltage VBE 1.45 V dc Test condition A, IC = 2.5 A dc, IB = 250 mA dc, pulsed (see 4.5.1) VBE(sat1) 1.45 V dc 3066 Test condition A, IC = 5 A dc IB = 500 mA dc, pulsed (see 4.5.1) VBE(sat2) 2.2 V dc Collector-emitter saturation voltage 3071 IC = 2.5 A dc, IB = 250 mA dc, pulsed (see 4.5.1) VCE(sat1) 0.75 V dc Collector-emitter saturation voltage 3071 IC = 5 A dc, VCE = 40 V dc, pulsed (see 4.5.1) VCE(sat2) 1.5 V dc ICEX 500 µA dc Subgroup 3 High-temperature operation: Collector to emitter cutoff current TC = +150°C 3041 Low-temperature operation: Forward-current transfer ratio Bias condition A; VCE = 60 V dc, VBE = +2 V dc TC = -65°C 3076 VCE = 5 V dc, IC = 2.5 A dc, pulsed (see 4.5.1) hFE4 2N5003 2N5005 15 25 Subgroup 4 hfe Common-emitter, smallsignal, short-circuit, forward-current transfer ratio 3206 VCE = 5 V dc, IC = 100 mA dc, f = 1 kHz 2N5003 2N5005 20 50 See footnote at end of table. 9 MIL-PRF-19500/535B TABLE I. Group A inspection - Continued. Inspection 1/ MIL-STD-750 Method Symbol Conditions Limits Min Unit Max Subgroup 4 - Continued Magnitude of commonemitter, small-signal short-circuit, forwardcurrent transfer ratio 3206 VCE = 5 V dc, IC = 500 mA dc f = 10 MHz hfe 2N5003 2N5005 Open-circuit output capacitance 6 7 3236 Switching time VCB = 10 V dc, IE = 0, f = 1 MHz Cobo 250 pF IC = 5 A dc, IB1 = 500 mA dc ton 0.5 µs IB2 = -500 mA dc ts 1.4 µs VBE(off) = 3.7 V tf 0.5 µs RL = 6Ω,(See figure 5) toff 1.5 µs Subgroup 5 Safe operating area (dc) 3055 Pre-pulse condition for each test: VCE = 0, IC = 0, TC = +25°C Pulse condition for each test tp = 1 sec. 1 cycle TC = +25°C, (See figure 3) Test #1 VCE = 12 V dc, IC = 5 A dc Test #2 VCE = 32 V dc, IC = 1.7 A dc Test #3 VCE = 80 V dc, IC = 100 mA dc Safe operating area (unclamped inductive) TC = +25°C, RBB1 = 10Ω RBB2 = 100Ω, L = 0.3 mH, RL = 0.1Ω, VCC = 10 V dc VBB1 = 10 V dc, VBB2 = 4 V dc ICM = 10 A dc (See figure 4) End-point electrical measurements See table II, steps 1, 2, and 3 Subgroups 6 and 7 Not applicable 1/ For sampling plan, see MIL-PRF-19500 10 MIL-PRF-19500/535B TABLE II. Groups A, B, and C electrical measurements. 3/ 4/ 5/ Steps Inspection 1/ MIL-STD-750 Method Symbol Conditions Limits Min 1. Collector to emitter cutoff current 3041 VCE = 60 V dc Condition C, VBE = 0 ICES1 2. Forward-current transfer ratio 3076 VCE = 5 V dc IC = 2.5 A dc pulsed (see 4.5.1) hFE2 2N5003 2N5005 Unit Max 1.0 30 70 µA dc 90 200 3. Breakdown voltage collector to emitter 3011 Bias condition A, IC = 100 mA dc IB = 0, pulsed (see 4.5.1) V(BR)CEO 80 4. Collector to emitter cutoff current 3041 VCE = 60 V dc ICES1 2/ 100 percent of initial value or 100 nA, whichever is greater. 5. Forward-current transfer ratio 3076 IC = 2.5 V dc, VCE = 5 V dc pulsed (see 4.5.1) ∆hFE2 2/ ± 20 percent change from initial reading. 6. Base to emitter saturation voltage 3066 Test condition A, IC = 2.5 A dc IB = 250 mA dc pulsed (see 4.5.1) VBE(sat) V dc 1.45 V dc 1/ See MIL-PRF-19500 for sampling plan. 2/ Devices which exceed the group A limits for this test shall not be accepted. 3/ The electrical measurements for appendix E, table VIa (JANS) of MIL-PRF-19500 are as follows: a. Subgroup 3, see table II herein, steps 1, 2, and 6. b. Subgroup 4, see table II herein, steps 2, 3, 4, 5, and 6. c. Subgroup 4, see table II herein, steps 2, 3, 4, 5, and 6. 4/ The electrical measurements for appendix E, table VIb (JANTX and JANTXV) of MIL-PRF-19500 are as follows: a. Subgroup 2, see table II herein, steps 1, 2, and 3. b. Subgroup 3, see table II herein, steps 1, 2, 4, and 5. c. Subgroup 6, see table II herein, steps 1, 2, 4, and 5. 5/ The electrical measurements for appendix E, table V of MIL-PRF-19500 are as follows: a. Subgroup 2, see table II herein, steps 1, 2, and 3. b. Subgroup 3, see table II herein, steps 1, 2, and 3. c. Subgroup 6, see table II herein, steps 1, 2, 4, and 5. 11 MIL-PRF-19500/535B FIGURE 3. Maximum safe operating area. RBB1 = 10Ω RBB2 = 100Ω L = 0.3 mH RL = 0.1Ω VCC = 10 V dc IC = 10 A VBB1 = 10 V dc VBB2 = 4 V dc FIGURE 4. Unclamped inductive load energy test circuit. 12 MIL-PRF-19500/535B NOTES: 1. Vgen is -30 pulse (from 0 V) into a 50 ohm termination. 2. The Vgen waveform is supplied by a generator with the following characteristics: tr ≤ 15 ns, tf = 15 ns, Zout = 50 ohm, duty cycle ≤ 2 percent. 3. Waveforms are monitored on an oscilloscope with the following characteristics: tr ≤ 1 ns, RIN ≥ 10 MΩ, CIN ≤ 11.5 pF. 4. Resistors shall be noninductive types. 5. The dc power supplies may require additional bypassing in order to minimize ringing. 6. An equivalent drive circuit may be used. FIGURE 5. Switching time test circuit. 13 MIL-PRF-19500/535B 5. PACKAGING 5.1. Packaging. Packaging shall prevent mechanical damage of the devices during shipping and handling and shall not be detrimental to the device. When actual packaging of material is to be performed by DoD personnel, these personnel need to contact the responsible packaging activity to ascertain requisite packaging requirements. Packaging requirements are maintained by the Inventory Control Points' packaging activity within the Military Department or Defense Agency, or within the Military Departments' System Command. Packaging data retrieval is available from the managing Military Departments' or Defense Agency's automated packaging files, CD-ROM products, or by contacting the responsible packaging activity. 5.2. Marking. Unless otherwise specified (see 6.2), marking shall be in accordance with MIL-STD-129. 6. NOTES (This section contains information of a general or explanatory nature that may be helpful, but is not mandatory.) 6.1. Notes. The notes specified in MIL-PRF-19500 are applicable to this specification. 6.2. Acquisition requirements. See MIL- PRF-19500. 6.3. Qualification. With respect to products requiring qualification, awards will be made only for products which are, at the time of award of contract, qualified for inclusion in Qualified Products List QPL No.19500 whether or not such products have actually been so listed by that date. The attention of the contractors is called to these requirements, and manufacturers are urged to arrange to have the products that they propose to offer to the Federal Government tested for qualification in order that they may be eligible to be awarded contracts or purchase orders for the products covered by this specification. Information pertaining to qualification of products may be obtained from Defense Supply Center Columbus, ATTN: DSCCVQE, Post Office Box 3990, Columbus, OH 43216-5000. 6.4. Interchangeability information. The 2N5003 and 2N5005 (MIL-PRF-19500/535) are inactive for new design. For new design use 2N7372 (MIL-PRF-19500/612). MIL-PRF-19500/612 is a T0-254 package version of MIL-PRF-19500/535, which is a T0-210 (T0-59) package version. The military 2N7372 contains the same die as the military 2N5003 and 2N5005. 6.5. Suppliers of JANHC die. The qualified JANHC die suppliers with the applicable letter version (example JANHCA2N5003) will be identified on the QPL. JANHC ordering information PIN Manufacturer CAGE 33178 2N5003 2N5005 JANHCA2N5003 JANHCA2N5005 2N5003 2N5005 JANKCA2N5003 JANKCA2N5005 6.6. Changes from previous issue. Marginal notations are not used in this revision to identify changes with respect to the previous issue due to the extent of the changes. 14 MIL-PRF-19500/535B CONCLUDING MATERIAL Custodians: Air Force - 17 NASA - NA Preparing activity: DLA - CC (Project 5961 - F149) Review activities: Air Force - 19, 85, 99 15 MIL-PRF-19500/535B STANDARDIZATION DOCUMENT IMPROVEMENT PROPOSAL INSTRUCTIONS 1. The preparing activity must complete blocks 1, 2, 3, and 8. In block 1, both the document number and revision letter should be given. 2. The submitter of this form must complete blocks 4, 5, 6, and 7. 3. The preparing activity must provide a reply within 30 days from receipt of the form. NOTE: This form may not be used to request copies of documents, nor to request waivers, or clarification of requirements on current contracts. Comments submitted on this form do not constitute or imply authorization to waive any portion of the referenced document(s) or to amend contractual requirements. I RECOMMEND A CHANGE: 1. DOCUMENT NUMBER MIL-PRF-19500/535B 2. DOCUMENT DATE 20 December 1997 3. DOCUMENT TITLE SEMICONDUCTOR DEVICE, TRANSISTOR, PNP, SILICON, POWER TYPES 2N5003, 2N5005, JAN, JANTX, JANTXV, JANS, JANHC, AND JANKC 4. NATURE OF CHANGE (Identify paragraph number and include proposed rewrite, if possible. Attach extra sheets as needed.) 5. REASON FOR RECOMMENDATION 6. SUBMITTER a. NAME (Last, First, Middle initial) b. ORGANIZATION c. ADDRESS (Include Zip Code) d. TELEPHONE (Include Area Code) Commercial DSN FAX 7. DATE SUBMITTED EMAIL 8. PREPARING ACTIVITY a. Point of Contact Alan Barone c. ADDRESS Defense Supply Center Columbus, ATTN: DSCC-VAT, 3990 East Broad Street, Columbus, OH 43216-5000 DD Form 1426, OCT 89 b. TELEPHONE Commercial (614)692-0510 DSN 850-0510 FAX (614)692-6939 EMAIL [email protected] IF YOU DO NOT RECEIVE A REPLY WITHIN 45 DAYS, CONTACT: Defense Quality and Standardization Office 5203 Leesburg Pike, Suite 1403, Falls Church, VA 22041-3466 Telephone (703) 756-2340 AUTOVON 289-2340 Previous editions are obsolete 16 198/290