LINER LTC1700

LTC1700
No RSENSE Synchronous
Step-Up DC/DC Controller
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FEATURES
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The LTC®1700 is a current mode synchronous step-up
DC/DC controller that drives external N-channel and
P-channel power MOSFETs using a constant frequency
PWM architecture. Current limiting is provided by sensing
the voltage drop across the main MOSFET, eliminating the
need of a sense resistor. This No RSENSETM technique helps
the LTC1700 maintain high efficiency at heavy loads while
Burst Mode operation ensures high efficiency at light loads,
thus providing high efficiencies over a wide range of load
currents.
High Efficiency: Up to 95%
No Current Sense Resistor Required
Constant Frequency 530kHz Operation Allows
Small Size, Surface Mount Inductors
OPTI-LOOPTM Compensation Minimizes COUT
Selectable Burst ModeTM Operation
Minimum Start-Up Voltage as low as 0.9V
Synchronizable Between 400kHz and 750kHz
Micropower Shutdown: 10µA
Current Mode Operation for Excellent Line and Load
Transient Response
Soft-Start Reduces Supply Current Transients
1.5% Output Voltage Accuracy
Uses Low Value, Small Size, Surface Mount Inductors
Available in 10-Lead MSOP Package
The LTC1700 operates at a minimum input voltage as low as
0.9V. The device boasts a ±1.5% output voltage accuracy and
consumes only 200µA of quiescent current. In shutdown, it
only draws 10µA.
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APPLICATIO S
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To prevent inductor current runaway, the duty cycle is limited
to 90%. Overvoltage protection is also provided which shuts
both the external MOSFETs off when tripped.
Cellular Telephones
Wireless Modems
RF Communications
2.5V to 3.3V, 2.5V to 5V Converters
Battery-Powered Equipment
Telecom/Network Systems
High constant operating frequency of 530kHz allows the use
of small inductors and output capacitors. The LTC1700 can
also be synchronized between 400kHz to 750kHz. Burst
Mode operation is inhibited when the device is externally
clocked or when the SYNC/MODE pin is pulled low to reduce
noise and RF interference.
, LTC and LT are registered trademarks of Linear Technology Corporation.
Burst Mode, OPTI-LOOP and No RSENSE are trademarks of Linear Technology Corporation.
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TYPICAL APPLICATIO
L1
1.8µH
2
C5
220pF
R3
2200Ω
4
C3
220pF
C4
0.1µF
1
3
R2
100k
5
R1
316k
ITH
SW
RUN/SS
BG
M1
VFB
5V
2A
TG
SYNC/MODE VOUT
9
C7
330µF
6V
6
80
VIN = 4.2V
VIN = 3.3V
70
60
7
50
1700 • F01a
C1: CERAMIC TAIYO YUDEN LMK432BJ226MM
C2: AVX TAJB686K006R
L1: TOKO 919AS-IR8N (D104C TYPE)
90
C6
10µF
+
PGND
Efficiency vs Load Current
100
LTC1700
SGND
VIN
3.3V to 4.2V
C2
68µF
6.3V
M2
10
8
C1
22µF
+
EFFICIENCY (%)
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DESCRIPTIO
C6: CERAMIC TAIYO YUDEN JMK316BJ106ML
C7: SANYO POSCAP 6TPB330M
M1: SILICONIX Si9804
M2: SILICONIX Si9803
40
0.001
0.01
0.1
LOAD CURRENT (A)
1.0
1700 F01b
Figure 1. High Efficiency Step-Up Converter
1
LTC1700
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ABSOLUTE
AXI U RATI GS
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PACKAGE/ORDER I FOR ATIO
(Note 1)
Output Supply Voltage (VOUT) .....................– 0.3V to 6V
RUN/SS, VFB Voltages ..............................– 0.3V to 2.4V
SYNC/MODE, ITH Voltages ...........................– 0.3V to 6V
SWITCH Voltage (SW) ..............................– 0.3V to 6.5V
TG, BG Peak Output Current (<10µs) ......................... 1A
Operating Temperature Range (Note 2) ...–40°C to 85°C
Junction Temperature (Note 3) ............................. 125°C
Storage Temperature Range ................. – 65°C to 150°C
Lead Temperature (Soldering, 10 sec).................. 300°C
ORDER PART
NUMBER
TOP VIEW
SGND
ITH
VFB
RUN/SS
SYNC/MODE
10
9
8
7
6
1
2
3
4
5
SW
PGND
BG
VOUT
TG
LTC1700EMS
MS10 PART
MARKING
MS10 PACKAGE
10-LEAD PLASTIC MSOP
TJMAX = 125°C, θJA = 150°C/W
LTLC
Consult LTC Marketing for parts specified with wider operating temperature ranges.
ELECTRICAL CHARACTERISTICS
The ● denotes the specifications which apply over the full operating
temperature range, otherwise specifications are at TA = 25°C. VOUT = 3V unless otherwise specified.
SYMBOL
PARAMETER
CONDITIONS
TYP
MAX
VSOP
Start-Up Minimum Operating Voltage
(Note 4)
0.9
1.8
V
VOP
Minimum Operating Voltage
Hysteresis
(Note 5) VOUT Ramping Up
2.34
90
2.6
V
mV
IS
Input DC Supply Current
Normal Mode
Sleep Mode
Start-Up Mode
Shutdown
(Note 6)
VFB = 1.6V, VMODE = 0V, VRUN/SS = 3V
VFB = 1.6V, VMODE = 3V, VRUN/SS = 3V
VFB = 0V, VMODE, VRUN/SS, VOUT = 1.8V
VFB = 0V, VMODE = 3V, VRUN/SS = 0V
536
179
35
10
620
210
45
14
µA
µA
µA
µA
IVFB
Feedback Current
VFB = 1.20V
1
50
nA
VFB
Regulated Output Voltage
(Note 7)
1.205
1.223
V
∆VOSENS
Reference Voltage Line Regulation
VIN = 2.7V to 5V (Note 7)
0.0106
0.080
%/V
VLOADREG
Output Voltage Load Regulation
Measured in Servo Loop; VITH = 0.3V to 0.9V
0.036
0.065
%
VOVL
Output Overvoltage Lockout
Reference to Nominal VFB
VRUN/SS
Shutdown Threshold
VRUN/SS Ramping Up
IRUN/SS
Soft-Start Current Source
VRUN/SS = 0V
fOSC
Oscillator Frequency
Start-Up Oscillator Frequency
VOUT = 4.2V
VOUT = 1.8V, VRUN/SS = 1.8V, VSW = 1.1V
VSYNC/MODE
SYNC/MODE Threshold
VSYNC/MODE Ramping Down from 1.2V
DC MAX
Maximum Duty Cycle
fOSC = 550kHz
∆VSENSE(MAX)
Maximum Current Sense Voltage
ILIMIT
Current Limit At Start-Up
VOUT = 1.8V
gm
Transconductance of Error Amplifier
VFB = VREF ± 10mV
●
●
●
●
1.187
UNITS
2.5
4.8
9
%
0.7
1.09
1.2
V
2
3.79
6
µA
460
150
530
225
630
kHz
kHz
1.03
1.13
1.25
V
84
88
92
%
55
63
78
100
mV
mV
40
60
0.65
0.9
mA
1.30
m
Ω
2
MIN
LTC1700
ELECTRICAL CHARACTERISTICS
The ● denotes the specifications which apply over the full operating
temperature range, otherwise specifications are at TA = 25°C. VOUT = 3V unless otherwise specified.
SYMBOL
PARAMETER
CONDITIONS
TG tr
TG tf
TG Transition Time
TG Gate Drive Rise Time
TG Gate Drive Fall Time
BG tr
BG tf
tdll
tdhh
TYP
MAX
UNITS
CLOAD = 3000pF, 10% to 90%
CLOAD = 3000pF, 90% to 10%
60
60
100
100
ns
ns
BG Transition Time
BG Gate Drive Rise Time
BG Gate Drive Fall Time
CLOAD = 3000pF, 10% to 90%
CLOAD = 3000pF, 90% to 10%
80
50
100
70
ns
ns
Dead Time
BG and TG Gates Go Low
BG and TG Gates Go High
CLOAD = 3000pF on BG and TG
CLOAD = 3000pF on TG and BG
88
66
110
90
ns
ns
Note 1: Absolute Maximum Ratings are those values beyond which the life
of a device may be impaired.
Note 2: The LTC1700E is guaranteed to meet performance specifications
from 0°C to 70°C. Specifications over the –40°C to 85°C operating
temperature range are assured by design, characterization and correlation
with statistical process controls.
Note 3: TJ is calculated from the ambient temperature TA and power
dissipation PD according to the following formula:
TJ = TA + (PD • 150°C/W)
MIN
Note 4: At an input supply less than 2.3V, only the start-up circuitry of the
LTC1700 is active. This test ensures the start-up circuitry is working.
Note 5: An input supply at or above this minimum operating voltage
activates the main control loop. Start-up circuitry of the LTC1700 is
shut off.
Note 6: Dynamic supply current is higher due to the gate charge being
delivered at the switching frequency.
Note 7: The LTC1700 is tested in a feedback loop that servos VFB to the
feedback point for the error amplifier (VITH = 0.6V)
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TYPICAL PERFORMANCE CHARACTERISTICS
Shutdown Current vs Supply
Voltage
20
1.208
18
1.206
16
1.204
1.202
1.200
1.198
1.196
1.194
250
14
12
10
8
6
4
200
150
100
50
2
1.192
1.190
– 55 –35 –15
Quiescent Current vs Supply
Voltage
QUIESCENT CURRENT (µA)
1.210
SHUTDOWN CURRENT (µA)
REFERENCE VOLTAGE (V)
Reference Voltage vs
Temperature
0
0
5 25 45 65 85 105 125
TEMPERATURE (°C)
1700 G01
1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
SUPPLY VOLTAGE (V)
1700 G02
1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
SUPPLY VOLTAGE (V)
1700 G03
3
LTC1700
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TYPICAL PERFORMANCE CHARACTERISTICS
Normalized Oscillator Frequency
vs Temperature
Minimum Operating Voltage
vs Temperature
1.08
1.4
5
1.06
1.2
4
3
2
1
START-UP VOLTAGE (V)
6
NORMALIZED FREQUENCY
RUN/SS CURRENT (µA)
RUN/SS Current vs Temperature
1.04
1.02
1.00
0.98
5 25 45 65 85 105 125
TEMPERATURE (°C)
0.94
– 55 –35 –15
5 25 45 65 85 105 125
TEMPERATURE (°C)
1.0
Maximum Current Sense Voltage
vs Temperature
0.8
2.22
0.6
2.20
Efficiency vs Load Current
(Burst Mode Operation Disabled)
100
EFFICIENCY (%)
START-UP CURRENT LIMIT (A)
SENSE VOLTAGE (mV)
90
0.10
0.08
0.06
60
5 25 45 65 85 105 125
TEMPERATURE (°C)
40
0.001
0.1
0.01
LOAD CURRENT (A)
1.0
1700 G09
3.3V Output Efficiency, Circuit of
Figure 1 With Burst Mode
Operation Inhibited
100
Load Step Transient Response
Burst Mode Operation Enabled
100
VIN = 2.7V
A/C COUPLED
OUTPUT
VOLTAGE
(0.2V/DIV)
90
80
VIN = 2V
EFFICIENCY (%)
EFFICIENCY (%)
VIN = 3.3V
1700 G8
3.3V Output Efficiency, Circuit of
Figure 1 With Burst Mode
Operation
70
60
40
40
1.0
1700 G10
VIN = 2V
INDUCTOR
CURRENT
(2A/DIV)
60
50
0.01
0.1
LOAD CURRENT (A)
VIN = 2.7V
70
50
4
70
50
1700 G7
30
0.001
80
0.04
0
– 55 –35 –15
5 25 45 65 85 105 125
TEMPERATURE (°C)
VIN = 4.2V
0.12
0.02
80
2.14
5 25 45 65 85 105 125
TEMPERATURE (°C)
1700 G6
0.14
90
2.18
2.16
0
– 55 –35 –15
0.16
60
– 55 –35 –15
MAIN
CONTROLLER
0.4
Start-Up Current Limit vs
Temperature
90
70
2.24
1700 G5
1700 G04
80
2.26
START-UP
CIRCUIT
0.2
0.96
0
– 55 –35 –15
2.28
30
0.001
VIN = 3.3V
VOUT = 5V
0.1
0.01
LOAD CURRENT (A)
1.0
1700 F16
2A/DIV
VSYNC = VIN
LOAD STEP = 100mA TO 1.7A
1700 G12
LTC1700
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TYPICAL PERFORMANCE CHARACTERISTICS
Load Step Transient Response
Burst Mode Operation Inhibited
Load Step Transient Response
Burst Mode Operation Enabled
Load Step Transient Response
Burst Mode Operation Inhibited
A/C COUPLED
OUTPUT
VOLTAGE
(0.2V/DIV)
A/C COUPLED
OUTPUT
VOLTAGE
(0.2V/DIV)
A/C COUPLED
OUTPUT
VOLTAGE
(0.2V/DIV)
INDUCTOR
CURRENT
(2A/DIV)
INDUCTOR
CURRENT
(2A/DIV)
INDUCTOR
CURRENT
(2A/DIV)
1700 G13
VIN = 4.2V
VOUT = 5V
2A/DIV
VSYNC = VIN
LOAD STEP = 100mA TO 1.7A
1700 G15
1700 G14
VIN = 4.2V
VOUT = 5V
2A/DIV
VSYNC = 0V
LOAD STEP = 100mA TO 1.7A
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VIN = 3.3V
VOUT = 5V
2A/DIV
VSYNC = 0V
LOAD STEP = 100mA TO 1.7A
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PIN FUNCTIONS
SGND (Pin 1): Small-Signal Ground. Must be routed
separately from other grounds to the (–) terminal of COUT.
ITH (Pin 2): Error Amplifier Compensation Point. The
current comparator threshold increases with this control
voltage. Nominal voltage range for this pin is 0V to 1.18V.
VFB (Pin 3): Receives the feedback voltage from an external resistive divider across the output capacitor.
RUN/SS (Pin 4): Combination of Soft-Start and Run
Control Inputs. A capacitor to ground at this pin sets the
ramp time to full output current. The time is approximately
0.45s/µF. Forcing this pin below 1.08V causes all circuitry
to be shut down.
SYNC/MODE (Pin 5): This pin performs three functions. A
voltage greater than 1.2V on this pin allows Burst Mode
operation at low load currents, while grounding or applying a clock signal on this pin defeats Burst Mode operation.
An external clock between 400kHz and 750kHz applied to
this pin forces the LTC1700 to operate at the external clock
frequency. Do not attempt to synchronize below 400kHz
or above 750kHz.
TG (Pin 6): Top Gate Drive. Drives the external synchronous P-channel MOSFET with a voltage swing between 0V
to VOUT.
VOUT (Pin 7): This pin performs two functions. It serves as
the supply pin and also as one of the inputs to the current
reversal comparator.
BG (Pin 8): Bottom Gate Drive. Drives the external main
N-channel MOSFET with a voltage swing between 0V to
VOUT.
PGND (Pin 9): Top and Bottom Gate Drivers Ground.
Connects to the (–) terminal of COUT. Source of the main
N-channel MOSFET must be connected close to this pin
since this pin is also one of the inputs to the VDS sense
amplifier.
SW (Pin 10): This pin connects to the inputs of two
comparators: The VDS sense amplifier and the current
reversal comparator. The drain of an internal N-channel
start-up MOSFET (M1) is also connected to this pin.
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LTC1700
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FUNCTIONAL DIAGRA
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VCC
Y = “0” ONLY WHEN X IS A CONSTANT “1”, OTHERWISE Y = “1”
Y
BURST
INHIBIT
X
SYNC/
MODE
SLOPE
COMP
5
MAIN
OSC
ITH
0.36V
90% DUTY
CYCLE LIMIT
2
–
VFB
3
+
–
EA
1.205V
+
–
Ω
gm = 0.9m
SLEEP
VOUT
BURST
0.12V
+
6 TG
VOUT
VOUT
7
1.205V
REFERENCE
VREF + 58mV
RUN/
SOFT-START
–
OV
VFB
3.8µA
RUN/SS 4
+
SWITCHING
LOGIC
AND
BLANKING
CIRCUIT
VOUT
8 BG
SGND
1
–
+
SC
9 PGND
VOUT
= “1” WHEN VOUT < 2.3V
+
IRCMP
9mV
SHDN
START-UP
OSCILLATOR
–
SW 10
S
QB
L1
R
Q
M1
+
VDS
+
–
ICMP
1Ω
–
60mV
1700 • FD
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OPERATIO (Refer to Functional Diagram)
Main Control Loop
The LTC1700 is a constant frequency, current mode
controller for DC/DC step-up converters. In normal operation, the main external N-channel power MOSFET is turned
on when the oscillator sets a latch and turned off either
when the VDS sense amplifier (VDS) resets the latch or the
duty cycle has reached 90%. When the main MOSFET is
turned off, the synchronous rectifier P-channel MOSFET is
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turned on until either the inductor current is about to
reverse, as determined by the current reversal comparator
(IRCMP), or the next cycle begins. Inductor current is
measured by sensing the VDS potential across the conducting MOSFET. The peak inductor current is controlled
by the voltage on the ITH pin, which is the output of the
error amplifier (EA). An external resistive divider connected between VOUT and GND allows EA to receive an
LTC1700
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OPERATIO
output feedback voltage VFB. When the load current increases, it causes a slight decreases in VFB relative to the
1.205V reference, which in turn causes the ITH voltage to
increase until the average inductor current matches the
new load current.
The internal oscillator can be synchronized to an external
clock applied to the SYNC/MODE pin and can lock to a
frequency between 400kHz to 750kHz. When not synchronized, the oscillator runs at 530kHz.
The main control loop is shut down by pulling the RUN/SS
pin low. Releasing the RUN/SS pin allows an internal
3.8µA current source to charge up an external soft-start
capacitor (CSS). When this voltage reaches 0.8V, the main
control loop is enabled with the ITH voltage clamped at
approximately 5% of its maximum value. As CSS continues to charge, ITH is gradually released allowing normal
operation to resume.
An overvoltage comparator 0V guards against transient
overshoots greater than 5% above regulated voltage by
turning off both the external MOSFETs and keeping them
off until the fault is removed.
To prevent excessive inductor current buildup, the main
N-channel MOSFET is only allowed to turn on for a
maximum duty cycle of 90%.
Burst Mode Operation
The LTC1700 can be enabled to go into Burst Mode
operation at low load currents simply by connecting the
SYNC/MODE pin to a voltage of at least 1.2V. In this mode,
the peak current of the inductor is set as if VITH = 0.36V (at
low duty cycles) even though the voltage at the ITH pin is
actually at a lower value. If the inductor’s average current
is greater than the load requirement, the voltage at the ITH
pin will drop. When the ITH voltage goes below 0.12V, the
internal sleep signal goes low, turning off both external
MOSFETs. Now the load current will solely be supplied by
the output capacitor and the output voltage begins to
droop. This drooping of the output voltage results in the
rise of ITH voltage and once it has risen above 0.22V,
switching will then be resumed on the next oscillator cycle.
Frequency Synchronization
The LTC1700 can be externally driven by a CMOS
(0V to 1.2V) compatible clock signal between 400kHz and
750kHz. Do not synchronize the LTC1700 below 400kHz
or above 750kHz as this may cause abnormal operation.
During synchronization, Burst Mode operation is
inhibited.
Low Input Operation
When the voltage at VOUT is less than 2.3V, the LTC1700
operates in the “start-up” mode. In this mode, most
internal circuitry is turned off except the start-up oscillator, current comparator (ICMP) and the start-up comparator (SC). The voltage at pins TG and BG are forced to
ensure both the external MOSFETs are off. The start-up
oscillator runs at about 210kHz at 50% duty cycle and is
used to set the latch (L1) which turns on the internal
MOSFET M1 (see Functional Diagram). When the inductor’s
current reaches 60mA, the current comparator (ICMP) is
tripped and resets the latch. This turns M1 off and the
parasitic diode of the external P-channel MOSFET is used
to transfer the energy from the inductor to the output
capacitor. The above cycle repeats again on the next
oscillator pulse.
When the output voltage rises above 2.3V, the start-up
comparator will trip, powering up the rest of the LTC1700.
All start-up circuitry will then be turned off. Now the
LTC1700 has successfully transitioned out of its start-up
mode and commences normal operation as described
under the section “Main Control Loop.”
Protection Circuitry
Two protection circuits are incorporated into the LTC1700.
To prevent the inductor from saturating the maximum
duty cycle of the regulator is limited to 90%. This is done
to ensure that at least 10% of the time energy is being
transferred from the inductor to the output capacitor.
Output overvoltage protection is also provided. Should the
output rises about 5% above the regulated value, both the
external MOSFETs will be forced off.
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LTC1700
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APPLICATIONS INFORMATION
The LTC1700 requires two external power MOSFETs, one
for the main switch (N-channel) and one for the synchronous rectifier (P-channel). Since the voltage operating
range of the LTC1700 is limited to less than 6V, the
breakdown voltage of the MOSFETs is not a concern.
Therefore the MOSFETs parameters that should be used
for selecting the power MOSFETs are threshold voltage
VGS(TH), on-resistance RDS(ON), reverse transfer capacitance CRSS and maximum current ID(MAX).
The gate drive voltage is set by the output voltage, VOUT.
Since the LTC1700 exits the start-up mode at 2.3V, sublogic level threshold MOSFETs should be used in LTC1700
applications. Newer MOSFETs with guaranteed RDSON at
gate voltage of 1.8V are now available and will work very
well with the LTC1700.
The MOSFETs on-resistance is chosen based on the
required load current. The maximum average output
current IO(MAX) is :
IO(MAX) = (IPK – 0.5∆I)(1 – DC)
For 25°C operating condition, set ∆VSENSE = 65mV. For
conditions that vary over the full temperature range, set
∆VSENSE = 55mV.
The ρT is a normalized term accounting for the significant
variation in RDS(ON) with temperature, typically about
0.375%/°C as shown in Figure 2. Junction to case temperature TJC is around 10°C in most applications. For a
maximum ambient temperature of 70°C, using ρ80°C ≅ 1.2
in the above equation is a reasonable choice. This equation
is plotted in Figure 3 to illustrate the dependence of
maximum output current on R DS(ON) , assuming
∆I = 0.4IO(MAX).
1.5
ρT NORMALIZED ON RESISTANCE
Power MOSFET Selection
where:
1.4
1.3
1.2
1.1
1.0
0.9
0.8
0.7
0.6
–55 –35 –15
IPK = Peak Inductor Current
∆I = Inductor Ripple Current
5 25 45 65 85 105 125
TEMPERATURE (°C)
1700 F02
Figure 2. RDS(ON) vs Temperature
DC = Duty Cycle
RDS(ON)(MAX) ≅
5.0
4.5
MAXIMUM OUTPUT CURRENT (A)
The peak inductor current is inherently limited in a
current mode controller. The maximum VDS sense voltage of the main MOSFET is limited to 78mV. The LTC1700
will not allow peak inductor current to exceed 78mV/
RDS(ON)(N-CHANNEL). The following equation is a good
guide for determining the required RDS(ON)(MAX), allowing some margin for ripple current, current limit and
variations in the LTC1700 and external component values:
4.0
3.5
DUTY CYCLE = 10%
3.0
2.5
DUTY CYCLE = 50%
2.0
1.5
DUTY CYCLE = 80%
1.0
0.5
0
∆VSENSE
0
 IO(MAX) 1 
+ ∆IL  ρT

 1 – DC 2 
( )
10 20 30 40 50 60 70 80 90 100
RDS(ON) (mΩ)
1700 F03
Figure 3. Maximum Current vs RDS(ON)
Power dissipated by the main and synchronous
MOSFETs depends upon their respective duty cycles and
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LTC1700
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APPLICATIONS INFORMATION
load current. When the LTC1700 is operating in continuous mode, the duty cycles for the MOSFETs are:
Main MOSFET Duty Cycle = 1 – VIN/VOUT
then there is a net positive amount of energy stored in the
output capacitor for every cycle. The output voltage then
rises and once it exceeds 2.3V, the LTC1700 will successfully exit out of its start-up mode.
Synchronous MOSFET Duty Cycle = VIN/VOUT
The MOSFET power dissipations at maximum output
current are:
PMAIN = (1 – VIN/VOUT)(IO(MAX)2)(ρT(MAIN))(RDS(ON))
+ (k)(V0UT2)(IO(MAX))CRSS(f)
PSYNC = (VIN/VOUT)(IO(MAX)2)(ρT(BOT))(RDS(ON))
Both MOSFETs have I2R losses and the PMAIN equation
includes an additional term for transition losses, which are
largest at high output voltages. The constant k = 2.5 can be
used to estimate the amount of transition loss. The synchronous MOSFET losses are greatest at high input voltage and low output voltage.
Start-Up Load Current
In start-up mode, the current limit is set at 60mA and the
oscillator runs at 210kHz with 50% duty cycle at
VIN = 1.8V. Since the current limit is low, the amount of
energy that is stored in the inductor during the on time is
small. Therefore the LTC1700 is incapable of supplying
the full load current. Figure 4 shows the amount of load
current the LTC1700 can provide while successfully exiting out of the start-up mode. If the load current exceeds
the amount shown in Figure 4 during start-up, the output
voltage will not increase but will “hang” at a value below
the regulated voltage. However, if the load current is lower,
START-UP LOAD CURRENT (mA)
A = 15µH
B = 10µH
C = 6.2µH
D = 4.2µH
E = 2.2µH
30
25
Slope Compensation and Peak Inductor Current
D
E
5
0
1.0
1.2
1.4
1.6
1.8
2.0
The LTC1700 will lock on at the leading edge of the external
clock and the minimum pulse width required is
200ns.
B
C
10
The internal oscillator runs at a nominal 530kHz frequency
when the SYNC/MODE pin is either connected to GND or
VIN. When a CMOS compatible clock is applied to the
SYNC/MODE pin, the internal oscillator will lock on to the
external clock. The LTC1700 uses a novel technique to
phase lock to the external clock without the requirement of
an external PLL filter, hence minimizing components. The
capture range is between 400kHz to 750kHz. Do not
synchronize below or above the capture range as this will
cause abnormal operation. During synchronization, Burst
Mode operation is inhibited.
A
20
15
The choice of operating frequency and inductor value is a
trade-off between efficiency and component size. Low
frequency operation improves efficiency by reducing
MOSFET switching losses, both gate charge loss and
transition loss. However, lower frequency operation requires more inductance for a given amount of ripple
current.
Remember just because you can operate at a high switching frequency doesn’t always mean you should. At higher
frequencies the switching loss increases, so the CRSS of
the N-channel MOSFET becomes very critical to keep
efficiencies high.
40
35
Operating Frequency and Synchronization
2.2
2.4
VIN (V)
1700 • G04
Current mode switching regulators that operate with a
duty cycles greater than 50% with continuous inductor
current can exhibit duty cycle instability. While the regulator will not be damaged and may even continue to
function acceptably, a look at its frequency spectrum will
indicate harmonics. These harmonics may interfere with
other sensitive devices and will cause non-optimal performance.
Figure 4. Start-Up Load Current
9
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To eliminate this subharmonic oscillations, a compensating ramp is added internally to the LTC1700 on the
inductor current waveform when the duty cycle exceeds
5%. This scheme, known as slope compensation, makes
the loop perceive that there is more inductor current than
it actually has. As a result, the maximum current capability
of the regulator is reduced. This reduction is proportional
to the duty cycle and is shown in Figure 5. Hence for
applications that operate at high duty cycles, the
N-channel MOSFET chosen should have a lower RDS(ON)
to make up for this reduction (See Design Example).
NORMALIZED PEAK CURRENT REDUCTION
1.2
 DC 
L MIN ≥ VIN(MAX) 

 f∆IL 
With Burst Mode operation enabled on the LTC1700, the
ripple current is normally set such that the inductor
current is continuous during burst periods. Remember
that during bursting, the peak current is clamped at
approximately:
IBURST(PEAK) ≅ 36mV/RDS(ON)
Hence the peak-to-peak ripple selected for optimal burst
mode operation should not exceed IBURST(PEAK). This
implies a minimum inductance of:
1.0
L MINBURST =
0.8
0.6
( )
VIN(MAX) DC
 IOMAX 
(f)(0.66)

 1 – DC 
0.4
0.2
0
0
10
20
40
30
50
DUTY CYCLE (%)
60
70
1700 F05
Figure 5. Maximum Output Current vs Duty Cycle
Inductor Value Selection
Given the input voltage, inductor value and operating
frequency, the ripple current can be calculated:
 DC 
∆IL = VIN  
 fL 
In applications that invoke Burst Mode operation, the
inductor should be chosen so it has low ripple (0.4IOMAX)
current during heavy load and continuous operation during bursting. The criteria for selecting which equation to
use is:
Use LMIN for Duty Cycle > 36%
Use LMINBURST for Duty Cycle ≤ 36%
A smaller value than LMIN could be used in the circuit;
however, the inductor current will not be continuous
during burst periods. The advantage of using a smaller
inductance than LMIN is primarily size. The disadvantage is
higher output ripple.
Inductor Core Selection
Lower ripple current reduces core losses in the inductor,
ESR losses in the output capacitors and output voltage
ripple. Thus, highest efficiency operation is obtained at
low frequency with small ripple current. To achieve this,
however, requires a larger inductor.
A reasonable starting point is to choose a ripple current
that is about 40% of IO(MAX). Note that the largest ripple
current occurs at the highest VIN. To guarantee that ripple
current does not exceed a specified maximum, the inductor should be chosen according to:
10
Once the value for L is known, the type of inductor must be
selected. High efficiency converters generally cannot afford the core loss found in low cost powdered iron cores,
forcing the use of more expensive ferrite, molypermalloy,
or Kool Mµ® cores. Actual core loss is independent of core
size for a fixed inductor value, but it is very dependent on
inductance selected. As inductance increases, core losses
go down. Unfortunately, increased inductance requires
more turns of wire and therefore copper losses will
Kool Mµ is a registered trademark of Magnetics, Inc.
LTC1700
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increase. Ferrite designs have very low core losses and are
preferred at high switching frequencies, so design goals
can concentrate on copper loss and preventing saturation.
Ferrite core material saturates “hard”, which means that
inductance collapses abruptly when the peak design current is exceeded. This results in an abrupt increase in
inductor ripple current and output voltage ripple. Do not
allow the core to saturate!
Molypermalloy (from Magnetics, Inc.) is a very good, low
loss core material for toroids, but it is more expensive than
ferrite. A reasonable compromise from the same manufacturer is Kool Mµ. Toroids are very space efficient,
especially when you can use several layers of wire. Because they generally lack a bobbin, mounting is more
difficult. However, new designs for surface mount are
available which do not increase the height significantly.
COUT Selection
During continuous operation, the output capacitor has a
trapezoidal current profile. The RMS current into the
capacitor is then given by:


V
ICOUT (RMS) ≅  IOUT OUT – 1
VIN


The RMS current is greatest at IOUT(MAX) and minimum
input working voltage. Therefore the output capacitor
should be chosen with a rating at least ICOUT(RMS). Several
capacitors can also be paralleled to meet this requirement.
Besides RMS current rating, the selection of COUT is also
driven by the required effective series resistance (ESR).
The ESR of the capacitor together with its capacitance
determines the output ripple voltage and can be expressed
as:
( )
∆VOUT ≈ IPK ESR +
2IOUT
C OUT
tON
where COUT = output capacitance, tON = on time of main
MOSFET and IPK = peak inductor current. A common
technique to lower the total ESR at the output is to parallel
the output capacitor with a 10µF ceramic capacitor.
The choice of using a smaller output capacitance increases the output ripple voltage due to the frequency
dependent term but can be compensated for by using
capacitors of very low ESR to maintain low ripple voltage.
The ITH pin OPTI-LOOP compensation components can be
optimized to provide stable, high performance transient
response regardless of the output capacitors selected.
Manufacturers such as Nichicon, United Chemicon and
Sanyo should be considered for high performance throughhole capacitors. The OS-CON semiconductor dielectric
capacitor available from Sanyo has the lowest ESR (size)
product of any aluminum electrolytic at a somewhat
higher price.
Multiple capacitors may have to be paralleled to meet the
ESR or RMS current handling requirements of the application. Aluminum electrolytic and dry tantalum capacitors
are both available in surface mount configurations. In the
case of tantalum, it is critical that the capacitors are surge
tested for use in switching power supplies. An excellent
choice is the AVX TPS series of surface mount tantalum,
available in case heights ranging from 2mm to 4mm. Other
capacitor types include Sanyo OS-CON, Nichicon PL series and Sprague 593D and 595D series. Consult the
manufacturer for other specific recommendations.
Setting Output Voltage
The LTC1700 develops a 1.205V reference voltage between the feedback (Pin 3) terminal and ground (see
Figure 6). By selecting resistor R1, a constant current is
caused to flow through R1 and R2 to set the overall output
voltage. The regulated output voltage is determined by:
VOUT = 1.205(1 + R2/R1)
For most applications, a 30k resistor is suggested for R1.
To prevent stray pickup, a 100pF capacitor is suggested
across R1 located close to LTC1700.
VOUT
LTC1700
R2
VFB
R1
1700 • F06
Figure 6. Setting Output Voltage
11
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Efficiency Considerations
The efficiency of a switching regulator is equal to the
output power divided by the input power (× 100%).
Percent efficiency can be expressed as:
% Efficiency = 100%–(L1 + L2 + L3 + ...)
where L1, L2, etc. are the individual losses as a percentage
of input power. It is often useful to analyze individual
losses to determine what is limiting the efficiency and
which change would produce the most improvement.
Although all dissipative elements in the circuit produce
losses, four main sources usually account for most of the
losses in LTC1700 circuits:
1. LTC1700 supply current. This DC supply current, given
in the electrical characteristics, excludes MOSFET drivers
and control current. This supply current results in a small
loss which increases with VOUT.
2. MOSFETs gate charge current results from switching
the gate capacitance of the power MOSFETs. Each time a
MOSFET gate is switched on and then off, a packet of gate
charge Qg moves from VOUT to ground. The resulting
current out from VOUT is typically much larger than the
control circuit current. In continuous mode, IGATECHG =
f(Qg(TOP) + Qg(BOT)). At high switching frequencies, this
loss becomes increasing important.
3. DC I2R Losses. Since there is no sense resistor needed,
DC I2R losses arise only from the resistances of the
MOSFETs and inductor. In continuous mode, the average
current flows through the inductor but is “chopped”
between the synchronous P-channel MOSFET and the
main N-channel MOSFET. If the two MOSFETs have approximately the same RDS(ON), then the resistance of one
MOSFET can simply be summed with the resistance of the
inductor to obtain the DC I2R loss. For example, if each
RDS(ON) = 0.05Ω and RL = 0.15Ω, then the total resistance
is 0.2Ω. This results in losses ranging from 2% to 8% as
the output current increases from 0.5A to 2A for a 5V
output. I2R losses cause the efficiency to drop at high
output currents.
12
4. Transition losses apply to the main external MOSFET
and increase at higher operating frequencies and output
voltages. Transition losses can be estimated from:
Transition Loss = 2.5(VOUT)2IO(MAX)CRSS(f)
Other losses including CIN and COUT ESR dissipative
losses, and inductor core losses, generally account for
less than 2% total loss.
Run/Soft Start Function
The RUN/SS pin is a dual purpose pin that provides the
soft-start function and a means to shut down the LTC1700.
Soft-start reduces input surge current from VIN by gradually increasing the internal current limit. Power supply
sequencing can also be accomplished using this pin.
An internal 3.8µA current source charges up an external
capacitor CSS. When the voltage on the RUN/SS pin
reaches 0.7V, the LTC1700 begins operating. As the
voltage on RUN/SS continues to ramp from 0.7V to 1V, the
internal current limit is also ramped at a proportional linear
rate. The current limit begins near 0A (at VRUN/SS = 0.7V)
and ends at 0.078/RDS(ON) (VRUN/SS ≈ 2.2V). The output
current thus ramps up slowly, reducing the starting surge
current required from the input power supply. If the RUN/
SS has been pulled all the way to ground, there will be a
delay before the current limit starts increasing and is given
by:
tDELAY = 1.13CSS/ICHG
For input voltages less than 2.3V during the start-up
duration, the soft-start function has no effect on the
internal 60mA current limit. Therefore to fully take advantage of this feature, the soft-start capacitor has to be sized
accordingly to account for the time it takes VOUT to reach
2.3V. An approximate mathematical representation for the
time it takes VOUT to reach 2.3V upon powering up is given
by:
tPOWER−UP =
C OUT (2.3 – VIN – VD )
260(L)
– IOUT
2.3 – VIN
LTC1700
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where:
VD = Voltage drop of P-channel parasitic diode
IOUT = Initial load current during start-up
COUT = Output capacitance
RDS(ON) = (13.2)(0.9)
= 11.9mΩ
Hence you would select the start-up capacitor, CSS, to
ensure tDELAY > tPOWERUP. Remember that the above
equation is only valid for VIN < 2.3V. If VIN is greater than
2.3V, then tPOWERUP = 0ns.
Design Example
Assume the LTC1700 is used to convert a 3.3V input to 5V
output. Load current requirement is a maximum 3A and a
minimum of 100mA. Efficiency at both low and high load
currents is important. Ambient temperature = 25°C.
Since low load current efficiency is important, Burst Mode
operation is enabled by connecting pin 5 to VOUT.
Duty Cycle = 1 – VIN/VOUT = 0.34
Since the duty cycle is less than 36%, the value of the
inductor is chosen based on the LMINBURST equation.
LMINBURST = 0.8µH.
In the application, (Figure 7) a 4.6µH inductor is used to
further reduce ripple current. The actual ripple current is
now:


0.34
∆IL = 3.3V
 = 0.46A
 530kHz(4.6µH)
For the main N-channel MOSFET, the RDS(ON) should be:
RDS(ON)(N−CHANNEL) =
Accounting for the peak current reduction due to slope
compensation (see Figure 5), the RDS(ON) of the N-channel
should be:
63mV
IO(MAX)
1– D
+ 0.5(∆IL )
= 13.2mΩ
The factor, 0.9, is obtained from Figure 5 using a duty cycle
of 34%. The peak current of the inductor is 5A. Select an
inductor that does not saturate at this current level. The
average current through the N-channel MOSFET is 1.62A
while the average current through the synchronous Pchannel MOSFET is 3A.
The FDS6670A and FDS6375 are chosen for the
N-channel and P-channel MOSFET respectively. We can
now calculate the temperature rise in the FDS6670A. RMS
current flowing through the FDS6670A is 2.78A. Hence
power dissipated is:
PDISS = (2.78)2 (8 × 10–3)
= 61.82mW
The θJA of the FDS6670A is 50°C/W. Therefore temperature rise is:
TRISE = 61.82mW × 50
= 3.1°C
This is an insignificant temperature rise and therefore the
omission of the ρT in calculating the required RDS(ON)
does not generate a large error.
At 3A load, the RMS current into the output capacitor is
given by:
ICOUT(RMS) = 3(5/3.3 – 1)0.5 = 2.15A
To meet the RMS current requirement, two SANYO POSCAP
100µF capacitors are paralleled. These capacitors have
low ESR (55mΩ) and to futher reduce the overall ESR, a
10µF ceramic capacitor is placed in parallel with the
POSCAP capacitor. Figure 7 shows the complete circuit.
13
LTC1700
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L1
4.6µH
1
220pF
2.2k
2
270pF
SGND
ITH
8
BG
+
C2
68µF
6.3V
M2
FDS6375
10
SW
C1
10µF
C3
22µF
M1
FDS6670A
VOUT
5V/3A
C4
150µF
6.3V
×2
+
LTC1700
470pF
4
30k
3
5
95k
RUN/SS
9
PGND
VFB
6
TG
7
SYNC/MODE VOUT
C1: TAIYO YUDEN CERAMIC JMK316BJ106ML
C2: AVX TAJB68K006R
C3: TAIYO YUDEN CERAMIC JMK325BJ226M
VIN
3.3V
C4: SANYO POSCAP 6TPA150M
L1: SUMIDA CEP1234R6
1700 • F07
Figure 7. Design Example Schematic
PC Board Layout Checklist
3. Connect the (+) plate of C2 to the source of the P-channel
MOSFET. This capacitor supports the load current when
the inductor is being “recharged”.
When laying out the printed circuit board, the following
checklist should be used to ensure proper operation of the
LTC1700. These items are illustrated graphically in the
layout diagram in Figure 8. Check the following in your
layout:
4. Connect the (–) plate of C2 to the source of the N-channel
MOSFET. Connect the power and signal ground to this
node.
1. Are all the components connected close to the SW node
(Pin 10)? The SW pin is the input to the VDS sense
amplifier and the current reverse comparator.
5. Does the VFB pin connects directly to the feedback
resistors? The resistive divider R1 and R2 must be connected between the (+) plate of C2 and signal ground.
2. Connect the VOUT lead directly to the source of the
P-channel MOSFET. Besides supplying current to the
LTC1700, it also serves as the other input to the current
reverse comparator.
6. Keep the switching node SW away from sensitive small
signal nodes.
7. Switched currents flow in M1, M2 and C2, keep the loop
formed by these components as small as possible.
VIN
L1
C1
1
C3
R3
2
SGND
ITH
SW
PGND
M2
10
VOUT
9
+
LTC1700
R1
3
C4
4
R2
5
VFB
RUN/SS
SYNC/MODE
C2
BG
VOUT
TG
8
M1
7
6
1700 • F08
Figure 8. LTC1700 Layout Diagram (See PC Board Layout Checklist)
14
LTC1700
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TYPICAL APPLICATIO
LTC1700 3.3V/1A Regulator with External Frequency Synchronization
L1
1.5µH
1
100pF
SGND
10
2
470pF
4
30k
3
5
53.6k
ITH
C4
22µF
BG
RUN/SS
PGND
VFB
TG
SYNC/MODE VOUT
8
+
C1
68µF
6.3V
+
C3
220µF
6.3V
M1
LTC1700
180pF
2.2k
SW
C2
10µF
VIN
2V TO 2.4V
3.3V/1A
M1
9
6
7
650kHz
1700 • TA01
C1: AVX TAJB686K006R
C2: TAIYO YUDEN CERAMIC JMK316BJ106ML
C3: AVX TPSD227M006R0100
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PACKAGE DESCRIPTIO
C4: TAIYO YUDEN CERAMIC JMK325BJ226MM
L1: MURATA LQN6C
M1: SILICONIX Si6562DQ
Dimensions in inches (millimeters) unless otherwise noted.
MS10 Package
10-Lead Plastic MSOP
(LTC DWG # 05-08-1661)
0.034
(0.86)
REF
0.043
(1.10)
MAX
0.007
(0.18)
0.118 ± 0.004*
(3.00 ± 0.102)
10 9 8 7 6
0° – 6° TYP
0.021 ± 0.006
(0.53 ± 0.015)
SEATING
PLANE 0.007 – 0.011
(0.17 – 0.27)
0.0197
(0.50)
BSC
0.005 ± 0.002
(0.13 ± 0.05)
0.118 ± 0.004**
(3.00 ± 0.102)
0.193 ± 0.006
(4.90 ± 0.15)
* DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH,
PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.006" (0.152mm) PER SIDE
** DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.006" (0.152mm) PER SIDE
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
1 2 3 4 5
MSOP (MS10) 1100
15
LTC1700
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LTC1700 2.5V VIN 3.3V/1.8A Output Regulator
L1
2.2µH
1
300pF
SGND
2
470pF
4
30k
3
5
53.6k
ITH
C3
22µF
RUN/SS
BG
PGND
VFB
TG
SYNC/MODE VOUT
C1: TAIYO YUDEN CERAMIC JMK316BJ106ML
C2: AVX TAJB68K006R
C3: TAIYO YUDEN CERAMIC JMK325BJ226M
C4: KEMET T520D227M006AS
8
+
M2
10
LTC1700
470pF
33k
SW
C1
10µF
+
C2
68µF
6.3V
VIN
2.5V
VOUT
3.3V/1.8A
C4
220µF
6.3V
M1
9
6
7
L1: MURATA LQN6C
M1: Si9802
M2: Si9803
1700 • TA02
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16
Linear Technology Corporation
1700f LT/TP 0801 2K • PRINTED IN USA
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