Order this document by MPX700/D SEMICONDUCTOR TECHNICAL DATA The MPX700 series device is a silicon piezoresistive pressure sensor providing a very accurate and linear voltage output — directly proportional to the applied pressure. This standard, low cost, uncompensated sensor permits manufacturers to design and add their own external temperature compensating and signal conditioning networks. Compensation techniques are simplified because of the predictability of Motorola’s single element strain gauge design. 0 to 700 kPa (0 – 100 psi) 60 mV FULL SCALE SPAN (TYPICAL) Features • Low Cost • Patented, Silicon Shear Stress Strain Gauge Design • Linearity to ± 0.5% (Max) Linearity • Easy to Use Chip Carrier Package Options • Ratiometric to Supply Voltage • 60 mV Span (Typ) • Absolute, Differential and Gauge Options BASIC CHIP CARRIER ELEMENT CASE 344–15, STYLE 1 Application Examples • Environmental Control Systems • Pneumatic Control Systems • Appliances • Automotive Performance Controls • Medical Instrumentation • Industrial Controls DIFFERENTIAL PORT OPTION CASE 344C–01, STYLE 1 Figure 1 illustrates a schematic of the internal circuitry on the stand–alone pressure sensor chip. PIN 3 + VS NOTE: Pin 1 is the notched pin. PIN 2 + Vout X–ducer PIN 4 – Vout PIN NUMBER 1 Gnd 3 VS 2 +Vout 4 –Vout PIN 1 Figure 1. Uncompensated Pressure Sensor Schematic VOLTAGE OUTPUT versus APPLIED DIFFERENTIAL PRESSURE The differential voltage output of the X–ducer is directly proportional to the differential pressure applied. The absolute sensor has a built–in reference vacuum. The output voltage will decrease as vacuum, relative to ambient, is drawn on the pressure (P1) side. The output voltage of the differential or gauge sensor increases with increasing pressure applied to the pressure (P1) side relative to the vacuum (P2) side. Similarly, output voltage increases as increasing vacuum is applied to the vacuum (P2) side relative to the pressure (P1) side. This sensor is designed for applications where P1 is always greater than, or equal to P2. Senseon and X–ducer are trademarks of Motorola, Inc. REV 5 Motorola Sensor Device Data Motorola, Inc. 1997 1 MAXIMUM RATINGS Rating Overpressure(8) (P2 v 1 Atmosphere) v 1 Atmosphere) Symbol Value Unit P1max 2800 kPa Burst Pressure(8) (P2 P1burst 5000 kPa Storage Temperature Tstg – 40 to +125 °C TA – 40 to +125 °C Operating Temperature OPERATING CHARACTERISTICS (VS = 3.0 Vdc, TA = 25°C unless otherwise noted. P1 Characteristic w P2; P2 v 1 Atmosphere.) Symbol Min Typ Max Unit Pressure Range(1) POP 0 — 700 kPa Supply Voltage(2) VS — 3.0 6.0 Vdc Supply Current Io — 6.0 — mAdc VFSS 45 60 90 mV Full Scale Span(3) Offset(4) Voff 0 20 35 mV ∆V/∆P — 86 — µV/kPa — – 0.5 – 1.0 — — 0.5 1.0 %VFSS Pressure Hysteresis(5) (0 to 700 kPa) — — ± 0.1 — %VFSS Temperature Hysteresis(5) (– 40°C to +125°C) — — ± 0.5 — %VFSS Temperature Coefficient of Full Scale Span(5) TCVFSS – 0.21 — – 0.15 %VFSS/°C TCVoff — ±15 — µV/°C TCR 0.34 — 0.4 %Zin/°C Sensitivity Linearity(5) MPX700D MPX700A Temperature Coefficient of Offset(5) Temperature Coefficient of Resistance(5) Zin 400 — 550 Ω Zout 750 — 1800 Ω Response Time(6) (10% to 90%) tR — 1.0 — ms Warm–Up (7) — — 20 — ms Symbol Min Typ Max Unit — — 2.0 — Grams Input Impedance Output Impedance MECHANICAL CHARACTERISTICS Characteristic Weight (Basic Element, Case 344–15) NOTES: 1. 1.0 kPa (kiloPascal) equals 0.145 psi. 2. Device is ratiometric within this specified excitation range. Operating the device above the specified excitation range may induce additional error due to device self–heating. 3. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. 4. Offset (Voff) is defined as the output voltage at the minimum rated pressure. 5. Accuracy (error budget) consists of the following: • Linearity: Output deviation from a straight line relationship with pressure, using end point method, over the specified pressure range. • Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied. • Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from the minimum or maximum rated pressure, at 25°C. • TcSpan: Output deviation at full rated pressure over the temperature range of 0 to 85°C, relative to 25°C. • TcOffset: Output deviation with minimum rated pressure applied, over the temperature range of 0 to 85°C, relative to 25°C. • TCR: Zin deviation with minimum rated pressure applied, over the temperature range of – 40°C to +125°C, relative to 25°C. 6. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 7. Warm–up is defined as the time required for the device to meet the specified output voltage after the pressure has been stabilized. 8. Basic Element only, Case 344–15. 9. P2 max : 500 kPa. 2 Motorola Sensor Device Data TEMPERATURE COMPENSATION Figure 2 shows the typical output characteristics of the MPX700 series over temperature. The X–ducer piezoresistive pressure sensor element is a semiconductor device which gives an electrical output signal proportional to the pressure applied to the device. This device uses a unique transverse voltage diffused semiconductor strain gauge which is sensitive to stresses produced in a thin silicon diaphragm by the applied pressure. Because this strain gauge is an integral part of the silicon diaphragm, there are no temperature effects due to differences in the thermal expansion of the strain gauge and the diaphragm, as are often encountered in bonded strain gauge pressure sensors. However, the properties of the strain gauge itself are temperature dependent, requiring that the device be temperature compensated if it is to be used over an extensive temperature range. Temperature compensation and offset calibration can be achieved rather simply with additional resistive components or by designing your system using the MPX2700 series sensors. Several approaches to external temperature compensation over both – 40 to +125°C and 0 to + 80°C ranges are presented in Motorola Applications Note AN840. LINEARITY Linearity refers to how well a transducer’s output follows the equation: Vout = Voff + sensitivity x P over the operating pressure range (Figure 3). There are two basic methods for calculating nonlinearity: (1) end point straight line fit or (2) a least squares best line fit. While a least squares fit gives the “best case” linearity error (lower numerical value), the calculations required are burdensome. Conversely, an end point fit will give the “worst case” error (often more desirable in error budget calculations) and the calculations are more straightforward for the user. Motorola’s specified pressure sensor linearities are based on the end point straight line method measured at the midrange pressure. 70 80 – 40°C MPX700 VS = 3 Vdc P1 > P2 60 LINEARITY + 125°C 50 + 25°C SPAN RANGE (TYP) 40 30 20 50 OUTPUT (mVdc) OUTPUT (mVdc) 70 ACTUAL 40 SPAN (VFSS) 30 THEORETICAL 20 OFFSET (TYP) 10 0 PSI 0 20 140 kPa 40 60 280 420 PRESSURE DIFFERENTIAL 80 100 560 700 Figure 2. Output versus Pressure Differential SILICONE GEL DIE COAT DIFFERENTIAL/GAUGE STAINLESS STEEL DIE METAL COVER P1 EPOXY CASE ÉÉÉÉÉÉÉÉÉÉÉ ÉÉÉÉÉÉÉÉÉÉÉ ÉÉÉÉÉÉÉÉÉÉÉ ÉÉÉÉÉÉÉÉÉÉÉ ÉÉÉÉÉÉÉÉÉÉÉ WIRE BOND LEAD FRAME DIFFERENTIAL/GAUGE ELEMENT P2 DIE BOND 10 OFFSET (VOFF) 0 0 MAX POP PRESSURE (kPA) Figure 3. Linearity Specification Comparison SILICONE GEL ABSOLUTE DIE COAT DIE P1 ÉÉÉÉÉÉÉÉÉÉÉ ÉÉÉÉÉÉÉÉÉÉÉ ÉÉÉÉÉÉÉÉÉÉÉ ÉÉÉÉÉÉÉÉÉÉÉ ÉÉÉÉÉÉÉÉÉÉÉ WIRE BOND LEAD FRAME ABSOLUTE ELEMENT P2 STAINLESS STEEL METAL COVER EPOXY CASE DIE BOND Figure 4. Cross–Sectional Diagrams (not to scale) Figure 4 illustrates the differential or gauge configuration in the basic chip carrier (Case 344–15). A silicone gel isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the silicon diaphragm. The MPX700 series pressure sensor operating character- Motorola Sensor Device Data istics and internal reliability and qualification tests are based on use of dry air as the pressure media. Media other than dry air may have adverse effects on sensor performance and long term reliability. Contact the factory for information regarding media compatibility in your application. 3 PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE Motorola designates the two sides of the pressure sensor as the Pressure (P1) side and the Vacuum (P2) side. The Pressure (P1) side is the side containing silicone gel which isolates the die from the environment. The differential or gauge sensor is designed to operate with positive differential Part Number pressure applied, P1 > P2. The absolute sensor is designed for vacuum applied to P1 side. The Pressure (P1) side may be identified by using the table on the below: Case Type Pressure (P1) Side Identifier MPX700A, MPX700D 344–15C Stainless Steel Cap MPX700DP 344C–01 Side with Part Marking MPX700AP, MPX700GP 344B–01 Side with Port Attached MPX700GVP 344D–01 Stainless Steel Cap MPX700AS, MPX700GS 344E–01 Side with Port Attached MPX700ASX, MPX700GSX 344F–01 Side with Port Attached MPX700GVSX 344G–01 Stainless Steel Cap ORDERING INFORMATION MPX700 series pressure sensors are available in differential and gauge configurations. Devices are available in the basic element package or with pressure port fittings which provide printed circuit board mounting ease and barbed hose pressure connections. MPX Series D i T Device Type O i Options C Case Type T Order Number Device Marking Basic Element Absolute, Differential Case 344–15 MPX700A MPX700D MPX700A MPX700D Ported Elements Differential Case 344C–01 MPX700DP MPX700DP Absolute, Gauge Case 344B–01 MPX700AP MPX700GP MPX700AP MPX700GP Gauge Vacuum Case 344D–01 MPX700GVP MPX700GVP Absolute, Gauge Stove Pipe Case 344E–01 MPX700AS MPX700GS MPX700A MPX700D Absolute, Gauge Axial Case 344F–01 MPX700ASX MPX700GSX MPX700A MPX700D Gauge Vacuum Axial Case 344G–01 MPX700GVSX MPX700D 4 Motorola Sensor Device Data PACKAGE DIMENSIONS NOTES: C 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION –A– IS INCLUSIVE OF THE MOLD STOP RING. MOLD STOP RING NOT TO EXCEED 16.00 (0.630). POSITIVE PRESSURE (P1) R M B –A– DIM A B C D F G J L M N R N 1 PIN 1 2 3 L 4 –T– SEATING PLANE J POSITIVE PRESSURE (P1) G F D 4 PL 0.136 (0.005) T A M M INCHES MIN MAX 0.595 0.630 0.514 0.534 0.200 0.220 0.016 0.020 0.048 0.064 0.100 BSC 0.014 0.016 0.695 0.725 30_ NOM 0.475 0.495 0.430 0.450 STYLE 1: PIN 1. 2. 3. 4. MILLIMETERS MIN MAX 15.11 16.00 13.06 13.56 5.08 5.59 0.41 0.51 1.22 1.63 2.54 BSC 0.36 0.40 17.65 18.42 30_ NOM 12.07 12.57 10.92 11.43 GROUND + OUTPUT + SUPPLY – OUTPUT CASE 344–15 ISSUE W SEATING PLANE NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5, 1982. 2. CONTROLLING DIMENSION: INCH. –A– –T– U L R H N PORT #1 POSITIVE PRESSURE (P1) –Q– B 1 2 3 4 PIN 1 K –P– 0.25 (0.010) J M T Q S S F C G D 4 PL 0.13 (0.005) M T S S Q S DIM A B C D F G H J K L N P Q R S U INCHES MIN MAX 1.145 1.175 0.685 0.715 0.305 0.325 0.016 0.020 0.048 0.064 0.100 BSC 0.182 0.194 0.014 0.016 0.695 0.725 0.290 0.300 0.420 0.440 0.153 0.159 0.153 0.159 0.230 0.250 0.220 0.240 0.910 BSC STYLE 1: PIN 1. 2. 3. 4. MILLIMETERS MIN MAX 29.08 29.85 17.40 18.16 7.75 8.26 0.41 0.51 1.22 1.63 2.54 BSC 4.62 4.93 0.36 0.41 17.65 18.42 7.37 7.62 10.67 11.18 3.89 4.04 3.89 4.04 5.84 6.35 5.59 6.10 23.11 BSC GROUND + OUTPUT + SUPPLY – OUTPUT CASE 344B–01 ISSUE B Motorola Sensor Device Data 5 PACKAGE DIMENSIONS — CONTINUED PORT #1 R NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. –A– U V W L H PORT #2 PORT #1 POSITIVE PRESSURE (P1) PORT #2 VACUUM (P2) N –Q– B SEATING PLANE SEATING PLANE 1 2 3 4 PIN 1 K –P– –T– –T– 0.25 (0.010) T Q M S S F J G D 4 PL C 0.13 (0.005) M T S S Q S DIM A B C D F G H J K L N P Q R S U V W INCHES MIN MAX 1.145 1.175 0.685 0.715 0.405 0.435 0.016 0.020 0.048 0.064 0.100 BSC 0.182 0.194 0.014 0.016 0.695 0.725 0.290 0.300 0.420 0.440 0.153 0.159 0.153 0.159 0.063 0.083 0.220 0.240 0.910 BSC 0.248 0.278 0.310 0.330 STYLE 1: PIN 1. 2. 3. 4. MILLIMETERS MIN MAX 29.08 29.85 17.40 18.16 10.29 11.05 0.41 0.51 1.22 1.63 2.54 BSC 4.62 4.93 0.36 0.41 17.65 18.42 7.37 7.62 10.67 11.18 3.89 4.04 3.89 4.04 1.60 2.11 5.59 6.10 23.11 BSC 6.30 7.06 7.87 8.38 GROUND + OUTPUT + SUPPLY – OUTPUT CASE 344C–01 ISSUE B NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5, 1982. 2. CONTROLLING DIMENSION: INCH. –A– U L SEATING PLANE –T– R DIM A B C D F G H J K L N P Q R S U H PORT #2 VACUUM (P2) POSITIVE PRESSURE (P1) N –Q– B 1 2 3 4 K PIN 1 S C J F –P– 0.25 (0.010) M T Q S G D 4 PL 0.13 (0.005) M T S S Q S INCHES MIN MAX 1.145 1.175 0.685 0.715 0.305 0.325 0.016 0.020 0.048 0.064 0.100 BSC 0.182 0.194 0.014 0.016 0.695 0.725 0.290 0.300 0.420 0.440 0.153 0.159 0.153 0.158 0.230 0.250 0.220 0.240 0.910 BSC STYLE 1: PIN 1. 2. 3. 4. MILLIMETERS MIN MAX 29.08 29.85 17.40 18.16 7.75 8.26 0.41 0.51 1.22 1.63 2.54 BSC 4.62 4.93 0.36 0.41 17.65 18.42 7.37 7.62 10.67 11.18 3.89 4.04 3.89 4.04 5.84 6.35 5.59 6.10 23.11 BSC GROUND + OUTPUT + SUPPLY – OUTPUT CASE 344D–01 ISSUE B 6 Motorola Sensor Device Data PACKAGE DIMENSIONS — CONTINUED PORT #1 POSITIVE PRESSURE (P1) –B– C NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. A BACK SIDE VACUUM (P2) DIM A B C D F G J K N R S V V 4 3 2 1 PIN 1 K J N MILLIMETERS MIN MAX 17.53 18.28 6.22 6.48 19.81 20.82 0.41 0.51 1.22 1.63 2.54 BSC 0.36 0.41 8.76 9.53 7.62 7.87 4.52 4.72 5.59 6.10 4.62 4.93 G STYLE 1: PIN 1. 2. 3. 4. F R SEATING PLANE S INCHES MIN MAX 0.690 0.720 0.245 0.255 0.780 0.820 0.016 0.020 0.048 0.064 0.100 BSC 0.014 0.016 0.345 0.375 0.300 0.310 0.178 0.186 0.220 0.240 0.182 0.194 D 4 PL 0.13 (0.005) –T– M T B M GROUND + OUTPUT + SUPPLY – OUTPUT CASE 344E–01 ISSUE B –T– C A E –Q– U N V B R PORT #1 POSITIVE PRESSURE (P1) PIN 1 –P– 0.25 (0.010) M T Q M 4 3 2 1 S K J F NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. DIM A B C D E F G J K N P Q R S U V INCHES MIN MAX 1.080 1.120 0.740 0.760 0.630 0.650 0.016 0.020 0.160 0.180 0.048 0.064 0.100 BSC 0.014 0.016 0.220 0.240 0.070 0.080 0.150 0.160 0.150 0.160 0.440 0.460 0.695 0.725 0.840 0.860 0.182 0.194 MILLIMETERS MIN MAX 27.43 28.45 18.80 19.30 16.00 16.51 0.41 0.51 4.06 4.57 1.22 1.63 2.54 BSC 0.36 0.41 5.59 6.10 1.78 2.03 3.81 4.06 3.81 4.06 11.18 11.68 17.65 18.42 21.34 21.84 4.62 4.92 G D 4 PL 0.13 (0.005) M T P S Q S STYLE 1: PIN 1. 2. 3. 4. GROUND V (+) OUT V SUPPLY V (–) OUT CASE 344F–01 ISSUE B Motorola Sensor Device Data 7 PACKAGE DIMENSIONS — CONTINUED –T– C A E –Q– U POSITIVE PRESSURE (P1) N V B R PIN 1 PORT #2 VACUUM (P2) –P– 0.25 (0.010) M T Q M 1 2 3 4 S K F J G D 4 PL 0.13 (0.005) M T P S Q S NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. DIM A B C D E F G J K N P Q R S U V INCHES MIN MAX 1.080 1.120 0.740 0.760 0.630 0.650 0.016 0.020 0.160 0.180 0.048 0.064 0.100 BSC 0.014 0.016 0.220 0.240 0.070 0.080 0.150 0.160 0.150 0.160 0.440 0.460 0.695 0.725 0.840 0.860 0.182 0.194 STYLE 1: PIN 1. 2. 3. 4. MILLIMETERS MIN MAX 27.43 28.45 18.80 19.30 16.00 16.51 0.41 0.51 4.06 4.57 1.22 1.63 2.54 BSC 0.36 0.41 5.59 6.10 1.78 2.03 3.81 4.06 3.81 4.06 11.18 11.68 17.65 18.42 21.34 21.84 4.62 4.92 GROUND V (+) OUT V SUPPLY V (–) OUT CASE 344G–01 ISSUE B Motorola reserves the right to make changes without further notice to any products herein. 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