Order this document by MPXL10/D SEMICONDUCTOR TECHNICAL DATA The MPXL10 series device is a silicon piezoresistive pressure sensor providing a very accurate and linear voltage output — directly proportional to the applied pressure. This standard, low cost, uncompensated sensor permits manufacturers to design and add their own external temperature compensating and signal conditioning networks. Compensation techniques are simplified because of the predictability of Motorola’s single element strain gauge design. 0 to 10 kPa (0 – 1.45 psi) 35 mV FULL SCALE SPAN (TYPICAL) Features • Low Profile Package • Low Cost • Patented Silicon Shear Stress Strain Gauge Design • Ratiometric to Supply Voltage • Easy to Use Chip Carrier Package Options • Differential and Gauge Options • Available in Unibody Package (see MPX10 Series Data Sheet) Application Examples • Air Movement Control • Environmental Control Systems • Level Indicators • Leak Detection • Medical Instrumentation • Industrial Controls • Pneumatic Control Systems • Robotics PIN NUMBER Figure 1 shows a schematic of the internal circuitry on the stand–alone pressure sensor chip. PIN 3 CASE 472B–01, STYLE 2 1 Gnd 5 N/C 2 +Vout VS 6 N/C 3 7 N/C 4 –Vout 8 N/C NOTE: Pins 5, 6, 7, and 8 are not device connections. Do not connect to external circuitry or ground. Pin 1 is noted by the notch in the Lead. + VS PIN 2 + Vout X–ducer PIN 4 – Vout PIN 1 Figure 1. Uncompensated Pressure Sensor Schematic VOLTAGE OUTPUT versus APPLIED DIFFERENTIAL PRESSURE The differential voltage output of the X–ducer is directly proportional to the differential pressure applied. The output voltage of the differential or gauge sensor increases with increasing pressure applied to the pressure side (P1) relative to the vacuum side (P2). Similarly, output voltage increases as increasing vacuum is applied to the vacuum side (P2) relative to the pressure side (P1). Senseon and X–ducer are trademarks of Motorola, Inc. Motorola Sensor Device Data Motorola, Inc. 1997 1 MAXIMUM RATINGS Rating Overpressure(8) (P1 > P2) Burst Pressure(8) (P1 > P2) Storage Temperature Operating Temperature Symbol Value Unit Pmax Pburst Tstg 75 kPa 100 kPa – 40 to +125 °C TA – 40 to +125 °C OPERATING CHARACTERISTICS (VS = 3.0 Vdc, TA = 25°C unless otherwise noted, P1 > P2) Characteristic Symbol Min Typ Max Unit POP VS 0 — 10 kPa — 3.0 6.0 Vdc Io — 6.0 — mAdc Full Scale Span(3) Offset(4) VFSS Voff 20 35 50 mV 0 20 35 mV Sensitivity Linearity(5) ∆V/∆P — 3.5 — mV/kPa — –1.0 — 1.0 Pressure Hysteresis(5) (0 to 10 kPa) Temperature Hysteresis(5) (– 40°C to +125°C) — — ± 0.1 — %VFSS %VFSS — — ± 0.5 — Temperature Coefficient of Full Scale Span(5) Temperature Coefficient of Offset(5) TCVFSS TCVoff – 0.22 — – 0.16 %VFSS %VFSS/°C — ±15 — µV/°C Temperature Coefficient of Resistance(5) TCR 0.21 — 0.27 Input Impedance Zin Zout 400 — 550 %Zin/°C Ω 750 — 1250 Ω — 1.0 — ms Warm–Up tR — — 20 — ms Offset Stability(9) — — ± 0.5 — %VFSS Symbol Min Typ Max Unit — — — 690 kPa Differential Pressure Range(1) Supply Voltage(2) Supply Current Output Impedance Response Time(6) (10% to 90%) MECHANICAL CHARACTERISTICS Characteristic Common Mode Line Pressure(7) NOTES: 1. 1.0 kPa (kiloPascal) equals 0.145 psi. 2. Device is ratiometric within this specified excitation range. Operating the device above the specified excitation range may induce additional error due to device self–heating. 3. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. 4. Offset (Voff) is defined as the output voltage at the minimum rated pressure. 5. Accuracy (error budget) consists of the following: • Linearity: Output deviation from a straight line relationship with pressure, using end point method, over the specified pressure range. • Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied. • Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from the minimum or maximum rated pressure, at 25°C. • TcSpan: Output deviation at full rated pressure over the temperature range of 0 to 85°C, relative to 25°C. • TcOffset: Output deviation with minimum rated pressure applied, over the temperature range of 0 to 85°C, relative to 25°C. • TCR: Zin deviation with minimum rated pressure applied, over the temperature range of – 40°C to +125°C, relative to 25°C. 6. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 7. Common mode pressures beyond specified may result in leakage at the case–to–lead interface. 8. Exposure beyond these limits may cause permanent damage or degradation to the device. 9. Offset stability is the product’s output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test. 2 Motorola Sensor Device Data TEMPERATURE COMPENSATION Figure 2 shows the typical output characteristics of the MPXL10 series over temperature. The X–ducer piezoresistive pressure sensor element is a semiconductor device which gives an electrical output signal proportional to the pressure applied to the device. This device uses a unique transverse voltage diffused semiconductor strain gauge which is sensitive to stresses produced in a thin silicon diaphragm by the applied pressure. Because this strain gauge is an integral part of the silicon diaphragm, there are no temperature effects due to differences in the thermal expansion of the strain gauge and the diaphragm, as are often encountered in bonded strain gauge pressure sensors. However, the properties of the strain gauge itself are temperature dependent, requiring that the device be temperature compensated if it is to be used over an extensive temperature range. Temperature compensation and offset calibration can be achieved rather simply with additional resistive components, or by designing your system using the MPX2010D series sensor. LINEARITY Linearity refers to how well a transducer’s output follows the equation: Vout = Voff + sensitivity x P over the operating pressure range (Figure 3). There are two basic methods for calculating nonlinearity: (1) end point straight line fit or (2) a least squares best line fit. While a least squares fit gives the “best case” linearity error (lower numerical value), the calculations required are burdensome. Conversely, an end point fit will give the “worst case” error (often more desirable in error budget calculations) and the calculations are more straightforward for the user. Motorola’s specified pressure sensor linearities are based on the end point straight line method measured at the midrange pressure. 80 70 – 40°C 60 50 SPAN RANGE (TYP) + 125°C 40 30 20 OFFSET (TYP) 10 0 PSI 0 kPa 0.3 2.0 0.6 0.9 LINEARITY 60 + 25°C VS = 3 Vdc P1 > P2 1.2 4.0 6.0 8.0 PRESSURE DIFFERENTIAL 1.5 10 Figure 2. Output versus Pressure Differential Figure 4 illustrates the Differential/Gauge Sensing Chip in the basic Low Profile Package (Case 472B–01). A fluorosilicone gel isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the sensor diaphragm. The MPXL10 series pressure sensor operating characteristics, and internal reliability and qualification tests are based on use of dry air as the pressure media. Media, other than dry air, may have adverse effects on sensor performance and long– term reliability. Contact the factory for information regarding media compatibility in your application. 50 OUTPUT (mVdc) OUTPUT (mVdc) 70 ACTUAL 40 SPAN (VFSS) 30 THEORETICAL 20 10 OFFSET (VOFF) 0 0 MAX POP PRESSURE (kPA) Figure 3. Linearity Specification Comparison STAINLESS STEEL METAL COVER DIE ÉÉÉÉÉÉÉÉÉÉÉ ÉÉÉÉÉÉÉÉÉÉÉ ÉÉÉÉÉÉÉÉÉÉÉ ÇÇÇÇ ÉÉÉÉÉÉÉÉÉÉÉ ÇÇÇÇ ÉÉÉÉÉÉÉÉÉÉÉ ÉÉÉÉÉÉÉÉÉÉÉ ÉÉÉÉÉÉÉÉÉÉÉ FLUORO SILICONE DIE COAT P1 WIRE BONDS EPOXY CASE LEAD FRAME Figure 4. Cross–Sectional Diagram (Not to Scale) Motorola Sensor Device Data 3 ORDERING INFORMATION MPXL10 series pressure sensors are available in differential and gauge configurations. Devices are available in the basic element package or with pressure port fittings which provide printed circuit board mounting ease and barbed hose pressure connections. MPX Series D i T Device Type O i Options C Case Type T Order Number Device Marking MPXL10GC7U N/A Case 472B–01 MPXL10GC7U MPXL10G PACKAGE DIMENSIONS NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. VERTICAL SURFACES MAY BE UP TO 5° DRAFT. 6. DIMENSION P TO CENTER OF LEAD WHEN FORMED PARALLEL. MARKING SURFACE –A– G 1 8 –B– W 4 5 X P R S V U C Y –T– L M F 8 PL J 0.25 (0.010) M CASE 472B–01 ISSUE O T B S A S DIM A B C F G J L M P R S U V W X Y INCHES MIN MAX 0.658 0.668 0.541 0.551 0.555 0.595 0.026 0.034 0.100 BSC 0.009 0.011 0.138 0.150 0_ 15 _ 0.735 0.745 0.185 0.195 0.155 0.165 0.120 0.130 0.305 0.315 0.561 0.571 0.010 0.025 0.002 0.020 STYLE 2: PIN 1. 2. 3. 4. 5. 6. 7. 8. MILLIMETERS MIN MAX 16.71 16.97 13.74 13.99 14.10 15.11 0.66 0.86 2.54 BSC 0.23 0.28 3.50 3.81 0_ 15_ 18.67 18.92 4.69 4.95 3.94 4.19 3.05 3.30 7.75 8.00 14.25 14.50 0.25 0.63 0.05 0.51 GROUND +VOUT VSUPPLY –VOUT NC NC NC NC Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters which may be provided in Motorola data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. 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