Freescale Semiconductor Technical Data MPXA6115A Rev 3, 01/2007 High Temperature Accuracy Integrated Silicon Pressure Sensor for Measuring Absolute Pressure, On-Chip Signal Conditioned, Temperature Compensated and Calibrated The MPXA6115A/MPXH6115A series sensor integrates on-chip, bipolar op amp circuitry and thin film resistor networks to provide a high output signal and temperature compensation. The small form factor and high reliability of on-chip integration make the pressure sensor a logical and economical choice for the system designer. The MPXA6115A/MPXH6115A series piezoresistive transducer is a state-ofthe-art, monolithic, signal conditioned, silicon pressure sensor. This sensor combines advanced micromachining techniques, thin film metallization, and bipolar semiconductor processing to provide an accurate, high level analog output signal that is proportional to applied pressure. Figure 1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip. MPXA6115A MPXH6115A SERIES INTEGRATED PRESSURE SENSOR 15 TO 115 kPA (2.2 TO 16.7 psi) 0.2 TO 4.8 V OUTPUT SMALL OUTLINE PACKAGE MPXA6115A6U/6T1 MPXA6115C6U/C6T1 CASE 482A-01 CASE 482-01 SMALL OUTLINE PACKAGE PIN NUMBERS(1) Features • • • • • • Improved Accuracy at High Temperature Available in Small and Super Small Outline Packages 1.5% Maximum Error over 0° to 85°C Ideally suited for Microprocessor or Microcontroller-Based Systems Temperature Compensated from -40° to +125°C Durable Thermoplastic (PPS) Surface Mount Package Typical Applications • • • • Aviation Altimeters Industrial Controls Engine Control/Manifold Absolute Pressure (MAP) Weather Station and Weather Reporting Device Barometers 1 N/C 5 N/C 2 VS 6 N/C 3 GND 7 N/C 4 VOUT 8 N/C 1. Pins 1, 5, 6, 7, and 8 are internal device connections. Do not connect to external circuitry or ground. Pin 1 is denoted by the notch in the lead. SUPER SMALL OUTLINE PACKAGE ORDERING INFORMATION Device Type Options Case No. MPX Series Order No. Packing Options Device Marking MPXH6115A6U/6T1 CASE 1317-04 MPXH6115AC6U/C6T1 CASE 1317A-03 SMALL OUTLINE PACKAGE SUPER SMALL OUTLINE PACKAGE PIN NUMBERS(1) Basic Element Absolute, Element Only 482 MPXA6115A6U Rails MPXA6115A Absolute, Element Only 482 MPXA6115A6T1 Tape & Reel MPXA6115A Ported Element Absolute, Axial Port 482A MPXA6115AC6U Rails MPXA6115A 1 N/C 5 N/C Absolute, Axial Port 482A MPXA6115AC6T1 Tape & Reel MPXA6115A 2 VS 6 N/C 3 GND 7 N/C 1317 MPXH6115A6U Rails MPXH6115A 4 VOUT 8 N/C 1317 MPXH6115A6T1 SUPER SMALL OUTLINE PACKAGE Basic Element Absolute, Element Only Tape & Reel MPXH6115A Ported Element Absolute, Axial Port 1317A MPXH6115AC6U Rails MPXH6115A Absolute, Axial Port 1317A MPXH6115AC6T1 Tape & Reel MPXH6115A Absolute, Element Only © Freescale Semiconductor, Inc., 2007. All rights reserved. 1. Pins 1, 5, 6, 7, and 8 are internal device connections. Do not connect to external circuitry or ground. Pin 1 is denoted by the notch in the lead VS Thin Film Temperature Compensation and Gain Stage #1 Sensing Element GND Gain Stage #2 and Ground Reference Shift Circuitry VOUT Pins 1, 5, 6, 7, and 8 are NO CONNECTS Figure 1. Fully Integrated Pressure Sensor Schematic Table 1. Maximum Ratings(1) Symbol Value Units Maximum Pressure (P1 > P2) Rating Pmax 400 kPa Storage Temperature Tstg -40° to +125° °C TA -40° to +125° °C Output Source Current @ Full Scale Output Io + 0.5 mAdc Output Sink Current @ Minimum Pressure Offset(2) Io - -0.5 mAdc Operating Temperature (2) 1. Exposure beyond the specified limits may cause permanent damage or degradation to the device. 2. Maximum Output Current is controlled by effective impedance from Vout to Gnd or Vout to VS in the application circuit. MPXA6115A 2 Sensors Freescale Semiconductor Table 2. Operating Characteristics (VS = 5.0 Vdc, TA = 25°C unless otherwise noted, P1 > P2) Characteristic Symbol Min Typ Max Unit Pressure Range POP 15 — 115 kPa Supply Voltage(1) VS 4.75 5.0 5.25 Vdc Supply Current Io - 6.0 10 mAdc Minimum Pressure Offset(2) @ VS = 5.0 Volts (0 to 85°C) Voff 0.133 0.200 0.268 Vdc Full Scale Output(3) @ VS = 5.0 Volts (0 to 85°C) VFSO 4.633 4.700 4.768 Vdc Full Scale Span(4) @ VS = 5.0 Volts (0 to 85°C) VFSS 4.433 4.500 4.568 Vdc Accuracy(5) (0 to 85°C) — — — ±1.5 %VFSS Sensitivity V/P — 45.9 — mV/kPa (6) Response Time tR — 1.0 — ms Warm-Up Time(7) — — 20 — ms Offset Stability(8) — — ±0.25 — %VFSS 1. Device is ratiometric within this specified excitation range. 2. Offset (Voff) is defined as the output voltage at the minimum rated pressure. 3. Full Scale Output (VFSO) is defined as the output voltage at the maximum or full rated pressure. 4. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. 5. Accuracy is the deviation in actual output from nominal output over the entire pressure range and temperature range as a percent of span at 25°C due to all sources of error including the following: • Linearity: Output deviation from a straight line relationship with pressure over the specified pressure range. • Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied. • Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from minimum or maximum rated pressure at 25°C. • TcSpan: Output deviation over the temperature range of 0° to 85°C, relative to 25°C. • TcOffset: Output deviation with minimum pressure applied, over the temperature range of 0° to 85°C, relative to 25°C. 6. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 7. Warm-up Time is defined as the time required for the product to meet the specified output voltage after the pressure has been stabilized. 8. Offset Stability is the product's output deviation when subjected to 1000 cycles of Pulsed Pressure, Temperature Cycling with Bias Test. MPXA6115A Sensors Freescale Semiconductor 3 . +5.0 V Fluoro Silicone Gel Die Coat Wire Bond Stainless Steel Cap Die P1 Thermoplastic Case VS Pin 2 MPXA6115A MPXH6115A Vout Pin 4 100 nF Lead Frame to ADC 47 pF GND Pin 3 51 K Die Bond Absolute Element Sealed Vacuum Reference Figure 2. Cross Sectional Diagram SSOP (Not to Scale) 5.0 4.5 4.0 Output (Volts) 3.5 Figure 3. Typical Application Circuit (Output Source Current Operation) MAX Transfer Function: Vout = Vs* (.009*P-.095) ± Error VS = 5.0 Vdc TEMP = 0 to 85ºC TYP 3.0 2.5 2.0 1.5 MIN 1.0 0.5 5 10 15 20 25 30 35 40 45 50 55 60 65 70 75 80 85 90 95 100 105 110 115 120 0 Pressure (ref: to sealed vacuum) in kPa Figure 4. Output versus Absolute Pressure Figure 2 illustrates the absolute sensing chip in the basic Super Small Outline chip carrier (Case 1317). Figure 3 shows a typical application circuit (output source current operation). Figure 4 shows the sensor output signal relative to pressure input. Typical minimum and maximum output curves are shown for operation over 0 to 85×C temperature range. The output will saturate outside of the rated pressure range. A fluorosilicone gel isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the silicon diaphragm. The MPXA6115A/ MPXH6115A series pressure sensor operating characteristics, internal reliability and qualification tests are based on use of dry air as the pressure media. Media other than dry air may have adverse effects on sensor performance and long-term reliability. Contact the factory for information regarding media compatibility in your application. MPXA6115A 4 Sensors Freescale Semiconductor Transfer Function (MPXA6115A/MPXH6115A) Nominal Transfer Value: Vout = VS x (0.009 x P - 0.095) ± (Pressure Error x Temp. Factor x 0.009 x VS) VS = 5.0 ± 0.25 Vdc Temperature Error Band MPXA6115A/MPXH6115A SERIES 4.0 Break Points 3.0 Temperature Error Factor 2.0 Temp Multiplier - 40 0 to 85 125 3 1 1.75 1.0 0.0 -40 -20 0 20 40 60 80 100 120 140 Temperature in Cº NOTE: The Temperature Multiplier is a linear response from 0ºC to -40ºC and from 85ºC to 125ºC Pressure Error Band Error Limits for Pressure 3.0 Pressure Error (kPa) 2.0 1.0 0.0 20 40 60 80 100 120 Pressure (in kPa) -1.0 -2.0 Pressure 15 to 115 (kPa) Error (Max) ±1.5 (kPa) -3.0 MPXA6115A Sensors Freescale Semiconductor 5 MINIMUM RECOMMENDED FOOTPRINT FOR SMALL AND SUPER SMALL PACKAGES Surface mount board layout is a critical portion of the total design. The footprint for the semiconductor package must be the correct size to ensure proper solder connection interface between the board and the package. With the correct pad geometry, the packages will self-align when subjected to a solder reflow process. It is always recommended to fabricate boards with a solder mask layer to avoid bridging and/or shorting between solder pads, especially on tight tolerances and/or tight layouts. 0.100 TYP 2.54 0.660 16.76 0.060 TYP 8X 1.52 0.300 7.62 inch mm 0.100 TYP 8X 2.54 Figure 5. SOP Footprint (Case 482) 0.050 1.27 TYP 0.387 9.83 0.150 3.81 0.027 TYP 8X 0.69 0.053 TYP 8X 1.35 inch mm Figure 6. SSOP Footprint (Case 1317 and 1317A) MPXA6115A 6 Sensors Freescale Semiconductor PACKAGE DIMENSIONS -A- D 8 PL 0.25 (0.010) 4 5 M T B S A S NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT. -BG 8 1 S N H C J -TSEATING PLANE PIN 1 IDENTIFIER K M DIM A B C D G H J K M N S INCHES MIN MAX 0.415 0.425 0.415 0.425 0.212 0.230 0.038 0.042 0.100 BSC 0.002 0.010 0.009 0.011 0.061 0.071 0˚ 7˚ 0.405 0.415 0.709 0.725 MILLIMETERS MIN MAX 10.54 10.79 10.54 10.79 5.38 5.84 0.96 1.07 2.54 BSC 0.05 0.25 0.23 0.28 1.55 1.80 0˚ 7˚ 10.29 10.54 18.01 18.41 CASE 482-01 ISSUE O SMALL OUTLINE PACKAGE -A- D 4 0.25 (0.010) 5 N 8 PL M T B S A S NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT. -BG 8 1 S W V C H J -TK M PIN 1 IDENTIFIER DIM A B C D G H J K M N S V W INCHES MIN MAX 0.415 0.425 0.415 0.425 0.500 0.520 0.038 0.042 0.100 BSC 0.002 0.010 0.009 0.011 0.061 0.071 0˚ 7˚ 0.444 0.448 0.709 0.725 0.245 0.255 0.115 0.125 MILLIMETERS MIN MAX 10.54 10.79 10.54 10.79 12.70 13.21 0.96 1.07 2.54 BSC 0.05 0.25 0.23 0.28 1.55 1.80 0˚ 7˚ 11.28 11.38 18.01 18.41 6.22 6.48 2.92 3.17 SEATING PLANE CASE 482A-01 ISSUE A SMALL OUTLINE PACKAGE MPXA6115A Sensors Freescale Semiconductor 7 PACKAGE DIMENSIONS PAGE 1 OF 3 CASE 1317-04 ISSUE F SUPER SMALL OUTLINE PACKAGE MPXA6115A 8 Sensors Freescale Semiconductor PACKAGE DIMENSIONS PAGE 2 OF 3 CASE 1317-04 ISSUE F SUPER SMALL OUTLINE PACKAGE MPXA6115A Sensors Freescale Semiconductor 9 PACKAGE DIMENSIONS PAGE 3 OF 3 CASE 1317-04 ISSUE F SUPER SMALL OUTLINE PACKAGE MPXA6115A 10 Sensors Freescale Semiconductor PACKAGE DIMENSIONS PAGE 1 OF 2 CASE 1317A-03 ISSUE C SUPER SMALL OUTLINE PACKAGE MPXA6115A Sensors Freescale Semiconductor 11 PACKAGE DIMENSIONS PAGE 2 OF 2 CASE 1317A-03 ISSUE C SUPER SMALL OUTLINE PACKAGE MPXA6115A 12 Sensors Freescale Semiconductor How to Reach Us: Home Page: www.freescale.com Web Support: http://www.freescale.com/support USA/Europe or Locations Not Listed: Freescale Semiconductor, Inc. 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