E2A0014-16-X0 ¡ Semiconductor MSM7512B Semiconductor This version: MSM7512B Jan. 1998 Previous version: Nov. 1996 1200 bps Half Duplex FSK Modem – ITU-T V.23 GENERAL DESCRIPTION The MSM7512B is useful for the ITU-T V.23 modem, for examples, low cost built-in modems, telecontrol systems, home security systems, etc. The family version, MSM7510 for ITU-T V.21, will be available following this device. Oki has been mass-producing and delivering the MSM6926 and 6927 for a long time, but these devices need two power supplies, +5 V for digital and +12 V for analog. New generation devices, MSM7510/7512B, work with single rail +3 V to +5 V and low power consumption. FEATURES • Conforms to ITU-T V.23, 1200 bps Half Duplex • Conforms to ITU-T V.23, 75 bps transmitter • Single Power Supply: +3 V to +5 V • Low Power Consumption Operating Mode: 25 mW Typ. Power Down Mode: 0.1 mW Max. • Line Hybrid Circuit on Chip • Line Direct Drive Capability of Analog Output • 3.579545 MHz Crystal Oscillator • Digital Interface: TTL • Package options: 16-pin plastic DIP (DIP16-P-300–2.54) (Product name: MSM7512BRS) 24-pin plastic SOP (SOP24-P-430-1.27–K) (Product name: MSM7512BGS-K) 1/12 Semiconductor MSM7512B BLOCK DIAGRAM AI (2) + Demodulator – *R1 *R1 AOG *R2 Modulator *R2 – AO (3) FSK & ANS Bandpass Filter *R3 *R2 + EAI (4) X1 (6) X2 (7) TEST (13) OSC MOD1 (14) CLK GEN. CONT. CLK (8) VDD (1) GND (5) RD (9) CD (10) XD (11) RS (12) MOD2 (15) AOG (16) SG GEN. * R1 to R3 ≥ 50 kW ( ) : for MSM7512BRS 2/12 Semiconductor MSM7512B PIN CONFIGURATION (TOP VIEW) VDD 1 16 AOG AI 2 15 MOD2 AO 3 14 MOD1 EAI 4 13 TEST GND 5 12 RS X1 6 11 XD X2 7 10 CD CLK 8 9 RD 16-Pin Plastic DIP VDD 1 24 AOG NC 2 23 NC AI 3 22 MOD2 NC 4 21 NC AO 5 20 MOD1 EAI 6 19 TEST GND 7 18 RS X1 8 17 XD NC 9 16 NC X2 10 15 CD NC 11 14 NC CLK 12 13 RD 24-Pin Plastic SOP NC : No connect pin 3/12 Semiconductor MSM7512B PIN DESCRIPTION No. RS GS-VK Name I/O Description 1 1 VDD — +3 V to +5 V Power Supply 2 3 AI I Analog receive signal input. 3 5 AO O Analog transmit signal output. External analog signal input. 4 6 EAI I The signal applied to this pin is transmitted from AO via transmit output amplifier. When not using this pin, it should be left open. 5 7 GND — 6 8 X1 I 7 10 X2 O 8 12 CLK O Ground, 0 V. 3.579545 MHz crystal resonator should be connected to X1 and X2. When applying external clock 3.579545 MHz to the device, it should be applied to X2 (not X1) via an AC-coupling capacitor of 100 pF and X1 has to be opened. 3.579545 MHz clock signal output. Modem receive serial data output. 9 13 RD O Digital "1" and "0" correspond to "Mark" and "Space", respectively. When CD (Carrier Detect) is off, RD is held at "Mark" state. 10 15 CD O 11 17 XD I* 12 18 RS I* FSK Receive signal and answer tone detect. Digital "0" and "1" represent "Detect" and "Non-detect", respectively. Modem transmit serial data input. Digital "1" and "0" correspond to "Mark" and "Space", respectively. FSK signal and answer tone transmit enable. When digital "0" is applied to RS, transmitting becomes enable. Chip test input. 13 19 TEST I* 14 20 MOD1 I* Operation mode select. 15 22 MOD2 I* Refer to Table 1. TEST should be open or digital "1". Analog transmit signal amplitude select. 16 24 AOG I* Digital "1" Æ –10 dBm Typ. at AO Digital "0" Æ –4 dBm Typ. at AO Note : I* : Internally pulled-up input pin. 4/12 Semiconductor MSM7512B ABSOLUTE MAXIMUM RATINGS Parameter Symbol Condition Rating Unit VDD Ta = 25°C, –0.3 to +7 V Input Voltage VIN With respect to GND –0.3 to VDD + 0.3 V Storage Temperature TSTG — –55 to +150 °C Power Supply Voltage RECOMMENDED OPERATING CONDITIONS Parameter Symbol Condition Min. Typ. Max. Unit VDD — +2.7 — +5.5 V Power Supply Voltage Top — –40 — +85 °C Input Clock Frequency fCLK To 3.579545 MHz –0.1 — +0.1 % VDD Bypass Capacitor Crystal Operating Temperature CVDD VDD – GND 10 — — mF Oscillation Frequency — — — 3.579545 — MHz Frequency Deviation — +25°C ±5°C –100 — +100 ppm Temperature Characteristics — –40°C to +85°C –50 — +50 ppm Equivalent Series Resistance — — — — 50 W Load Capacitance — — — 16 — pF ELECTRICAL CHARACTERISTICS DC Characteristics ( VDD = +2.7 V to +5.5 V, Top = –40°C to +85°C) Parameter Power Supply Current Digital Input Voltage Digital Input Leakage Current Digital Output Voltage * Symbol Condition Min. Typ. Max. Unit IDD Operating Mode — 5.0 10.0 mA ISS Power Down Mode — 5.0 20.0 mA VIL — 0 — 0.8 V VIH — 2.2 — VDD V IIL VI = 0 V * –80 — 10 mA IIH VI = 5 V –10 — 10 mA VOL IOL = 1.6 mA 0 0.2 0.4 V VOH IOH = –0.4 mA 2.4 — VDD V Internally pulled-up pins 5/12 Semiconductor MSM7512B AC Characteristics Modulator/analog output (AO) characteristics (VDD = +2.7 V to +5.5 V, Top = –40°C to +85°C) Parameter Symbol fDM FSK Transmit fDS Signal Frequency fBM FSK Transmit Signal VAO1 Answer Tone amplitude VAO2 Analog External VEA1 Input Signal Gain VEA2 fBS Condition 1200 bps Transmit Mode 75 bps Transmit Mode VO VAO – VEAI Min. Typ. Max. Unit XD = "1" 1296 1300 1304 Hz XD = "0" 2096 2100 2104 Hz XD = "1" 386 390 394 Hz XD = "0" 446 450 454 Hz AOG = "0" –6 –4 –2 dBm AOG = "1" –12 –10 –8 dBm AOG = "0" –2 0 2 dB AOG = "1" –8 –6 –4 dB –2 0 2 dB 4 kHz to 8 kHz — — P–20 dB 8 kHz to 12 kHz — — P–40 dB More than12 kHz — — P–60 dB FSK Transmit Signal Amplitude VAOD VAO(MARK) – VAO(SPACE) Ratio Out-of-band Energy VSPS P : In-band Signal Energy Output Offset Voltage VOFF To VDD/2 –150 — +150 mV Output Load Resistance RAO — 600 — — W * 0 dBm = 0.775 Vrms 6/12 Semiconductor MSM7512B Demodulator analog input (Al, EAI) characteristics ( VDD = +2.7 V to +5.5 V, Top = –40°C to +85°C) Parameter Receive Signal Amplitude Symbol Condition Min. Typ. Max. Unit VAI FSK Signal, at AI — — –6 dBm OFF Æ ON — — –42 dBm OFF Æ OFF –48 — — dBm — 2 — dB Receive Signal VON Detect Amplitude (CD) VOFF Hysteresis (CD) VHYS CD Delay Time tCDD CD Hold Time tCDH Receive Data (RD) Bias Distortion Input Resistance * FSK Signal, (1:1) at AI VON Æ VOFF 5 15 20 ms 20 40 60 ms 1200 bps, 1:1 Pattern –10 — 10 % RAI AI — 10 — MW REAI EAI 20 — — kW DBS See Fig. 1 0 dBm = 0.775 Vrms AI CD tCDD tCDH Figure 1 Carrier Detect (CD) Timing 7/12 Semiconductor MSM7512B OPERATION MODE Table 1 Operation Mode MOD2 MOD1 0 0 FSK Transmit Mode (Fig.2) 0 1 FSK Receive & 75 bps Transmit Mode (Fig.3) 1 0 Analog Loop Back Test Mode (Fig. 4) 1 1 Power Down Mode AI Phone Line Mode Receive Filter SG AO RD Demodulator VDD Transmit Filter Modulator DTE XD Figure 2 FSK Transmit Mode AI Receive Filter Demodulator RD Phone Line DTE AO Transmit Filter Modulator XD Figure 3 FSK Receive Mode AI Phone Line Receive Filter Demodulator RD DTE XD AO Transmit Filter Modulator SG Figure 4 Analog Loop Back Test Mode 8/12 Semiconductor MSM7512B APPLICATION CIRCUIT ➀ MSM7512BRS 600 W : 600 W 2.2 mF AOG 16 MOD2 MOD1 TEST RS XD CD RD 9 VDD AI AO 600 W EAI GND 10 mF X1 X2 3.58 MHz CLK 8 + – Line 1 CONT. To other circuit ➁ MSM7512BRS 600 W : 600 W 2.2 mF VDD AI AO 600 W EAI GND 10 mF X1 X2 100 pF CLK 8 + – Line 1 External Clock AOG 16 MOD2 MOD1 TEST RS XD CD RD 9 CONT. 3.58 MHz 2.2 mF External Analog Transmit Signal 9/12 Semiconductor MSM7512B An Example of the External Adjustment for a transmitting Level and detecting Level If you desire to change the transmitting level or detecting level, adjust the external circuit by referring to the following circuit. R2 51 kW VAOL Line 600 W 51 kW – – R1 2.2 mF AO + + 51 kW R4 600 W R3 51 kW – VAIL VAO + AI 2.2 mF VAI Line transmitting level : VAOL = VAO ¥ (R2/R1) IC input level : VAI = VAIL ¥ (R4/R3) 10/12 Semiconductor MSM7512B PACKAGE DIMENSIONS (Unit : mm) DIP16-P-300-2.54 Package material Lead frame material Pin treatment Solder plate thickness Package weight (g) Epoxy resin 42 alloy Solder plating 5 mm or more 0.99 TYP. 11/12 Semiconductor MSM7512B (Unit : mm) SOP24-P-430-1.27-K Mirror finish Package material Lead frame material Pin treatment Solder plate thickness Package weight (g) Epoxy resin 42 alloy Solder plating 5 mm or more 0.58 TYP. Notes for Mounting the Surface Mount Type Package The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which are very susceptible to heat in reflow mounting and humidity absorbed in storage. Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the product name, package name, pin number, package code and desired mounting conditions (reflow method, temperature and times). 12/12