3Northway Lane North Latham,New York 12110. Tollfree:1.800.984.5337 Phone:1.518.956.2980 Fax:1.518.785.4725 Http://www.marktechopto.com SPECIFICATION PART NO. : MTB10000-UR-A 10 SEGMENT LIGHT BAR 10 SEGMENT LIGHT BAR MTB10000-UR-A Dimensions 22.86 8.0 1.78 0.25 10.16 5.08 7.62 2.54 25.27 MARK 0.5 3.5 MIN. 2.54X9=22.86 Notes: 1. The slope angle of any PIN may be ±5.0° Max. 2. All dimensions are in mm, tolerance is ±0.25mm unless otherwise noted. Internal Circuit Diagram MTB10000-UR-A PIN. 1 2 A PIN. 20 3 B 19 4 C 18 5 D 17 6 E 16 7 F 15 8 G 14 9 H 13 10 I 12 VER.: 01 Date: 2007/10/04 J 11 Page: 1/5 10 SEGMENT LIGHT BAR MTB10000-UR-A Description LED Chip Part No. MTB10000-UR-A Face Color Material Emitting Color Surface Segments AlGaAs/GaAs Super Red Grey White Absolute Maximum Ratings at Ta=25 ℃ Parameter Symbol Rating Unit Power Dissipation Per Segment PD 66 mW Pulse Current(1/10Duty Cycle,0.1ms Pulse Width.) Per Chip IFP 100 mA Forward Current Per Chip IF 30 mA Reverse (Leakage)Current Per Chip Ir 100 uA Reverse Voltage Per Chip VR 4 V Operating Temperature Range Topr. -25 to +85 ℃ Storage Temperature Range Tstg. -40 to +100 ℃ Soldering Temperature. Tsol. Dip Soldering: 260℃ for 5 sec. Hand Soldering: 350℃ for 3 sec. VER.: 01 Date: 2007/10/04 Page: 2/5 10 SEGMENT LIGHT BAR MTB10000-UR-A Electrical and Optical Characteristics: Parameter Symbol Condition Min. Typ. Luminous Intensity Per Segment IV If=10mA/seg. 5.3 12.5 Forward Voltage Vf If=20mA/seg. 1.8 Peak Wavelength λp If=20mA/seg. 660 nm Dominant Wavelength λd If=20mA/seg. 643 nm Reverse Current Per Chip (Leakage Current Per Chip) Ir Vr=4V Spectrum Line Halfwidth ∆λ If=20mA/seg. 20 nm T ----------- 250 ns Response Time Max. Unit mcd 2.2 100 V µA Note: Customer’s special requirements are also welcome. VER.: 01 Date: 2007/10/04 Page: 3/5 10 SEGMENT LIGHT BAR MTB10000-UR-A Typical Electrical/Optical Characteristic Curves (25℃ Ambient Temperature Unless Otherwise Noted) Ratio of Maximum Operating Peak Current to Temperature Derated DC Current 0.5 Forward Current IF(mA) Forward Current IF(mA) 40 1.6 1.8 2.0 2.2 Forward Voltage VF(V) HZ 40 1.4 HZ 50 10 0 10 50 20 1 100 10 1000 tp - Pulse Duration - μs 10000 Fig.2 MAXIMUM TOLERABLE PEAK CURRENT VS. PULSE DURATION Fig.1 RELATIVE INTENSITY VS. WAVELENGTH 30 0 30 Wavelength (nm) HZ 1K 1 750 Z 700 10 Z 650 OPERATION IN THIS REGION REOUIRES TEMPERATURE DERATING OF IDC MAXIMUM H 3K 600 100 KH 10 IF PEAK IDC MAX Relative Intensity 1.0 30 20 10 0 2..4 20 40 60 80 100 Ambient Temperature Ta (°C) Fig.4 FORWARD CURRENT VS. DERATING CURVE Fig .3 FORWARD CURRENT VS. FORWARD VOLTAGE PER CHIP Relative Luminous Intensity Relative Luminous Intensity Normalized at 10mA 25 20 15 10 5 0 10 20 30 40 Forward Current (mA) Fig.5 RELATIVE LUMINOUS INTENSITY VS. FORWARD CURRENT 2.0 1.0 0.5 0.2 0.1 -30 -20 -10 0 10 20 30 40 50 60 70 Ambient Temperature Ta (°C) Fig.6 LUMINOUS INTENSITY VS. AMBIENT TEMPERATURE VER.: 01 Date: 2007/10/04 Page: 4/5 MTB10000-UR-A 10 SEGMENT LIGHT BAR Precautions in Use: PLEASE PAY SPECIAL ATTNTION TO THE NEXT POINT TO INCORPORATE OPTO DEVICE TO HIGH RELIABILITY 1. Do not bend the lead. Bending leads could cause breakage of leads or the degradation of the chip. When bending is unavoidable, strictly follow the cautionary instruction below. (1)Bend the leads before soldering. (2)Bending a lead must be done by fixing a lead tightly and applying no stress on the resin part. (3) The lead bending point must be more than 1.6mm away from the edge or the resin part. (4)When a pin is tested for its endurance, bending degree should be 45∘and repeated no more than two times. 2. Setting a product by using tool such as a holder should be avoided. When necessary, no stress should be applied to the resin part and lead to consider dimension tolerance, thermal expansion, thermal contraction of holder, product and circuit board etc. 3. The hole pitch of a circuit board must fit into the lead pitch of products. 4. When soldering, care the followings: (1)Do not heat a product under any stress (i.e.: twist) to leads. (2)Do not heat ( for example, by soldering ) a product while out side force is applied the resin part. (3 The lead bending point must be more than 1.6mm away from the edge or the resin part. (4)Soldering with PC Board should be conducted with following conditions. (a) For dip soldering Pre-heating : 90℃ Max. for within 60 Sec. Soldering Max. : 260±5℃(Solder Temp.) for within 5 Sec. (b) Soldering iron : 350℃(Soldering iron tip) for within 3 Sec. 5. Flux could corrode the leads.Use flux that contains as little chlorine as possible (RA, RMA, less than 0.2 wt%) and need not be washed way. When, however, washing is necessary, partially wash around the leads, instead of the entire LED, by the following conditions. Cleaning agent : Methyl Alcohol Cleaning temp : 45℃Max. Cleaning time : 30Sec. Max. 6. Minimum amount of soldering flux should be used. Soldering flux should be applied only to the pin portion. 7. The following may damage products or LED chips: Attachment or contact of residual flux solvent onto the product surface or to LED chips, or invasion of the same into the product. VER.: 01 Date: 2007/10/04 Page: 5/5