NCV4276B 400 mA Low-Drop Voltage Regulator The NCV4276B is a 400 mA output current integrated low dropout regulator family designed for use in harsh automotive environments. It includes wide operating temperature and input voltage ranges. The device is offered with adjustable voltage versions available in 2% output voltage accuracy. It has a high peak input voltage tolerance and reverse input voltage protection. It also provides overcurrent protection, overtemperature protection and inhibit for control of the state of the output voltage. The NCV4276B is available in DPAK surface mount package. The output is stable over a wide output capacitance and ESR range. The NCV4276B has improved startup behavior during input voltage transients. Features http://onsemi.com MARKING DIAGRAM 1 DPAK 5−PIN DT SUFFIX CASE 175AA 5 1 • Adjustable Voltage Version (from 2.5 V to 20 V) ±2% Output • • • • • • • Voltage 400 mA Output Current 500 mV (max) Dropout Voltage (5.0 V Output) Inhibit Input Very Low Current Consumption Fault Protection ♦ +45 V Peak Transient Voltage ♦ −42 V Reverse Voltage ♦ Short Circuit ♦ Thermal Overload NCV Prefix for Automotive and Other Applications Requiring Site and Change Controls These are Pb−Free Devices I 76BAJG ALYWW A L Y WW G = Assembly Location = Wafer Lot = Year = Work Week = Pb−Free Device *Tab is connected to Pin 3. ORDERING INFORMATION See detailed ordering and shipping information in the ordering information section on page 11 of this data sheet. Q Bandgap Reference Error Amplifier Current Limit and Saturation Sense − + Thermal Shutdown INH GND VA Figure 1. Block Diagram © Semiconductor Components Industries, LLC, 2010 June, 2010 − Rev. 0 1 Publication Order Number: NCV4276B/D NCV4276B PIN FUNCTION DESCRIPTION Pin No. Symbol Description 1 I 2 INH Inhibit; Set low−to inhibit. 3 GND Ground; Pin 3 internally connected to heatsink. 4 VA Voltage Adjust Input; use an external voltage divider to set the output voltage 5 Q Output: Bypass with a capacitor to GND. See Figures NO TAG to 3 and Regulator Stability Considerations section. Input; Battery Supply Input Voltage. MAXIMUM RATINGS* Rating Symbol Min Max Unit Input Voltage VI −42 45 V Input Peak Transient Voltage VI − 45 V Inhibit INH Voltage VINH −42 45 V Voltage Adjust Input VA VVA −0.3 10 V Output Voltage VQ −1.0 40 V Ground Current Iq − 100 mA Input Voltage Operating Range VI VQ + 0.5 V or 4.5 V (Note 1) 40 V − − 4.0 250 − − kV V Junction Temperature TJ −40 150 °C Storage Temperature Tstg −50 150 °C ESD Susceptibility (Human Body Model) (Machine Model) Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. *During the voltage range which exceeds the maximum tested voltage of I, operation is assured, but not specified. Wider limits may apply. Thermal dissipation must be observed closely. LEAD TEMPERATURE SOLDERING REFLOW (Note 2) Lead Temperature Soldering Reflow (SMD styles only), Leaded, 60−150 s above 183, 30 s max at peak Reflow (SMD styles only), Lead Free, 60−150 s above 217, 40 s max at peak Wave Solder (through hole styles only), 12 sec max TSLD − − − 240 265 310 °C THERMAL CHARACTERISTICS Characteristic Test Conditions (Typical Value) Unit Min Pad Board (Note 3) 1, Pad Board (Note 4) Junction−to−Tab (psi−JLx, yJLx) 4.2 4.7 C/W Junction−to−Ambient (RqJA, qJA) 100.9 46.8 C/W 1. 2. 3. 4. Minimum VI = 4.5 V or (VQ + 0.5 V), whichever is higher. Per IPC / JEDEC J−STD−020C. 1 oz. copper, 0.26 inch2 (168 mm2) copper area, 0.062″ thick FR4. 1 oz. copper, 1.14 inch2 (736 mm2) copper area, 0.062″ thick FR4. http://onsemi.com 2 NCV4276B ELECTRICAL CHARACTERISTICS (VI = 13.5 V; −40°C < TJ < 150°C; unless otherwise noted.) Characteristic Symbol Test Conditions Min Typ Max Unit 5.0 mA < IQ < 400 mA VQ+1 < VI < 40 V VI > 4.5 V −2% − +2% V OUTPUT Output Voltage AVQ Output Current Limitation IQ VQ = 90% VQTYP (VQTYP = 2.5 V) 400 700 1100 mA Quiescent Current (Sleep Mode) Iq = II − IQ Iq VINH = 0 V − − 10 mA Quiescent Current, Iq = II − IQ Iq IQ = 1.0 mA − 130 200 mA Quiescent Current, Iq = II − IQ Iq IQ = 250 mA − 10 15 mA Quiescent Current, Iq = II − IQ Iq IQ = 400 mA − 25 35 mA IQ = 250 mA, VDR = VI − VQ, VI > 4.5 V − 250 500 mV IQ = 5.0 mA to 400 mA − 3.0 20 mV DVI = 12 V to 32 V, IQ = 5.0 mA − 4.0 15 mV fr = 100 Hz, Vr = 0.5 VPP − 70 − dB − 0.5 − mV/K Dropout Voltage VDR Load Regulation DVQ,LO Line Regulation DVQ Power Supply Ripple Rejection PSRR Temperature Output Voltage Drift dVQ/dT − INHIBIT Inhibit Voltage, Output High VINH VQ w VQMIN − 2.3 2.8 V Inhibit Voltage, Output Low (Off) VINH VQ v 0.1 V 1.8 2.2 − V Input Current IINH VINH = 5.0 V 5.0 10 20 mA TSD IQ = 5.0 mA 150 − 210 °C THERMAL SHUTDOWN Thermal Shutdown Temperature* *Guaranteed by design, not tested in production. VQ = [(R1 + R2) * Vref] / R2 Input II CI1 1.0 mF I 1 CI2 100 nF 2 4 3 Output IQ CQ 22 mF NCV4276B INH IINH 5 Q Cb* R1 VA GND RL R2 Cb* − Required if usage of low ESR output capacitor CQ is demand, see Regulator Stability Considerations section Figure 2. Applications Circuit http://onsemi.com 3 NCV4276B TYPICAL PERFORMANCE CHARACTERISTICS 100 CQ = 22 mF for these Output Voltages Unstable Region ESR (W) 10 1 6V 2.5 V Stable Region 12 V 0.1 Unstable Region 0.01 Cb capacitor not connected 0 50 100 150 200 250 300 OUTPUT CURRENT (mA) 350 400 Figure 3. Output Stability with Output Capacitor ESR 5.0 2.54 Iq, CURRENT CONSUMPTION (mA) VQ, OUTPUT VOLTAGE (V) 2.55 VI = 13.5 V, RL = 1 kW 2.53 2.52 2.51 2.50 2.49 2.48 2.47 2.46 2.45 −40 0 40 80 120 160 TJ = 25°C RL = 20 W 4.5 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0 0 10 TJ, JUNCTION TEMPERATURE (°C) Figure 4. Output Voltage vs. Junction Temperature 40 50 Figure 5. Current Consumption vs. Input Voltage 4 2 TJ = 25°C RL = 20 W 3.5 0 II, INPUT CURRENT (mA) VQ, OUTPUT VOLTAGE (V) 20 30 VI, INPUT VOLTAGE (V) 3 2.5 2 1.5 1 0.5 2 4 6 VI, INPUT VOLTAGE (V) 8 −4 −6 −8 −10 −12 10 TJ = 25°C RL = 6.8 kW −14 −16 −18 −50 0 0 −2 −25 0 25 VI, INPUT VOLTAGE (V) Figure 6. Low Voltage Behavior Figure 7. High Voltage Behavior http://onsemi.com 4 50 NCV4276B TYPICAL PERFORMANCE CHARACTERISTICS 800 500 TJ = 125°C 400 300 TJ = 25°C 200 100 IQ, OUTPUT CURRENT (mA) VDR, DROPOUT VOLTAGE (mV) 600 700 600 500 TJ = 25°C VQ = 0 V 400 300 200 100 0 0 50 100 150 200 250 300 IQ, OUTPUT CURRENT (mA) 0 350 400 0 10 60 50 1.6 Iq, CURRENT CONSUMPTION (mA) Iq, CURRENT CONSUMPTION (mA) 40 Figure 9. Maximum Output Current vs. Input Voltage Figure 8. Dropout Voltage vs. Output Current, Regulator Set at 5.0 V TJ = 25°C VI = 13.5 V 50 40 30 20 10 0 20 30 VI, INPUT VOLTAGE (V) 0 100 200 300 400 500 1.2 1.0 0.8 0.6 0.4 0.2 0 600 TJ = 25°C VI = 13.5 V 1.4 0 10 20 30 40 50 IQ, OUTPUT CURRENT (mA) IQ, OUTPUT CURRENT (mA) Figure 10. Current Consumption vs. Output Current (High Load) Figure 11. Current Consumption vs. Output Current (Low Load) http://onsemi.com 5 60 NCV4276B Circuit Description The NCV4276B is an integrated low dropout regulator that provides a regulated voltage at 400 mA to the output. It is enabled with an input to the inhibit pin. The regulator voltage is provided by a PNP pass transistor controlled by an error amplifier with a bandgap reference, which gives it the lowest possible dropout voltage. The output current capability is 400 mA, and the base drive quiescent current is controlled to prevent oversaturation when the input voltage is low or when the output is overloaded. The regulator is protected by both current limit and thermal shutdown. Thermal shutdown occurs above 150°C to protect the IC during overloads and extreme ambient temperatures. ESR characteristics were measured with ceramic capacitors and additional series resistors to emulate ESR. Low duty cycle pulse load current technique has been used to maintain junction temperature close to ambient temperature. Calculating Bypass Capacitor If usage of low ESR ceramic capacitors is demanded, connect the bypass capacitor Cb between Voltage Adjust pin and Q pin according to Applications circuit at Figure 4. Parallel combination of bypass capacitor Cb with the feedback resistor R1 contributes in the device transfer function as an additional zero and affects the device loop stability, therefore its value must be optimized. Attention to the Output Capacitor value and its ESR must be paid. See also Stability in High Speed Linear LDO Regulators Application Note, AND8037/D for more information. Optimal value of bypass capacitor is given by following expression Regulator The error amplifier compares the reference voltage to a sample of the output voltage (VQ) and drives the base of a PNP series pass transistor via a buffer. The reference is a bandgap design to give it a temperature−stable output. Saturation control of the PNP is a function of the load current and input voltage. Oversaturation of the output power device is prevented, and quiescent current in the ground pin is minimized. See Figure 2, Test Circuit, for circuit element nomenclature illustration. Cb + 2 p 1 fz R1 @ (F) where R1 = the upper feedback resistor fz = the frequency of the zero added into the device transfer function by R1 and Cb external components. Set the R1 resistor according to output voltage requirement. Chose the fz with regard on the output capacitance CQ, refer to the table below. Regulator Stability Considerations The input capacitors (CI1 and CI2) are necessary to stabilize the input impedance to avoid voltage line influences. Using a resistor of approximately 1.0 W in series with CI2 can stop potential oscillations caused by stray inductance and capacitance. The output capacitor helps determine three main characteristics of a linear regulator: startup delay, load transient response and loop stability. The capacitor value and type should be based on cost, availability, size and temperature constraints. The aluminum electrolytic capacitor is the least expensive solution, but, if the circuit operates at low temperatures (−25°C to −40°C), both the value and ESR of the capacitor will vary considerably. The capacitor manufacturer’s data sheet usually provides this information. The value for the output capacitor CQ, shown in Figure 2, should work for most applications; see also Figure 3 for output stability at various load and Output Capacitor ESR conditions. Stable region of ESR in Figure 3 shows ESR values at which the LDO output voltage does not have any permanent oscillations at any dynamic changes of output load current. Marginal ESR is the value at which the output voltage waving is fully damped during four periods after the load change and no oscillation is further observable. CQ (mF) 10 22 47 100 fz Range (kHz) 20 - 50 14 - 35 10 - 20 7 – 14 Ceramic capacitors and its part numbers listed bellow have been used as low ESR output capacitors CQ from the table above to define the frequency ranges of additional zero required for stability. GRM31CR71C106KAC7 (10 mF, 16 V, X7R, 1206) GRM32ER71C226KE18 (22 mF, 16 V, X7R, 1210) GRM32ER61C476ME15 (47 mF, 16 V, X5R, 1210) GRM32ER60J107ME20 (100 mF, 6.3 V, X5R, 1210) Inhibit Input The inhibit pin is used to turn the regulator on or off. By holding the pin down to a voltage less than 1.8 V, the output of the regulator will be turned off. When the voltage on the Inhibit pin is greater than 2.8 V, the output of the regulator will be enabled to power its output to the regulated output voltage. The inhibit pin may be connected directly to the input pin to give constant enable to the output regulator. http://onsemi.com 6 NCV4276B Setting the Output Voltage The output voltage range can be set between 2.5 V and 20 V. This is accomplished with an external resistor divider feeding back the voltage to the IC back to the error amplifier by the voltage adjust pin VA. The internal reference voltage is set to a temperature stable reference of 2.5 V. The output voltage is calculated from the following formula. Ignoring the bias current into the VA pin: Use R2 < 50 k to avoid significant voltage output errors due to VA bias current. Connecting VA directly to Q without R1 and R2 creates an output voltage of 2.5 V. Designers should consider the tolerance of R1 and R2 during the design phase. The input voltage range for operation (pin 1) of the adjustable version is between (VQ + 0.5 V) and 40 V. Internal bias requirements dictate a minimum input voltage of 4.5 V. The dropout voltage for output voltages less than 4.0 V is (4.5 V − VQ). VQ + [(R1 ) R2) * Vref]ńR2 http://onsemi.com 7 NCV4276B Calculating Power Dissipation in a Single Output Linear Regulator The maximum power dissipation for a single output regulator (Figure 12) is: PD(max) + [VI(max) * VQ(min)] IQ(max) Heatsinks A heatsink effectively increases the surface area of the package to improve the flow of heat away from the IC and into the surrounding air. Each material in the heat flow path between the IC and the outside environment will have a thermal resistance. Like series electrical resistances, these resistances are summed to determine the value of RqJA: (1) ) VI(max)Iq where RqJA + RqJC ) RqCS ) RqSA VI(max) VQ(min) IQ(max) is the maximum input voltage, is the minimum output voltage, is the maximum output current for the application, Iq is the quiescent current the regulator consumes at IQ(max). Once the value of PD(max) is known, the maximum permissible value of RqJA can be calculated: o T RqJA + 150 C * A PD where RqJC is the junction−to−case thermal resistance, RqCS is the case−to−heatsink thermal resistance, RqSA is the heatsink−to−ambient thermal resistance. RqJC appears in the package section of the data sheet. Like RqJA, it too is a function of package type. RqCS and RqSA are functions of the package type, heatsink and the interface between them. These values appear in data sheets of heatsink manufacturers. Thermal, mounting, and heatsinking considerations are discussed in the ON Semiconductor application note AN1040/D. (2) The value of RqJA can then be compared with those in the package section of the data sheet. Those packages with RqJA less than the calculated value in Equation 2 will keep the die temperature below 150°C. In some cases, none of the packages will be sufficient to dissipate the heat generated by the IC, and an external heatsink will be required. IQ II VI SMART REGULATOR® (3) VQ } Control Features Iq Figure 12. Single Output Regulator with Key Performance Parameters Labeled http://onsemi.com 8 NCV4276B Thermal Model A discussion of thermal modeling is in the ON Semiconductor web site: http://www.onsemi.com/pub/collateral/BR1487−D.PDF. Table 1. DPAK 5−Lead Thermal RC Network Models Drain Copper Area (1 oz thick) 168 mm2 (SPICE Deck Format) 736 mm2 168 mm2 Cauer Network 168 mm2 736 mm2 Foster Network 736 mm2 Units Tau Tau Units C_C1 Junction GND 1.00E−06 1.00E−06 W−s/C 1.36E−08 1.361E−08 sec C_C2 node1 GND 1.00E−05 1.00E−05 W−s/C 7.41E−07 7.411E−07 sec C_C3 node2 GND 6.00E−05 6.00E−05 W−s/C 1.04E−05 1.029E−05 sec C_C4 node3 GND 1.00E−04 1.00E−04 W−s/C 3.91E−05 3.737E−05 sec C_C5 node4 GND 4.36E−04 3.64E−04 W−s/C 1.80E−03 1.376E−03 sec C_C6 node5 GND 6.77E−02 1.92E−02 W−s/C 3.77E−01 2.851E−02 sec C_C7 node6 GND 1.51E−01 1.27E−01 W−s/C 3.79E+00 9.475E−01 sec C_C8 node7 GND 4.80E−01 1.018 W−s/C 2.65E+01 1.173E+01 sec C_C9 node8 GND 3.740 2.955 W−s/C 8.71E+01 8.59E+01 sec C_C10 node9 GND 10.322 0.438 W−s/C 168 mm2 736 mm2 sec R’s R’s R_R1 Junction node1 0.015 0.015 C/W 0.0123 0.0123 C/W R_R2 node1 node2 0.08 0.08 C/W 0.0585 0.0585 C/W R_R3 node2 node3 0.4 0.4 C/W 0.0304 0.0287 C/W R_R4 node3 node4 0.2 0.2 C/W 0.3997 0.3772 C/W R_R5 node4 node5 2.97519 2.6171 C/W 3.115 2.68 C/W R_R6 node5 node6 8.2971 1.6778 C/W 3.571 1.38 C/W R_R7 node6 node7 25.9805 7.4246 C/W 12.851 5.92 C/W R_R8 node7 node8 46.5192 14.9320 C/W 35.471 7.39 C/W R_R9 node8 node9 17.7808 19.2560 C/W 46.741 28.94 C/W R_R10 node9 GND 0.1 0.1758 C/W NOTE: C/W Bold face items represent the package without the external thermal system. R1 Junction C1 R2 C2 R3 C3 Rn Cn Time constants are not simple RC products. Amplitudes of mathematical solution are not the resistance values. Ambient (thermal ground) Figure 13. Grounded Capacitor Thermal Network (“Cauer” Ladder) Junction R1 C1 R2 C2 R3 C3 Rn Cn Each rung is exactly characterized by its RC−product time constant; amplitudes are the resistances. Ambient (thermal ground) Figure 14. Non−Grounded Capacitor Thermal Ladder (“Foster” Ladder) http://onsemi.com 9 NCV4276B 110 100 qJA (C°/W) 90 80 70 60 1 oz 2 oz 50 40 30 150 200 250 300 350 400 450 500 550 600 650 700 750 COPPER AREA (mm2) Figure 15. qJA vs. Copper Spreader Area 100 Cu Area 167 mm2 Cu Area 736 mm2 R(t) C°/W 10 1.0 sqrt(t) 0.1 0.01 0.0000001 0.000001 0.00001 0.0001 0.001 0.01 0.1 1.0 10 100 1000 1.0 10 100 1000 TIME (sec) Figure 16. Single−Pulse Heating Curves 100 RqJA 736 mm2 C°/W 50% Duty Cycle 10 1.0 20% 10% 5% 2% 1% 0.1 Non−normalized Response 0.01 0.0000001 0.000001 0.00001 0.0001 0.001 0.01 0.1 PULSE WIDTH (sec) Figure 17. Duty Cycle for 1, Spreader Boards http://onsemi.com 10 NCV4276B ORDERING INFORMATION Device Output Voltage Accuracy Output Voltage Package Shipping† NCV4276BDTADJRKG 2% Adjustable DPAK, 5−Pin (Pb−Free) 2500 / Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. http://onsemi.com 11 NCV4276B PACKAGE DIMENSIONS DPAK 5, CENTER LEAD CROP DT SUFFIX CASE 175AA−01 ISSUE A −T− SEATING PLANE C B V NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. E R R1 Z A S DIM A B C D E F G H J K L R R1 S U V Z 1 2 3 4 5 U K F J L H D G 5 PL 0.13 (0.005) M INCHES MIN MAX 0.235 0.245 0.250 0.265 0.086 0.094 0.020 0.028 0.018 0.023 0.024 0.032 0.180 BSC 0.034 0.040 0.018 0.023 0.102 0.114 0.045 BSC 0.170 0.190 0.185 0.210 0.025 0.040 0.020 −−− 0.035 0.050 0.155 0.170 MILLIMETERS MIN MAX 5.97 6.22 6.35 6.73 2.19 2.38 0.51 0.71 0.46 0.58 0.61 0.81 4.56 BSC 0.87 1.01 0.46 0.58 2.60 2.89 1.14 BSC 4.32 4.83 4.70 5.33 0.63 1.01 0.51 −−− 0.89 1.27 3.93 4.32 T SOLDERING FOOTPRINT* 6.4 0.252 2.2 0.086 0.34 5.36 0.013 0.217 5.8 0.228 10.6 0.417 0.8 0.031 SCALE 4:1 mm Ǔ ǒinches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. SMART REGULATOR is a registered trademark of Semiconductor Components Industries, LLC (SCILLC). ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. 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