‘REPARED
BY:
DATE
SHARP
ELECTRONIC
SHARP
COMPONENTS
CROUP
SPEC
No.
PILE
No.
ED-93032
ISSUE
April
PACE
12
9,
Pages
REPRESENTATIVE
CORPORATION
DIVISION
0 PHOTOVOLTAICS
baOPTO-ELECTRONIC
0 ELECTRONIC
SPECIFICATION
DIV.
DEVICES
DI’
COMPONENTS
DIV.
0
0
1.
This
specification
sheets
include
the contents
Sharp
Corporation
(“Sharp”).
Please
keep them
important
information.
Please
don’t
reproduce
them \;i’thout
Sharp’s
consent,
2.
?lease
( :;
obey
This
Main
the
instructions
device
is designed
uses
of this
device
mentioned
below
under
the copyright
of
with
reasonable
care
as
or cause
anyone
reproduce
for
for
general
electronic
are as follows;
. Computer
OA equipment
-Telecommunication
* Measuring
equipment
*Tooling
machine
etc.
c * Home appliance,
l
(2)
Please
take
in case
this
high
reliability.
proper
device
steps
in
is used
Please
extremely
don’t
use
high
for
the
reliability
uses
mentioned
.Telecommunication
. Medical
element),
0 CUSTC.LIER’S
DATE
BY
APPROVAL
use
of
this
device.
equipment.
equipment
equipment
(Terminal)
I
order
to maintain
reliabflity
for
the uses mentioned
belov
-Unit
concerning
control
and safety
of
automobile
etc.)
*Gas
leak
detection
box and burglar
alarm
box
[ *Fire
*Other
0)
.AV
actual
a vehicle
breaker
safety
below
equipment
equipment
and
which
(air
plane,
* Traffic
equipment,
which
safety,
require
train,
signal
etc.
3
require
(Trunk)
(relating
etc.
to
any
fatal
1
PRESENTED
BY
T. Fla tsrimura
,
Department
General
Engineering
Dept.,
Opto-Electronic
ELECOM
Group
SHARP
CORPORATION
1993
Manager
of
TI
Devices
Div.
PAGE
1.
Application
This specification
photocoupler
Model
2.
outline
and characteristics
of
Outline
Refer
3.
applies
to the
No. PC3Q64.
to the attached
Ratings
3.1
drawing
No.
CY5888K02.
and characteristics
Absolute
maximum ratings
Ta=25'C
1
Parameter
, Input
*l
Forward
*2
Peak forward
*l
Power
1
I
!Output
,
I
Symbol
current
Rating
/
+50
IFM
i
21
p
i
70
35
!
j
I1
6
i
IF
current
!
!
dissipation
Collector-emitter
voltage
VCEO
Emitter-collector
voltage
VECO
1
I
1
Ic
I
50
PC
I
150
Collector
current
*l
Collector
power
*l
Total
power
Operating
I
dissipation
factors
of absolute
maximum rating
are shown in Fig.
1 'L 4.
*2
Pulse
5 lOOps,
*3
AC for
*4
For
10 s
Cuty
ratio
40 "u 60%RH, f=60Hz
: 0.001
(Refer
I
I
mW
V
(
vi
;mt;
, i
! mW i
I
due to ambient
to Fig.
mA
A
temperature
The derating
temperature
1 min.,
;
1
dissipation
*1
width
j Unit
5)
3.2
Electra-optical
characteristics
Ta=25"C
-
Parameter
Forward
j Symbol
MIN.
/
"F
___-._./
j
ct
I -
voltage
Input
Terminal
Dark
output
capacitance
current
Collector-emitter
breakdown
voltage
Collector
current
Collector-emitter
saturation
voltage
Transfer
characteristics
Isolation
j 250
1 100
; d
-
1
I
v /Ic=O.lmA
j IF=0
6
-
1 /
;
;
"
Ic
0.2
j 1
] 4.0
j
/ d
I
1j 0.1
j 0.2
!
/
'
i-
Riso
5x1010
loll
/ I
Floating
capacitance
i
Cf
I
Response
time
(Rise)
Response
time
(Fall)
1
I
&E=20",
,
-
1
/
'"CE(sat)
resistance
30
'IF='2Oti
I
i pF $=O, f=lkHz
1.0
I 0.6
1
1 18
/
tr
-
'
4
tf
-
1 3
j
/
/
II
"
35
BVCEO
1
I
1.4
/-
:
Conditions
1.2
I
I
/ BVECO
I
Emitter-collector
brakdown voltage
1
i-
'CEO
MAX. 1 Unit/
f
' TYP.
j
IF=0 I
;I~=l@ki,
I
IF=0 1
I
&=tld
/"CE=5"
1
;
" i1F=+20ti
/Ic=lmA
1
1 $rj iDC500V
/40 ?r 60%RH
1
I
i pF fV=O, f=lMHz
1
I
/
i
18
j ,,s VCE=2V
I
Ic=2mA
,1 us lRL=lOOO
I
I
(PAGE
IMODEL No.
I
4.
pc3Q64
I
Reliability
Refer
5.
to the
Incoming
Refer
6.
attached
sheet,
Page
7.
sheet,
Page
8.
inspection
to the
attached
Supplements
6.1
Isolation
voltage
shall
be measured
following
Short between anode and cathode
on the primary
between collector
and Emitter
on the secondary
(2)
The dielectric
be used,
(3)
The waveform of applied
(It is recommended
that
in insulation
oil)
withstand
6.3
(I)
This
product
is not
(2)
This
product
is
(3)
This
product
incorporates
Refer
AC input
with
voltage
shall
the isolation
product
Package
is
tester
This
6.5
the
(1)
6.2
6.4
in
zero-cross
UL : Under
attached
preparation
side
side.
and
circuit
shall
be a sine wave.
voltage
be measured
type.
designed
assembled
as radiation
with
sheet,
non coherent
Page
hardened.
electrical
specifications
to the
method.
9 to 11.
input
light
and output.
emitting
diode.
3
jh4ODEL
I
7.
PC3Q64
I
Notes
7.1
For cleaning
* Cleaning
(1)
Solvent
(2)
Ultrasonic
conditions:
cleaning:
* The cleaning
Solvent:
cleaning:
shall
Solvent
te perature
45°C
Immersion
3 min. or less
or less
Affection
to device
by ultrasonic
cleaning
has
different
affection
by cleaning
bath size,
ultrasonic
power output,
cleaning
time,
PWB size
or device
mounting
condition
etcIf user
carries
out ultrasonic
cleaning,
user should
select
fit
condition
that doesn't
occur defect.
be carried
Ethyl
Freon
out
alcohol,
TE.TF,
with
solvent
Methyl
alcohol,
Daiflon-solvent
below.
Isopropyl
S3-E
alcohol
Please
refrain
from using Chloro Fluoro
Carbon type solvent
to clean
devices
as much as possible
since it is restricted
to protect
the
ozonosphere.
Before
you use alternative
solvent
you are requested
to confirm
that it does not damage package resin.
7.2
On mounting
In mounting
this device,
please
perform
soldering
reflow
satisfied
with the conditions
indicated
in page 12.
And please
pay attention
not to occur the temperature
rising
of the package sectionally.
8.
Others
Any doubt as to this specification
upon mutual
consultation
of the
both
shall
be determined
parties.
.
1 PAGE
No.
in
good
faith
4
SHARI=
PC3Q64
Date
I---
code
Page
5
*l
Iiurr
-i 1lax.
0.2
l-t
Pin Nos*
connection
and internal
diagram
e
@Qa
Q@
aDQ!J @
T
P C 3 Q.6 4
Q
m
d
$1
4
-.-cu
d
-
d
l tl
W I
Epoxy
resin
.’
Date code is composed of 2-digit
to DIN standard
and the,following
number marked
weekly code
First
week :1
Second week : 2
Third weed : 3
Fouth week : 4
Fifth,
Sixth week : 5
UNIT
Name
rawin
0.
according
.
:l/lmm
PC3Q64
Outline
Dimensions
cy5888KO2
1
SHARP
Page 6
Fig.
-‘Tr
1
Forward
ambient
0
Ambient2~empe~~tu~~
Fig . 3
'!'~"(oC)
Collector
power dissipation
vs. ambient
temperature
-
Fig.
current
vs.
temperature
4.2
n
2
Diode power
vs. ambient
Ambitnt
Fig.
4
-
dissipation
temperature
55 75
fzmperature
Total
power
vs. ambient
100
Ta ("C)
dissipation
temperature
.a
200
150
\
100 -
100 --
\
50 -1501
-30
Ambiint
5
Peak
VS.
?zrnpe?\tuJ:
T'aoo(“C)
forward
current
duty ratio
Pulse width
S 100~
Ta = 25C
Duty
ratio
“l
*
I
4.
Reliability
The reliability
of products
shall
PC3Q64
be satisfied
with
Confidence
!
/
Test
Items
Test
level
Conditions
]
j Solderability
Soldering
heat
Terminal
(Bending)
strength
Variable
vibration
Failure
Judgement
Criteria
: 10%/20%
Samples
(n)l
Defective(C)
,
I
n=ll,
C=O
*2
i 260°C,
10 s
!
1
; VF > u x 1.2
I/
j I CEO ‘, u x 2
I
IC < L x 0.7
n=ll,
C=O
n=ll,
C=O
1 n=ll,
C=O
'
,
I
1
/
/
frequency
Weight
: lNtO.lkgf]
1 time/each
terminal
15000m/s2{1500G],
0.5ms
3 times/?X,
?Y, ?Z direction
i 100 2, 2000 s 100 Hz/4
j 4 times/X,Y,Z
direction
1 200m/s2t20G]
min.
-40°C Q, +125"C
(30min.)
(30min.)
j 20 cycle test
High temp. and high
humidity
storage
i +85"C,
i
] n=ll,
9
1
!
i n=22,
'CE(sat)
>ux1.2
: 1 cycle
i
85%RH,
500h
j
,
jU:
i
I
storage
1 +125"C,
storage
i -4O"C,
/
life
lOOOh
' Ta=25"C,
IF=?5OmA
Ptot=l-/OmW,
lOOOh
/
*1
Solder
shall
lead and pin
adhere at the
hole or other
*2
The lead pin
root of lead
depth
pins.
*3
Terminal
bending
Weight
dipped
(Refer
direction
: lNfO.lkgf)
/
I
I
Upper
specification.
is
shown below.
C=()
n=22,
C=O
I n=22,
C=O
n=22,
C=O
n=22,
C=O
limit
Lower
specification
limit
area of 95% or more of immersed
holes shall
not be concentrated
into
solder
shall
to the below)
C=O
!
lOOOh
:L:
Low temp.
Operation
: 90%, LTPD
5 s
shock
temp.
below.
i 23O"C,
Temperature
cycling
High
listed
*l
*3
Mechanical
items
7
I
be away 0.2mm
!
portion
of
on one portion.
from
the
IPAGE
IMODEL rb.
I
5.
Incoming
I
inspection
5.1
Inspection
(1)
items
Electrical
characteristics
VCE(sat J,
VFY ICE09
(2)
5.2
PC3Q64
method
and Inspection
A single
sampling
plan,
MIL-STD-105D
is applied.
items
are shown below.
Major
defect
Minor
defect
Riso,
Viso
Aplpearance
Sampling
Defect
Ic,
1
Inspection
Electrical
Unreadable
Appearance
the above
level
normal inspection
The AQL according
item
characteristics
marking
defect
except
mensioned.
level
to
I
1 Inspection
!
i
!
I
1
Normal
inspection
Normal
inspection
II
the
based on
inspection
level
AQL(%)
I
II
II
j
!
!
I
j
0.1
0.4
8
MODEL Noa
6.2
Package
6.2.1
(1)
(2)
Taping
Tape
conditions
structure
(Refer
and
The tape shall
pressed
on the
static
electricity.
have a structure
carrier
tape of
Reel
and
structure
Direction
of
attached
sheet,
Page
Dimensions
in which
a cover
hard vinylchloride
(Refer
to
shall
be of corrugated
attached
drawing.
product
insertion
the
tape is sealed
heatto protect
against
attached
cardboard
(Refer
to
the
with
attached
Joint
of
tape
to
and
repair
Adhesiveness
tape
carrier
taped
of
The exfoliation
0.2Ni20gf)s
6.2.3
sheet,
Page
its
dimensions
sheet,
11)
Page
11)
shall
direct
to
the
Rolling
anode
mark
at
tape
cover
The way
carrier
tape.
tape
in
failure
sha 11 be joint
one reel
cover
and
of
the
carrier
cutting
tape
portion
tape
force
lN{lOOgf]for
method
less.
devices
The way to repair
tap’ed failure
devices
cut a bottom
and after
replacing
to good devices,
with
a cutter,
shall
be sealed
with
adhesive
tape.
6.2.2
10)
4
The
(5)
to the
Dimensions
Product
direction
in
the hole
side
on the
(4)
between
the
carrier
tape and cover
angle
from 160” to 180”.
tape
shall
be
quanfity
Wind the tape back on the reel
so that
the cover
tape will
be outside
Attach
more than 20cm of blank
tape to the trailer
and the
the tape.
leader
of the tape and fix
the both ends with
adh sive tape.
One reel
shall
contain
1000 PCS.
6.2.4
Marking
The
outer
packaging
* Model
6 -2.3 -
Storage
No.
Safety
case
* Number
shall
of
be marked
pieces
with
following
information.
* Production
delivered
date
condition
Taped procuts
5 ‘L 30°C and
6.2.6
9
specifications
The taping
reel
as shown in the
(3)
PAGE
pc3Q64
shall
be stored
at
the humidities
lower
protection
There
shall
characteristecs
during
the tempera
ure
than 70ZRH.
lower
than
shipping
be no deformation
of
due to shipping.
component
or degradation
of
electrical
SHARI=
Tape
Page 10
structure
and Dimensions
I
5” max
Dimension
1
A
list
i
C
(Unit
t
:‘mm)
D
E
F
G
I 24. oto. 3 I 11. 5?0. 1 I 1.75+0. 1 12.OYJ.l 2.0+0.1 4.WO.I
10.4io. 05 I 3.oio.1 I 7.4iO.l
Ii
)1.5’>’
I
LO.8+-O.1
Page 11
SHARI=
Reel
structure
and DimensTons
Dimension
a
list
b.
330 25.5Al.5
Direction
(Unit
: mm)
f
lO;!l. 0 1310. 5 23:l. 0 2.010.5
of product
d
2. Ok 5
insertion
Pull-out
direction
MODEL
I’b.
PAGE
PC3Q64
Precautions
I.
If
solder
for
Soldering
Photocouplers
reflow:
be done at the
It is recommended
that only one soldering
the temperature
profile
as
temperature
and the time within
shown in the figure.
,
2 min.
--__-_--
L--
--; Ii37,
! * 1 min:'
'1.5
2.
Other
i;
c
1 min.
‘!1
i
min.
precautions
An infrared
localized
temperature
the resin
lamp used to heat up for soldering
may cause a
temperature
rise in the resin.
So keep the package
within
that specified
in Item 1. Also avoid immersing
part in the solder.
12