SKR 18,2 Qu bond Absolute Maximum Ratings Symbol Conditions VRRM IF(AV) 2 Values Unit Tj = 25 °C, IR = 2 mA 1600 V Tc = 80 °C, Tj = 150 °C 320 A 151300 A2s Tj = 25 °C 7000 A Tj = 150 °C 5500 A 150 °C it Tj = 150 °C, 10 ms, sin 180° IFSM 10 ms sin 180° Tjmax DIODE Electrical Characteristics IF(DC) = 380 A VRRM = 1600 V Size: 18,2 mm x 18,2 mm SKR 18,2 Qu bond Symbol Conditions IR VF min. typ. max. Unit Tj = 25 °C, VRRM 2 mA Tj = 120 °C, VRRM 3.3 mA Tj = 25 °C, IF = 360 A 1 1.21 V Tj = 125 °C, IF = 360 A 0.9 1.1 V V(TO) Tj = 125 °C 0.83 V rT Tj = 125 °C 0.5 mΩ trr Tj = 25 °C, ± 1 A 53 µs Thermal Characteristics Features • high current density due to mesa technology • high surge current • compatible to thick wire bonding • compatible to all standard solder processes Typical Applications* Symbol Conditions min. typ. max. Unit °C Tj -40 150 Tstg -40 150 °C Tsolder 10 min. 250 °C Tsolder 5 min. 320 °C Rth(j-c) Semipack 2 assembly 0.18 K/W Values Unit 18.2 x 18.2 mm2 331.24 mm2 • uncontrolled rectifier bridges Mechanical Characteristics Symbol Conditions Raster size Area total Anode bondable (Al) Cathode solderable (Ag/Ni) Al, diameter ≤ 500 µm Wire bond Package tray Chips / Package 16 pcs SKR © by SEMIKRON Rev. 1 – 19.02.2010 1 SKR 18,2 Qu bond This is an electrostatic discharge sensitive device (ESDS), international standard IEC 60747-1, Chapter IX * The specifications of our components may not be considered as an assurance of component characteristics. Components have to be tested for the respective application. Adjustments may be necessary. The use of SEMIKRON products in life support appliances and systems is subject to prior specification and written approval by SEMIKRON. We therefore strongly recommend prior consultation of our personal. 2 Rev. 1 – 19.02.2010 © by SEMIKRON