SMTYxxA Low forward voltage TVS: Transky™ Main applications ■ A Power rail ESD transient over-voltages and reverse voltages protection for 5 and 12 V supplied IC’s K Description SMA (JEDEC DO-214AC) The Transky is designed specifically for miniaturized electronic devices and equipment subject to ESD transient over-voltages. The Transky combines the performance of a Transil™ or TVS (Transient Voltage Suppressor) and low forward voltage Schottky diode in a monolithic structure. K It offers both an overshoot protection in the 6.4 V or 13.2 V clamping ranges and a negative spike protection in the -0.48 V clamping range compared to the -1 V with the standard Transil family on the 5 or 12 V power line. Its 600 W power capability offers high transient capability with SMA package. Features ■ Integration of a Transil with a Schottky diode ■ JEDEC registred SMA package outline ■ Low clamping factor VCL/VBR ■ Fast response time ■ RoHS compliant A Order code Benefits ■ Optimized PCB area: up to 62% space saving versus discrete solution ■ High peak pulse power: up to 600 W ■ Stand-off voltage: 5 V for SMTY5.0A 12 V for SMTY12A ■ ■ Part number Marking SMTY5.0A Y5.0 SMTY12A Y12 Complies with following standard IEC 61000-4-2 Level 4 Air discharge 15 kV Contact discharge 8 kV Low forward voltage: 0.48 V @ 1 A Very low leakage current: 10 µA @ 5 V for SMTY5.0A 20 µA @12 V for SMTY12A April 2006 Rev 1 1/7 www.st.com 7 Characteristics 1 SMTYxxA Characteristics Table 1. Absolute ratings (limiting value) Symbol Parameter Value Unit IEC 61000-4-2 level 4 standard Air discharge Contact discharge 15 8 kV Power dissipation on infinite heatsink Tamb = 25° C 4 W PPP Peak pulse Power dissipation (1) Tj initial = Tamb 600 W IFSM Non repetitive surge peak forward current tp=10 ms Tj initial = Tamb 40 A Tstg Storage temperature range -65 to +175 °C 150 °C Vpp P Maximum operating junction temperature (2) Tj 1. 10/1000µs pulse waveform dPtot --------------dTj 2. 1 - thermal runaway condition for a Transky < ------------------------Rth ( j – a ) Table 2. Thermal resistance Symbol Parameter Unit Rth(j-a) Junction to ambient on printed circuit 120 °C/W Rth(j-l) Junction to lead 30 °C/W Table 3. Electrical characteristics Symbol Parameter IRM Leakage current @ VRM VRM Stand-off voltage VBR Breakdown voltage IR Reverse leakage current VCL Clamping voltage IPP Peak pulse current VF Forward voltage drop I IF VF VCL VBR VRM IRM max @ VRM V IRM IR IPP IRM max @ VCLmax @ IPP VBR min @ IR VRM @ 85° C 10/1000 µs VF max @ 1A (1) αT max µA V mA V V mA V A V 10-4/°C SMTY5.0A 10 5 0.5 5 6.4 10 9 43.5 0.48 10 SMTY12A 20 12 1.2 12 13.2 1 18.5 31 0.48 10 1. Pulse test tp = 500 µs, δ < 2% 2/7 Value SMTYxxA Figure 1. Characteristics Pulse waveform (10/1000 µs) Figure 2. Peak pulse power versus exponential pulse duration (Tj initial = 25° C) Ppp(kW) 1.E+01 I Tj initial = 25 °C Pulse waveform 10/1000 µs 1.E+00 tp(ms) tp = 10 µs Figure 3. 110 1000 µs 1.E-01 0.01 Relative variation of peak pulse power versus initial junction temperature 0.10 Figure 4. 1.00 10.00 Average power dissipation versus ambient temperature P(W) % 4.5 100 4.0 90 3.5 Rth(j-a)=Rth(j-l) 80 3.0 70 60 2.5 50 2.0 40 Rth(j-a)=120 °C/W (PCB FR4, recommended pad layout) 1.5 30 1.0 20 10 0.5 Tj(°C) Tamb(°C) 0 0.0 0 25 Figure 5. 50 75 100 125 150 175 0 25 Variation of thermal impedance, Figure 6. junction to ambient, versus pulse duration (Epoxy, FR4, eCu = 35 µm) Zth(j-a) (°C/W) 50 75 100 125 150 Thermal resistance, junction to ambient, versus copper surface under each lead (printed circuit board FR4, eCu = 35 µm) Rth(j-a) (°C/W) 1000.0 140 SCU=3 mm² Recommended pad layout 120 100.0 100 80 10.0 60 40 1.0 20 tp(s) 0.1 1.E-03 SCU(cm²) 0 1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 3/7 Ordering information scheme Figure 7. 10.00 SMTYxxA Forward voltage drop versus forward current (typical values) IF (A) Figure 8. 1.E+04 Reverse leakage current versus junction temperature (typical values) IR(µA) 1.E+03 1.00 T j =85 °C SMTY12A VR= 12 V 1.E+02 T j =25 °C SMTY5.0A VR= 5 V 1.E+01 0.10 1.E+00 T j(°C) V F (V) 0.01 0.0 1.E-01 0.1 Figure 9. 100.0 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 0 25 50 75 100 125 SMTY5.0A Clamping voltage versus Figure 10. SMTY12A Clamping voltage versus peak pulse current (typical values) peak pulse current (typical values) IPP(A) 100.0 Tj initial =25 °C IPP(A) Tj initial =25 °C 8/20 µs 10.0 8/20 µs 10.0 10/1000 µs 10/1000 µs 1.0 1.0 SMTY12A SMTY5.0A VCL(V) VCL(V) 0.1 0.1 4.0 2 4.5 5.0 5.5 6.0 6.5 7.0 7.5 8.0 8.5 9.0 9.5 10.0 10 11 12 13 14 15 Ordering information scheme SMTY xx A Transky Stand off voltage 5.0 = 5 V 12 = 12 V Package A = SMA package 4/7 150 16 17 18 19 20 SMTYxxA Package information 3 Package information Table 4. SMA (plastic) dimensions Dimensions Ref. Figure 11. Footprint dimensions (millimeter) 5.49 Millimeters Min. Max. Min. Max. A1 1.90 2.03 0.075 0.080 A2 0.05 0.20 0.002 0.008 b 1.25 1.65 0.049 0.065 c 0.15 0.41 0.006 0.016 E 4.80 5.60 0.189 0.220 E1 3.95 4.60 0.156 0.181 D 2.25 2.95 0.089 0.116 L 0.75 1.60 0.030 0.063 Figure 12. Marking information scheme Cathode bar (unidirectional devices only ) e3 1.67 1.87 1.75 Inches x x x z y ww e3: ECOPACK ( Leadfree) XXX : Marking Z : Manufacturing location Y : Year WW : week 1.87 In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. 5/7 Ordering information 4 5 6/7 SMTYxxA Ordering information Ordering type Marking Package Weight Base quantity Delivery mode SMTY5.0A Y5.0 SMA 0.068g 5000 Tape and Reel SMTY12A Y12 SMA 0.068g 5000 Tape and Reel Revision history Date Revision 24-Apr-2006 1 Changes Initial release. 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