SCLS430K − MAY 1999 − REVISED APRIL 2005 2Y1 2Y0 3Y1 3-COM 3Y0 INH GND GND 15 3 14 4 13 5 12 6 11 7 10 8 9 2Y0 3Y1 3-COM 3Y0 INH GND VCC 2-COM 1-COM 1Y1 1Y0 A B C 1 16 2 15 3 14 4 13 5 12 6 11 10 7 8 Applications include signal gating, chopping, modulation or demodulation (modem), and signal multiplexing for analog-to-digital and digital-to-analog conversion systems. 2-COM 1-COM 1Y1 1Y0 A B 9 GND The ’LV4053A devices handle both analog and digital signals. Each channel permits signals with amplitudes up to 5.5 V (peak) to be transmitted in either direction. 16 2 SN74LV4053A . . . RGY PACKAGE (TOP VIEW) description/ordering information These triple 2-channel CMOS analog multiplexers/demultiplexers are designed for 2-V to 5.5-V VCC operation. 1 VCC D All Ports High On-Off Output-Voltage Ratio Low Crosstalk Between Switches Individual Switch Controls Extremely Low Input Current Latch-Up Performance Exceeds 250 mA Per JESD 17 ESD Protection Exceeds JESD 22 − 2000-V Human-Body Model (A114-A) − 200-V Machine Model (A115-A) − 1000-V Charged-Device Model (C101) C D D D D D SN54LV4053A . . . J OR W PACKAGE SN74LV4053A . . . D, DB, DGV, N, NS, OR PW PACKAGE (TOP VIEW) 2Y1 D 2-V to 5.5-V VCC Operation D Support Mixed-Mode Voltage Operation on ORDERING INFORMATION PACKAGE† TA Tube of 25 SN74LV4053AN SN74LV4053AN QFN − RGY Reel of 1000 SN74LV4053ARGYR LW053A Tube of 40 SN74LV4053AD Reel of 2500 SN74LV4053ADR SOP − NS Reel of 2000 SN74LV4053ANSR 74LV4053A SSOP − DB Reel of 2000 SN74LV4053ADBR LW053A Tube of 90 SN74LV4053APW Reel of 2000 SN74LV4053APWR Reel of 250 SN74LV4053APWT TVSOP − DGV Reel of 2000 SN74LV4053ADGVR LW053A CDIP − J Tube of 25 SNJ54LV4053AJ SNJ54LV4053AJ CFP − W Tube of 150 SNJ54LV4053AW TSSOP − PW −55°C to 125°C TOP-SIDE MARKING PDIP − N SOIC − D −40°C to 85°C ORDERABLE PART NUMBER LV4053A LW053A SNJ54LV4053AW † Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Copyright 2005, Texas Instruments Incorporated ! "#$%&'( $#()(! (*#+&)#( $%++'( )! #* ,%-.$)#( ")'/ +#"%$! $#(*#+& # !,'$*$)#(! ,'+ ' '+&! #* '0)! (!+%&'(! !)(")+" 1)++)(2/ +#"%$#( ,+#$'!!(3 "#'! (# ('$'!!)+.2 ($.%"' '!(3 #* ).. ,)+)&''+!/ POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 1 SCLS430K − MAY 1999 − REVISED APRIL 2005 FUNCTION TABLE INPUTS B A ON CHANNELS INH C L L L L 1Y0, 2Y0, 3Y0 L L L H 1Y1, 2Y0, 3Y0 L L H L 1Y0, 2Y1, 3Y0 L L H H 1Y1, 2Y1, 3Y0 L H L L 1Y0, 2Y0, 3Y1 L H L H 1Y1, 2Y0, 3Y1 L H H L 1Y0, 2Y1, 3Y1 L H H H 1Y1, 2Y1, 3Y1 H X X X None logic diagram (positive logic) 15 14 A 12 2 2 1Y1 2Y0 2Y1 9 5 3 INH 1Y0 10 1 C 1-COM 11 13 B 2-COM 6 4 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 3Y0 3Y1 3-COM SCLS430K − MAY 1999 − REVISED APRIL 2005 absolute maximum ratings over operating free-air temperature range (unless otherwise noted)† Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V Input voltage range, VI (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V Switch I/O voltage range, VIO (see Notes 1 and 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to VCC + 0.5 V Input clamp current, IIK (VI < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −20 mA I/O diode current, IIOK (VIO < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −50 mA Switch through current, IT (VIO = 0 to VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±25 mA Continuous current through VCC or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±50 mA Package thermal impedance, θJA (see Note 3): D package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73°C/W (see Note 3): DB package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82°C/W (see Note 3): DGV package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 120°C/W (see Note 3): NS package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64°C/W (see Note 3): PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 108°C/W (see Note 4): RGY package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39°C/W Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed. 2. This value is limited to 5.5 V maximum. 3. The package thermal impedance is calculated in accordance with JESD 51-7. 4. The package thermal impedance is calculated in accordance with JESD 51-5. recommended operating conditions (see Note 5) SN54LV4053A VCC VIH Supply voltage High-level input voltage, control inputs VIL Low-level input voltage, control inputs VI VIO Control input voltage ∆t/∆v MIN 2‡ VCC = 2 V VCC = 2.3 V to 2.7 V VCC = 3 V to 3.6 V VCC = 4.5 V to 5.5 V Input transition rise or fall rate 5.5 MIN 2‡ 1.5 1.5 VCC × 0.7 VCC × 0.7 VCC × 0.7 VCC × 0.7 VCC × 0.7 VCC × 0.7 VCC = 2 V VCC = 2.3 V to 2.7 V 0.5 0 0 VCC = 2.3 V to 2.7 V VCC = 3 V to 3.6 V VCC = 4.5 V to 5.5 V VCC × 0.3 5.5 VCC 200 MAX 5.5 UNIT V V 0.5 VCC × 0.3 VCC × 0.3 VCC = 3 V to 3.6 V VCC = 4.5 V to 5.5 V Input/output voltage MAX SN74LV4053A VCC × 0.3 VCC × 0.3 0 0 VCC × 0.3 5.5 V V VCC 200 V 100 100 ns/V 20 20 TA Operating free-air temperature −55 125 −40 85 °C ‡ With supply voltages at or near 2 V, the analog switch on-state resistance becomes very nonlinear. It is recommended that only digital signals be transmitted at these low supply voltages. NOTE 5: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. (*#+&)#( $#($'+(! ,+#"%$! ( ' *#+&)4' #+ "'!3( ,)!' #* "'4'.#,&'(/ )+)$'+!$ ")) )(" #'+ !,'$*$)#(! )+' "'!3( 3#).!/ '0)! (!+%&'(! +'!'+4'! ' +3 # $)(3' #+ "!$#((%' '!' ,+#"%$! 1#% (#$'/ POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 3 SCLS430K − MAY 1999 − REVISED APRIL 2005 electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) TEST CONDITIONS PARAMETER VCC MIN TA = 25°C TYP MAX SN54LV4053A MIN MAX SN74LV4053A MIN MAX IT = 2 mA, VI = VCC or GND, VINH = VIL (see Figure 1) 2.3 V 41 180 225 225 3V 30 150 190 190 4.5 V 23 75 100 100 IT = 2 mA, VI = VCC to GND, VINH = VIL 2.3 V 139 500 600 600 3V 63 180 225 225 4.5 V 35 100 125 125 Difference in on-state resistance between switches IT = 2 mA, VI = VCC to GND, VINH = VIL 2.3 V Control input current VI = 5.5 V or GND IS(off) IS(on) On-state switch resistance ron ron(p) ∆ron II ICC CIC Peak on-state resistance UNIT Ω Ω 2 30 40 40 3V 1.6 20 30 30 4.5 V 1.3 15 20 20 0 to 5.5 V ±0.1 ±1 ±1 µA Off-state switch leakage current VI = VCC and VO = GND, or VI = GND and VO = VCC, VINH = VIH (see Figure 2) 5.5 V ±0.1 ±1 ±1 µA On-state switch leakage current VI = VCC or GND, VINH = VIH (see Figure 3) 5.5 V ±0.1 ±1 ±1 µA Supply current VI = VCC or GND 5.5 V 20 20 µA Control input capacitance Ω 2 pF CIS Common terminal capacitance 8.2 pF COS Switch terminal capacitance 5.6 pF CF Feedthrough capacitance 0.5 pF switching characteristics over recommended operating free-air temperature range, VCC = 2.5 V ± 0.2 V (unless otherwise noted) PARAMETER TA = 25°C TYP MAX SN74LV4053A TO (OUTPUT) TEST CONDITIONS COM or Yn Yn or COM CL = 15 pF (see Figure 4) 2.5 10 16 16 ns MIN MIN MAX MIN MAX UNIT tPLH tPHL Propagation delay time tPZH tPZL Enable delay time INH COM or Yn CL = 15 pF (see Figure 5) 7.6 18 23 23 ns tPHZ tPLZ Disable delay time INH COM or Yn CL = 15 pF (see Figure 5) 7.7 18 23 23 ns tPLH tPHL Propagation delay time COM or Yn Yn or COM CL = 50 pF (see Figure 4) 4.4 12 18 18 ns tPZH tPZL Enable delay time INH COM or Yn CL = 50 pF (see Figure 5) 8.8 28 35 35 ns tPHZ tPLZ Disable delay time INH COM or Yn CL = 50 pF (see Figure 5) 11.7 28 35 35 ns (*#+&)#( $#($'+(! ,+#"%$! ( ' *#+&)4' #+ "'!3( ,)!' #* "'4'.#,&'(/ )+)$'+!$ ")) )(" #'+ !,'$*$)#(! )+' "'!3( 3#).!/ '0)! (!+%&'(! +'!'+4'! ' +3 # $)(3' #+ "!$#((%' '!' ,+#"%$! 1#% (#$'/ 4 SN54LV4053A FROM (INPUT) POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 SCLS430K − MAY 1999 − REVISED APRIL 2005 switching characteristics over recommended operating free-air temperature range, VCC = 3.3 V ± 0.3 V (unless otherwise noted) PARAMETER TA = 25°C TYP MAX SN54LV4053A SN74LV4053A FROM (INPUT) TO (OUTPUT) TEST CONDITIONS COM or Yn Yn or COM CL = 15 pF (see Figure 4) 1.6 6 10 10 ns MIN MIN MAX MIN MAX UNIT tPLH tPHL Propagation delay time tPZH tPZL Enable delay time INH COM or Yn CL = 15 pF (see Figure 5) 5.3 12 15 15 ns tPHZ tPLZ Disable delay time INH COM or Yn CL = 15 pF (see Figure 5) 6.1 12 15 15 ns tPLH tPHL Propagation delay time COM or Yn Yn or COM CL = 50 pF (see Figure 4) 2.9 9 12 12 ns tPZH tPZL Enable delay time INH COM or Yn CL = 50 pF (see Figure 5) 6.1 20 25 25 ns tPHZ tPLZ Disable delay time INH COM or Yn CL = 50 pF (see Figure 5) 8.9 20 25 25 ns switching characteristics over recommended operating free-air temperature range, VCC = 5 V ± 0.5 V (unless otherwise noted) PARAMETER FROM (INPUT) TO (OUTPUT) TEST CONDITIONS MIN TA = 25°C TYP MAX SN54LV4053A MIN MAX SN74LV4053A MIN MAX UNIT tPLH tPHL Propagation delay time COM or Yn Yn or COM CL = 15 pF (see Figure 4) 0.9 4 7 7 ns tPZH tPZL Enable delay time INH COM or Yn CL = 15 pF (see Figure 5) 3.8 8 10 10 ns tPHZ tPLZ Disable delay time INH COM or Yn CL = 15 pF (see Figure 5) 4.6 8 10 10 ns tPLH tPHL Propagation delay time COM or Yn Yn or COM CL = 50 pF (see Figure 4) 1.8 6 8 8 ns tPZH tPZL Enable delay time INH COM or Yn CL = 50 pF (see Figure 5) 4.3 14 18 18 ns tPHZ tPLZ Disable delay time INH COM or Yn CL = 50 pF (see Figure 5) 6.3 14 18 18 ns (*#+&)#( $#($'+(! ,+#"%$! ( ' *#+&)4' #+ "'!3( ,)!' #* "'4'.#,&'(/ )+)$'+!$ ")) )(" #'+ !,'$*$)#(! )+' "'!3( 3#).!/ '0)! (!+%&'(! +'!'+4'! ' +3 # $)(3' #+ "!$#((%' '!' ,+#"%$! 1#% (#$'/ POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 5 SCLS430K − MAY 1999 − REVISED APRIL 2005 analog switch characteristics PARAMETER Frequency response (switch on) FROM (INPUT) COM or Yn Crosstalk (between any switches) Feedthrough attenuation (switch off) TEST CONDITIONS Yn or COM COM or Yn Crosstalk (control input to signal output) Sine-wave distortion TO (OUTPUT) Yn or COM INH COM or Yn COM or Yn Yn or COM COM or Yn Yn or COM VCC TA = 25°C TYP CL = 50 pF, RL = 600 Ω,, fin = 1 MHz (sine wave) (see Note 6 and Figure 6) 2.3 V 30 3V 35 4.5 V 50 CL = 50 pF, RL = 600 Ω,, fin = 1 MHz (sine wave) (see Note 7 and Figure 7) 2.3 V −45 3V −45 4.5 V −45 CL = 50 pF, RL = 600 Ω,, fin = 1 MHz (square wave) (see Figure 8) 2.3 V 20 3V 35 4.5 V 65 CL = 50 pF, RL = 600 Ω,, fin = 1 MHz (see Note 7 and Figure 9) 2.3 V −45 3V −45 4.5 V −45 CL = 50 pF, RL = 10 kΩ, fin = 1 kHz (sine wave) (see Figure 10) 2.3 V 0.1 3V 0.1 4.5 V 0.1 VI = 2 Vp-p VI = 2.5 Vp-p VI = 4 Vp-p UNIT MHz dB mV dB % NOTES: 6. Adjust fin voltage to obtain 0-dBm output. Increase fin frequency until dB meter reads −3 dB. 7. Adjust fin voltage to obtain 0-dBm input. operating characteristics, VCC = 3.3 V, TA = 25°C PARAMETER Cpd TEST CONDITIONS Power dissipation capacitance CL = 50 pF, f = 10 MHz PARAMETER MEASUREMENT INFORMATION VCC VINH = VIL VCC VI = VCC or GND VO (ON) GND r on + 2 mA V VI − VO Figure 1. On-State Resistance Test Circuit 6 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 VI – VO 2 10 –3 W TYP UNIT 5.3 pF SCLS430K − MAY 1999 − REVISED APRIL 2005 PARAMETER MEASUREMENT INFORMATION VCC VINH = VIH VCC A VI VO (OFF) GND Condition 1: VI = 0, VO = VCC Condition 2: VI = VCC, VO = 0 Figure 2. Off-State Switch Leakage-Current Test Circuit VCC VINH = VIL VCC A VI Open (ON) GND VI = VCC or GND Figure 3. On-State Switch Leakage-Current Test Circuit VCC VINH = VIL VCC Input Output (ON) 50 Ω GND CL Figure 4. Propagation Delay Time, Signal Input to Signal Output POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 7 SCLS430K − MAY 1999 − REVISED APRIL 2005 PARAMETER MEASUREMENT INFORMATION VCC 50 Ω VINH VCC VI S1 VO GND 1 kΩ S2 TEST S1 S2 tPLZ/tPZL tPHZ/tPZH GND VCC VCC GND CL TEST CIRCUIT VCC VCC VINH 50% 50% 0V 0V tPZL tPZH ≈VCC VOH VO 50% 50% VOL ≈0 V (tPZL, tPZH) VCC VCC VINH 50% 50% 0V 0V tPLZ tPHZ ≈VCC VOH VO VOL + 0.3 V VOL (tPLZ, tPHZ) VOH − 0.3 V ≈0 V VOLTAGE WAVEFORMS Figure 5. Switching Time (tPZL, tPLZ, tPZH, tPHZ), Control to Signal Output VCC VINH = GND VCC (ON) fin 50 Ω 0.1 µF GND VO RL CL VCC/2 NOTE A: fin is a sine wave. Figure 6. Frequency Response (Switch On) 8 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 SCLS430K − MAY 1999 − REVISED APRIL 2005 PARAMETER MEASUREMENT INFORMATION VCC VINH = GND VCC (ON) fin 0.1 µF 600 Ω 50 Ω VO1 GND RL CL VCC/2 VCC VINH = VCC VCC (OFF) fin VO2 GND 600 Ω RL CL VCC/2 Figure 7. Crosstalk Between Any Two Switches 50 Ω VCC VINH VCC VO GND 600 Ω RL VCC/2 CL VCC/2 Figure 8. Crosstalk Between Control Input and Switch Output VCC VINH = VCC 0.1 µF VCC (OFF) fin 50 Ω 600 Ω GND VCC/2 VO RL CL VCC/2 Figure 9. Feedthrough Attenuation (Switch Off) POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 9 SCLS430K − MAY 1999 − REVISED APRIL 2005 PARAMETER MEASUREMENT INFORMATION VCC VINH = GND 10 µF fin 600 Ω 10 µF VCC (ON) VO GND RL VCC/2 Figure 10. Sine-Wave Distortion 10 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 CL PACKAGE OPTION ADDENDUM www.ti.com 9-Aug-2005 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty SN74LV4053AD ACTIVE SOIC D 16 SN74LV4053ADBR ACTIVE SSOP DB SN74LV4053ADBRE4 ACTIVE SSOP SN74LV4053ADE4 ACTIVE SN74LV4053ADG4 40 Lead/Ball Finish MSL Peak Temp (3) Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM DB 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LV4053ADGVR ACTIVE TVSOP DGV 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LV4053ADGVRE4 ACTIVE TVSOP DGV 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LV4053ADR ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LV4053ADRE4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LV4053ADRG4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LV4053AN ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU Level-NC-NC-NC SN74LV4053ANE4 ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU Level-NC-NC-NC SN74LV4053ANSR ACTIVE SO NS 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LV4053ANSRE4 ACTIVE SO NS 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LV4053APW ACTIVE TSSOP PW 16 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LV4053APWE4 ACTIVE TSSOP PW 16 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LV4053APWG4 ACTIVE TSSOP PW 16 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LV4053APWR ACTIVE TSSOP PW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LV4053APWRE4 ACTIVE TSSOP PW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LV4053APWRG4 ACTIVE TSSOP PW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LV4053APWT ACTIVE TSSOP PW 16 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LV4053APWTE4 ACTIVE TSSOP PW 16 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LV4053APWTG4 ACTIVE TSSOP PW 16 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LV4053ARGYR ACTIVE QFN RGY 16 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1YEAR SN74LV4053ARGYRG4 ACTIVE QFN RGY 16 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1YEAR Addendum-Page 1 PACKAGE OPTION ADDENDUM www.ti.com 9-Aug-2005 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS) or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 MECHANICAL DATA MPDS006C – FEBRUARY 1996 – REVISED AUGUST 2000 DGV (R-PDSO-G**) PLASTIC SMALL-OUTLINE 24 PINS SHOWN 0,40 0,23 0,13 24 13 0,07 M 0,16 NOM 4,50 4,30 6,60 6,20 Gage Plane 0,25 0°–8° 1 0,75 0,50 12 A Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,08 14 16 20 24 38 48 56 A MAX 3,70 3,70 5,10 5,10 7,90 9,80 11,40 A MIN 3,50 3,50 4,90 4,90 7,70 9,60 11,20 DIM 4073251/E 08/00 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side. Falls within JEDEC: 24/48 Pins – MO-153 14/16/20/56 Pins – MO-194 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MECHANICAL DATA MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001 DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE 28 PINS SHOWN 0,38 0,22 0,65 28 0,15 M 15 0,25 0,09 8,20 7,40 5,60 5,00 Gage Plane 1 14 0,25 A 0°–ā8° 0,95 0,55 Seating Plane 2,00 MAX 0,10 0,05 MIN PINS ** 14 16 20 24 28 30 38 A MAX 6,50 6,50 7,50 8,50 10,50 10,50 12,90 A MIN 5,90 5,90 6,90 7,90 9,90 9,90 12,30 DIM 4040065 /E 12/01 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-150 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MECHANICAL DATA MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999 PW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 14 PINS SHOWN 0,30 0,19 0,65 14 0,10 M 8 0,15 NOM 4,50 4,30 6,60 6,20 Gage Plane 0,25 1 7 0°– 8° A 0,75 0,50 Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,10 8 14 16 20 24 28 A MAX 3,10 5,10 5,10 6,60 7,90 9,80 A MIN 2,90 4,90 4,90 6,40 7,70 9,60 DIM 4040064/F 01/97 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-153 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. 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