STMICROELECTRONICS STD38NF03L

STD38NF03L

N - CHANNEL 30V - 0.013 Ω - 38A TO-252
STripFET POWER MOSFET
PRELIMINARY DATA
TYPE
V DSS
R DS(o n)
ID
STD38NF03L
30 V
< 0.019 Ω
38 A
■
■
■
■
TYPICAL RDS(on) = 0.013 Ω
OPTIMIZED FOR HIGH SWTICHING
OPERATIONS
LOW THRESHOLD DRIVE
ADD SUFFIX ”T4” FOR ORDERING IN TAPE
& REEL
DESCRIPTION
This Power MOSFET is the latest development of
STMicroelectronics unique ”Single Feature
Size” strip-based process. The resulting transistor shows extremely high packing density for low
on-resistance, rugged avalanche characteristics
and less critical alignment steps therefore a remarkable manufacturing reproducibility.
3
1
DPAK
TO-252
(Suffix ”T4”)
INTERNAL SCHEMATIC DIAGRAM
APPLICATIONS
■ HIGH CURRENT, HIGH SPEED SWITCHING
■ MOTOR CONTROL, AUDIO AMPLIFIERS
■ DC-DC & DC-AC CONVERTERS
ABSOLUTE MAXIMUM RATINGS
Symb ol
V DS
V DGR
Value
Unit
Drain-source Voltage (VGS = 0)
Parameter
30
V
Drain- gate Voltage (R GS = 20 kΩ)
30
V
± 20
V
38
A
Drain Current (continuous) at Tc = 100 o C
27
A
Drain Current (pulsed)
152
A
VGS
G ate-source Voltage
ID (*)
Drain Current (continuous) at Tc = 25 oC
ID
I DM (•)
P tot
T st g
Tj
o
T otal Dissipation at Tc = 25 C
45
W
Derating Factor
0.3
W /o C
Storage Temperature
Max. Operating Junction Temperature
(•) Pulse width limited by safe operating area
March 2000
-65 to 175
o
C
175
o
C
( *)Value limited by the package
1/6
STD38NF03L
THERMAL DATA
R th j-pc b
R thj -amb
R t hj-s ink
Tl
Thermal Resistance Junction-PC Board
Max
Thermal Resistance Junction-ambient
Max
Thermal Resistance Case-sink
T yp
Maximum Lead Temperature F or Soldering Purpose
o
3.33
62.5
1.5
300
C/W
C/W
o
C/W
o
C
o
ELECTRICAL CHARACTERISTICS (Tcase = 25 oC unless otherwise specified)
OFF
Symbo l
V (BR)DSS
Parameter
Drain-source
Breakdown Voltage
Test Con ditions
I D = 250 µA
V GS = 0
I DSS
V DS = Max Rating
Zero Gate Voltage
Drain Current (V GS = 0) V DS = Max Rating
IGSS
Gate-body Leakage
Current (VDS = 0)
Min.
Typ.
Max.
30
Unit
V
T c = 125 oC
V GS = ± 20 V
1
10
µA
µA
± 100
nA
Max.
Unit
ON (∗)
Symbo l
Parameter
Test Con ditions
ID = 250 µA
V GS(th)
Gate Threshold Voltage V DS = V GS
R DS(on)
Static Drain-source On
Resistance
V GS = 10 V
V GS = 4.5 V
I D(o n)
On State Drain Current
V DS > ID(o n) x R DS(on )ma x
V GS = 10 V
Min.
1
I D = 19 A
I D = 19 A
Typ.
1.7
2.5
V
0.013
0.016
0.019
0.023
Ω
Ω
38
A
DYNAMIC
Symbo l
g f s (∗)
C iss
C os s
C rss
2/6
Parameter
Test Con ditions
Forward
Transconductance
V DS > ID(o n) x R DS(on )ma x
Input Capacitance
Output Capacitance
Reverse Transfer
Capacitance
V DS = 20 V
f = 1 MHz
I D = 19 A
V GS = 0 V
Min.
Typ.
Max.
Unit
28
S
1450
390
155
pF
pF
pF
STD38NF03L
ELECTRICAL CHARACTERISTICS (continued)
SWITCHING ON
Symbo l
Parameter
Test Con ditions
Min.
Typ.
Max.
Unit
t d(on)
tr
Turn-on Delay T ime
Rise Time
V DD = 15 V
I D = 27.5 A
R G = 4.7 Ω
V GS = 4.5 V
(Resistive Load, see fig. 3)
25
280
Qg
Q gs
Q gd
Total G ate Charge
Gate-Source Charge
Gate-Drain Charge
V DD = 24 V ID = 55 A V GS = 4.5 V
27
11
12
36
nC
nC
nC
Typ.
Max.
Unit
ns
ns
SWITCHING OFF
Symbo l
Parameter
Test Con ditions
Min.
t d(of f)
tf
Turn-off Delay T ime
Fall T ime
V DD = 15 V
I D = 27.5 A
V GS = 4.5 V
R G = 4.7 Ω
(Resistive Load, see fig. 3)
60
240
ns
ns
tr (Voff)
tf
tc
Off-voltage Rise T ime
Fall T ime
Cross-over Time
V CLAMP = 24 V
I D = 55 A
V GS = 4.5 V
R G = 4.7 Ω
(Induct ive Load, see fig. 5)
140
200
350
ns
ns
ns
SOURCE DRAIN DIODE
Symbo l
Parameter
Test Con ditions
ISD
I SDM (•)
Source-drain Current
Source-drain Current
(pulsed)
V SD (∗)
Forward On Voltage
I SD = 38 A
Reverse Recovery
Time
Reverse Recovery
Charge
Reverse Recovery
Current
I SD = 55 A
di/dt = 100 A/µs
T j = 150 o C
V DD = 15 V
(see test circuit, fig. 5)
t rr
Q rr
I RRM
Min.
Typ.
V GS = 0
Max.
Unit
38
152
A
A
1.5
V
45
ns
52
nC
2.3
A
(∗) Pulsed: Pulse duration = 300 µs, duty cycle 1.5 %
(•) Pulse width limited by safe operating area
3/6
STD38NF03L
Fig. 1: Unclamped Inductive Load Test Circuit
Fig. 2: Unclamped Inductive Waveform
Fig. 3: Switching Times Test Circuits For
Resistive Load
Fig. 4: Gate Charge test Circuit
Fig. 5: Test Circuit For Inductive Load Switching
And Diode Recovery Times
4/6
STD38NF03L
TO-252 (DPAK) MECHANICAL DATA
mm
DIM.
MIN.
inch
TYP.
MAX.
MIN.
TYP.
MAX.
A
2.2
2.4
0.086
0.094
A1
0.9
1.1
0.035
0.043
A2
0.03
0.23
0.001
0.009
B
0.64
0.9
0.025
0.035
B2
5.2
5.4
0.204
0.212
C
0.45
0.6
0.017
0.023
C2
0.48
0.6
0.019
0.023
D
6
6.2
0.236
0.244
E
6.4
6.6
0.252
0.260
G
4.4
4.6
0.173
0.181
H
9.35
10.1
0.368
0.397
L2
0.8
L4
0.031
0.6
1
0.023
0.039
A1
C2
A
H
A2
C
DETAIL ”A”
L2
D
=
1
=
G
2
=
=
=
E
=
B2
3
B
DETAIL ”A”
L4
0068772-B
5/6
STD38NF03L
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of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is
granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specific ation mentioned in this publication are
subjec t to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products
are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.
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6/6
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