STPS8H100D/F/G/R/FP ® HIGH VOLTAGE POWER SCHOTTKY RECTIFIER MAIN PRODUCT CHARACTERISTICS IF(AV) 8A VRRM 100 V Tj (max) 175 °C VF (max) 0.58 V A K FEATURES AND BENEFITS ■ ■ ■ ■ ■ Negligible switching losses High junction temperature capability Low leakage current Good trade off between leakage current and forward voltage drop Insulated package: ISOWATT220AC, TO-220FPAC Insulating voltage = 2000V DC Capacitance = 12pF A K TO-220AC STPS8H100D ISOWATT220AC STPS8H100F K A NC D2PAK STPS8 DESCRIPTION Schottky barrier rectifier designed for high frequency compact Switched Mode Power Supplies such as adaptators and on board DC/DC converters. A NC A K I2PAK STPS8H100R K TO-220FPAC STPS8H100FP ABSOLUTE RATINGS (limiting values) Symbol Parameter Value Unit VRRM Repetitive peak reverse voltage 100 V IF(RMS) RMS forward current 30 A 8 A 250 A IF(AV) Average forward current δ = 0.5 TO-220AC / I2PAK / D2PAK Tc= 165°C ISOWATT220AC TO-220FPAC Tc = 150°C IFSM Surge non repetitive forward current tp = 10 ms sinusoidal IRRM Repetitive peak reverse current tp = 2 µs F = 1kHz square 1 A IRSM Non repetitive peak reverse current tp = 100 µs square 3 A Tstg Storage temperature range - 65 to + 175 °C 175 °C 10000 V/µs Tj dV/dt Maximum operating junction temperature Critical rate of rise of rise voltage January 2002 - Ed: 5D 1/8 STPS8H100D/F/G/R/FP THERMAL RESISTANCES Symbol Parameter 2 2 Rth (j-c) Junction to case TO-220AC / I PAK / D PAK Rth (j-c) Junction to case ISOWATT220AC / TO-220FPAC Value Unit 1.6 °C/W 4 °C/W Max. Unit 4.5 µA 6 mA V STATIC ELECTRICAL CHARACTERISTICS Symbol Parameter Tests Conditions IR * Reverse leakage current Tj = 25°C Min. VR = VRRM Tj = 125°C VF ** Pulse test : Forward voltage drop Typ. 2 Tj = 25°C IF = 8 A 0.71 Tj = 25°C IF = 10 A 0.77 Tj = 25°C IF = 16 A 0.81 Tj = 125°C IF = 8 A 0.56 0.58 Tj = 125°C IF = 10 A 0.59 0.64 Tj = 125°C IF = 16 A 0.65 0.68 * tp = 5 ms, δ < 2% ** tp = 380 µs, δ < 2% To evaluate the maximum conduction losses use the following equation : P = 0.48 x IF(AV) + 0.0125 x IF2(RMS) Fig. 1: Average forward power dissipation versus average forward current. (TO-220AC / ISOWATT220AC / I2PAK / D2PAK) Fig. 2-1: Average forward current versus ambient temperature (δ=0.5) (TO-220AC / I2PAK / D2PAK). IF(av)(A) PF(av)(W) 6.0 5.5 5.0 4.5 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0.0 2/8 δ = 0.1 δ = 0.2 δ = 0.05 10 δ = 0.5 Rth(j-a)=Rth(j-c) 8 δ=1 6 4 Rth(j-a)=15°C/W T T 2 δ=tp/T IF(av) (A) 0 1 2 3 4 5 6 7 8 tp 9 10 0 0 δ=tp/T tp 20 40 Tamb(°C) 60 80 100 120 140 160 180 STPS8H100D/F/G/R/FP Fig. 2-2: Average forward current versus ambient temperature (δ=0.5) (ISOWATT220AC, TO-220FPAC). Fig. 3-1: Non repetitive surge peak forward current versus overload duration (maximum values) (TO-220AC / I2PAK / D2PAK). IF(av)(A) IM(A) 10 160 Rth(j-a)=Rth(j-c) 140 8 120 100 6 4 60 T 40 2 0 Tc=75°C 80 Rth(j-a)=50°C/W δ=tp/T tp 20 40 0 Tamb(°C) 60 80 100 120 140 160 180 Fig. 3-2: Non repetitive surge peak forward current versus overload duration (maximum values) (ISOWATT220AC, TO-220FPAC). Tc=125°C t 0 1E-3 t(s) δ=0.5 1E-2 1E-1 1E+0 Fig. 4-1: Relative variation of thermal impedance junction to case versus pulse duration (TO-220AC / I2PAK / D2PAK). IM(A) 100 90 80 70 60 50 40 30 20 IM 10 0 1E-3 Tc=100°C IM 20 Zth(j-c)/Rth(j-c) 1.0 0.8 Tc=75°C δ = 0.5 0.6 0.4 Tc=100°C δ = 0.2 Tc=125°C 0.2 T δ = 0.1 Single pulse t t(s) δ=0.5 1E-2 δ=tp/T tp(s) 1E-1 1E+0 Fig. 4-2: Relative variation of thermal impedance junction to case versus pulse duration (ISOWATT220AC, TO-220FPAC). 0.0 1E-4 1E-3 1E-2 1E-1 tp 1E+0 Fig. 5: Reverse leakage current versus reverse voltage applied (typical values). IR(µA) Zth(j-c)/Rth(j-c) 5E+3 1.0 1E+3 Tj=125°C 0.8 1E+2 0.6 δ = 0.5 1E+1 0.4 δ = 0.2 0.2 1E+0 T Tj=25°C δ = 0.1 1E-1 Single pulse tp(s) 0.0 1E-3 1E-2 1E-1 δ=tp/T 1E+0 tp 1E+1 1E-2 VR(V) 0 10 20 30 40 50 60 70 80 90 100 3/8 STPS8H100D/F/G/R/FP Fig. 6: Junction capacitance versus reverse voltage applied (typical values). Fig. 7: Forward voltage drop versus forward current (maximum values). IFM(A) C(nF) 1000 50.0 F=1MHz Tj=25°C Tj=125°C 10.0 500 Tj=25°C 1.0 200 VFM(V) VR(V) 100 1 10 100 Fig. 8: Thermal resistance junction to ambient versus copper surface under tab (Epoxy printed circuit board FR4, copper thickness: 35µm)(D2PAK). Rth(j-a) (°C/W) 80 70 60 50 40 30 20 10 0 S(Cu) (cm²) 0 4/8 4 8 12 16 20 24 28 32 36 40 0.1 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 STPS8H100D/F/G/R/FP PACKAGE MECHANICAL DATA TO-220AC DIMENSIONS REF. Millimeters Min. A H2 C L5 L7 ØI L6 L2 D L9 F1 L4 M F E G A C D E F F1 G H2 L2 L4 L5 L6 L7 L9 M Diam. I Max. 4.40 4.60 1.23 1.32 2.40 2.72 0.49 0.70 0.61 0.88 1.14 1.70 4.95 5.15 10.00 10.40 16.40 typ. 13.00 14.00 2.65 2.95 15.25 15.75 6.20 6.60 3.50 3.93 2.6 typ. 3.75 3.85 Inches Min. Max. 0.173 0.181 0.048 0.051 0.094 0.107 0.019 0.027 0.024 0.034 0.044 0.066 0.194 0.202 0.393 0.409 0.645 typ. 0.511 0.551 0.104 0.116 0.600 0.620 0.244 0.259 0.137 0.154 0.102 typ. 0.147 0.151 PACKAGE MECHANICAL DATA ISOWATT220AC DIMENSIONS A H B Diam REF. L6 L7 L2 L3 F1 F D G E A B D E F F1 G H L2 L3 L6 L7 Diam Millimeters Inches Min. Typ. Max. Min. Typ. Max. 4.40 2.50 2.40 0.40 0.75 1.15 4.95 10.00 4.60 2.70 2.75 0.70 1.00 1.70 5.20 10.40 0.173 0.098 0.094 0.016 0.030 0.045 0.195 0.394 0.181 0.106 0.108 0.028 0.039 0.067 0.205 0.409 30.60 16.40 9.30 3.20 1.125 0.626 0.354 0.118 16.00 28.60 15.90 9.00 3.00 0.630 1.205 0.646 0.366 0.126 5/8 STPS8H100D/F/G/R/FP PACKAGE MECHANICAL DATA TO-220FPAC REF. A H B Dia L6 L2 L7 L3 L5 D F1 L4 F G1 G 6/8 E A B D E F F1 G G1 H L2 L3 L4 L5 L6 L7 Dia. DIMENSIONS Millimeters Inches Min. Max. 4.4 4.6 2.5 2.7 2.5 2.75 0.45 0.70 0.75 1 1.15 1.70 4.95 5.20 2.4 2.7 10 10.4 16 Typ. 28.6 30.6 9.8 10.6 2.9 3.6 15.9 16.4 9.00 9.30 3.00 3.20 Min. Max. 0.173 0.181 0.098 0.106 0.098 0.108 0.018 0.027 0.030 0.039 0.045 0.067 0.195 0.205 0.094 0.106 0.393 0.409 0.63 Typ. 1.126 1.205 0.386 0.417 0.114 0.142 0.626 0.646 0.354 0.366 0.118 0.126 STPS8H100D/F/G/R/FP PACKAGE MECHANICAL DATA D2PAK DIMENSIONS REF. A E C2 L2 D L L3 A1 B2 R C B G A2 2.0 MIN. FLAT ZONE V2 A A1 A2 B B2 C C2 D E G L L2 L3 R V2 Millimeters Inches Min. Typ. Max. Min. 4.30 2.49 0.03 0.70 4.60 2.69 0.23 0.93 0.169 0.098 0.001 0.027 1.40 0.45 1.21 8.95 10.00 4.88 15.00 1.27 1.40 0.181 0.106 0.009 0.037 0.055 0.60 1.36 9.35 10.28 5.28 15.85 1.40 1.75 0.017 0.047 0.352 0.393 0.192 0.590 0.050 0.055 8° 0° 0.40 0° Typ. Max. 0.024 0.054 0.368 0.405 0.208 0.624 0.055 0.069 0.016 8° FOOTPRINT (in millimeters)D2PAK 16.90 10.30 5.08 1.30 3.70 8.90 7/8 STPS8H100D/F/G/R/FP PACKAGE MECHANICAL DATA I2PAK DIMENSIONS REF. Inches Min. Typ. Max. Min. Typ. Max. A 4.30 4.60 0.169 0.181 A1 2.49 2.69 0.098 0.106 b 0.70 0.93 0.028 0.037 b1 1.20 1.38 0.047 0.054 b2 1.25 C 0.45 0.60 0.018 0.024 C2 1.21 1.36 0.048 0.054 D 8.95 9.35 0.352 0.368 1.40 0.049 0.055 e 2.44 2.64 0.096 0.104 E 10.00 10.28 0.394 0.405 L 13.10 13.60 0.516 0.535 L1 3.48 3.78 0.137 0.149 L2 1.27 1.40 0.050 0.055 Ordering type Marking Package Weight Base qty Delivery mode STPS8H100D STPS8H100D TO-220AC 1.86g 50 Tube STPS8H100F STPS8H100F ISOWATT220AC 2.00g 50 Tube STPS8H100FP STPS8H100FP TO-220FPAC 1.9 g 50 Tube STPS8H100R STPS8H100R I2PAK STPS8H100G STPS8H100G-TR ■ Millimeters STPS8H100G STPS8H100G 1.49g 50 Tube 2 1.48g 50 Tube 2 1.48g 500 Tape & reel D PAK D PAK Epoxy meets UL94,V0 Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a registered trademark of STMicroelectronics © 2002 STMicroelectronics - Printed in Italy - All rights reserved. STMicroelectronics GROUP OF COMPANIES Australia - Brazil - Canada - China - Finland - France - Germany Hong Kong - India - Israel - Italy - Japan - Malaysia - Malta - Morocco - Singapore Spain - Sweden - Switzerland - United Kingdom - United States. http://www.st.com 8/8